Servo driver
By adopting the modular structure of the three-layer PCB board and the optimized heat dissipation design, the problem of poor heat dissipation effect of the servo drive is solved, miniaturized and efficient heat dissipation are achieved, and the overall performance and application flexibility of the drive are improved.
Patent Information
- Application Number
- CN202421760673.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-24
AI Technical Summary
The existing servo drives have the problem of poor heat dissipation effect, which is difficult to achieve miniaturization, which limits its application in small devices.
A servo driver is designed, adopting a modular structure of a three-layer PCB board, including an IO board, a control board and a power board. The power board is installed on the heat dissipation base plate and is connected by copper studs to optimize the heat dissipation effect.
It realizes the overall size of the servo drive, optimized heat dissipation, modular design and convenient testing, and improves the thermal management efficiency and application flexibility of the drive.
Smart Images

Figure CN222916464U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a controller, in particular to a servo driver. Background Art
[0002] A servo driver is a controller used to control a servo motor and belongs to a part of a servo system, mainly for high-precision positioning systems. Generally, the servo motor is controlled in three ways: position, speed, and torque to achieve high-precision positioning of the transmission system.
[0003] Servo drivers are widely used in industrial control and automated production products, such as 3C automation, single-axis manipulators, logistics, and other automated control industries. With the rapid development of the automation industry, small devices play an increasingly important role in the fields of life and industry. However, due to size limitations, small devices often cannot use traditional servo systems.
[0004] At the same time, existing servo drivers have problems such as poor heat dissipation. Therefore, how to miniaturize the servo driver and improve the heat dissipation performance has become a technical problem to be solved. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a servo driver to overcome the defects of the existing technologies described above.
[0006] The purpose of the utility model can be achieved by the following technical solutions:
[0007] According to one aspect of the utility model, a servo driver is provided, which includes a housing, a three-layer PCB board, and a heat dissipation bottom plate. After the housing and the heat dissipation bottom plate are connected, a space for placing the three-layer PCB board is formed. The three-layer PCB board includes an IO board, a control board, and a power board. The power board is installed on the heat dissipation bottom plate, the control board is installed on the power board, and the IO board is installed on the control board.
[0008] As a preferred technical solution, the housing is provided with a driver operation status indicator light and a driver communication status indicator light.
[0009] As a preferred technical solution, the driver operation status indicator light and the driver communication status indicator light are separately wired on the IO board and are displayed using light guide columns.
[0010] As a preferred technical solution, the IO board is provided with an IO connector and an encoder connector.
[0011] As a preferred technical solution, the control board is provided with a communication interface, and the communication interface is a CANopen communication interface or a 485 communication interface.
[0012] As a preferred technical solution, a power supply interface and a motor interface are provided on the power board.
[0013] As a preferred technical solution, the power board is mounted on the heat dissipation bottom plate through copper studs.
[0014] As a preferred technical solution, the control board is mounted on the power board through copper studs.
[0015] As a preferred technical solution, the IO board is mounted on the control board through screws and copper studs.
[0016] As a preferred technical solution, the housing is connected to the IO board through screws and is connected to the heat dissipation bottom plate by a snap connection method.
[0017] Compared with the prior art, the utility model has the advantages of small overall size, optimized heat dissipation, modularization, convenient testing, etc. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is an exploded structural schematic diagram of the utility model;
[0019] Figure 2 is a top view structural schematic diagram of the utility model;
[0020] Figure 3 is a three-dimensional structural schematic diagram of the utility model;
[0021] Figure 4 is a three-dimensional structural schematic diagram of another perspective of the utility model;
[0022] Wherein 1. housing, 2. IO board, 3. control board, 4. power board, 5. heat dissipation bottom plate, 21. IO connector, 22. encoder connector, 31. communication interface, 41. power supply interface, 42. motor interface, 61. driver operation status indicator light, 62. driver communication status communication indicator light. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.
[0024] As Figure 1As shown in the figure, a servo driver includes a housing (1), a three-layer PCB board, and a heat dissipation bottom plate 5. After the housing 1 and the heat dissipation bottom plate 5 are connected, a space for placing the three-layer PCB board is formed. The three-layer PCB board includes an IO board 2, a control board 3, and a power board 4. The power board 4 is installed on the heat dissipation bottom plate 5, the control board 3 is installed on the power board 4, and the IO board 2 is installed on the control board 3.
