Case and electronic equipment

Abstract

The utility model provides a case and electronic equipment, and relates to the technical field of electronic equipment. The case comprises a case body, and the case body is provided with a wiring area close to a side plate assembly; and the connecting supports are internally provided with mounting spaces used for mounting processor modules, connecting lines of the connecting supports are located in the wiring area, and the two connecting supports are arranged in the box body in a spaced and mirror symmetry mode in the first direction.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly relates to a chassis and an electronic device. Background Art

[0002] Currently, the assembly method of the graphics processor module is to assemble it into the chassis in the same direction. With this assembly method, when in an air-cooled configuration, the cable routing of the graphics processor module is complex and inconvenient for operation and maintenance. When in a water-cooled configuration, the density of cables and cold pipes is high, and high-speed cables and water pipes cross, making both assembly and operation and maintenance extremely difficult. Summary of the Utility Model

[0003] The purpose of the embodiments of this application is to provide a chassis and an electronic device, and mainly provide the following technical solutions:

[0004] In the first aspect of this application, a chassis is provided. The chassis includes: a box body, and the box body has a routing area close to the side plate assembly;

[0005] A connection bracket, the connection bracket has an installation space inside for installing a processor module, the connection lines of the connection bracket are located in the routing area, and the two connection brackets are arranged at intervals and symmetrically in mirror image along a first direction in the box body.

[0006] In some modified embodiments of the first aspect of this application, the side plate assembly includes a first side plate and a second side plate arranged opposite to each other. The first side plate has a first routing area on the side facing the second side plate, and the second side plate has a second routing area on the side facing the first side plate;

[0007] The connection lines of the connection bracket close to the first side plate are located in the first routing area, and the connection lines of the connection bracket close to the second side plate are located in the second routing area.

[0008] In some modified embodiments of the first aspect of this application, the side plate assembly further includes a bottom plate intersecting and connecting with the first side plate and the second side plate, and the connection bracket is connected to the bottom plate through a clamping member.

[0009] In some modified embodiments of the first aspect of this application, a first connection hole is opened at the central position of the side part of the connection bracket and in the direction perpendicular to the bottom plate for connecting the clamping member to the bottom plate;

[0010] The clamping member includes a first part and a second part forming a preset angle. A second connection hole corresponding to the first connection hole is opened on the first part for connecting a locking member to fix the clamping member and the connection bracket, and the second part is connected to the bottom plate through a locking member.

[0011] In some modified embodiments of the first aspect of the present application, the end of the connection bracket has a connection component and a heat dissipation component. The connection component is disposed in the box body near the side plate component for arranging the connection wires of the connection bracket;

[0012] The heat dissipation component is used to adapt to the length of the processor module and expose the end of the processor module, so that the processor module dissipates heat.

[0013] In some modified embodiments of the first aspect of the present application, one side of the connection bracket in the first direction has a first installation opening communicating with the installation space for inserting the processor module into the installation space. The first installation openings of the two connection brackets are arranged facing each other;

[0014] The first installation opening is detachably installed with a cover plate, and the first connection hole is provided on the cover plate.

[0015] In some modified embodiments of the first aspect of the present application, an installation edge is provided at the edge of the first installation opening corresponding to the side where the heat dissipation component is located on the connection bracket. The installation edge is attached to one end of the cover plate and is locked and fixed to the cover plate by at least two locking screws.

[0016] In some modified embodiments of the first aspect of the present application, hooks are symmetrically provided on the surface of the other end of the cover plate facing the installation space in a direction perpendicular to the bottom plate. The connection bracket is provided with clamping portions corresponding to the two hooks respectively. The hooks are movably clamped with the corresponding clamping portions to limit the relative position of the two in the first direction.

[0017] In some modified embodiments of the first aspect of the present application, bending portions are respectively provided on the opposite sides of the cover plate in a direction perpendicular to the bottom plate and on the side away from the heat dissipation component, which are bent toward the side where the installation space is located for fitting to the corresponding side walls of the connection bracket.

