Warp degree scanner

Abstract

The utility model provides a warping degree scanner, and belongs to the technical field of scanners. The warping degree scanner comprises a table body, a scanning mechanism is installed at the top of the table body, a supporting seat is further installed at the top of the table body, a cavity is formed in the supporting seat, a positioning assembly is installed at the top of the cavity and penetrates through the top of the cavity in a sliding mode, and a wafer containing frame is placed at the top of the supporting seat. The supporting seat is installed on the table body, the cavity is formed in the supporting seat, the four second threaded rods are installed at the top of the cavity, the four second threaded rods are all sleeved with the clamping blocks in a threaded mode, and meanwhile every two adjacent second threaded rods are in mutual transmission, so that after the wafer containing frame is placed on the supporting seat, the second threaded rods are rotated, the four clamping blocks move at the same time, and the wafer containing frame is placed on the supporting seat. Therefore, the wafer placing rack can be clamped and positioned conveniently, the wafer positioning accuracy is improved, the scanning mechanism can detect the wafer in the wafer placing rack conveniently, and the accuracy of the scanning direction is further improved.

Description

Technical Field

[0001] The present application relates to the field of scanners, and in particular, to a warp scanner. Background Art

[0002] In the semiconductor industry, wafers undergo a thinning process. After thinning, the wafers will sag under the action of gravity, which will produce internal stress, affect the quality of the wafer, and have a serious impact on the accuracy of the subsequent nano-level processing technology. At the same time, the sagging and warping of solar panels will also affect the quantum conversion efficiency of the battery.

[0003] When detecting the warpage of a wafer, the wafer is placed on a wafer rack, and then placed on a detection platform. The wafer on the wafer rack is scanned by a detection device to detect the warpage of the wafer. However, the existing detection platform lacks a positioning structure for the wafer rack, resulting in deflection and displacement of the wafer rack. This will affect the detection accuracy of the scanning mechanism to a certain extent. For this reason, we propose a warpage scanner. Utility Model Content

[0004] In order to make up for the above deficiencies, the present application provides a warpage scanner, which aims to improve the problem of the lack of positioning structure in the existing scanner detection platform.

[0005] An embodiment of the present application provides a warp scanner, including a table, a scanning mechanism is installed on the top of the table, and a support base is also installed on the top of the table, a chamber is opened in the support base, a positioning component is installed on the top of the chamber, the positioning component slides through the top of the chamber, a wafer placement rack is placed on the top of the support base, and the positioning component clamps the wafer placement rack.

[0006] In a specific implementation, the scanning mechanism includes a base body fixedly mounted on the top of the platform, a lifting mechanism is mounted on the base body, a detection module is mounted on the lifting mechanism, and the detection module is arranged toward the wafer placement rack.

[0007] In a specific embodiment, a groove is opened on the side wall of the seat body, and the lifting mechanism includes a motor installed on the top of the seat body. The driving shaft of the motor is connected to a first threaded rod, which rotates through the top of the groove and has a lifting block threadedly sleeved thereon, and the detection module is connected to the lifting block.

[0008] In a specific embodiment, the positioning assembly includes four second threaded rods, the four second threaded rods are all installed on the top of the chamber, and two adjacent second threaded rods are transmission connected, and clamping blocks are threadedly sleeved on the four second threaded rods, and the four clamping blocks pass through the top of the chamber.

[0009] In a specific embodiment, four through openings are opened on the top of the chamber, and the four clamping blocks are respectively arranged through the four through openings.

[0010] In a specific embodiment, a rotating rod is fixedly connected to the side wall at one end of one of the second threaded rods, and the rotating rod is rotatably arranged to penetrate the side wall of the chamber.

[0011] In a specific implementation manner, the wafer placement rack includes a crystal box, a support ring is fixedly installed at the bottom of the crystal box, and the four clamping blocks are all arranged in contact with the inner wall of the support ring.

[0012] In a specific implementation manner, a transmission box is fixedly installed on the top of the chamber, and the four second threaded rods rotate and penetrate the side wall of the transmission box.

