PCB high-temperature and high-humidity test frame and test device

Abstract

The embodiment of the utility model relates to the technical field of PCB (Printed Circuit Board) production equipment, in particular to a PCB high-temperature and high-humidity test frame and a test device, which comprise a support body provided with at least two support plates; the supporting plate is provided with a first clamping groove, a second clamping groove and a third clamping groove, and the first clamping groove, the second clamping groove and the third clamping groove are sequentially and circularly formed in the upper end of the supporting plate. The width of the first clamping groove, the width of the second clamping groove and the width of the third clamping groove are different from one another. Test samples with different thicknesses are respectively fixed through the first clamping grooves, the second clamping grooves and the third clamping grooves in the same positions of the plurality of supporting plates; therefore, the technical problem that the test result is seriously influenced by the fact that water drops fall on the surface of the test sample due to inclination of the sample is solved.

Description

Technical Field

[0001] The utility model embodiment relates to the technical field of PCB production equipment, and in particular to a PCB high-temperature and high-humidity test rack and a test device. Background Art

[0002] In the reliability test of PCB circuit boards, the test in high temperature and high humidity environment is an important part. At present, the sample carrier for high temperature and high humidity test is SU304 stainless steel carrier, and the board is placed in an inclined state during the test. The existing solution has the following technical problems: during the test, the SU304 stainless steel carrier will absorb heat, which indirectly prevents the temperature in the box from reaching the set temperature quickly, seriously affecting the test results; during the high temperature and high humidity test, the sample is in an inclined state, and water droplets in the air will fall on the surface of the test sample, seriously affecting the test results. This will seriously affect the test results. Utility Model Content

[0003] In view of the above problems, the embodiment of the utility model provides a PCB high temperature and high humidity test rack and test device, which solves the problem that the SU304 stainless steel load rack in the prior art absorbs heat, indirectly causing the temperature in the box to fail to quickly reach the set temperature, seriously affecting the test results; during the high temperature and high humidity test, the sample is tilted, and water droplets in the air will fall on the surface of the test sample, seriously affecting the test results. Thus, the problem of seriously affecting the test results.

[0004] First,

[0005] The utility model provides a PCB high temperature and high humidity test stand, comprising a bracket body, wherein the bracket body is provided with at least two support plates; the support plate is provided with a first card slot, a second card slot, and a third card slot, and the first card slot, the second card slot, and the third card slot are sequentially and cyclically arranged on the upper end of the support plate; wherein the width of the first card slot, the width of the second card slot, and the width of the third card slot are different from each other.

[0006] In some optional embodiments, a first groove is disposed at the bottom of the first card slot, a second groove is disposed at the bottom of the second card slot, and a third groove is disposed at the bottom of the third card slot.

[0007] In some optional embodiments, the cross-sectional shapes of the first groove, the second groove, and the third groove are semicircular; and the radius of the first groove is 0.5 mm, the radius of the second groove is 1 mm, and the radius of the third groove is 1.5 mm.

[0008] In some optional embodiments, the distance between the first card slot and the adjacent second card slot, the distance between the second card slot and the adjacent third card slot, and the distance between the third card slot and the adjacent first card slot are all equal.

[0009] In some optional embodiments, at least one locking assembly is provided on the inner walls of the first slot, the second slot and the third slot; the locking assembly includes a first locking piece and a second locking piece, and the first locking groove and the second locking groove are provided on the inner walls on both sides of the first slot, the second slot or the third slot, respectively; the first locking piece is elastically arranged in the first locking groove, and the first locking piece is limited by the first locking groove, so that one end of the first locking piece extends out of the first slot, the second slot or the third slot; the second locking piece is elastically arranged in the second locking groove, and the second locking piece is limited by the second locking groove, so that one end of the second locking piece extends out of the first slot, the second slot or the third slot.

[0010] In some optional embodiments, the first locking groove and the second locking groove are groove structures that are wide in the middle and narrow at the ends; the first locking member and the second locking member both include an elastic member and a fastener, one end of the elastic member is connected to the bottom of the first locking groove or the second locking groove, and the other end of the elastic member is connected to the fastener, and the other end of the fastener can be telescopically protruded in the first card slot, the second card slot, or the third card slot.

