Air knife valve body for silicon wafer electroplating and electroplating equipment

Abstract

The utility model provides an air knife valve body for silicon wafer electroplating and electroplating equipment. The air knife valve body is characterized in that a backflow outlet is formed in the bottom end of a base; the cover plate is mounted at the top end of the base, and an inlet corresponding to the backflow outlet is formed in the cover plate; the separator is arranged at the bottom end of the base, is of a hollow structure, is communicated with the backflow outlet and comprises a first isolation part and a second isolation part, and the top end of the first isolation part is higher than the second isolation part in the vertical direction; the air knife assembly is located on the side, adjacent to the first isolation part, of the base, an air inlet is formed in the end, away from the first isolation part, of the base, and an air knife outlet is formed between the end adjacent to the first isolation part and the cover plate. The liquid collecting cavity is formed in the base, and a liquid drainage hole is formed in the end, adjacent to the side wall of the base, of the liquid collecting cavity. The air knife valve body can be used for cleaning electroplating equipment and discharging liquid in two working states at the same time, and is small in size and convenient to control and clean.

Description

Technical Field

[0001] The utility model belongs to the technical field of electroplating, and particularly relates to an air knife valve body for silicon wafer electroplating and an electroplating device. Background Art

[0002] With the increasing demand for renewable energy, the solar energy industry has developed rapidly, and the manufacturing technology of solar cells has become the key to the industry's development. In the manufacturing process of solar cells, the electroplating process is widely used because it can improve the conductivity and durability of the cells. However, there are some problems to be solved urgently in the existing electroplating technology.

[0003] For example Figure 1 Fig. shows an electroplating device in the prior art, where 1 represents a process tank, 2 represents an auxiliary tank, and 3 represents a hose. The process tank 1 is reflux-connected to the auxiliary tank 2 through the hose 3. The electroplating reaction takes place in the process tank 1, and the electroplating solution flows back to the auxiliary tank 2 through the hose 3. However, after batch electroplating, there is often electroplating solution residue on the inner surface of the process tank 1 and the rollers in the tank. These residual electroplating solutions form crystals after evaporation. If not completely dissolved, they will scratch the solar cells during the next electroplating, affecting the product quality.

[0004] Currently, the best way to clean the rollers and the inner surface of the process tank 1 is to spray deionized water with a high-pressure water gun. The water after cleaning will flow back into the auxiliary tank 2, resulting in a decrease in the concentration of metal ions and additives in the electroplating solution, and further affecting the electroplating process parameters. In addition, due to the extremely limited space between the process tank 1 and the auxiliary tank 2, there is only a space of 60 mm in height, which further increases the difficulty of cleaning and crystal management. Therefore, an improved technical solution is needed to address the above deficiencies in the prior art.

[0005] Therefore, an improved technical solution is needed to address the above deficiencies in the prior art.

[0006] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the present application and facilitating the understanding of those skilled in the art. It cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art section of the present application. Summary of the Utility Model

[0007] In view of the above-mentioned deficiencies of the prior art, the purpose of the present utility model is to provide an air knife valve body for silicon wafer electroplating and an electroplating device, which are used to solve the problems that the existing electroplating device cannot achieve liquid diversion and the cleaning water after crystallization flows back into the auxiliary tank, affecting the electroplating process parameters.

[0008] To achieve the above and other related objectives, the present utility model provides an air knife valve body for silicon wafer electroplating, and the air knife valve body includes:

[0009] A base, with a reflux outlet opened at the bottom end of the base;

[0010] A cover plate, which is installed on the top end of the base. An inlet corresponding to the reflux outlet is opened on the cover plate, and the inlet has a flange protruding outside the cover plate;

[0011] An isolation member, which is arranged at the bottom end inside the base. The inside of the isolation member is of a hollow structure, and the inside of the isolation member is communicated with the reflux outlet. The isolation member includes a first isolation part and a second isolation part. The top end of the first isolation part is higher than the second isolation part in the vertical direction, and a gap is formed between the top end of the first isolation part and the cover plate;

[0012] An air knife assembly, which is located on one side of the base adjacent to the first isolation part. An air inlet is opened at one end of the air knife assembly away from the first isolation part, and an air knife outlet is formed between one end of the air knife assembly adjacent to the first isolation part and the cover plate. Compressed air enters from the air inlet and is blown out from the air knife outlet, and an air knife is formed at the air knife outlet;

[0013] A liquid collection cavity, which is formed inside the base and is located on one side of the base adjacent to the second isolation part. A liquid discharge hole is opened at one end of the liquid collection cavity adjacent to the side wall of the base, and the liquid discharge hole is used to discharge the liquid in the liquid collection cavity.

