Multi-daughter card interconnection backboard

Abstract

The utility model discloses a multi-daughter card interconnection backboard, the backboard is provided with a power supply area, a heat dissipation area, a function area and a main control area, and the output end of the power supply area is connected with the power supply input ends of the heat dissipation area and the function area; the functional area comprises at least two functional modules, each functional module comprises a main control slot position and a plurality of baseband slot positions, and the main control slot position is respectively connected with bus side communication interfaces of the plurality of baseband slot positions through a backboard bus interface; the baseband slot position of any function module is connected with the baseband slot position beside the function module and all the main control slot positions of the function area, and all the main control slot positions of the function area are connected with one another. The backboard provided by the utility model can improve the integration level of the whole machine, the whole machine can be cascaded with more distributed base stations through a plurality of daughter cards, the equipment volume of the whole machine is reduced, and the cost is saved.

Description

Technical Field

[0001] The utility model relates to the field of wireless communications, in particular to a multi-daughter card interconnection backplane. Background Art

[0002] The current mainstream networking architecture is remote radio unit (RRU) + baseband processing unit (BBU). In order to meet the application direction of high coverage in multiple scenarios of trains, BBU as a core network data processing device needs to be compatible with more forms of sub-cards and processing units, which raises the requirements for traditional signal interconnection design. Therefore, the present invention proposes a multi-sub-card interconnection redundant backplane device to solve this problem. It can not only improve the integration of the equipment and reduce the size of the whole machine, but also increase the redundancy function to improve the reliability of the equipment. Utility Model Content

[0003] The utility model provides a multi-daughter card interconnection backplane, which is used to solve the problems pointed out in the background technology.

[0004] A multi-subcard interconnection backplane, the backplane is provided with a power supply area, a heat dissipation area, a functional area and a main control area, the output end of the power supply area is connected to the power input end of the heat dissipation area and the functional area;

[0005] The functional area includes at least two functional modules, the functional modules include a main control slot and a plurality of baseband slots, the main control slot is connected to the bus side communication interfaces of the plurality of baseband slots respectively through a backplane bus interface;

[0006] The baseband slot of any functional module is connected to the baseband slot located next to it and all the main control slots of the functional area, and all the main control slots of the functional area are connected to each other.

[0007] The multiple functional modules included in the functional area are arranged horizontally, and the main control slots and baseband slots of the functional modules are arranged vertically.

[0008] The power supply area includes a plurality of power slots corresponding to a plurality of functional modules one by one, and output parts of the plurality of power slots are combined on the backplane and connected to power input ends of all slots in the heat dissipation area and the functional area.

[0009] The heat dissipation area and the power supply area are respectively located on two sides of the functional area, and the heat dissipation area includes at least one fan slot.

[0010] The fan slot is connected to the main control slot via a bus.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: the backplane provided by the present invention can improve the integration of the whole machine, and the whole machine can cascade more distributed base stations through multiple daughter cards, thereby reducing the volume of the whole machine equipment and saving costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the slots of each functional area of ​​the back panel of the utility model;

[0013] Figure 2 This is a structural block diagram of the back panel of the utility model.

[0014] Description of reference numerals:

[0015] 1- Main control slot, 2- Baseband slot, 3- Fan slot, 4- Power supply slot. DETAILED DESCRIPTION

[0016] A specific implementation of the present utility model is described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present utility model is not limited by the specific implementation mode.

[0017] like Figure 1 to Figure 2 As shown, a multi-daughter card interconnection backplane provided by an embodiment of the utility model adopts a 2U (80mm) height design. This embodiment is isolated according to functional areas, adopts vertical functional division, and horizontal redundant backup design, taking into account the signal isolation and compatibility of the daughter cards; the backplane is provided with a power supply area, a heat dissipation area, a functional area and a main control area, and the output end of the power supply area is connected to the power input end of the heat dissipation area and the functional area; the heat dissipation area and the power supply area are respectively located on both sides of the functional area;

[0018] Among them, the functional area includes at least two functional modules. This embodiment takes two functional modules as an example. The functional module includes a main control slot 1 and multiple baseband slots 2. This embodiment takes three baseband slots as an example. The two functional modules included in the functional area are arranged horizontally, and one main control slot of the functional module and the three baseband slots are arranged vertically;

[0019] The bottom layer is the main control slot, and the top three are baseband slots. The main control slot cooperates with the main control unit daughter card, and the baseband slot cooperates with the baseband unit daughter card;

[0020] The main control slot in the same functional module is connected to the bus side communication interfaces of multiple baseband slots respectively through the backplane bus interface;

[0021] The baseband slot of any functional module is connected to the baseband slot located next to it and all the main control slots of the functional area, and all the main control slots of the functional area are connected to each other.