[0011] In some optional embodiments, the bracket body is a PEK bracket; the bracket body includes a base plate, and a plurality of support plates are equidistantly distributed on the upper surface of the base plate.

[0012] In some optional embodiments, the bottom plate is provided with a plurality of through holes, and the plurality of through holes are evenly distributed between adjacent support plates.

[0013] In some optional embodiments, the width of the first card slot is 1 mm, the width of the second card slot is 2 mm, the width of the third card slot is 3 mm, the depths of the first card slot, the second card slot and the third card slot are all 20 mm; the spacing between the first card slot and the adjacent second card slot, the spacing between the second card slot and the adjacent third card slot, and the spacing between the third card slot and the adjacent first card slot are all 7.8 mm; the size of the through hole is 45*25 mm and 180° fillets are set at both ends of the through hole.

[0014] Second aspect

[0015] The utility model provides a testing device, comprising a frame, a heating module, and a humidification module. A testing cavity is arranged inside the frame, and a PCB high-temperature and high-humidity testing frame as described above is arranged inside the testing cavity; the heating module and the humidification module are arranged on the frame and control the temperature and humidity of the testing cavity.

[0016] The present application provides a PCB high temperature and high humidity test stand and a test device, which have the following beneficial effects compared with the prior art:

[0017] (1) The utility model fixes test samples of different thicknesses respectively by means of first card slots, second card slots and third card slots at the same position of multiple support plates; the test samples are vertically aligned with the corresponding card slots for high temperature and high humidity testing, thereby solving the technical problem that when the sample is tilted, water droplets will fall onto the surface of the test sample and seriously affect the test results.

[0018] (2) The utility model also provides locking components on the inner walls of the first card slot, the second card slot, and the third card slot, and the test sample inserted into the card slot is further fixed by the locking components, thereby improving the stability of the test sample.

[0019] (3) The original stainless steel 304 material is replaced with PEK material, and the bottom plate is hollowed out to allow air to circulate quickly, solving the problem of the material absorbing heat during the test, causing the temperature inside the box to fail to quickly reach the set temperature, which seriously affects the test.

[0020] The above description is only an overview of the technical solution of the embodiment of the utility model. In order to more clearly understand the technical means of the embodiment of the utility model, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are only used to illustrate the embodiments and are not considered to be limitations of the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings:

[0022] Figure 1 A three-dimensional schematic diagram of a PCB high temperature and high humidity test stand provided by the utility model is shown;

[0023] Figure 2 A schematic side view of a PCB high temperature and high humidity test stand provided by the utility model is shown;

[0024] Figure 3 A schematic top view of a PCB high temperature and high humidity test stand provided by the utility model is shown;

[0025] Figure 4 The schematic diagram of the structure of the locking assembly provided by the utility model is shown.

[0026] in,

[0027] 1. First card slot; 2. Second card slot; 3. Third card slot; 4. Support plate; 5. Bottom plate; 6. Through hole; 7. First locking slot; 8. Locking assembly; 9. Fastener; 10. Elastic member. DETAILED DESCRIPTION

[0028] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein.

[0029] Embodiment 1:

[0030] Figure 1-3 The utility model shows a PCB high temperature and high humidity test stand, including a bracket body, the bracket body is provided with at least two support plates 4; the support plate 4 is provided with a first card slot 1, a second card slot 2, and a third card slot 3, and the first card slot 1, the second card slot 2, and the third card slot 3 are sequentially and cyclically arranged at the upper end of the support plate 4; wherein the width of the first card slot 1, the width of the second card slot 2, and the width of the third card slot 3 are different from each other. In this embodiment, the number of support plates 4, the number of first card slots 1, the number of second card slots 2, and the number of third card slots 3 can be set according to the size and number of test samples. The card slots arranged on the same horizontal line of multiple support plates 4 are the same, and can be the first card slot 1, the second card slot 2, or the third card slot 3. The test sample is inserted into the first card slot 1, the second card slot 2, or the third card slot 3 in the direction perpendicular to the support plate 4, so that the test sample is fixed. The first card slot 1, the second card slot 2, and the third card slot 3 are arranged in sequence and in a cycle, so that the first card slot 1, the second card slot 2, and the third card slot 3 can fix the first test sample, the second test sample, and the third test sample respectively, and the first test sample, the second test sample, and the third test sample of different thicknesses are arranged in a cycle, so that the arrangement between the test samples is more reasonable, and it is easier to grab or put the test samples during manual arrangement or robot arrangement, thereby improving the test efficiency. The utility model fixes the test samples of different thicknesses respectively through the first card slot 1, the second card slot 2, and the third card slot 3 at the same position of multiple support plates 4; the test samples are vertically aligned with the corresponding card slots for high temperature and high humidity testing, so as to solve the problem that the water droplets will fall on the surface of the test sample when the sample is tilted and seriously affect the test results.