[0018] The second aspect of the present application provides an electronic device, which includes: a box body having a wiring area near the side plate component;

[0019] A connection bracket, the interior of which has an installation space, and the connection wires of the connection bracket are located in the wiring area; the two connection brackets are arranged in the box body at intervals along the first direction and are mirror-symmetric;

[0020] A main board, which has symmetrically arranged connectors, and the main board is disposed in the box body;

[0021] The processor module is disposed in the installation space of the connection bracket and is connected to the connector through the connection line. Description of the Drawings

[0022] By referring to the drawings and reading the detailed description below, the above and other objects, features, and advantages of the exemplary embodiments of the present application will become readily understandable. In the drawings, several embodiments of the present application are shown in an exemplary rather than restrictive manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0023] Figure 1 Schematically shows a schematic structural diagram of the chassis provided by the present application;

[0024] Figure 2 Schematically shows a schematic structural diagram of the connection bracket provided by the present application;

[0025] Figure 3 Schematically shows a schematic structural diagram of the connection bracket after removing the cover plate provided by the present application;

[0026] Figure 4 Schematically shows a schematic structural diagram of the interior of the connection bracket after disassembly provided by the present application;

[0027] Figure 5 Schematically shows a schematic structural diagram of the connection bracket provided by the present application from another angle;

[0028] Figure 6 Schematically shows a schematic partial structural diagram of the connection bracket provided by the present application;

[0029] Figure 7 Schematically shows a schematic structural diagram of the cover plate of the connection bracket provided by the present application;

[0030] Explanation of the Reference Numerals in the Drawings:

[0031] 1. Cabinet; 11. First side plate; 12. Second side plate; 13. Bottom plate; 101. Wiring area;

[0032] 2. Connection bracket; 201. First installation space; 202. First installation opening; 203. Second installation space; 204. Second installation opening; 205. Installation edge; 206. Clamping portion; 211. Connection component; 212. Heat dissipation component; 2121. Heat dissipation opening; 2122. Installation beam; 213. Cover plate; 2131. Hook; 2132. Bending portion; 2133. First connection hole; 214. Engaging member; 2141. First part; 2142. Second part;

[0033] 3. Processor module; 31. Graphics processing unit; 32. Adapter card;

[0034] x, the first direction. Detailed implementation manners

[0035] The exemplary implementation manners of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary implementation manners of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the implementation manners set forth herein. On the contrary, these implementation manners are provided so that the present disclosure can be understood more thoroughly and the scope of the present disclosure can be completely conveyed to those skilled in the art.

[0036] It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meanings understood by those skilled in the art to which this application belongs.

[0037] Embodiment 1

[0038] Refer to the attached Figure 1 and the attached Figure 2 , Embodiment 1 of the present application provides a chassis, which includes: a box body 1, the box body 1 having a wiring area 101 close to the side plate assembly; and a connection bracket 2, the connection bracket 2 having an installation space inside for installing a processor module 3, the connection wires of the connection bracket 2 being located in the wiring area 101, and the two connection brackets 2 being arranged at intervals and mirror-symmetrically along the first direction x in the box body 1.

[0039] Specifically, the chassis provided in this embodiment is a housing structure of an electronic device. Here, the electronic device can be, but is not limited to, a server. The chassis is formed by enclosing a bottom plate 13, a side plate assembly, and a top plate to form a box body 1 structure with an opening on one side. The inside of the chassis has a wiring area 101 close to the side plate assembly for arranging connection wires; the connection bracket 2 is installed in the box body 1, and it has an installation space inside for installing a processor module 3. Here, the processor module 3 can include, but is not limited to, multiple Graphics Processing Units (GPUs) 31. After the processor module 3 is installed on the connection bracket 2, connection wires such as cables or water cooling pipes need to be connected. For example: the connection wires connected to the processor module 3 include high-speed wires, and the high-speed wires are connected to the motherboard to achieve signal transmission and communication between the processor module 3 and the motherboard; two connection brackets 2 can be provided in the box body 1 for installing two processor modules 3. To avoid the problem of the connection wires connected after the installation of the two processor modules 3 being crossed and the wiring being complicated, in the technical solution adopted in the present application, the two connection brackets 2 are arranged at intervals and mirror-symmetrically along the first direction x in the box body 1, and at least part of the connection wires connected to each connection bracket 2 are arranged from the wiring area 101 of the side plate assembly. Such an arrangement can improve the symmetry of the layout in the box body 1 and can reduce the problem of wire crossing, and can reduce the complexity of wire management.