[0022] The power supply area includes two power supply slots 4, which are the same in number as the functional modules, and are used to install power supply module 1 and power supply module 2 respectively. The output parts of the power supply slots are combined on the backplane and connected to the power input terminals of all slots in the heat dissipation area and the functional area.

[0023] The heat dissipation area includes at least one fan slot 3, and the fan slot is connected to the main control slot via a bus;

[0024] The backplane of this embodiment supports BBU transceiver operation in redundant mode (1+1 backup), non-redundant mode (each functional subcard has at least one) and mixed mode (each subcard can be randomly matched).

[0025] like Figure 2 As shown, the backplane of this embodiment can support one fan cooling daughter card, two 1500W power supply daughter cards, six baseband unit daughter cards and two main control unit daughter cards; the power supply function daughter card supports load sharing in redundant mode and can provide higher power supply; the baseband slot supports any live plug-in of daughter cards with the same function, automatically identifies redundant and non-redundant modes, supports foolproof design of daughter cards with different functions, and supports active switching of online fault daughter cards to spare daughter cards;

[0026] At the same time, the number of BBU-to-RRU connections supports the same flexible ratio as the sub-card. A maximum of 16 RRU devices can be connected in redundant mode. The switching interface throughput can reach 360Gbps by port.

[0027] Redundant backup is used to realize redundant signal connection between slots that need to be backed up on the backplane, for example Figure 2 In the example, the baseband unit subcard 1 and the baseband unit subcard 2 are mutually active and standby, and there is no active and standby relationship with other baseband slots. The baseband and the main control unit belong to different business areas and there is no active and standby relationship. The main control unit subcard 1 and the main control unit subcard 2 have an active and standby relationship, which is the physical realization of redundant backup. When backup switching is required, the software control part needs to operate to make the original active slot enter the standby state and the standby slot enter the active state. This is the active and standby switching on the software. Since the physical signal connection on the backplane is exactly the same for the active and standby slots, the active and standby physical switching can be completed by completing the switching state at the software level. This principle is also applicable to the baseband service and main control management slot subcards.

[0028] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit and basic features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim involved.

[0029] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A multi-daughter card interconnection backplane, characterized in that: It includes a power supply area, a heat dissipation area, a functional area and a main control area arranged on the backplane, and the output end of the power supply area is connected to the power input ends of the heat dissipation area and the functional area; The functional area includes at least two functional modules, the functional modules include a main control slot and a plurality of baseband slots, the main control slot is connected to the bus side communication interfaces of the plurality of baseband slots respectively through a backplane bus interface; The baseband slot of any functional module is connected to the baseband slot located next to it and all the main control slots of the functional area, and all the main control slots of the functional area are connected to each other.

2. The multi-daughter card interconnection backplane according to claim 1, characterized in that: The multiple functional modules included in the functional area are arranged horizontally, and the main control slots and baseband slots of the functional modules are arranged vertically.

3. The multi-daughter card interconnection backplane according to claim 1, characterized in that: The power supply area includes a plurality of power slots corresponding to a plurality of functional modules one by one, and output parts of the plurality of power slots are combined on the backplane and connected to power input ends of all slots in the heat dissipation area and the functional area.

4. The multi-daughter card interconnection backplane according to claim 1, characterized in that: The heat dissipation area and the power supply area are respectively located on two sides of the functional area, and the heat dissipation area includes at least one fan slot.

5. The multi-daughter card interconnection backplane according to claim 4, characterized in that: The fan slot is connected to the main control slot via a bus.

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