Laser cleaning simulation galvanometer interface card

Abstract

The utility model relates to a laser cleaning simulation galvanometer interface card which comprises a circuit board and a control circuit arranged on the circuit board, and a communication interface on the control circuit is electrically connected with an electromagnetic compatibility module and a power supply time sequence module. The electromagnetic compatibility module is electrically connected with the first level conversion module through the differential receiving module and the differential driving module, the first level conversion module, the second level conversion module and the RTD module are electrically connected with the micro-control module, and the second level conversion module is electrically connected with the X-axis interface and the Y-axis interface through the first DAC module and the second DAC module respectively. The multiplexing module is electrically connected with the RTD module and the micro-control module, and the multiplexing module is electrically connected with a plurality of temperature sensor interfaces. The laser cleaning system has an interface signal EMC protection function, a temperature monitoring function and a debugging monitoring interface, functions and algorithms can be expanded, and functional requirements of the laser cleaning system can be better met.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic control, and particularly relates to a laser cleaning analog galvanometer interface card. Background Technique

[0002] Generally, the common analog galvanometer has only one DB25 interface for external communication, including the XY2-100 communication bus and the power interface. An interface card is generally designed at the external interface of the galvanometer for protocol and power conversion; the conventional galvanometer interface card is generally designed with discrete analog devices, and the subsequent analog galvanometer drive card is also designed with discrete analog devices, and function expansion cannot be carried out.

[0003] In the field of laser cleaning, extended functions such as temperature monitoring and status feedback need to be realized on the galvanometer side, and the interface cards of traditional analog galvanometers cannot meet the requirements; in addition, some traditional analog galvanometer interface cards do not provide EMC protection for interface signals, and the anti-interference ability of the whole machine is weak.

[0004] In summary, there is an urgent need to provide a laser cleaning analog galvanometer interface card that has the functions of EMC protection for interface signals, temperature monitoring, and debugging and monitoring interfaces, can expand functions and algorithms, and can better meet the functional requirements of the laser cleaning system. Content of the Utility Model

[0005] The purpose of the utility model is to provide a laser cleaning analog galvanometer interface card that has the functions of EMC protection for interface signals, temperature monitoring, and debugging and monitoring interfaces, can expand functions and algorithms, and can better meet the functional requirements of the laser cleaning system.

[0006] The above object is achieved by the following technical solution: A laser cleaning simulation galvanometer interface card, comprising a circuit board and a control circuit disposed on the circuit board. The control circuit includes a micro-control module, a power supply timing module, a communication interface, an electromagnetic compatibility module, a first level conversion module, a second level conversion module, a differential receiving module, a differential driving module, an X-axis interface, a Y-axis interface, a first DAC module, a second DAC module, an RTD module, and a multiplexing module. The communication interface is electrically connected to the electromagnetic compatibility module and the power supply timing module. The electromagnetic compatibility module is electrically connected to the first level conversion module through the differential receiving module and the differential driving module. The first level conversion module, the second level conversion module, and the RTD module are electrically connected to the micro-control module. The second level conversion module is electrically connected to the X-axis interface and the Y-axis interface through the first DAC module and the second DAC module respectively. The multiplexing module is electrically connected to the RTD module and the micro-control module. The multiplexing module is electrically connected with a plurality of temperature sensor interfaces. The power supply timing module is used to generate the power required for the laser cleaning simulation galvanometer and control the timing of the corresponding power supply. The differential receiving module is used to receive differential signals as single-ended signals. The differential driving module is used to drive single-ended signals as differential signals. The X-axis interface and the Y-axis interface are respectively used to electrically connect the X-axis motor drive card and the Y-axis motor drive card of the laser cleaning simulation galvanometer.