[0040] As listed above, an embodiment of the present application provides a chassis, which can enable symmetric wire routing on both sides inside the cabinet 1, facilitating the reduction of wire crossing, and making the layout inside the chassis more symmetric and uniform, which is beneficial to the uniformity of heat dissipation inside the cabinet 1, reducing system impedance, improving heat dissipation efficiency, facilitating equipment assembly and subsequent operation and maintenance. Moreover, the connecting wires do not cross the motherboard and are routed from both sides of the cabinet 1, which also improves the EMC electromagnetic interference to a certain extent. In addition, such a layout method makes the layout of the connecting wires clearer and more reasonable, thus reducing the types of different lengths of the connecting wires and facilitating cost control.

[0041] Further, referring to the appendix Figure 1 In a specific implementation, the side plate assembly includes a first side plate 11 and a second side plate 12 which are oppositely arranged. The first side plate 11 has a first wire routing area on the side facing the second side plate 12, and the second side plate 12 has a second wire routing area on the side facing the first side plate 11. The connecting wires of the connection bracket 2 arranged close to the first side plate 11 are located in the first wire routing area, and the connecting wires of the connection bracket 2 arranged close to the second side plate 12 are located in the second wire routing area.

[0042] Specifically, in order to achieve this, in the technical solution adopted by the present application, the side plate assembly includes a first side plate 11 and a second side plate 12 which are oppositely arranged in the first direction x. The first side plate 11 has a first wire routing area on the side facing the second side plate 12, and the second side plate 12 has a second wire routing area on the side facing the first side plate 11. The above-mentioned wire routing area 101 includes the first wire routing area and the second wire routing area. Such a design enables at least part of the connecting wires connected to the processor module 3 installed in the connection bracket 2 installed close to the first side plate 11 to be arranged in the first wire routing area, and enables at least part of the connecting wires connected to the processor module 3 installed in the connection bracket 2 installed close to the second side plate 12 to be arranged in the second area, thereby realizing a symmetric layout inside the chassis and facilitating wire management. The first wire routing area is arranged on the first side plate 11 close to the connection bracket 2 on the same side, and the second wire routing area is arranged on the second side plate 12 close to the connection bracket 2 on the same side. The first wire routing area and the second wire routing area can be specifically divided based on the principle of minimizing and simplifying the wire routing paths of the corresponding connecting wires. The first wire routing area and the second wire routing area can be oppositely arranged and symmetric to each other. Since high-speed signals will experience attenuation due to characteristics such as resistance, capacitance, and inductance during transmission, and reflection and interference will occur due to discontinuity and impedance mismatch to the same, reducing the wire routing length of the connecting wires can reduce the loss of high-speed signals.

[0043] Further, referring to the appendix Figure 1, in a specific implementation, the side plate assembly further includes a bottom plate 13 intersecting and connected to the first side plate 11 and the second side plate 12, and the connecting bracket 2 is connected to the bottom plate 13 through a clamping member 214.

[0044] Specifically, in order to achieve the symmetrical layout of the two connecting brackets 2 in the box body 1, in the technical solution adopted in this application, the side plate assembly further includes a bottom plate 13 at the bottoms of the first side plate 11 and the second side plate 12 and rubber-connected to the first side plate 11 and the second side plate 12. The two connecting brackets 2 are installed on the bottom plate 13 and are respectively installed close to the first side plate 11 and the second side plate 12. The connecting bracket 2 can be specifically connected to the bottom plate 13 through the clamping member 214. The two clamping members 214 can be respectively located on the surfaces of the two opposite sides of the two connecting brackets 2, which can facilitate the installation of the connecting bracket 2, and can achieve the symmetrical and spaced layout of the two connecting brackets 2, and can enable the two connecting brackets to adopt the same assembly method and can be reused, and can reduce the types of structural parts developed.

[0045] Further, referring to the attached Figure 1 and the attached Figure 2 , in a specific implementation, a first connection hole 2133 is opened at the center position of the side part of the connecting bracket 2 and in the direction perpendicular to the bottom plate 13, for connecting the clamping member 214 to the bottom plate 13; the clamping member 214 includes a first part 2141 and a second part 2142 forming a preset angle. A second connection hole corresponding to the first connection hole 2133 is opened on the first part 2141, for connecting a locking member to fix the clamping member 214 and the connecting bracket 2, and the second part 2142 is connected to the bottom plate 13 through a locking member.

