Refrigeration and heat storage structure for radio frequency therapeutic instrument

Abstract

The utility model discloses a refrigeration and heat storage structure for a radio frequency therapeutic instrument, which comprises an electrode probe, a first end face of which is used for contacting with the skin of a user; the active refrigeration module comprises a semiconductor refrigeration sheet, a first temperature sensor, a second temperature sensor and a feedback control module; the refrigeration surface of the semiconductor refrigeration sheet is connected with the second end face of the electrode probe, the first temperature sensor is used for detecting the temperature of the refrigeration surface of the semiconductor refrigeration sheet, and the second temperature sensor is used for detecting the temperature of the heating surface of the semiconductor refrigeration sheet; the electrode probe is installed on the heat conduction fixing piece, the heating face of the semiconductor chilling plate is connected with the heat conduction fixing piece, the semiconductor chilling plate is arranged between the electrode probe and the heat conduction fixing piece, and the heat pipe is installed on the heat conduction fixing piece and connected with the phase change material piece. Radio frequency treatment and cold compress are synchronously carried out, the risk of overheating injury of the epidermal layer of a user in the radio frequency treatment process is reduced, and meanwhile the treatment effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiofrequency therapeutic instruments, and particularly relates to a refrigeration and heat storage structure for a radiofrequency therapeutic instrument. Background Art

[0002] Existing household radiofrequency therapeutic instruments / beauty instruments generally consist of a radiofrequency generator, a sensor module, and a feedback control chip. Multiple contact-type working heads are arranged on the treatment head of the instrument, and the working heads are electrodes of the working circuit and are used to contact the user's skin.

[0003] When the instrument is started, the working circuit of the radiofrequency generator outputs a radiofrequency current to the working head end. The radiofrequency current will enter the dermal tissue through the user's skin and generate heat, and this heat will act on the target tissue, thereby achieving a beauty or treatment effect on the user.

[0004] Existing cooling solutions for therapeutic instruments / beauty instruments and portable electronic devices include: air cooling, water cooling, refrigerant, and semiconductor refrigeration, etc.

[0005] To better stimulate the regeneration of collagen in the dermal layer, the existing instruments adopt the following solution: by increasing the heating power of the instrument to quickly heat the dermal layer to 55 - 70 degrees Celsius.

[0006] However, during the heat transfer process between the dermal layer and the epidermal layer, the epidermal layer is very likely to heat up too quickly and reach too high a temperature (the tolerable temperature of the human epidermal layer is 43 - 46 degrees Celsius), ultimately resulting in local tissue congestion, swelling, and bringing a burning sensation and pain to the user.

[0007] After treatment, generally, the cold compress function of the instrument, external cold compress, or liquid nitrogen cooling is used to relieve the above symptoms and discomfort, but the effect of the existing cold compress function is not good.

[0008] Therefore, there is an urgent need for a refrigeration and heat storage structure for a radiofrequency therapeutic instrument that can solve one or more of the above problems. Summary of the Utility Model

[0009] To solve one or more problems existing in the prior art, the utility model provides a refrigeration and heat storage structure for a radiofrequency therapeutic instrument. The technical solution adopted by the utility model to solve the above problems is: a refrigeration and heat storage structure for a radiofrequency therapeutic instrument, which includes: an electrode probe, and the first end face of the electrode probe is used to contact the user's skin;

[0010] An active refrigeration module, and the active refrigeration module includes: a semiconductor refrigeration chip, a first temperature sensor, a second temperature sensor, and a feedback control module;

[0011] The cooling surface of the semiconductor refrigeration chip is connected to the second end face of the electrode probe. The first temperature sensor is used to detect the temperature of the cooling surface of the semiconductor refrigeration chip, the second temperature sensor is used to detect the temperature of the heating surface of the semiconductor refrigeration chip, and the feedback control module is used to control the output power of the semiconductor refrigeration chip;

[0012] The electrode probe is installed on a heat-conducting fixing member. The heating surface of the semiconductor refrigeration chip is connected to the heat-conducting fixing member. The semiconductor refrigeration chip is arranged between the electrode probe and the heat-conducting fixing member. The heat-conducting fixing member is provided with a heat pipe, and the heat pipe is connected to a phase change material member.

[0013] In some embodiments, the first end face is opposite to the second end face, and the cooling surface is opposite to the heating surface.

[0014] In some embodiments, a heat-conducting gel is provided between the second end face and the cooling surface, and a heat-conducting gel is provided between the heating surface and the heat-conducting fixing member.