[0007] The communication interface of the utility model is an external interface, and a DB25 interface is preferably used, including an XY2-100 communication bus and a power supply interface. In a specific application process, the communication interface has an XY2-100 bus and a positive and negative 15V power supply input, and the positive and negative 15V power supply is input to a power supply timing module. The power supply timing module is used to generate the power required for the laser cleaning simulation galvanometer and control the timing of the corresponding power supply. It can generate -12V power supply, +5V power supply, +12V power supply, +3V3 power supply, and can control the timing of each power supply so that the -12V power supply is powered on first. , followed by +5V power supply, then +12V power supply, and finally +3V3 power supply; after the XY2-100 bus signal comes in through the DB25 interface, it is connected to the electromagnetic compatibility module. The electromagnetic compatibility module is used to protect EMC problems on the bus, such as differential surge, ESD, spike voltage, etc.; after the XY2-100 signal passes through the electromagnetic compatibility module, the 4 groups of differential signals for signal reception are connected to the differential receiving module, and the 2 groups of differential signals for signal feedback are connected to the differential driving module, where the function of the differential receiving module is to receive the differential signal as Single-ended signal, the function of the differential drive module is to drive the single-ended signal into a differential signal; the signals of the differential receiving module and the differential drive module are both connected to the first level conversion module, the first level conversion module is used to convert the 5V signal level and the 3V3 signal level, and the signal after the conversion is completed is connected to the microcontrol module or the first DAC module and the second DAC module, the first DAC1 module communicates with the microcontrol module, and the output analog voltage signal is connected to the X-axis interface, and the X-axis interface is connected to the X-axis motor drive card through a cable, the second DAC module communicates with the microcontrol module, and the output analog voltage signal is connected to the Y-axis interface, and the Y-axis interface is connected to the Y-axis motor drive card through a cable; the RTD module is a dedicated IC for the temperature sensor, which can read the temperature fed back by the temperature sensor, the multiplexing module is connected to the RTD module, and is also connected to the microcontrol module, the microcontrol module controls the multiplexing module, and the RTD module can poll multiple different temperature sensor interfaces in time sharing.

[0008] A further technical solution is that the microcontroller module is an FPGA. By using FPGA, the interface function can be independently developed and designed, which is more convenient for function expansion. In addition, its parallel processing mechanism is suitable for concurrent control, such as synchronous triggering of the XY axis, and the FPGA is more reasonable for the bus reception timing processing of XY2-100. The FPGA can adopt the domestic E-Finance T13 series.

[0009] A further technical solution is that the IO pins of the FPGA simulate three interfaces of SPI-X, SPI-Y, and SPI. The SPI-X and SPI-Y are electrically connected to the second level conversion module and communicate with the first DAC module and the second DAC module respectively. The FPGA is electrically connected to the RTD module through the SPI. In the specific application process, the two interfaces of SPI-X and SPI-Y are connected to the second level conversion module. The second level conversion module is used for the conversion between 5V signal level and 3V3 signal level. The converted signal is connected to the IO pins of the FPGA or the first DAC module or the second DAC module. The FPGA communicates with the first DAC module and the second DAC module through SPI-X and SPI-Y respectively. Among them, the two groups of SPI signals of SPI-X and SPI-Y share the SCLK and LDAC signals to ensure the synchronous control of the X-axis and Y-axis. The first DAC module communicates with the FPGA through SPI-X, and outputs an analog voltage signal to be connected to the X-axis interface. The X-axis interface is externally connected to the X-axis motor drive card through a cable. The second DAC module communicates with the FPGA through SPI-Y, and outputs an analog voltage signal to be connected to the Y-axis interface. The Y-axis interface is externally connected to the Y-axis motor drive card through a cable. The analog SPI interface of the FPGA is connected to the RTD module.

[0010] A further technical solution is that the multiple temperature sensor interfaces at least include a first temperature sensor interface, a second temperature sensor interface, a third temperature sensor interface, and a fourth temperature sensor interface. The first temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the X-axis reflecting mirror. The second temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the Y-axis reflecting mirror. The third temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the field lens. The fourth temperature sensor interface is used to connect a temperature sensor for monitoring the temperature inside the working chamber of the galvanometer reflecting mirror.

[0011] A further technical solution is that the temperature sensor is a platinum resistor or a thermocouple. When a platinum resistor is used, the RTD module is a dedicated IC for resistance temperature sensors, which can read the temperature feedback by the platinum resistor, specifically supporting platinum resistors PT-100 and PT-1000. The connection with the platinum resistor adopts a 4-wire connection, with high temperature feedback accuracy and good stability. During use, the temperature sensor is installed at the corresponding temperature monitoring position.