[0013] The beneficial effects of the present application are as follows: a support seat is installed on the table body, a chamber is opened in the support seat, four second threaded rods are installed on the top of the chamber, clamping blocks are threadedly sleeved on the four second threaded rods, and two adjacent second threaded rods are mutually transmitted, so that after the wafer placement rack is placed on the support seat, the second threaded rods are rotated to make the four clamping blocks move at the same time, so as to clamp and position the wafer placement rack, improve the wafer positioning accuracy, facilitate the scanning mechanism to detect the wafer in the wafer placement rack, and further improve the accuracy of the scanning orientation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the drawings required for use in the implementation methods will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the structure of a warpage scanner provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of the structure provided for the implementation method of this application;

[0017] Figure 3 A schematic diagram of the structure provided for the implementation method of this application;

[0018] Figure 4 A schematic diagram of the structure provided for an implementation method of the present application.

[0019] In the figure: 10- platform; 20- scanning mechanism; 210- base; 2110- groove; 220- lifting mechanism; 2210- motor; 2220- first threaded rod; 2230- lifting block; 230- detection module; 30- support seat; 40- chamber; 410- through opening; 420- transmission box; 50- positioning assembly; 510- second threaded rod; 520- clamping block; 60- wafer placement rack; 610- crystal box; 620- support ring; 70- rotating rod. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0021] See also Figure 1-4 The present application provides a warpage scanner, including a platform 10, a scanning mechanism 20 is installed on the top of the platform 10, and a support base 30 is also installed on the top thereof, a chamber 40 is opened in the support base 30, a positioning component 50 is installed on the top of the chamber 40, the positioning component 50 slides through the top of the chamber 40, a wafer placement rack 60 is placed on the top of the support base 30, and the positioning component 50 clamps the wafer placement rack 60. Specifically, the wafer placement rack 60 is placed on the support base 30, and then the wafer placement rack 60 can be fixed through the positioning component 50, and then the warpage of the wafer is detected through the scanning mechanism 20.

[0022] The scanning mechanism 20 includes a base body 210 fixedly mounted on the top of the platform 10, a lifting mechanism 220 is mounted on the base body 210, a detection module 230 is mounted on the lifting mechanism 220, and the detection module 230 is set toward the wafer placement rack 60. When set, the specific structure and detection method of the detection module 230 are both existing technologies, so that the lifting mechanism 220 drives the detection module 230 to move up and down to achieve the purpose of detecting the wafer on the wafer placement rack 60.

[0023] A groove 2110 is opened on the side wall of the base body 210, and the lifting mechanism 220 includes a motor 2210 installed on the top of the base body 210. The driving shaft of the motor 2210 is connected to the first threaded rod 2220. The first threaded rod 2220 rotates and passes through the top of the groove 2110, and a lifting block 2230 is threadedly sleeved thereon. The detection module 230 is connected to the lifting block 2230. It should be noted that the cylindrical part of the first threaded rod 2220 rotates and passes through the top of the groove 2110, and at the same time, the bottom of the first threaded rod 2220 is rotatably connected to the bottom of the groove 2110, and the lifting block 2230 is slidably set in the groove 2110 to drive the wafer placement rack 60 to move.

[0024] The positioning assembly 50 includes four second threaded rods 510, which are all installed on the top of the chamber 40, and two adjacent second threaded rods 510 are transmission connected. The four second threaded rods 510 are all threadedly sleeved with clamping blocks 520, and the four clamping blocks 520 all pass through the top of the chamber 40. Four through holes 410 are opened on the top of the chamber 40, and the four clamping blocks 520 are respectively arranged through the four through holes 410. In the specific setting, two adjacent second threaded rods 510 are arranged perpendicular to each other, and at the same time, one end of the four second threaded rods 510 is fixedly installed with a bevel gear, and the two adjacent bevel gears are meshed with each other, so that by rotating one of the second threaded rods 510, the four second threaded rods 510 can be rotated together, and the four clamping blocks 520 can be further moved.

[0025] It should be noted that four fixing blocks are fixedly installed on the top of the chamber 40 , and one end of the four second threaded rods 510 are rotatably connected to the four fixing blocks respectively. At the same time, the cylindrical part of the second threaded rod 510 rotates and penetrates the side wall of the transmission box 420 .

[0026] A rotating rod 70 is fixedly connected to the side wall at one end of one of the second threaded rods 510, and the rotating rod 70 rotates through the side wall of the chamber 40. Specifically, a connecting block is fixedly connected to one end of the rotating rod 70 to facilitate the rotation of the rotating rod 70, thereby causing the rotating rod 70 to drive the second threaded rod 510 connected thereto to rotate.

