Buffer structure and electronic equipment
By designing a buffer structure in the electronic device and using multiple sealing chambers to separate the airflow, the problem of sudden airflow changes during pressing of the electronic device is solved, reducing audio noise and improving user experience.
Patent Information
- Application Number
- CN202421522881.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-05-23
- Estimated Expiration
- 2034-06-28
AI Technical Summary
When the electronic device is pressed, the battery cover is prone to deformation, causing instantaneous changes in the internal airflow, affecting the operation of parts such as the earpiece, microphone, etc., causing noise, and reducing audio performance.
A buffer structure is designed, including a first mounting layer, a buffer layer and a second mounting layer. The buffer layer is equipped with a plurality of spaced inner holes to form a plurality of independent sealing chambers. Through this structure, the air flow is partially separated into the electronic device to prevent the entire air flow from suddenly changing.
Effectively reduce or eliminate audio noise from electronic devices, improve user experience, and maintain the stability of the internal air pressure of electronic devices by limiting the instantaneous sudden change in the air flow to a local area.
Smart Images
Figure CN222897266U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic equipment accessories, and in particular to a buffer structure and an electronic equipment. Background Art
[0002] At present, the stacking space of electronic devices such as mobile phones is increasingly pursued to the extreme, and the design of battery covers has also changed from rigid designs such as glass and metal materials to flexible designs such as PU (polyurethane) materials. When the whole device is pressed, the battery cover is more likely to deform, causing the airflow inside the electronic device to produce an instantaneous mutation. This change will affect the operation of components such as the earpiece and microphone of the electronic device, causing noise and affecting the audio performance of the electronic device. Utility Model Content
[0003] In view of this, the present application provides a buffer structure and an electronic device, which can improve the sudden change of airflow generated when the electronic device is pressed.
[0004] Specifically, the following technical solutions are included:
[0005] In a first aspect, an embodiment of the present application provides a buffer structure, which includes a first mounting layer, a buffer layer and a second mounting layer, wherein the first mounting layer, the buffer layer and the second mounting layer are stacked and connected in sequence, and the buffer layer is provided with a plurality of spaced inner holes to separate and form a plurality of mutually independent sealed chambers between the first mounting layer and the second mounting layer.
[0006] In an optional embodiment, the buffer layer is a flexible member with elastic deformation capability.
[0007] In an optional embodiment, a filler is contained in the sealed chamber.
[0008] In an optional embodiment, the filler is gas.
[0009] In an optional embodiment, there are multiple buffer layers, and the multiple buffer layers are stacked.
[0010] In an optional embodiment, the inner hole penetrates the buffer layer along the thickness direction of the buffer layer.
[0011] In an optional embodiment, the buffer layer is bonded to the first mounting layer and the second mounting layer respectively.
[0012] In a second aspect, an embodiment of the present application provides an electronic device, comprising a housing and a buffer structure provided by any one of the embodiments of the first aspect, wherein the buffer structure is installed in the housing.
[0013] In an optional embodiment, the electronic device further includes a battery and a battery cover, wherein the battery is located inside the housing, the battery cover is disposed on one side of the housing, the first mounting layer of the buffer structure is the battery cover, and the battery is located on a side of the second mounting layer away from the first mounting layer.
[0014] In an optional embodiment, the electronic device also includes a display screen and a middle frame, the middle frame is located inside the shell, the display screen covers one side of the shell, the first mounting layer of the buffer structure is the display screen, and the middle frame is located on the side of the second mounting layer away from the first mounting layer.
[0015] The beneficial effects of the technical solution provided by the embodiment of the present application include at least: since the first mounting layer, the buffer layer and the second mounting layer are stacked and connected in sequence, and the buffer layer is provided with a plurality of inner holes arranged at intervals, the first mounting layer, the buffer layer and the second mounting layer form a plurality of mutually independent sealed chambers. When the buffer structure is pressed, only the air pressure in the sealed chamber within a small range will change, which will not cause instantaneous sudden changes in the airflow of the electronic device as a whole and the buffer structure as a whole, thereby helping to reduce or eliminate audio noise of the electronic device and improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 A schematic diagram of the change of airflow inside an electronic device in the prior art when a battery cover is pressed;
[0018] Figure 2 A schematic diagram of the structure of the buffer structure provided in an embodiment of the present application;
[0019] Figure 3 A schematic diagram of the structure of the buffer layer provided in an embodiment of the present application;
[0020] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.
[0021] The reference numerals in the figures represent respectively:
[0022] 1-first installation layer; 2-buffer layer; 21-inner hole; 3-second installation layer; 4-sealed chamber; 5-glue layer;
[0023] 100-battery cover; 200-battery.