[0012] A further technical solution is that the control circuit is provided with a general-purpose IO module for indicating the overall state of the laser cleaning analog galvanometer. The general-purpose IO module is electrically connected to the IO pins of the FPGA. The overall state of the laser cleaning analog galvanometer indicated can include the functional state of the X-axis drive, the functional state of the Y-axis drive, the over-threshold state of the temperature, and the on state of the laser. Specifically, it can be indicated through the state of an external LED light.

[0013] A further technical solution is that the control circuit is provided with an LED indication circuit for indicating the working state of the laser cleaning analog galvanometer interface card, and the LED indication circuit is electrically connected to the IO pins of the FPGA.

[0014] A further technical solution is that the control circuit is provided with a UART debugging interface for debugging and function expansion, and the UART debugging interface is electrically connected to the IO pins of the FPGA. The UART debugging interface is a reserved debugging and monitoring interface.

[0015] Compared with the prior art, the laser cleaning analog galvanometer interface card of the present invention can expand functions and algorithms, can simultaneously monitor the working temperature of the X-axis reflecting lens, the working temperature of the Y-axis reflecting lens, the working temperature of the field lens, and the working chamber temperature of the galvanometer reflecting lens, and has a relevant working state indication function; secondly, it has an interface signal EMC protection function and a debugging and monitoring interface, which is convenient for debugging and later function expansion, and can better meet the functional requirements of the laser cleaning system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not constitute an improper limitation of the present invention.

[0017] Figure 1 It is a schematic structural block diagram of the laser cleaning analog galvanometer interface card according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The present invention will be described in detail below with reference to the drawings. The description of this part is only exemplary and explanatory, and should not have any restrictive effect on the protection scope of the present invention. In addition, those skilled in the art can make corresponding combinations of the features in the embodiments and different embodiments in this document according to the description of this document.

[0019] The embodiments of the present invention are as follows, with reference to Figure 1, a laser cleaning simulation galvanometer interface card, comprising a circuit board and a control circuit arranged on the circuit board. The control circuit includes a micro-control module, a power supply timing module, a communication interface, an electromagnetic compatibility module, a first level conversion module, a second level conversion module, a differential receiving module, a differential driving module, an X-axis interface, a Y-axis interface, a first DAC module, a second DAC module, an RTD module and a multiplexing module. The communication interface is electrically connected to the electromagnetic compatibility module and the power supply timing module. The electromagnetic compatibility module is electrically connected to the first level conversion module through the differential receiving module and the differential driving module. The first level conversion module, the second level conversion module and the RTD module are electrically connected to the micro-control module. The second level conversion module is electrically connected to the X-axis interface and the Y-axis interface through the first DAC module and the second DAC module respectively. The multiplexing module is electrically connected to the RTD module and the micro-control module. The multiplexing module is electrically connected with a plurality of temperature sensor interfaces. The power supply timing module is used to generate the power required for the laser cleaning simulation galvanometer and control the timing of the corresponding power supply. The differential receiving module is used to receive the differential signal as a single-ended signal. The differential driving module is used to drive the single-ended signal as a differential signal. The X-axis interface and the Y-axis interface are respectively used to electrically connect the X-axis motor driving card and the Y-axis motor driving card of the laser cleaning simulation galvanometer.