[0014] Preferably, a flow distribution cavity is arranged between the air inlet and the air knife outlet. One end of the flow distribution cavity is communicated with the air inlet, and the other end is communicated with the air knife outlet. The compressed air introduced from the air inlet is split by the flow distribution cavity and then flows out from the air knife outlet to form an air knife.

[0015] Preferably, the flow distribution cavity is arranged in a stepped upward inclination, and the inner diameter of the flow distribution cavity increases along the direction from the air inlet to the air knife outlet.

[0016] Preferably, the input end of the air inlet is connected with compressed air through an input pipeline, and a throttle valve and a pressure valve are arranged on the input pipeline. The throttle valve and the pressure valve are used to adjust the pressure and flow rate of the compressed air entering the air inlet, so as to control the blowing force and flow rate of the formed air knife.

[0017] Preferably, the distance between the air knife outlet and the cover plate is not greater than the height of the gap between the first isolation part and the cover plate.

[0018] Preferably, a liquid discharge joint is provided on the liquid discharge hole, and the output end of the liquid discharge joint is connected to a liquid discharge pump, which is used to discharge the liquid in the liquid collection cavity into a special recovery tank.

[0019] Preferably, an electric ball valve is provided on the liquid discharge joint, and the electric ball valve is used to control the on-off of the liquid discharge joint.

[0020] Preferably, the isolation member and the bottom end of the base are integrally formed.

[0021] Preferably, the inner diameter of the isolation member is not greater than the inner diameter of the reflux outlet.

[0022] The present utility model also provides an electroplating device, and the electroplating device includes the above-mentioned air knife valve body.

[0023] As described above, the air knife valve body for silicon wafer electroplating of the present utility model has the following beneficial effects:

[0024] The air knife valve body in the present utility model includes a base, a cover plate, an isolation member, an air knife assembly and a liquid collection cavity, and can be used for discharging liquid in both the cleaning state and the working state of the electroplating device. Without increasing the equipment investment, the waste liquid during the cleaning operation can be discharged into a special recovery tank, and the electroplating solution can flow back normally during the electroplating in the working state; the setting of the shunt cavity gradually transitions the circular air cavity into a strip-shaped air knife. When in the cleaning state, compressed air enters the shunt cavity from the air inlet, and then blows out from the air knife outlet, and a uniformly distributed air knife is formed at the top of the first isolation part. The air knife blows the waste liquid flowing down from the inlet to the liquid collection cavity outside the second isolation part. The setting of the isolation member further improves the waste liquid collection efficiency; when in the working state, the opening or closing of the electric ball valve is realized through electrical control to achieve the opening and closing of the liquid discharge hole. The liquid discharge hole is closed during the working state, so that the electroplating solution can flow back normally through this air knife valve body.

[0025] The air knife valve body in the present utility model can effectively reduce the equipment height, and has the characteristics of small volume, easy control and easy cleaning, and can be widely used in electroplating and process equipment with easily crystallized solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 Shows a schematic structural diagram of an electroplating device in the prior art.

[0027] Figure 2 Shows a three-dimensional structural diagram of the air knife valve body in the present utility model.

[0028] Figure 3 Shows Figure 2 The top view structural diagram of.

[0029] Figure 4Shown as Figure 3 Schematic cross-sectional structure diagram along the A-A' direction.

[0030] Figure 5 Shown as the internal three-dimensional structure diagram of the air knife valve body of the present utility model.

[0031] Figure 6 Shown as Figure 5 Top view structure diagram of

[0032] Figure 7 Shown as Figure 6 Schematic cross-sectional structure diagram along the B-B' direction.

[0033] Figure 8 Shown as another perspective internal three-dimensional structure diagram of the air knife valve body of the present utility model.