[0015] The technical effects achieved by the present utility model are as follows: 1. Using a heat pipe as a heat conduction medium for heat dissipation to solve the problem that the poor thermal conductivity of the phase change material is not conducive to heat conduction; 2. The structure of the present application can realize synchronous cold compress and radiofrequency treatment. The radiofrequency current heats the skin internally, and the semiconductor refrigeration chip cools the skin externally, thereby reducing the risk of epidermal layer damage during the radiofrequency treatment. At the same time, it can make the temperature difference between the dermis layer and the epidermis layer larger. On the premise of ensuring that the temperature of the epidermis layer is not high, the radiofrequency power can be continuously increased to increase the temperature of the dermis layer, and finally improve the effect of radiofrequency treatment; 3. Compared with conventional air-cooled and water-cooled refrigeration modules, the structure of the present application is small in volume, small in mass, high in safety, low in noise, and low in power consumption, and is also convenient for transplantation and maintenance. Description of the Drawings

[0016] Figure 1 It is a cross-sectional view of the present utility model;

[0017]

Reference Numerals

[0018] 1... Electrode probe, 2.1... First semiconductor refrigeration chip, 2.2... Second semiconductor refrigeration chip, 3... Heat-conducting fixing member, 4... Heat pipe, 5... Phase change material member, 6.1... First temperature sensor, 6.2... Second temperature sensor. Detailed Embodiments

[0019] To make the above objects, features, and advantages of the present utility model more understandable, the following will describe in detail the specific embodiments of the present utility model with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from this description, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0020] As Figure 1 shown, the present utility model discloses a refrigeration and heat storage structure for a radiofrequency therapeutic apparatus, which includes: an electrode probe 1, the first end face of the electrode probe 1 is used to contact the user's skin;

[0021] an active refrigeration module, the active refrigeration module includes: a semiconductor refrigeration sheet, a first temperature sensor 6.1, a second temperature sensor 6.2, and a feedback control module;

[0022] the refrigerating surface of the semiconductor refrigeration sheet is connected to the second end face of the electrode probe 1, the first temperature sensor 6.1 is used to detect the temperature of the refrigerating surface of the semiconductor refrigeration sheet, the second temperature sensor 6.2 is used to detect the temperature of the heating surface of the semiconductor refrigeration sheet, and the feedback control module is used to control the output power of the semiconductor refrigeration sheet;

[0023] the electrode probe 1 is installed on a heat-conducting fixing member 3, the heating surface of the semiconductor refrigeration sheet is connected to the heat-conducting fixing member 3, the semiconductor refrigeration sheet is arranged between the electrode probe 1 and the heat-conducting fixing member 3, a heat pipe 4 is installed on the heat-conducting fixing member 3, and the heat pipe 4 is connected to a phase change material member 5.

[0024] Specifically, as combined with Figure 1 shown, in a single electrode probe 1, two semiconductor refrigeration sheets can be provided, namely: a first semiconductor refrigeration sheet 2.1 and a second semiconductor refrigeration sheet 2.2. The electrode probe 1 is used to output a radiofrequency current to the user, and is electrically connected to the radiofrequency generator of the instrument and forms a loop with the user's skin and other electrode probes.

[0025] It should be noted that in the electrode probe 1, the first end face and the second end face can be oppositely arranged, such as being arranged on the front and back of the electrode probe 1. This design has better effects compared to being arranged on the front and adjacent sides. Moreover, in the semiconductor refrigeration sheet, the refrigerating surface and the heating surface are oppositely arranged. The phase change material member 5 is a heat storage module composed of phase change materials.

[0026] It should be noted that a thermal conductive gel (not shown in the figure) is provided between the second end face and the refrigerating surface, and a thermal conductive gel is provided between the heating surface and the thermal conductive fixing member 3. The thermal conductive gel can not only improve the heat conduction efficiency, but also play an elastic buffering role. The thermal conductive fixing member 3 can be an aluminum block, and the semiconductor refrigeration chip is nested and supported and fixed by the electrode probe 1 and the thermal conductive fixing member 3. The feedback control module can be an existing microprocessor main control module.

[0027] When the device is in use, the feedback control module detects the temperatures of the refrigerating surface and the heating surface and uses the PID control algorithm to control the output power of the semiconductor refrigeration chip, and finally controls the temperature of the electrode probe to achieve temperature control adjustment.