[0020] The communication interface of this utility model is an external interface, preferably using a DB25 interface, including an XY2-100 communication bus and a power interface. In the specific application process, the communication interface has an XY2-100 bus and positive and negative 15V power inputs. The positive and negative 15V power inputs are sent to the power sequence module. The power sequence module is used to generate the power required for the laser cleaning analog galvanometer and control the sequence of the corresponding power supplies. It can generate -12V power, +5V power, +12V power, and +3V3 power, and can control the sequence of each power supply, so that the -12V power is powered on first, followed by the +5V power, then the +12V power, and finally the +3V3 power. After the XY2-100 bus signal comes in through the DB25 interface, it is connected to the electromagnetic compatibility module. The electromagnetic compatibility module is used to protect the EMC problems on the bus, such as differential surges, ESD, spike voltages, etc. After the XY2-100 signal passes through the electromagnetic compatibility module, the 4 groups of differential signals for signal reception are connected to the differential reception module, and the 2 groups of differential signals for signal feedback are connected to the differential drive module. The function of the differential reception module is to receive the differential signal as a single-ended signal, and the function of the differential drive module is to drive the single-ended signal as a differential signal. The signals of the differential reception module and the differential drive module are both connected to the first level conversion module. The first level conversion module is used for the conversion between 5V signal level and 3V3 signal level. After the conversion is completed, the signal is connected to the micro control module or connected to the differential drive module. The second level conversion module is used for the conversion between 5V signal level and 3V3 signal level. The converted signal is connected to the micro control module or the first DAC module and the second DAC module. The first DAC1 module communicates with the micro control module and outputs an analog voltage signal connected to the X-axis interface. The X-axis interface is externally connected to the X-axis motor drive card through a cable. The second DAC module communicates with the micro control module and outputs an analog voltage signal connected to the Y-axis interface. The Y-axis interface is externally connected to the Y-axis motor drive card through a cable. The RTD module is a dedicated IC for temperature sensors, which can read the temperature feedback by the temperature sensor. The multiplexing module is connected to the RTD module and also connected to the micro control module. The micro control module controls the multiplexing module to enable the RTD module to poll multiple different temperature sensor interfaces in a time-sharing manner.

[0021] Based on the above embodiments, in another embodiment of this utility model, as Figure 1 , the micro control module is an FPGA. Using an FPGA, the interface functions can be independently developed and designed, which is more convenient for function expansion. In addition, its parallel processing mechanism is suitable for controls that require concurrency, such as the synchronous triggering of the X and Y axes. And the FPGA also processes the bus reception sequence of XY2-100 more reasonably. The FPGA can use the domestic ElingSi T13 series.

[0022] Based on the above embodiments, in another embodiment of this utility model, as Figure 1, the IO pins of the FPGA simulate three interfaces: SPI-X, SPI-Y, and SPI. The SPI-X and SPI-Y are electrically connected to the second level conversion module and communicate with the first DAC module and the second DAC module respectively. The FPGA is electrically connected to the RTD module through the SPI. In the specific application process, the two interfaces of SPI-X and SPI-Y are connected to the second level conversion module. The second level conversion module is used for the conversion between 5V signal level and 3V3 signal level. The converted signal is connected to the IO pins of the FPGA, or the first DAC module, or the second DAC module. The FPGA communicates with the first DAC module and the second DAC module through SPI-X and SPI-Y respectively. Among them, the two groups of SPI signals of SPI-X and SPI-Y share the SCLK and LDAC signals to ensure the synchronous control of the X-axis and Y-axis; the first DAC module communicates with the FPGA through SPI-X, and outputs an analog voltage signal to be connected to the X-axis interface. The X-axis interface is externally connected to the X-axis motor drive card through a cable; the second DAC module communicates with the FPGA through SPI-Y, and outputs an analog voltage signal to be connected to the Y-axis interface. The Y-axis interface is externally connected to the Y-axis motor drive card through a cable; the analog SPI interface of the FPGA is connected to the RTD module.

[0023] Based on the above embodiments, in another embodiment of the present invention, as Figure 1 , the multiple temperature sensor interfaces at least include a first temperature sensor interface, a second temperature sensor interface, a third temperature sensor interface, and a fourth temperature sensor interface. The first temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the X-axis reflecting mirror. The second temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the Y-axis reflecting mirror. The third temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the field lens. The fourth temperature sensor interface is used to connect a temperature sensor for monitoring the temperature inside the working chamber of the galvanometer reflecting mirror.

[0024] Based on the above embodiments, in another embodiment of the present invention, as Figure 1 , the temperature sensor is a platinum resistor or a thermocouple. When a platinum resistor is adopted, the RTD module is a dedicated IC for resistance temperature sensors, which can read the temperature feedback by the platinum resistor, specifically supporting platinum resistors PT-100 and PT-1000. The connection with the platinum resistor adopts a 4-wire connection, with high temperature feedback accuracy and good stability; during use, the temperature sensor is installed at the corresponding temperature monitoring position.