[0034] Description of component labels

[0035] 1 Process tank

[0036] 2 Auxiliary tank

[0037] 3 Hose

[0038] 10 Base

[0039] 101 Return outlet

[0040] 20 Cover plate

[0041] 201 Inlet

[0042] 30 Spacer

[0043] 301 First isolation part

[0044] 302 Second isolation part

[0045] 401 Air inlet

[0046] 402 Shunt cavity

[0047] 403 Air knife outlet

[0048] 50 Liquid collection cavity

[0049] 501 Drain hole Detailed implementation manners

[0050] The following describes each of the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. When detailing the embodiments of the present application, for ease of explanation, the cross-sectional views showing the device structure will be enlarged locally not in accordance with the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of the present application here. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0051] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed connection" means that the components are connected to each other and the relative positional relationship after connection remains unchanged. It should be understood that when component A is fixedly connected to component C through component B, a change in the relative positional relationship due to the deformation of component A, component B, and component C itself is allowed. "Rotational connection" means that the components are connected to each other and can rotate relative to each other after connection. "Sliding connection" means that the components are connected to each other and can slide relative to each other after connection. Among them, the integration of two components through an integral molding process means that during the process of forming one of the two components, this component is connected to the other component together without the need to connect the two components through additional processing methods (such as bonding, welding, snap connection, screw connection).

[0052] The directional terms mentioned in the embodiments of the present application, such as "upper", "lower", "side", "top", "bottom", etc., are only references to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation on the embodiments of the present application.

[0053] The term "plurality" means at least two. The term "above" includes the number itself. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as implying or indicating relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include one or more of such features.

[0054] Refer to Figure 1 Fig. Figure 1 is a schematic structural diagram of an electroplating device in the prior art, which mainly includes a process tank 1, an auxiliary tank 2 and a hose 3. The process tank 1 is connected to the auxiliary tank 2 through the hose 3. The electroplating reaction takes place in the process tank 1, and the electroplating solution flows back to the auxiliary tank 2 through the hose 3. However, after batch electroplating, there is often electroplating solution residue on the inner surface of the process tank 1 and the rollers in the tank. These residual electroplating solutions form crystals after evaporation. When deionized water is sprayed with a high-pressure water gun, the water after cleaning will flow back into the auxiliary tank 2, resulting in a decrease in the concentration of metal ions and additives in the electroplating solution, thereby affecting the electroplating process parameters.

[0055] Based on this, the present utility model designs a special air knife valve body to replace the hose 3. When electroplating, the electroplating solution can flow back to the auxiliary tank 2 normally. When cleaning the crystals or the process tank 1, the deionized water used for cleaning will be diverted to a special tank to prevent the deionized water from entering the auxiliary tank 2 and affecting the concentration of the electroplating solution.

[0056] In addition, since the space between the process tank 1 and the auxiliary tank 2 in the electroplating device of the prior art is relatively small, only about 60 mm, the on-site installation position is compact, and the on-site installation situation also needs to be considered.

[0057] Based on the problems existing in the above prior art, please refer to Figures 2 to 8 , the present utility model provides an air knife valve body for silicon wafer electroplating. The air knife valve body includes a base 10, a cover plate 20, a separator 30, an air knife assembly and a liquid collecting chamber 50. Among them, a reflux outlet 101 is opened at the bottom end of the base 10; the cover plate 20 is installed on the top end of the base 10, and an inlet 201 corresponding to the reflux outlet 101 is opened on the cover plate 20, and the inlet 201 has a flange protruding outside the cover plate 20; the separator 30 is arranged at the bottom end inside the base 10, the inside of the separator 30 is of a hollow structure, and the inside of the separator 30 is communicated with the reflux outlet 101. The separator 30 includes a first separator part 301 and a second separator part 302. The top end of the first separator part 301 is higher than the second separator part 302 in the vertical direction, and a gap is formed between the top end of the first separator part 301 and the cover plate 20; the air knife assembly is located on one side of the base 10 adjacent to the first separator part 301. An air inlet 401 is opened at one end of the air knife assembly away from the first separator part 301, and an air knife outlet 403 is formed between one end of the air knife assembly adjacent to the first separator part 301 and the cover plate 20. Compressed air enters from the air inlet 401 and blows out from the air knife outlet 403, and an air knife is formed at the air knife outlet 403; the liquid collecting chamber 50 is formed inside the base 10 and is located on one side of the base 10 adjacent to the second separator part 302. A drain hole 501 is opened at one end of the liquid collecting chamber 50 adjacent to the side wall of the base 10, and the drain hole 501 is used to drain the liquid in the liquid collecting chamber 50.

