IGBT (Insulated Gate Bipolar Translator) module shell PIN pinhole structure

Abstract

The utility model discloses an IGBT (Insulated Gate Bipolar Translator) module shell PIN pinhole structure, which comprises a plurality of PIN pinholes arranged on an IGBT module shell, the top of each PIN pinhole is of an outer edge structure, the middle part of each PIN pinhole is of a vertical surface structure, and the lower part of each PIN pinhole is of a bowl-shaped structure; the parts, located in the bowl-cover-shaped structure and the vertical face structure, of the PIN holes can be made of silica gel or soft plastic. According to the utility model, by adopting the design of the double-material composite fit interference gap structure, water vapor, salt, dust and the like can be effectively prevented from entering the IGBT module, the service life of the IGBT module in an extremely severe environment is prolonged, and the use requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of PIN pinhole structures, in particular to an IGBT module housing PIN pinhole structure. Background Art

[0002] The existing IGBT module housing material is generally made of a single material such as PBT, PPS or PPA by injection molding. The existing IGBT module PIN pins are usually round pins, and some manufacturers use square pins or fisheye pins. When designing the IGBT module packaging process, an assembly gap must be reserved between the IGBT module PIN pins and the IGBT module housing PIN pin holes. With the widespread application of IGBT modules in the field of new energy, such as solar power generation, wind power generation, new energy vehicles, etc., it is proposed that IGBT modules should meet the needs of long-term use in extremely harsh environments such as high humidity, high salt, and high dust.

[0003] However, the existing IGBT module housing PIN pinhole structure cannot achieve reliable and complete sealing. Water vapor, salt, dust, etc. will enter the IGBT module through the gap between the IGBT module PIN pin and the IGBT module housing PIN pinhole, causing the IGBT module to be unable to adapt to long-term use in extremely harsh environments and cannot meet usage requirements. Based on the above situation, we propose an IGBT module housing PIN pinhole structure. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes an IGBT module housing PIN pinhole structure.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] An IGBT module housing PIN pinhole structure, comprising a plurality of PIN pinholes arranged on the IGBT module housing, wherein the top of the PIN pinhole is set as an outer edge structure, the middle of the PIN pinhole is set as a vertical surface structure, and the lower part of the PIN pinhole is set as a bowl-shaped structure;

[0007] The material of the portion of the PIN pinhole located in the bowl-shaped structure and the vertical surface structure can be one of silicone or soft plastic;

[0008] The material of the portion of the PIN pinhole located at the outer edge structure can be one of PBT, PPS or PPA.

[0009] Preferably, a spacing groove opened on the IGBT module housing is provided between two adjacent PIN pin holes.

[0010] Preferably, the material of the IGBT module housing is one of PBT, PPS or PPA.

[0011] Preferably, the outer edge structure and the IGBT module housing are injection molded at one time, and the outer edge structure supports the lower part of the PIN pinhole.

[0012] Preferably, the IGBT module housing is provided with a PIN pin, and the PIN pin is interference fit with the PIN pin hole.

[0013] Compared with the existing technology, the beneficial effects of the utility model are:

[0014] The utility model adopts a double-material composite interference gap structure design, which can effectively isolate water vapor, salt, dust, etc. from entering the IGBT module, extend the service life of the IGBT module in extremely harsh environments, and meet usage requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic cross-sectional view of a PIN pinhole structure of an IGBT module housing proposed by the utility model;

[0016] Figure 2 The utility model is a three-dimensional structural schematic diagram of a PIN pinhole structure of an IGBT module housing.

[0017] In the figure: 1. PIN pinhole; 2. IGBT module housing; 3. Outer edge structure; 4. Bowl-shaped structure; 5. Vertical surface structure; 6. Spacing groove. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Reference Figure 1-2 , an IGBT module housing PIN pinhole structure, comprising a plurality of PIN pinholes 1 arranged on an IGBT module housing 2, wherein a spacing groove 6 opened on the IGBT module housing 2 is arranged between two adjacent PIN pinholes 1, the material of the IGBT module housing 2 is one of PBT, PPS or PPA, the IGBT module housing 2 is provided with a PIN pin, and the PIN pin is interference-fitted with the PIN pinhole 1;

[0020] The top of the PIN pinhole 1 is set as an outer edge structure 3, the middle of the PIN pinhole 1 is set as a vertical surface structure 5, and the lower part of the PIN pinhole 1 is set as a bowl-shaped structure 4;

[0021] The part of the PIN pinhole 1 located at the bowl-shaped structure 4 and the vertical surface structure 5 can be made of silicone or soft plastic;

[0022] The part of the PIN pinhole 1 located at the outer edge structure 3 can be made of one of PBT, PPS or PPA. The outer edge structure 3 and the IGBT module housing 2 are injection molded at one time, and the outer edge structure 3 supports the lower part of the PIN pinhole 1. The utility model adopts a double-material composite interference gap structure design to effectively isolate water vapor, salt, dust, etc. from entering the IGBT module, thereby extending the service life of the IGBT module in extremely harsh environments and meeting usage requirements.

[0023] Working principle: The material of the outer edge structure 3 of the PIN pinhole 1 is set to one of PBT, PPS or PPA, and is injection molded with the IGBT module housing 2 at one time, and the material of the bowl-shaped structure 4 and the vertical surface structure 5 inside the PIN pinhole 1 is set to one of silicone or soft plastic. This part is completely integrated with the IGBT module housing 2 through secondary processing. The elastic material used in the lower part of the PIN pinhole 1 can achieve an interference fit between the PIN pinhole 1 and the PIN pin, thereby achieving a sealing effect. By adopting the design of a dual-material composite interference gap structure, water vapor, salt, dust, etc. can be effectively isolated from entering the IGBT module, thereby extending the service life of the IGBT module in extremely harsh environments.

[0024] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An IGBT module housing PIN pinhole structure, comprising a plurality of PIN pinholes (1) arranged on an IGBT module housing (2), characterized in that: The top of the PIN pinhole (1) is configured as an outer edge structure (3), the middle of the PIN pinhole (1) is configured as a vertical surface structure (5), and the bottom of the PIN pinhole (1) is configured as a bowl-shaped structure (4); The part of the PIN pinhole (1) located at the bowl-shaped structure (4) and the vertical surface structure (5) may be made of silicone or soft plastic; The part of the PIN pinhole (1) located at the outer edge structure (3) can be made of one of PBT, PPS or PPA.

2. The IGBT module housing PIN pinhole structure according to claim 1, characterized in that: A spacing groove (6) opened on the IGBT module housing (2) is provided between two adjacent PIN pin holes (1).

3. The IGBT module housing PIN pinhole structure according to claim 1, characterized in that: The material of the IGBT module housing (2) is one of PBT, PPS or PPA.

4. The IGBT module housing PIN pinhole structure according to claim 1, characterized in that: The outer edge structure (3) and the IGBT module housing (2) are formed by one-time injection molding, and the outer edge structure (3) has a supporting effect on the lower part of the PIN pinhole (1).

5. The IGBT module housing PIN pinhole structure according to claim 1, characterized in that: The IGBT module housing (2) is provided with a PIN pin, and the PIN pin is interference-fitted with the PIN pin hole (1).

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