[0046] Specifically, in order to achieve the installation of the connecting bracket 2, in the technical solution adopted in this application, first connection holes 2133 are opened at the center positions of the opposite side parts of the two connecting brackets 2 and in the direction perpendicular to the bottom plate 13, for connecting the clamping member 214 to the bottom plate 13. The setting position of the first connection hole 2133 can realize the reuse of the two connecting brackets 2 and the corresponding connecting lines, can reduce the types of structural parts developed, and can reduce the types of different lengths of the connecting lines, and can make the lengths of the connecting lines more standardized and normalized; the clamping member 214 can be set as an "L" - shaped structure, specifically including a first part 2141 and a second part 2142 forming a preset angle. Here, the preset angle can be but is not limited to 90 degrees. A second connection hole corresponding to the first connection hole 2133 is opened on the first part 2141, for connecting a locking member to lock and fix with the connecting bracket 2. The second part 2142 is attached to the bottom plate 13 and is connected to the bottom plate 13 through a locking member. The locking connection can be but is not limited to a screw, etc.

[0047] Among them, in addition to being connected to the base plate 13 through the snap-fitting piece 214, in order to improve the connection strength between the connecting bracket 2 and the base plate 13, one end of the connecting bracket 2 close to the opening of the chassis can be directly connected to the base plate 13 through a locking piece. This position is directly connected to the base plate 13 for ease of operation and can improve the stability of the installation of the connecting bracket 2.

[0048] For further information, see Attachment Figure 2 -Attached Figure 5 In a specific implementation, the installation space of the connecting bracket 2 includes a first installation space 201, which is used to adapt and install multiple graphics processor units 31 of the processor module 3. The connecting bracket 2 has a first installation port 202 connected to the first installation space 201 on one side in the first direction x. Multiple graphics processor units 31 can be plugged into the first installation space 201 through the first installation port 202. The first installation ports 202 of the two connecting brackets 2 are arranged in opposite directions; a connecting component 211 is provided on one side of the connecting bracket 2. The connecting component 211 can be specifically located on a side of the connecting component 211 close to its corresponding side panel component, and is used to arrange the connecting wires of the connecting bracket 2. The connecting wires here may include The high-speed line and the power line can be specifically connected by the adapter card 32 of the processor module 3 located on the side of the connecting bracket 2. The adapter card 32 can be directly locked to the side of the connecting bracket 2 by a locking piece, or the installation space of the connecting bracket 2 can include a second installation space 203 located on the side, and the second installation port 204 of the second installation space 203 is located on the side away from the opening of the chassis. The adapter card 32 can be plugged into the second installation space 203 through the second installation port 204, so that a connecting line can be set at the second installation port 204; wherein, the first installation space 201 and the second installation space 203 of the connecting bracket 2 are connected so that the graphics processor unit 31 can be electrically connected to the adapter card 32.

[0049] For further information, see Attachment Figure 2 -Attached Figure 5 In a specific implementation, the end of the connecting bracket 2 has a heat dissipation component 212, and the heat dissipation component 212 is used to adapt to the length of the processor module 3 and expose the end of the processor module 3 so that the processor module 3 can dissipate heat.

[0050] Specifically, in the technical solution adopted by the present application, the end of the connection bracket 2 is provided with a heat dissipation component 212. The heat dissipation component 212 is connected to the first installation space 201 and is used to adapt to the length of the graphics processing unit 31 of the processor module 3. Moreover, it has a heat dissipation port 2121 on the same side as the second installation port 204, which can expose the end of the graphics processing unit 31 to dissipate heat from the graphics processing unit 31. Based on the different heat dissipation methods of the graphics processing unit 31, when its heat dissipation method is water cooling, the size of the heat dissipation component 212 is relatively small, and the end of the graphics processing unit 31 is connected with a water cooling pipe. By the symmetrical layout of the two connection brackets 2 in the box body 1 and the way that the connecting wires are arranged in the wiring area 101 of the side plate assembly, the crossing of the water cooling pipe and the connecting wires can be avoided, which is beneficial to reducing the complexity of the wiring in the box body 1. When the heat dissipation method of the graphics processing unit 31 is air cooling, the size of the graphics processing unit 31 in this direction is relatively large, so the size of the heat dissipation component 212 is relatively large. In order to further fix the processor module 3, at least one installation beam 2122 extending in a direction perpendicular to the bottom plate 13 is provided at the heat dissipation port 2121. The installation beam 2122 is connected to a plurality of locking screws to be respectively locked and connected to each graphics processing unit 31.