[0024] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0026] The directional nouns involved in the embodiments of the present application, such as "upper", "lower", "side", etc., are generally based on the relative relationship of the directions shown in the figures, and these directional nouns are used only to more clearly describe the relationship between structures, and are not intended to describe absolute directions. When the product is placed in different postures, the direction may change, for example, "upper" and "lower" may be interchangeable.
[0027] Unless otherwise defined, all technical terms used in the embodiments of the present application have the same meanings as those generally understood by those of ordinary skill in the art. Some technical terms appearing in the embodiments of the present application are explained below.
[0028] In order to make the technical solutions and advantages of the present application more clear, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.
[0029] At present, the stacking space of electronic devices such as mobile phones is increasingly pursued to the extreme, and the design of battery covers has also changed from rigid designs such as glass and metal materials to flexible designs such as PU (polyurethane) materials. When the whole device is pressed, the battery cover is more likely to deform, causing the airflow inside the electronic device to produce an instantaneous mutation. This change will affect the operation of components such as the earpiece and microphone of the electronic device, causing noise and affecting the audio performance of the electronic device.
[0030] like Figure 1 As shown, when the electronic device is pressed in the direction indicated by the arrow below, the airflow inside the electronic device flows in the direction indicated by the horizontal arrow, causing instantaneous airflow changes inside the electronic device, which can easily cause airflow impact on electronic components such as microphones and earpieces, and thus easily generate noise, affecting the user experience.
[0031] In order to solve the above technical problems, an embodiment of the present application provides a buffer structure.
[0032] like Figure 2 and Figure 3 As shown, the buffer structure includes a first mounting layer 1, a buffer layer 2 and a second mounting layer 3, which are stacked and connected in sequence, and the buffer layer 2 is provided with a plurality of spaced inner holes 21 to separate the first mounting layer 1 and the second mounting layer 3 to form a plurality of mutually independent sealed chambers 4.
[0033] Exemplarily, the buffer structure is applied to electronic devices, including but not limited to mobile phones, tablet computers, e-book readers, wearable devices, navigators, handheld game consoles, virtual and reality devices, augmented reality devices, etc.
[0034] like Figure 2 As shown, the vertical direction is the thickness direction of the first mounting layer 1 , the buffer layer 2 and the second mounting layer 3 , and the first mounting layer 1 , the buffer layer 2 and the second mounting layer 3 are stacked in sequence from bottom to top, and the buffer layer 2 is located between the first mounting layer 1 and the second mounting layer 3 .
[0035] The inner hole 21 on the buffer layer 2 extends along the thickness direction of the buffer layer 2, and the inner hole 21 can be a through hole or a blind hole. When the inner hole 21 is a through hole, the first mounting layer 1 and the second mounting layer 3 respectively seal the two ends of the inner hole 21, and the inner wall of the inner hole 21, the first mounting layer 1 and the second mounting layer 3 are surrounded to form a sealed chamber 4; when the inner hole 21 is a blind hole, the inner wall of the inner hole 21 and the first mounting layer 1 or the second mounting layer 3 are surrounded to form a sealed chamber 4.
[0036] Compared with the design without opening the inner hole 21 on the buffer layer 2, the buffer structure provided in the embodiment of the present application, by opening a plurality of inner holes 21 spaced apart in the buffer layer 2, is beneficial to reducing the weight of the buffer structure and realizing a lightweight design of the electronic device.
[0037] In a specific embodiment, the inner hole 21 penetrates the buffer layer 2 along the thickness direction of the buffer layer 2 , that is, the inner hole 21 is a through hole.
[0038] This arrangement is helpful to reduce the volume and weight of the buffer layer 2, and is easy to process and shape, which is helpful to reduce the production difficulty and improve the production efficiency.
[0039] The shape of the inner hole 21 can be circular, elliptical, triangular, rectangular, parallelogram or other polygonal, etc., which is not specifically limited in this application. Figure 3 As shown, the inner hole 21 has a circular, trapezoidal, rectangular or other shape.
[0040] The distribution density, size, etc. of the inner hole 21 can be set according to actual needs, and this application does not make any specific limitations.
[0041] The sealed chamber 4 is a closed structure, and the multiple sealed chambers 4 are independent of each other, making it difficult to generate gas exchange. At the same time, each sealed chamber 4 is not connected to the external environment of the buffer structure, thereby ensuring the independence of each sealed chamber 4.
[0042] When the first mounting layer 1 or the second mounting layer 3 is pressed and deformed, the sealed chambers 4 within the deformation range each produce air pressure changes. Since the sealed chambers 4 are not connected to each other, it is difficult for the sealed chambers 4 outside the deformation range to produce air pressure changes. The buffer structure can limit the instantaneous mutation of the airflow to a local area, thereby ensuring that the internal air pressure of the buffer structure as a whole and the internal air pressure of the electronic equipment will not produce drastic instantaneous changes, thereby preventing audio noise.