[0031] Embodiment 2:

[0032] This embodiment is based on Embodiment 1 and further limits Embodiment 1.

[0033] In some optional embodiments, a first groove is provided at the bottom of the first card slot 1, a second groove is provided at the bottom of the second card slot 2, and a third groove is provided at the bottom of the third card slot 3. The cross-sectional shape of the first groove, the second groove, and the third groove is semicircular; and the radius of the first groove is 0.5mm, the radius of the second groove is 1mm, and the radius of the third groove is 1.5mm. In this embodiment, according to the different thicknesses of the first card slot 1, the second card slot 2, and the third card slot 3, the first groove, the second groove, and the third groove of different radii are set. Through the grooves of different radii, the groove shape is gradually reduced from the upper end to the lower end along the central axis direction of the card slot in the assembly. The first groove, the second groove, and the third groove with gradually reduced width can achieve abutment and fixation of the end face of the test sample. So that the test sample remains in a vertical state.

[0034] In some optional embodiments, compared with the above embodiments, the utility model also provides a locking method for a test sample, specifically including: at least one locking assembly 8 is provided on the inner walls of the first card slot 1, the second card slot 2, and the third card slot 3; the locking assembly 8 includes a first locking member and a second locking member, and the first locking groove and the second locking groove are respectively provided on the inner walls on both sides of the first card slot 1 or the second card slot 2 or the third card slot 3; the first locking member is elastically arranged in the first locking groove 7, and the first locking member is limited by the first locking groove 7, so that one end of the first locking member extends out of the first card slot 1 or the second card slot 2 or the third card slot 3; the second locking member is elastically arranged in the second locking groove, and the second locking member is limited by the second locking groove, so that one end of the second locking member extends out of the first card slot 1 or the second card slot 2 or the third card slot 3. The first locking groove 7 and the second locking groove are groove structures which are wide in the middle and narrow at the ends; the first locking member and the second locking member both include an elastic member 10 and a fastener 9, one end of the elastic member 10 is connected to the bottom of the first locking groove 7 or the second locking groove, and the other end of the elastic member 10 is connected to the fastener 9, and the other end of the fastener 9 is telescopically protruding from the first card slot 1 or the second card slot 2 or the third card slot 3.

[0035] In this embodiment, see Figure 4, the elastic member 10 may be a spring, and the fastener 9 may be a fastening ball, which may be protruded on the surface of the first card slot 1, the second card slot 2, or the third card slot 3 by the elastic action of the elastic member 10. A locking assembly 8 may be provided on the inner wall of the first card slot 1, the second card slot 2, or the third card slot 3, or two locking assemblies 8 may be provided opposite to each other, or a plurality of locking assemblies 8 may be provided on the inner wall of the first card slot 1, the second card slot 2, or the third card slot 3, so as to realize vertically fixing the test sample on the first card slot 1, the second card slot 2, or the third card slot 3. In a specific embodiment, the inner walls of both sides of the first card slot 1, the second card slot 2, or the third card slot 3 are respectively provided with locking assemblies 8, and when the test sample is inserted into the test card slot, the fastener 9 abuts against the surface of the test sample, and the fastener 9 compresses the elastic member 10 so that the fastener 9 is partially squeezed into the locking groove 7. Under the action of the elastic member 10, the test sample can be firmly inserted vertically into the card slot.

