Silicon wafer reference surface directional test tool

Abstract

The utility model provides a silicon wafer reference surface orientation test tool, comprising a bearing platform, the top surface of which bears a silicon wafer, and the bearing platform is arranged in a liftable manner; the baffle abuts against one side of the bearing table, a slit allowing laser to pass through is longitudinally formed in the middle of the baffle, light guide slopes are arranged on the two sides of the slit, and a positioning face used for positioning the silicon wafer is arranged on the side, close to the bearing table, of the baffle. The baffle is arranged on one side of the bearing table, and the baffle is matched with the slit formed in the baffle and the positioning surfaces on the two sides of the slit, so that the multi-thickness monocrystalline silicon wafer with the tangent plane is measured, and the problem that the monocrystalline silicon wafer with the Flat reference surface cannot be positioned in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon wafer production, in particular to a silicon wafer reference surface orientation testing tool. Background Art

[0002] In the manufacturing and processing of silicon wafers, due to the anisotropic characteristics of single crystals, they must be cut according to a specific crystal direction to meet production needs and avoid fragmentation. Therefore, during the processing of silicon wafers, a reference surface needs to be processed to identify the crystal direction and position the wafer, which is called a flat, or reference surface. <110> ±1° crystal orientation can be processed, and the crystal orientation position can be tested by an orientation instrument. However, in the prior art, there is no special test tool for the crystal orientation of the reference surface after the crystal rod is cut into silicon wafers.

[0003] Chinese patent CN218956451U discloses a sample table for measuring the crystal orientation of the main reference surface of a silicon wafer after chamfering, including a carrier for carrying a silicon wafer, on which a first positioning component, a second positioning component and a third positioning component are arranged; the first positioning component includes a first positioning block for positioning the main reference surface of the silicon wafer, the first positioning block is fixedly connected to the carrier, and a slit is provided in the first positioning block; the second positioning component includes a second positioning block, the second positioning block is slidably connected to the carrier and can be fixed, and the second positioning block has a contact surface for contacting the circumferential surface of the silicon wafer; the third positioning component includes a first positioning block for positioning <100> The third positioning block of the crystal silicon wafer and the positioning block <111> The fourth positioning block of the crystal-oriented silicon wafer, the third positioning block and the fourth positioning block are all slidably connected to the supporting platform, the sliding direction of the third positioning block is perpendicular to the first positioning block, and the angle between the sliding direction of the fourth positioning block and the sliding direction of the third positioning block is 60°.

[0004] However, this technical solution is only applicable to positioning single crystal silicon wafers with Notch grooves, and cannot be used to position single crystal silicon wafers with Flat reference surfaces. In addition, it has the following problems: the positioning operation is complicated, and it is not applicable to single crystal silicon wafers of various thicknesses. Utility Model Content

[0005] The purpose of the utility model is to provide a silicon wafer reference surface orientation test tooling to address the deficiencies of the prior art. By setting a baffle on one side of the carrier platform, cooperating with a slit set on the baffle and positioning surfaces on both sides of the slit, it is possible to measure multi-thickness single-crystal silicon wafers with a cutting plane, thereby solving the problem that the prior art cannot locate single-crystal silicon wafers with a flat reference surface.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A silicon wafer reference surface orientation test tool, comprising:

[0008] A carrying platform, the top surface of which carries the silicon wafer, and the carrying platform can be raised and lowered;

[0009] A baffle is abutted against one side of the carrier platform, a slit is longitudinally opened in the middle thereof for allowing laser to pass through, light guiding inclined surfaces are arranged on both sides of the slit, and a positioning surface for positioning the silicon wafer is arranged on one side of the baffle close to the carrier platform.

[0010] As a preference, the positioning surface is a plane.

[0011] As a preferred embodiment, a lifting mechanism is installed under the supporting platform, and the lifting mechanism includes a base, a lifting frame installed on the base, and a control rod for controlling the lifting of the lifting frame.