[0043] Optionally, the buffer structure can be integrated into the components of the electronic device itself, for example, the battery cover 100 or the display screen of the electronic device is used as the first mounting layer 1, so as to reduce the space occupied by the buffer structure inside the electronic device and reduce the thickness of the electronic device.
[0044] Optionally, the first mounting layer 1 and / or the second mounting layer 3 are made of PET (Polyethylene terephthalate) material, which has good mechanical properties.
[0045] The buffer structure provided in the embodiment of the present application has a first mounting layer 1, a buffer layer 2 and a second mounting layer 3 which are sequentially stacked and connected, and the buffer layer 2 is provided with a plurality of inner holes 21 arranged at intervals. Therefore, the first mounting layer 1, the buffer layer 2 and the second mounting layer 3 enclose a plurality of mutually independent sealed chambers 4. When the buffer structure is pressed, only the air pressure in the sealed chambers 4 within a small range will change, which will not cause instantaneous mutation of the airflow of the electronic device as a whole and the buffer structure as a whole, thereby helping to reduce or eliminate audio noise of the electronic device and improving the user experience.
[0046] In a further embodiment, the buffer layer 2 is a flexible member having elastic deformation capability.
[0047] Exemplarily, the buffer layer 2 is made of rubber, silicone, foam and other materials. It is not only soft in texture but also can produce elastic deformation. When the buffer structure is pressed, the buffer layer 2 can play a role of shock absorption and buffering through elastic deformation. At the same time, it is beneficial for the sealed chamber 4 to reset and restore the initial air pressure after being compressed.
[0048] In a specific embodiment, the buffer layer 2 is made of foam, which has the advantages of light weight, good sealing and sound insulation.
[0049] In one embodiment, the sealed chamber 4 contains a filler.
[0050] Exemplarily, the filler is a material with functions such as buffering, shock absorption, and noise reduction, for example, the filler is sponge, foam, plastic, etc. The filler can also be an elastic element such as a spring, which can play a role of shock absorption and buffering through elastic deformation.
[0051] This arrangement can further improve the buffering effect of the buffer structure, prevent instantaneous mutations in the airflow of the entire electronic device and the entire buffer structure, and help reduce or eliminate audio noise in the electronic device and improve audio performance.
[0052] Optionally, the filler is a gas.
[0053] For example, the filler is air or inert gas, which not only ensures the shock absorption and buffering effects, but also helps to reduce the weight of the buffer structure and realize the lightweight design of electronic equipment.
[0054] Based on any of the above embodiments, there are multiple buffer layers 2, and the multiple buffer layers 2 are stacked.
[0055] Optionally, the positions of the inner holes 21 in the multiple buffer layers 2 correspond to each other, that is, the contours of the orthographic projections of the inner holes 21 in the multiple buffer layers 2 on the first mounting layer 1 overlap. Alternatively, the positions of the inner holes 21 in the multiple buffer layers 2 are staggered, that is, the contours of the orthographic projections of the inner holes 21 in the multiple buffer layers 2 on the first mounting layer 1 do not overlap.
[0056] In this embodiment, by providing multiple buffer layers 2, the buffering effect of the buffer structure can be further improved, preventing the airflow of the electronic device as a whole and the buffer structure as a whole from producing instantaneous mutations, which is beneficial to reducing or eliminating audio noise of the electronic device and improving audio performance.
[0057] In a specific embodiment, the buffer layer 2 is bonded to the first installation layer 1 and the second installation layer 3 respectively, which has the advantages of good sealing, high flatness, and no need for fasteners. Figure 2 As shown, a glue layer 5 is disposed between the first installation layer 1 and the buffer layer 2 and between the second installation layer 3 and the buffer layer 2 .
[0058] An embodiment of the present application further provides an electronic device, which includes a housing and a buffer structure provided by any one of the above embodiments, wherein the buffer structure is installed in the housing.
[0059] Exemplarily, electronic devices include, but are not limited to, mobile phones, tablet computers, e-book readers, wearable devices, navigators, handheld game consoles, virtual and reality devices, augmented reality devices, etc.
[0060] The electronic device provided in the embodiment of the present application has a first mounting layer 1, a buffer layer 2 and a second mounting layer 3 which are sequentially stacked and connected, and the buffer layer 2 is provided with a plurality of spaced inner holes 21. Therefore, the first mounting layer 1, the buffer layer 2 and the second mounting layer 3 enclose a plurality of mutually independent sealed chambers 4. When the buffer structure is pressed, only the air pressure in the sealed chamber 4 within a small range will change, which will not cause instantaneous mutation of the airflow of the electronic device as a whole and the buffer structure as a whole, thereby helping to reduce or eliminate audio noise of the electronic device and improving the user experience.