[0036] In some optional embodiments, the bracket body is a PEK bracket; the bracket body includes a bottom plate 5, and a plurality of support plates 4 are evenly distributed on the upper surface of the bottom plate 5. The bottom plate 5 is provided with a plurality of through holes 6, and the plurality of through holes 6 are evenly distributed between adjacent support plates 4. In some optional embodiments, the spacing between the first card slot 1 and the adjacent second card slot 2, the spacing between the second card slot 2 and the adjacent third card slot 3, and the spacing between the third card slot 3 and the adjacent first card slot 1 are all equal. In this embodiment, the original stainless steel 304 material is replaced with PEK material, and the bottom plate 5 is hollowed out to allow air to circulate quickly, so as to solve the problem that the material absorbs heat during the test, causing the temperature in the box to fail to quickly reach the set temperature, which seriously affects the test.

[0037] In some optional embodiments, the width of the first card slot 1 is 1mm, the width of the second card slot 2 is 2mm, the width of the third card slot 3 is 3mm, the depths of the first card slot 1, the second card slot 2, and the third card slot 3 are all 20mm; the spacing between the first card slot 1 and the adjacent second card slot 2, the spacing between the second card slot 2 and the adjacent third card slot 3, and the spacing between the third card slot 3 and the adjacent first card slot 1 are all 7.8mm; the size of the through hole 6 is 45*25mm and 180° fillets are set at both ends of the through hole 6. In this embodiment, the bracket body is made of PEK, and the size of the bracket body can be: 50mm high*360mm long*100mm wide, and the thickness of the PEK board is 6mm. The first slot 1 has a width of 1mm R 0.5mm, tolerance: +0.1 / -0mm, depth 20mm; the second slot 2 has a width of 2mm R1mm, tolerance: +0.1 / -0mm, depth 20mm; the third slot 3 has a width of 3mm R1.5mm, tolerance: +0.1 / -0mm, depth 20mm; the adjacent slots have a width of 7.8mm, tolerance: +0.1 / -0mm, depth 20mm; the slot gap is 1mm 2mm3mm cycle; the support plate 4 is 41mm apart; the aperture size of the through hole 6 is 45*25mm, tolerance: +0.1 / -0mm, and the holes have 180° fillets at both ends. In this embodiment, 6mmPEK board is used, and the boards are connected with M4 screws; before screwing, glue is applied to the connecting surface of the board; pay attention to the verticality between the boards after assembly.

[0038] Embodiment 3:

[0039] The utility model provides a testing device, including a rack, a heating module, and a humidifying module. A test cavity is arranged inside the rack, and a PCB high temperature and high humidity test rack as described above is arranged inside the test cavity; the heating module and the humidifying mode are arranged on the rack and control the temperature and humidity of the test cavity. In this embodiment, the test sample is first placed on the PCB high temperature and high humidity test rack, and then the PCB high temperature and high humidity test rack is sent into the test cavity, and then the heating module and the humidifying module are started to heat and humidify the test cavity, and the test sample is tested in a high temperature and high humidity environment. The utility model fixes the test samples of different thicknesses respectively through the first card slot 1, the second card slot 2, and the third card slot 3 at the same position of multiple support plates 4; the test sample is vertically aligned with the corresponding card slot for high temperature and high humidity testing, so as to solve the problem that the water droplets of the sample tilted will fall on the surface of the test sample and seriously affect the test results. The utility model also has a locking assembly 8 arranged on the inner wall of the first card slot 1, the second card slot 2, and the third card slot 3, and the test sample inserted into the card slot is further fixed by the locking assembly 8; the stability of the test sample is improved. The original stainless steel 304 material is replaced with PEK material, and the bottom plate 5 is hollowed out to allow air to circulate quickly, solving the problem of the material absorbing heat during the test, causing the temperature in the box to fail to quickly reach the set temperature, which seriously affects the test.

[0040] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system or other device. In addition, the embodiments of the present utility model are not directed to any particular programming language.

[0041] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various aspects of the present invention, in the above description of the exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Among them, the claims that follow the specific embodiments are hereby expressly incorporated into the specific embodiments, wherein each claim itself serves as a separate embodiment of the present invention.

[0042] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0043] It should be noted that the above embodiments illustrate the utility model rather than limit the utility model, and those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets should not be constructed as a limitation on the claims. The word "comprising" does not exclude the existence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the existence of multiple such elements. The utility model can be implemented by means of hardware including several different elements and by means of appropriately programmed computers. In a unit claim that lists several devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words can be interpreted as names. The steps in the above embodiments should not be understood as limitations on the order of execution unless otherwise specified.