[0051] Further, referring to Appendix Figure 2 and Appendix Figure 7 , in a specific implementation, a cover plate 213 is detachably installed at the first installation port 202, and the first connection hole 2133 is provided on the cover plate 213.

[0052] Specifically, in order to install the connection bracket 2 in the box body 1, in the technical solution adopted by the present application, a cover plate 213 is installed at the first installation port 202 of the connection bracket 2. The cover plate 213 is adapted to the first installation port 202 and can close the first installation space 201. Moreover, the above-mentioned first connection hole 2133 is provided on the cover plate 213.

[0053] Further, referring to Appendix Figure 2 and Appendix Figure 4 , in a specific implementation, an installation edge 205 is provided at the edge of the first installation port 202 corresponding to the side where the heat dissipation component 212 is located on the connection bracket 2. The installation edge 205 is attached to one end of the cover plate 213 and is locked and fixed to the cover plate 213 through at least two locking screws.

[0054] Specifically, in order to achieve the installation and fixation of the cover plate 213 and the connection bracket 2, in the technical solution adopted in this application, an installation edge 205 is provided at the edge of the first installation opening 202 corresponding to the side where the connection bracket 2 is located in the heat dissipation component 212. The installation edge 205 is parallel to the plane where the first installation opening 202 is located, so that when the cover plate 213 closes the first installation opening 202, its end can be attached to the installation edge 205, and the cover plate 213 and the connection bracket 2 can be locked and fixed by at least two locking screws.

[0055] Further, referring to the attached Figure 6 and the attached Figure 7 In order to further achieve the fixing effect between the cover plate 213 and the connection bracket 2, in a specific implementation, two hooks 2131 are provided on the surface of the other end of the cover plate 213 opposite to the installation edge 205 and facing the first installation space 201. The two hooks 2131 are symmetrically arranged in the direction perpendicular to the bottom plate 13. Correspondingly, in the first installation space 201 of the connection bracket 2, there are engaging parts 206 respectively corresponding to the two hooks 2131. When the cover plate 213 closes the first installation opening 202, the hooks 2131 are movably engaged with the corresponding engaging parts 206, which can realize the reliable positioning and fixing of the cover plate 213 and the connection directly.

[0056] Further, referring to the attached Figure 7 In a specific implementation, on the two opposite sides of the cover plate 213 in the direction perpendicular to the bottom plate 13 and on the side away from the heat dissipation component 212, there are respectively provided bending parts 2132 that are bent towards the side where the installation space is located. The bending parts can be set perpendicular to the cover plate 213. When the cover plate 213 closes the first installation opening, the bending parts are attached to the corresponding side walls of the connection bracket 2, thereby realizing reliable connection.

[0057] Embodiment Two

[0058] Referring to the attached Figure 1 In Embodiment Two of this application, an electronic device is proposed. The electronic device includes: a box body 1, the box body 1 has a wiring area 101 close to the side plate assembly; a connection bracket 2, the connection bracket 2 has an installation space inside, and the connecting wire of the connection bracket 2 is located in the wiring area 101; two connection brackets 2 are arranged in the box body 1 at intervals and mirror-symmetrically along the first direction x; a main board, the main board has symmetrically arranged connectors, and the main board is arranged in the box body 1; a processor module 3, arranged in the installation space of the connection bracket 2 and connected to the connector through the connecting wire.