[0025] Based on the above embodiments, in another embodiment of the present invention, as Figure 1, the control circuit is provided with a general-purpose IO module for indicating the overall state of the laser cleaning analog galvanometer, and the general-purpose IO module is electrically connected to the IO pins of the FPGA. The overall state of the laser cleaning analog galvanometer to be indicated may include the functional state of the X-axis drive, the functional state of the Y-axis drive, the over-threshold state of the temperature, and the on state of the laser, and can be specifically indicated by the state of an external LED lamp.

[0026] Based on the above embodiments, in another embodiment of the present invention, as Figure 1 , the control circuit is provided with an LED indication circuit for indicating the working state of the interface card of the laser cleaning analog galvanometer, and the LED indication circuit is electrically connected to the IO pins of the FPGA.

[0027] Based on the above embodiments, in another embodiment of the present invention, as Figure 1 , the control circuit is provided with a UART debugging interface for debugging and function expansion, and the UART debugging interface is electrically connected to the IO pins of the FPGA. The UART debugging interface is a reserved debugging and monitoring interface.

[0028] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A laser cleaning simulation galvanometer interface card, comprising a circuit board and a control circuit arranged on the circuit board, characterized in that: The control circuit includes a microcontroller module, a power timing module, a communication interface, an electromagnetic compatibility module, a first level conversion module, a second level conversion module, a differential receiving module, a differential driving module, an X-axis interface, a Y-axis interface, a first DAC module, a second DAC module, an RTD module and a multiplexing module. The communication interface is electrically connected to the electromagnetic compatibility module and the power timing module. The electromagnetic compatibility module is electrically connected to the first level conversion module through the differential receiving module and the differential driving module. The first level conversion module, the second level conversion module and the RTD module are electrically connected to the microcontroller module. The level conversion module is electrically connected to the X-axis interface and the Y-axis interface through the first DAC module and the second DAC module respectively, the multiplexing module is electrically connected to the RTD module and the microcontroller module, the multiplexing module is electrically connected to a plurality of temperature sensor interfaces, the power timing module is used to generate the power required for the laser cleaning simulation galvanometer and control the timing of the corresponding power supply, the differential receiving module is used to receive the differential signal as a single-ended signal, the differential driving module is used to drive the single-ended signal as a differential signal, and the X-axis interface and the Y-axis interface are respectively used to electrically connect the X-axis motor driving card and the Y-axis motor driving card of the laser cleaning simulation galvanometer.

2. The laser cleaning simulation galvanometer interface card according to claim 1, characterized in that: The microcontrol module is FPGA.

3. The laser cleaning simulation galvanometer interface card according to claim 2, characterized in that: The IO pins of the FPGA simulate the SPI-X, SPI-Y and SPI three-way interfaces, the SPI-X and SPI-Y are electrically connected to the second level conversion module and communicate with the first DAC module and the second DAC module respectively, and the FPGA is electrically connected to the RTD module through the SPI.

4. The laser cleaning simulation galvanometer interface card according to claim 2, characterized in that: The multiple temperature sensor interfaces include at least a first temperature sensor interface, a second temperature sensor interface, a third temperature sensor interface and a fourth temperature sensor interface. The first temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the X-axis reflective lens, the second temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the Y-axis reflective lens, the third temperature sensor interface is used to connect a temperature sensor for monitoring the working temperature of the field mirror, and the fourth temperature sensor interface is used to connect a temperature sensor for monitoring the temperature inside the working cavity of the galvanometer reflective lens.

5. The laser cleaning simulation galvanometer interface card according to claim 4, characterized in that: The temperature sensor is a platinum resistor or a thermocouple.

6. The laser cleaning simulation galvanometer interface card according to any one of claims 2 to 4, characterized in that: The control circuit is provided with a general IO module for indicating the status of the laser cleaning simulation galvanometer, and the general IO module is electrically connected to the IO pin of the FPGA.

7. The laser cleaning simulation galvanometer interface card according to any one of claims 2 to 4, characterized in that: The control circuit is provided with an LED indicating circuit for indicating the working state of the laser cleaning simulation galvanometer interface card, and the LED indicating circuit is electrically connected to the IO pin of the FPGA.

8. The laser cleaning simulation galvanometer interface card according to any one of claims 2 to 4, characterized in that: The control circuit is provided with a UART debugging interface for debugging and function expansion, and the UART debugging interface is electrically connected to the IO pins of the FPGA.

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