Claims

1. A PCB high temperature and high humidity test stand, characterized in that: The invention comprises a bracket body, wherein the bracket body is provided with at least two support plates (4); the support plate (4) is provided with a first card slot (1), a second card slot (2), and a third card slot (3), and the first card slot (1), the second card slot (2), and the third card slot (3) are sequentially and cyclically arranged at the upper end of the support plate (4); wherein the width of the first card slot (1), the width of the second card slot (2), and the width of the third card slot (3) are different from each other.

2. The PCB high temperature and high humidity test stand according to claim 1, characterized in that: The first card slot (1) is provided with a first groove at the bottom, the second card slot (2) is provided with a second groove at the bottom, and the third card slot (3) is provided with a third groove at the bottom.

3. The PCB high temperature and high humidity test stand according to claim 2, characterized in that: The cross-sectional shapes of the first groove, the second groove and the third groove are semicircular; the radius of the first groove is 0.5 mm, the radius of the second groove is 1 mm, and the radius of the third groove is 1.5 mm.

4. The PCB high temperature and high humidity test stand according to claim 2, characterized in that: The spacing between the first card slot (1) and the adjacent second card slot (2), the spacing between the second card slot (2) and the adjacent third card slot (3), and the spacing between the third card slot (3) and the adjacent first card slot (1) are all equal.

5. The PCB high temperature and high humidity test stand according to claim 1, characterized in that: At least one locking assembly (8) is arranged on the inner wall of each of the first card slot (1), the second card slot (2) and the third card slot (3); the locking assembly (8) comprises a first locking member and a second locking member, and a first locking groove (7) and a second locking groove are arranged on the inner walls on both sides of the first card slot (1), the second card slot (2) or the third card slot (3) respectively; the first locking member is elastically arranged in the first locking groove (7), and the first locking member is limited by the first locking groove (7), so that one end of the first locking member extends out of the first card slot (1), the second card slot (2) or the third card slot (3); the second locking member is elastically arranged in the second locking groove, and the second locking member is limited by the second locking groove, so that one end of the second locking member extends out of the first card slot (1), the second card slot (2) or the third card slot (3) is arranged.

6. The PCB high temperature and high humidity test stand according to claim 5, characterized in that: The first locking groove (7) and the second locking groove are groove structures with a width in the middle and a narrow end. The first locking member and the second locking member both comprise an elastic member (10) and a fastener (9). One end of the elastic member (10) is connected to the bottom of the first locking groove (7) or the second locking groove, and the other end of the elastic member (10) is connected to the fastener (9). The other end of the fastener (9) is telescopically protruding from the first card slot (1), the second card slot (2) or the third card slot (3).

7. The PCB high temperature and high humidity test stand according to claim 1, characterized in that: The support body is a PEK support; the support body comprises a bottom plate (5), and a plurality of support plates (4) are equidistantly distributed on the upper surface of the bottom plate (5).

8. The PCB high temperature and high humidity test stand according to claim 7, characterized in that: The bottom plate (5) is provided with a plurality of through holes (6), and the plurality of through holes (6) are evenly distributed between adjacent support plates (4).

9. The PCB high temperature and high humidity test stand according to claim 8, characterized in that: The width of the first card slot (1) is 1 mm, the width of the second card slot (2) is 2 mm, the width of the third card slot (3) is 3 mm, and the depths of the first card slot (1), the second card slot (2) and the third card slot (3) are all 20 mm; the spacing between the first card slot (1) and the adjacent second card slot (2), the spacing between the second card slot (2) and the adjacent third card slot (3), and the spacing between the third card slot (3) and the adjacent first card slot (1) are all 7.8 mm; the size of the through hole (6) is 45*25 mm, and both ends of the through hole (6) are provided with 180° fillets.

10. A testing device, characterized in that: It comprises a frame, a heating module and a humidification module. A test cavity is arranged inside the frame, and a PCB high temperature and high humidity test frame as described in any one of claims 1 to 9 is arranged inside the test cavity. The heating module and the humidification module are arranged on the frame and control the temperature and humidity of the test cavity.

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