[0027] The wafer placement rack 60 includes a crystal box 610, a support ring 620 is fixedly installed at the bottom of the crystal box 610, four clamping blocks 520 are all arranged in contact with the inner wall of the support ring 620, a transmission box 420 is fixedly installed on the top of the chamber 40, and four second threaded rods 510 rotate and penetrate the side wall of the transmission box 420. When set, the specific structure of the crystal box 610 is the existing technology, and the sides of the four clamping blocks 520 that are in contact with the support ring 620 are all arranged in an arc shape, so that the arc surface of the clamping block 520 is in contact with the inner wall of the support ring 620.

[0028] The working principle of this warp scanner is as follows: the crystal box 610 is placed between the four clamping blocks 520, and the support ring 620 is placed on the top of the support seat 30, and then the rotating rod 70 is rotated, and the rotating rod 70 drives one of the second threaded rods 510 to rotate, so as to realize the simultaneous rotation of the four second threaded rods 510, so that the four second threaded rods 510 drive the four clamping blocks 520 to rotate at the same time, so as to realize the four clamping blocks 520 are attached to the inner wall of the support ring 620, so as to achieve the purpose of limiting the crystal box 610, and then the motor 2210 can be started, so that the motor 2210 drives the first threaded rod 2220 to rotate, and the first threaded rod 2220 drives the lifting block 2230 to move, so as to drive the detection module 230 to rise and fall, and then the warp of the wafer in the crystal box 610 can be detected.

[0029] It should be noted that the specific models and specifications of the motor 2210, the detection module 230, and the crystal box 610 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0030] The power supply and principle of the motor 2210 and the detection module 230 are clear to those skilled in the art and will not be described in detail here.

[0031] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

Claims

1. A warpage scanner, characterized in that: The invention comprises a platform (10), a scanning mechanism (20) is installed on the top of the platform (10), and a support seat (30) is also installed on the top of the platform (10), a chamber (40) is opened in the support seat (30), a positioning component (50) is installed on the top of the chamber (40), the positioning component (50) slides through the top of the chamber (40), a wafer placement rack (60) is placed on the top of the support seat (30), and the positioning component (50) clamps the wafer placement rack (60).

2. The warpage scanner according to claim 1, characterized in that: The scanning mechanism (20) comprises a base (210) fixedly mounted on the top of the platform (10), a lifting mechanism (220) being mounted on the base (210), a detection module (230) being mounted on the lifting mechanism (220), and the detection module (230) being arranged toward the wafer placement rack (60).

3. The warpage scanner according to claim 2, characterized in that: A groove (2110) is provided on the side wall of the seat body (210), and the lifting mechanism (220) includes a motor (2210) installed on the top of the seat body (210), and the driving shaft of the motor (2210) is connected to a first threaded rod (2220), and the first threaded rod (2220) rotates to pass through the top of the groove (2110), and a lifting block (2230) is threadedly sleeved thereon, and the detection module (230) is connected to the lifting block (2230).

4. The warpage scanner according to claim 1, characterized in that: The positioning assembly (50) includes four second threaded rods (510), and the four second threaded rods (510) are all installed on the top of the chamber (40), and two adjacent second threaded rods (510) are transmission connected, and the four second threaded rods (510) are all threadedly sleeved with clamping blocks (520), and the four clamping blocks (520) pass through the top of the chamber (40).

5. The warpage scanner according to claim 4, characterized in that: The top of the chamber (40) is provided with four through openings (410), and the four clamping blocks (520) are respectively arranged through the four through openings (410).

6. The warpage scanner according to claim 4, characterized in that: A rotating rod (70) is fixedly connected to the side wall at one end of one of the second threaded rods (510), and the rotating rod (70) is arranged to rotate and penetrate the side wall of the chamber (40).

7. The warpage scanner according to claim 4, characterized in that: The wafer placement rack (60) comprises a wafer box (610), a support ring (620) is fixedly mounted on the bottom of the wafer box (610), and the four clamping blocks (520) are all arranged in contact with the inner wall of the support ring (620).

8. The warpage scanner according to claim 4, characterized in that: A transmission box (420) is fixedly mounted on the top of the chamber (40), and the four second threaded rods (510) rotate and penetrate the side wall of the transmission box (420).

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