[0012] As a preference, the lifting frame is symmetrically arranged on both sides of the base, and the lifting frame on each side includes a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod, one end of the first connecting rod is hinged to the base, and the other end is hinged to the second connecting rod, and the other end of the second connecting rod is hinged to the supporting platform; one end of the third connecting rod is horizontally slidably connected to the base, and the other end is hinged to the fourth connecting rod, and the other end of the fourth connecting rod is horizontally slidably connected to the supporting platform.

[0013] Preferably, a first control shaft is installed between the hinges of the first and second connecting rods on both sides, a second control shaft is installed between the hinges of the third and fourth connecting rods, the control rod is rotationally connected to the first control shaft, and the control rod is threadedly connected to the second control shaft.

[0014] As a preferred embodiment, it further comprises a positioning component installed on the top surface of the supporting platform, and the positioning component presses the cutting plane of the silicon wafer against the positioning surface.

[0015] As a preference, the positioning assembly is provided with at least one group, which includes:

[0016] A slider is arranged to slide relative to the carrier platform, a control portion is arranged on its top surface, and an abutment surface is arranged on one end thereof facing the silicon wafer;

[0017] A guide plate is installed on the top surface of the bearing platform, and is provided with a waist hole. The guide plate is arranged parallel to both sides of the slider to form a first guide groove, and a fixing plate is arranged at one end of the first guide groove;

[0018] An installation shaft movably connects the slider and the guide plate, and an end portion of the installation shaft is provided with a waist-shaped block that matches the waist hole;

[0019] An elastic member has one end abutting against the sliding block, and the other end abutting against the fixing plate.

[0020] As a preference, the sliding direction of the slider is perpendicular to the baffle, pushing the cutting plane of the silicon wafer to abut against the baffle.

[0021] Preferably, the supporting platform is provided with a second guide groove parallel to the first guide groove, and the second guide groove is arranged below the first guide groove.

[0022] Preferably, a guide portion slidably matched with the second guide groove is provided on the bottom surface of the sliding block, the guide portion is as wide as the second guide groove, and the abutting surface extends downward to the guide portion.

[0023] The beneficial effects of the utility model are:

[0024] (1) The utility model realizes the measurement of multi-thickness single-crystal silicon wafers with a cutting plane by setting a baffle on one side of the supporting platform, cooperating with a slit set on the baffle and positioning surfaces on both sides of the slit, thereby solving the problem that the prior art cannot locate single-crystal silicon wafers with a flat reference surface.

[0025] (2) The utility model allows the user to adjust the height of the loading platform according to actual needs by providing a lifting mechanism below the loading platform, thereby adapting to silicon wafers of different thicknesses, thereby improving the application scope of the utility model.

[0026] (3) The utility model provides a positioning component, which cooperates with the control part provided on the slider. The staff only needs to pull the control part to place or remove the silicon wafer, and the silicon wafer can be automatically and accurately positioned on the carrier, thereby simplifying the operation.

[0027] (4) The utility model extends the abutting surface downward to the guide portion, so that when measuring a thinner silicon wafer (2), the slider will not slide over the silicon wafer, thereby ensuring the stability of positioning.

[0028] In summary, the utility model has the advantages of simple operation, stable and accurate positioning, and wide application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0030] Figure 2 This is a schematic diagram of the top view structure of the utility model;

[0031] Figure 3 This is a schematic diagram of the exploded structure of the positioning component of the utility model;

[0032] Figure 4 It is a side structural schematic diagram of the utility model. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the equipment or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0035] Embodiment 1

[0036] like Figure 1-4 As shown, this embodiment provides a silicon wafer reference surface orientation test tool, including: a carrier platform 1, the top surface of which carries a silicon wafer 2, and the carrier platform 1 can be raised and lowered; a baffle 3, which abuts against one side of the carrier platform 1, and has a slit 31 longitudinally opened in the middle to allow laser to pass through, and light-guiding inclined surfaces 32 are provided on both sides of the slit 31 to optimize the laser measurement angle range and avoid obstruction of the laser by the baffle 3, and a positioning surface 33 for positioning the silicon wafer 2 is provided on the side of the baffle 3 close to the carrier platform 1.