[0061] In a specific embodiment, the electronic device also includes a battery 200 and a battery cover 100, the battery 200 is located in the outer shell, the battery cover 100 is covered on one side of the outer shell, the first mounting layer 1 of the buffer structure is the battery cover 100, and the battery 200 is located on the side of the second mounting layer 3 away from the first mounting layer 1.
[0062] like Figure 4 As shown, the battery cover 100 is arranged opposite to the second installation layer 3 , the buffer layer 2 is located between the battery cover 100 and the second installation layer 3 , and the battery 200 is located above the second installation layer 3 .
[0063] When the battery cover 100 is pressed and deformed, the sealed chambers 4 within the deformation range each produce air pressure changes. Since the sealed chambers 4 are not connected to each other, it is difficult for the sealed chambers 4 outside the deformation range to produce air pressure changes. The buffer structure can limit the instantaneous mutation of the airflow to a local area, thereby ensuring that the internal air pressure of the buffer structure as a whole and the internal air pressure of the electronic device will not produce drastic instantaneous changes, thereby preventing audio noise.
[0064] In another specific embodiment, the electronic device also includes a display screen and a middle frame, the middle frame is located in the shell, the display screen covers one side of the shell, the first mounting layer 1 of the buffer structure is the display screen, and the middle frame is located on the side of the second mounting layer 3 away from the first mounting layer 1.
[0065] Specifically, the display screen is arranged opposite to the second installation layer 3 , the buffer layer 2 is located between the display screen and the second installation layer 3 , and the middle frame is located on a side of the second installation layer 3 away from the display screen.
[0066] When the display screen is pressed and deformed, the sealed chambers 4 within the deformation range each produce air pressure changes. Since the sealed chambers 4 are not connected to each other, it is difficult for the sealed chambers 4 outside the deformation range to produce air pressure changes. The buffer structure can limit the instantaneous mutation of the airflow to a local area, thereby ensuring that the internal air pressure of the buffer structure as a whole and the internal air pressure of the electronic equipment will not produce drastic instantaneous changes, thereby preventing audio noise.
[0067] By integrating the buffer structure into the battery cover 100 or the display screen, the space occupied by the buffer structure inside the electronic device is reduced, which is beneficial to reducing the weight and volume of the electronic device.
[0068] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.
[0069] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the present application disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only.
[0070] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.
Claims
1. A buffer structure, characterized in that: The buffer structure comprises a first mounting layer (1), a buffer layer (2) and a second mounting layer (3); the first mounting layer (1), the buffer layer (2) and the second mounting layer (3) are stacked and connected in sequence; the buffer layer (2) is provided with a plurality of inner holes (21) arranged at intervals, so as to separate and form a plurality of mutually independent sealed chambers (4) between the first mounting layer (1) and the second mounting layer (3).
2. The buffer structure according to claim 1, characterized in that: The buffer layer (2) is a flexible member having elastic deformation capability.
3. The buffer structure according to claim 1, characterized in that: The sealed chamber (4) contains a filler.
4. The buffer structure according to claim 3, characterized in that: The filler is gas.
5. The buffer structure according to any one of claims 1 to 4, characterized in that: There are a plurality of buffer layers (2), and the plurality of buffer layers (2) are stacked.
6. The buffer structure according to claim 1, characterized in that: The inner hole (21) penetrates the buffer layer (2) along the thickness direction of the buffer layer (2).
7. The buffer structure according to claim 1, characterized in that: The buffer layer (2) is bonded to the first mounting layer (1) and the second mounting layer (3) respectively.
8. An electronic device, characterized in that: The electronic device comprises a housing and the buffer structure according to any one of claims 1 to 7, wherein the buffer structure is installed in the housing.
9. The electronic device according to claim 8, characterized in that: The electronic device further comprises a battery (200) and a battery cover (100), wherein the battery (200) is located in the housing, the battery cover (100) is arranged on one side of the housing, the first mounting layer (1) of the buffer structure is the battery cover (100), and the battery (200) is located on a side of the second mounting layer (3) away from the first mounting layer (1).
10. The electronic device according to claim 8, characterized in that: The electronic device further comprises a display screen and a middle frame, wherein the middle frame is located inside the shell, the display screen covers one side of the shell, the first mounting layer (1) of the buffer structure is the display screen, and the middle frame is located on a side of the second mounting layer (3) away from the first mounting layer (1).