[0059] Specifically, the electronic device provided in this embodiment may be, but is not limited to, a server. The box body 1 is the housing structure of the electronic device. A main board, two connection brackets 2, and two processor modules 3 are arranged inside the box body 1. The two connection brackets 2 are arranged at intervals and symmetrically in mirror image along the first direction x inside the box body 1. An installation space is respectively arranged inside each connection bracket 2 for installing the processor module 3. The connection lines connected to the processor module 3 are led out through the connection bracket 2 and arranged in the wiring area 101 of the side plate assembly to be connected to the connector on the main board, realizing the connection between the processor module 3 and the connector on the main board, and being able to achieve symmetrical wire outlet on both sides inside the box body 1, which is beneficial to reducing the crossing of connection lines, and can make the layout and wiring inside the chassis more symmetrical and uniform, which is beneficial to the uniformity of heat dissipation inside the box body 1 of the electronic device, reducing the system impedance, and improving the heat dissipation efficiency.

[0060] It should be noted that in the description of this specification, the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application; terms such as "connection", "installation", and "fixation" should all be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] In the description of this specification, the description of terms such as "one embodiment", "some embodiments", and "specific embodiments" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or instance. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0062] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application, and all should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A chassis, characterized in that: include: A box body, wherein the box body has a wiring area close to the side panel assembly; A connecting bracket has an installation space inside for installing a processor module, a connecting line of the connecting bracket is located in the wiring area, and two connecting brackets are spaced apart and mirror-symmetrically arranged in the box along a first direction.

2. The chassis according to claim 1, characterized in that: The side panel assembly comprises a first side panel and a second side panel which are arranged opposite to each other, wherein a side of the first side panel facing the second side panel has a first wiring area, and a side of the second side panel facing the first side panel has a second wiring area; The connection line of the connection bracket arranged near the first side panel is located in the first wiring area, and the connection line of the connection bracket arranged near the second side panel is located in the second wiring area.

3. The chassis according to claim 2, characterized in that: The side panel assembly further comprises a bottom panel intersecting and connected with the first side panel and the second side panel, and the connecting bracket is connected with the bottom panel via a clamping member.

4. The chassis according to claim 3, characterized in that: A first connection hole is provided on the side of the connection bracket and at the center position perpendicular to the bottom plate, for connecting the engaging member to the bottom plate; The engaging member includes a first part and a second part forming a preset angle, the first part is provided with a second connecting hole corresponding to the first connecting hole, which is used to connect a locking member to fix the engaging member and the connecting bracket, and the second part is connected to the base plate through the locking member.

5. The chassis according to claim 4, characterized in that: The end of the connecting bracket has a connecting component and a heat dissipation component, and the connecting component is arranged in the box body close to the side plate component for arranging the connecting line of the connecting bracket; The heat dissipation component is used to adapt to the length of the processor module and expose the end of the processor module so that the processor module can dissipate heat.

6. The chassis according to claim 5, characterized in that: The connecting bracket has a first installation opening on one side in the first direction that is connected to the installation space and is used to plug the processor module into the installation space, and the first installation openings of the two connecting brackets are arranged in opposite directions; The first installation opening is detachably provided with a cover plate, and the cover plate is provided with the first connecting hole.

7. The chassis according to claim 6, characterized in that: The edge of the first mounting opening corresponding to the side where the heat dissipation component is located of the connecting bracket is provided with a mounting edge, and the mounting edge is fitted with one end of the cover plate and is locked and fixed to the cover plate by at least two locking screws.

8. The chassis according to claim 7, characterized in that: The other end of the cover plate and the surface facing the installation space are symmetrically provided with hooks in a direction perpendicular to the base plate, and the connecting bracket is provided with clamping parts corresponding to the two hooks respectively, and the hooks are movably clamped with the corresponding clamping parts to limit the relative positions of the two in the first direction.

9. The chassis according to claim 7, characterized in that: The cover plate is provided with bending portions bent toward the side where the installation space is located on two opposite sides in a direction perpendicular to the bottom plate and on a side away from the heat dissipation assembly, respectively, for fitting to the corresponding side walls of the connecting bracket.

10. An electronic device, characterized in that: include: A box body, wherein the box body has a wiring area close to the side panel assembly; A connecting bracket, wherein the connecting bracket has an installation space inside, and the connecting wire of the connecting bracket is located in the wiring area; two connecting brackets are spaced apart along a first direction and are arranged in the box in a mirror-symmetrical manner; A mainboard, the mainboard having symmetrically arranged connectors, and the mainboard is arranged in the box; The processor module is arranged in the installation space of the connecting bracket and is connected to the connector through the connecting line.

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