[0028] For the semiconductor refrigeration chip, its specifications can be: the refrigeration energy efficiency ratio COP value is 0.5 - 0.7, the main material is a semiconductor refrigeration chip of bismuth telluride and 96% alumina copper-clad ceramic substrate, and when the input power is 1.6 w, it provides 1 w of refrigeration power to meet the refrigeration capacity required for epidermal layer cold compress during the radiofrequency treatment process.

[0029] For the phase change material member 5, the materials used can be: a high molecular polymer mainly composed of a kind of paraffin and SEBS, the heat transfer coefficient is 0.8 w / mK, the phase change temperature is about 42 degrees Celsius, the enthalpy is about 16 J / g, and the specific heat capacity is about 2.2 j / gK. Before the phase change material's heat storage is saturated, the temperature of the phase change material will remain at about 42 degrees Celsius. The heat storage density of the phase change material is large enough. The phase change heat storage value of about 20 g of the phase change material is about 3200 J. At this time, it can support the semiconductor refrigeration chip to work continuously for 20 minutes under the working conditions of 1.6 w input power and 1 w refrigeration power, meeting the whole process of a single radiofrequency treatment. After a single radiofrequency treatment is completed, the phase change material returns to room temperature through natural heat dissipation methods such as convection and contact heat conduction.

[0030] If the phase change material member 5 is directly connected to the semiconductor refrigeration chip, it will lead to poor heat dissipation effect on the hot surface and too high temperature of the heating surface due to excessive thermal resistance, and finally the refrigeration effect of the semiconductor refrigeration chip will decline. In the structure of this application, the heat transfer coefficient of the phase change material member is the smallest. By using a heat pipe with a high heat transfer coefficient, the heat dissipation efficiency between the heating surface of the semiconductor refrigeration chip and the phase change material member is increased, the thermal resistance is reduced, and then the heat conduction effect during heat dissipation is enhanced, and finally the overall heat dissipation efficiency is improved.

[0031] In summary, the technical effects achieved by the structure of the present application are as follows: 1. Using a heat pipe as a heat conduction medium for heat dissipation to solve the problem of poor thermal conductivity of the phase change material, which is not conducive to heat conduction; 2. The structure of the present application can realize synchronous cold compress and radiofrequency treatment. The radiofrequency current heats the skin internally, and the semiconductor refrigeration cools the skin externally, thereby reducing the risk of epidermal layer damage during the radiofrequency treatment. At the same time, it can make the temperature difference between the dermis layer and the epidermis layer larger. On the premise of ensuring that the temperature of the epidermis layer is not high, the radiofrequency power can be continuously increased to increase the temperature of the dermis layer, ultimately improving the effect of radiofrequency treatment; 3. Compared with conventional air-cooled and water-cooled refrigeration modules, the structure of the present application is small in volume, small in mass, high in safety, low in noise, and low in power consumption. At the same time, it is convenient for transplantation and maintenance.

[0032] The above-described embodiments merely represent one or more implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the appended claims.

Claims

1. A refrigeration heat storage structure for a radio frequency therapeutic apparatus, characterized in that: include: An electrode probe, wherein a first end surface of the electrode probe is used to contact with the user's skin; An active refrigeration module, the active refrigeration module comprising: a semiconductor refrigeration sheet, a first temperature sensor, a second temperature sensor and a feedback control module; The cooling surface of the semiconductor refrigeration piece is connected to the second end surface of the electrode probe, the first temperature sensor is used to detect the temperature of the cooling surface of the semiconductor refrigeration piece, the second temperature sensor is used to detect the temperature of the heating surface of the semiconductor refrigeration piece, and the feedback control module is used to control the output power of the semiconductor refrigeration piece; The electrode probe is installed on a heat-conducting fixing part, the heating surface of the semiconductor refrigeration sheet is connected to the heat-conducting fixing part, the semiconductor refrigeration sheet is arranged between the electrode probe and the heat-conducting fixing part, the heat-conducting fixing part is installed with a heat pipe, and the heat pipe is connected to the phase change material part.

2. The refrigeration heat storage structure for radio frequency therapeutic apparatus according to claim 1, characterized in that: The first end surface is opposite to the second end surface, and the cooling surface is opposite to the heating surface.

3. The refrigeration and heat storage structure for radio frequency therapeutic apparatus according to claim 1, characterized in that: A heat-conducting gel is arranged between the second end surface and the cooling surface, and a heat-conducting gel is arranged between the heating surface and the heat-conducting fixing member.

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