[0025] Specifically, in the present utility model, the status indicator light and the alarm indicator light of the communication interface are separately wired on the IO board and displayed on the upper surface of the driver using a light guide column, making it more convenient for users to observe the indicator lights; for the layout of the three PCB boards, the encoder, IO, communication interface, power supply interface, motor interface, and USB connector adopt the layout structure of three PCB boards.
[0026] The present utility model has the following advantages:
[0027] Modularity: The functions of the driver are distributed on three independent PCBs, enabling a highly modular design. In this way, individual drive modules can be easily added, replaced, or upgraded as needed without modifying the entire system. Among them, the control board 3 can select a PCB board with a CANopen communication interface or a 485 communication interface to form two models of the driver, namely EC and RC.
[0028] Optimized heat dissipation: The design of the three PCB boards can make more effective use of space for heat dissipation. Distributing the drive circuit on multiple PCBs helps to disperse heat, and the air circulation between the layers of the PCB boards is also beneficial to heat dissipation, thereby improving the overall thermal management efficiency of the driver.
[0029] Convenient testing: The modular PCB design of the three boards makes the assembly and testing during the production process simpler. Since each module can be tested independently, the PCB where the problem lies can be quickly located. When a problem is found, only the corresponding module needs to be replaced instead of the entire system, reducing the maintenance cost.
[0030] Small overall size: The layout of stacking the three PCB boards makes the overall volume of the driver small and the integration degree high, without occupying too much area for installing the driver, which is convenient for application in small devices.
[0031] As Figures 2 - 4 shown, for the servo driver of the present utility model, there is a driver operation status indicator light 61 on the left side of the housing 1, and a driver communication status indicator light 62 on the right side; there is an IO connector 21 and an encoder connector 22 on the IO board 2; there is a communication interface 31 on the control board 3; there is a power supply interface 41 and a motor interface 42 on the power board 4;
[0032] The installation method is as follows:
[0033] 1. Install the power board 4 onto the heat dissipation base plate 5 through four copper studs;
[0034] 2. Install the control board 3 onto the power board 4 through four copper studs;
[0035] 3. Install the IO board 2 onto the control board through two screws and two copper studs;
[0036] 4. Install the housing onto the IO board 2 through two screws, and install the front buckle of the housing into the buckle groove of the heat dissipation base plate.
[0037] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims
1. A servo drive, characterized in that: The invention comprises a housing (1), a three-layer PCB board and a heat dissipation base plate (5); the housing (1) and the heat dissipation base plate (5) are connected to form a space for placing the three-layer PCB board; the three-layer PCB board comprises an IO board (2), a control board (3) and a power board (4); the power board (4) is mounted on the heat dissipation base plate (5), the control board (3) is mounted on the power board (4), and the IO board (2) is mounted on the control board (3).
2. A servo driver according to claim 1, characterized in that: The housing (1) is provided with a driver operation status indicator light (61) and a driver communication status indicator light (62).
3. A servo driver according to claim 2, characterized in that: The driver operation status indicator light (61) and the driver communication status indicator light (62) are individually wired on the IO board (2) and displayed using a light guide column.
4. A servo driver according to claim 1, characterized in that: The IO board (2) is provided with an IO connector (21) and an encoder connector (22).
5. A servo driver according to claim 1, characterized in that: The control panel (3) is provided with a communication interface (31), and the communication interface (31) is a CANopen communication interface or a 485 communication interface.
6. A servo driver according to claim 1, characterized in that: The power board (4) is provided with a power supply interface (41) and a motor interface (42).
7. A servo driver according to claim 1, characterized in that: The power board (4) is mounted on the heat dissipation base plate (5) via copper studs.
8. A servo driver according to claim 1, characterized in that: The control board (3) is mounted on the power board (4) via copper studs.
9. A servo driver according to claim 1, characterized in that: The IO board (2) is mounted on the control board (3) by means of screws and copper studs.
10. A servo driver according to claim 1, characterized in that: The housing (1) is connected to the IO board (2) by means of screws, and is connected to the heat dissipation base plate (5) by means of snap fastening.
Citation Information
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