Chip structure of battery cooler
By adding a middle partition wave structure to the battery cooler chip to form a U-shaped runner, the problems of poor welding and insufficient heat dissipation performance are solved, and higher welding strength and heat dissipation efficiency are achieved.
Patent Information
- Application Number
- CN202421797382.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-29
AI Technical Summary
The welding part between the existing battery cooler chips has a simple structure and does not have a good contact area. It is prone to poor welding defects such as dummy welding and desoldering. The space utilization rate is low, and the contact area between the heat exchange medium and the chip is small, resulting in insufficient heat dissipation performance.
By adding the intermediate partition wave structure, the first chip and the second chip form a U-shaped runner, increasing the welding contact area and the contact area between the heat exchange medium and the chip, and improving the overall strength and heat dissipation performance.
It improves the overall strength after welding, solves the problems of dummy welding and desoldering, increases the contact area between the heat exchange medium and the chip, improves the heat dissipation performance, and has the advantages of simple and reasonable structure.
Smart Images
Figure CN222914927U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a cooling module component of a new energy vehicle, and particularly to a battery cooler chip structure. Background Art
[0002] Most new energy vehicles are powered by battery packs. The battery pack can exert its maximum energy efficiency only at a suitable working temperature, and a battery cooler is required to control the temperature of the power battery. The main functions of the battery cooler include avoiding the risk of explosion or failure of the battery pack due to thermal runaway, playing a heat preservation role and having a rapid heating function when the temperature of the battery pack is too low, and maintaining the temperature balance of the battery pack. This requires the battery cooler to have good reliability and heat dissipation performance. The welding part structure between the existing battery cooler chips is simple, without a good contact area, and it is easy to have poor welding defects such as virtual soldering and desoldering after welding; in a limited space, the space utilization rate is low, and the contact area between the heat exchange medium and the chip is small, resulting in insufficient heat dissipation performance. Summary of the Invention
[0003] In order to solve the technical problems that the welding part structure between the existing battery cooler chips is simple, without a good contact area, and it is easy to have poor welding defects such as virtual soldering and desoldering after welding; in a limited space, the space utilization rate is low, and the contact area between the heat exchange medium and the chip is small, resulting in insufficient heat dissipation performance, the utility model provides a battery cooler chip structure, which can improve the overall strength after welding, increase the contact area between the heat exchange medium and the chip, and enhance the heat dissipation performance by adding an intermediate partition wave structure.
[0004] The technical solution for solving the above technical problems is: a battery cooler chip structure, including a first chip and a second chip. The first chip is an intermediate partition single wave structure, and the second chip is an intermediate partition double wave structure. The gap between the intermediate partition single wave structure of the first chip and the intermediate partition double wave structure of the second chip fits to form a barrier, and the first chip and the second chip form a U-shaped flow channel.
[0005] The first chip and the second chip are stacked into a plurality of combinations to form a plurality of U-shaped flow channels, and the combinations of a plurality of first chips and second chips are welded into an integral body through a brazing furnace.
[0006] The first chip and the second chip are made of double-sided solder material.
[0007] The first chip and the second chip are stamped to form an intermediate partition wave structure.
[0008] The utility model has the following beneficial effects:
[0009] By adding an intermediate partition wave structure, the welding contact area between the first chip and the second chip is increased, which is beneficial to improving the overall strength after welding; the intermediate partition wave structure between the two chips forms a U-shaped flow channel, increasing the contact area between the heat exchange medium and the chips, which is beneficial to improving the heat dissipation performance, and has the advantages of simple and reasonable structure. Brief Description of the Drawings
[0010] Figure 1 is a schematic structural diagram of the first chip of the present utility model.
[0011] Figure 2 is a schematic structural diagram of the second chip of the present utility model.
[0012] Figure 3 is a schematic diagram of the multi-layer assembly of the first chip and the second chip of the present utility model.
[0013] Figure 4 is a cross-sectional view after the first chip and the second chip of the present utility model are assembled.
[0014] Figure 5 is a U-shaped flow diagram of the heat exchange medium after the first chip and the second chip of the present utility model are assembled.
[0015] The labels in the figure are: the first chip 1, the second chip 2, the first chip 1, the intermediate partition single wave structure 3, the second chip 2, and the intermediate partition double wave structure 4. Detailed Description of the Preferred Embodiments
[0016] The technical composition of the present utility model will be further described in detail below with reference to the drawings and embodiments.
[0017] As Figures 1 to 4 shown, a battery cooler chip structure includes a first chip 1 and a second chip 2. The first chip 1 is formed with an intermediate partition single wave structure 3 by stamping, and the second chip 2 is formed with an intermediate partition double wave structure 4 by stamping. After the first chip 1 and the second chip 2 are assembled, the intermediate partition wave structure 3 of the first chip 1 is closely attached to the intermediate partition wave structure 4 of the second chip 2. A U-shaped flow channel is formed between the first chip 1 and the second chip 2. At the same time, multiple U-shaped flow channels can be formed by stacking the number of the first chip 1 and the second chip 2, and they are welded into an integral body through a brazing furnace.
[0018] Working Principle and Process:
[0019] In this utility model, a single-wave structure with an intermediate partition is added to the first chip 1, and a double-wave structure with an intermediate partition is added to the second chip 2. After assembly, they are closely fitted together, forming a U-shaped flow channel between the two chips, which increases the contact area between the first chip 1 and the second chip 2, improves the overall strength after welding, and solves the problems of poor welding, virtual soldering, and desoldering between the chips of the existing battery cooler; at the same time, the U-shaped flow channel formed by the wavy structure with an intermediate partition between the two chips increases the contact area between the heat exchange medium and the chips, and the wavy structure with an intermediate partition forms a disturbance during the heat exchange between the heat exchange medium and the chips, thereby increasing the heat dissipation efficiency.
Claims
1. A battery cooler chip structure, characterized in that: It includes a first chip and a second chip, the first chip is a single-wave structure with a middle partition, the second chip is a double-wave structure with a middle partition, the gap between the single-wave structure with a middle partition of the first chip and the double-wave structure with a middle partition of the second chip is fitted together to form a barrier, and the first chip and the second chip form a U-shaped flow channel.
2. A battery cooler chip structure according to claim 1, characterized in that: The first chip and the second chip are stacked into a plurality of assemblies to form a plurality of U-shaped flow channels, and the assemblies of the first chip and the second chip are welded into a whole.
3. A battery cooler chip structure according to claim 1, characterized in that: The first chip and the second chip are made of double-sided solder material.
4. A battery cooler chip structure according to claim 1, characterized in that: The first chip and the second chip are punched to form a wave-like structure with a middle partition.