[0037] like Figure 2 As shown, the positioning surface 33 is a plane, and may also be an arc-shaped structure, adapted to a silicon wafer with a cylindrical structure.

[0038] By setting a baffle 3 on one side of the supporting platform 1, cooperating with the slit 31 set on the baffle 3 and the positioning surfaces 33 on both sides of the slit 31, the measurement of multi-thickness single crystal silicon wafers 21 with cutting planes is achieved, thereby solving the problem that the existing technology cannot locate the single crystal silicon wafer 21 with a flat reference surface.

[0039] like Figure 1 , 4As shown, a lifting mechanism 5 is installed below the carrying platform 1, and the lifting mechanism 5 includes a base 51, a lifting frame 52 installed on the base 51, and a control rod 53 for controlling the lifting of the lifting frame 52. The lifting frames 52 are symmetrically arranged on both sides of the base 51, and each lifting frame 52 includes a first connecting rod 521, a second connecting rod 522, a third connecting rod 523 and a fourth connecting rod 524, one end of the first connecting rod 521 is hinged to the base 51, and the other end is hinged to the second connecting rod 522, and the other end of the second connecting rod 522 is hinged to the carrying platform 1; one end of the third connecting rod 523 is horizontally slidably connected to the base 51, and the other end is hinged to the fourth connecting rod 524, and the other end of the fourth connecting rod 524 is horizontally slidably connected to the carrying platform 1. A first control shaft 525 is installed between the hinge positions of the first connecting rod 521 and the second connecting rod 522 on both sides, and a second control shaft 526 is installed between the hinge positions of the third connecting rod 523 and the fourth connecting rod 524. The control rod 53 is rotatably connected to the first control shaft 525, and the control rod 53 is threadedly connected to the second control shaft 526.

[0040] The lifting mechanism 6 below the carrying platform 1 allows the user to adjust the height of the carrying platform 1 according to actual needs, thereby adapting to silicon wafers of different thicknesses, thereby improving the application scope of the utility model.

[0041] Embodiment 2

[0042] like Figure 1-3 As shown, the components identical or corresponding to those in the first embodiment are marked with the corresponding reference numerals in the first embodiment. For the sake of simplicity, only the differences from the first embodiment are described below. The second embodiment differs from the first embodiment in that:

[0043] This embodiment further includes a positioning assembly 4 installed on the top surface of the carrier 1 , and the positioning assembly 4 presses the cutting plane 21 of the silicon wafer 2 against the positioning surface 33 .

[0044] The positioning assembly 4 includes: a slider 41, which is arranged to slide relative to the supporting platform 1, and a control part 411 is arranged on its top surface, and a contact surface 412 is arranged on one end facing the silicon wafer 2, and the contact surface 412 is arranged obliquely, and is tangent to the silicon wafer 2 when it contacts the outer periphery of the silicon wafer 2; a guide plate 42, which is installed on the top surface of the supporting platform 1, and is provided with a waist hole 421, and the guide plate 42 is arranged parallel to both sides of the slider 41 to form a first guide groove 422, and a fixed plate 423 is arranged at one end of the first guide groove 422; an installation shaft 43, which movably connects the slider 41 and the guide plate 42, and a waist-shaped block 431 cooperating with the waist hole 421 is arranged at its end, and the waist-shaped block 431 can slide back and forth in the waist hole 421; an elastic member 44, which is preferably a spring in this embodiment and is in a compressed state, one end of which contacts the slider 41, and the other end of which contacts the fixed plate 423. The sliding direction of the slider 41 is perpendicular to the baffle 3 , pushing the cutting plane of the silicon wafer 2 to abut against the baffle 3 .

[0045] By setting the positioning component 4 and cooperating with the control part 411 set on the slider 41, the staff only needs to pull the control part 411 to place or remove the silicon wafer. At the same time, under the abutment of the control part 411, the cutting plane 21 of the silicon wafer 2 is always against the positioning surface 33, avoiding the phenomenon of inaccurate detection results caused by the tilt of the cutting plane 21, thereby simplifying the operation.

[0046] The bearing platform 1 is provided with a second guide groove 11 parallel to the first guide groove 422, and the second guide groove 11 is arranged below the first guide groove 422. The bottom surface of the slider 41 is provided with a guide portion 413 that is slidably matched with the second guide groove 11, and the guide portion 413 is as wide as the second guide groove 11, and the abutting surface 412 extends downward to the guide portion 413.

[0047] By extending the abutting surface 412 downward to the guide portion 413 , the slider 41 will not slide over the silicon wafer 21 when measuring a thinner silicon wafer 2 , thereby ensuring the stability of positioning.

[0048] like Figure 1 As shown, at least one group of positioning components 4 is provided. In this embodiment, two groups of positioning components 4 are symmetrically provided to balance the forces on the left and right sides of the silicon wafer and ensure that the cutting plane is parallel to the positioning surface 33.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer reference surface orientation test tool, characterized in that: include: A carrying platform, the top surface of which carries the silicon wafer, and the carrying platform can be raised and lowered; A baffle is abutted against one side of the carrier platform, a slit is longitudinally opened in the middle thereof for allowing laser to pass through, light guiding inclined surfaces are arranged on both sides of the slit, and a positioning surface for positioning the silicon wafer is arranged on one side of the baffle close to the carrier platform.

2. A silicon wafer reference surface orientation test tool according to claim 1, characterized in that: The positioning surface is a plane.

3. The silicon wafer reference surface orientation test tool according to claim 1, characterized in that: A lifting mechanism is installed below the bearing platform, and the lifting mechanism includes a base, a lifting frame installed on the base, and a control rod for controlling the lifting of the lifting frame.

4. A silicon wafer reference surface orientation test tool according to claim 3, characterized in that: The lifting frame is symmetrically arranged on both sides of the base, and the lifting frame on each side includes a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod. One end of the first connecting rod is hinged to the base, and the other end is hinged to the second connecting rod. The other end of the second connecting rod is hinged to the bearing platform; one end of the third connecting rod is horizontally slidably connected to the base, and the other end is hinged to the fourth connecting rod. The other end of the fourth connecting rod is horizontally slidably connected to the bearing platform.

5. The silicon wafer reference surface orientation test tool according to claim 4, characterized in that: A first control shaft is installed between the hinges of the first and second connecting rods on both sides, a second control shaft is installed between the hinges of the third and fourth connecting rods, the control rod is rotationally connected to the first control shaft, and the control rod is threadedly connected to the second control shaft.

6. A silicon wafer reference surface orientation test tool according to any one of claims 1 to 5, characterized in that: It also includes a positioning component installed on the top surface of the carrier platform, and the positioning component presses the cutting plane of the silicon wafer against the positioning surface.

7. A silicon wafer reference surface orientation test tool according to claim 6, characterized in that: The positioning assembly is provided with at least one group, which includes: A slider is arranged to slide relative to the carrier platform, a control portion is arranged on its top surface, and an abutment surface is arranged on one end thereof facing the silicon wafer; A guide plate is installed on the top surface of the bearing platform, and is provided with a waist hole. The guide plate is arranged parallel to both sides of the slider to form a first guide groove, and a fixing plate is arranged at one end of the first guide groove; An installation shaft movably connects the slider and the guide plate, and an end portion of the installation shaft is provided with a waist-shaped block that matches the waist hole; An elastic member has one end abutting against the sliding block, and the other end abutting against the fixing plate.

8. The silicon wafer reference surface orientation test tool according to claim 7, characterized in that: The sliding direction of the slider is perpendicular to the baffle, pushing the cutting plane of the silicon wafer to abut against the baffle.

9. A silicon wafer reference surface orientation test tool according to claim 8, characterized in that: The bearing platform is provided with a second guide groove which is parallel to the first guide groove, and the second guide groove is arranged below the first guide groove.

10. A silicon wafer reference surface orientation test tool according to claim 9, characterized in that: The bottom surface of the slider is provided with a guide portion that is slidably matched with the second guide groove. The guide portion is equal in width to the second guide groove, and the abutment surface extends downward to the guide portion.

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