[0058] Specifically, the air knife valve body can be used for liquid discharge in both the cleaning and working states of the silicon wafer electroplating equipment. Without increasing the equipment investment, it can achieve the discharge of waste liquid to a dedicated recovery tank during the cleaning operation, and the normal reflux of the electroplating solution during the electroplating operation in the working state. When performing the cleaning operation, compressed air enters from the air inlet 401, then blows out from the air knife outlet 403. The compressed air will form an air knife at the air knife outlet 403, and the air knife will blow the liquid flowing down from the process tank 1 into the liquid collection cavity 50 for collection, and then discharge it to the dedicated recovery tank through the liquid discharge hole 501. When performing the electroplating operation, a weak air flow enters from the air inlet 401, which can prevent the electroplating solution from entering the air knife assembly. At the same time, the liquid discharge hole 501 is closed, and the liquid in the process tank will directly flow back to the auxiliary tank 2, and a small amount of liquid will flow back to the liquid collection cavity 50. When the liquid level is higher than the top of the second isolation part 302, it will flow back to the auxiliary tank 2 again.

[0059] In addition, in the specific embodiment of the present invention, the height of the second isolation part 302 should be lower than the height of the first isolation part 301. The specific height needs to be adjusted according to the actual situation, which is related to the pressure and flow rate of the compressed air introduced into the air inlet 401, and will not be overly limited here.

[0060] As an example, a flow splitting cavity 402 is provided between the air inlet 401 and the air knife outlet 403. One end of the flow splitting cavity 402 is in communication with the air inlet 401, and the other end is in communication with the air knife outlet 403. The compressed air introduced from the air inlet 401 is split by the flow splitting cavity 402 and then flows out through the air knife outlet 403 to form an air knife.

[0061] Specifically, referring to Figure 4 、 Figure 5 , the air inlet 401 is a round hole penetrating the side wall of the base 10.

[0062] As an example, the flow splitting cavity 402 is arranged in a stepped upward slope, and the inner diameter of the flow splitting cavity 402 increases in the direction from the air inlet 401 to the air knife outlet 403.

[0063] Specifically, referring to Figure 4 、 Figure 5 , the flow splitting cavity 402 is arranged in an upward slope from the air inlet 401, and the inner diameter of the cavity of the flow splitting cavity 402 shows an increasing trend in a stepped upward manner. The compressed gas entering the flow splitting cavity 402 from the air inlet 401 gradually transforms the circular air cavity into a strip-shaped air knife.

[0064] As an example, the input end of the air inlet 401 is connected to compressed air through an input pipeline, and a throttle valve and a pressure valve are arranged on the input pipeline. The throttle valve and the pressure valve are used to adjust the pressure and flow rate of the compressed air entering the air inlet 401, and thus control the blowing force and flow rate of the formed air knife.

[0065] As an example, the distance between the air knife outlet 403 and the cover plate 20 is not greater than the clearance height between the first isolation part 301 and the cover plate 20.

[0066] Specifically, referring to Figures 4 to 7 , a platform is formed between the outer edge of the first isolation part 301 and the air knife outlet 403, so that the air blown out from the air knife outlet 403 can be evenly distributed at the platform to form a uniform air knife, and the liquid flowing down from the inlet 201 is blown by the air knife to the periphery of the second isolation part 302; the distance between the platform and the cover plate 20 is the clearance height between the first isolation part 301 and the cover plate 20; of course, in other specific embodiments, the air knife outlet 403 may also be inclined downward between the outer edge of the first isolation part 301, and at this time, the distance between the highest end of the outer edge of the first isolation part 301 and the cover plate 20 is the clearance height between the first isolation part 301 and the cover plate 20.

[0067] As an example, a drain connector (not shown in the figure) is provided on the drain hole 501, and the output end of the drain connector is connected to a drain pump, and the drain pump is used to discharge the liquid in the liquid collection cavity 50 to a dedicated recovery tank.

[0068] Specifically, referring to Figures 5 to 8 , the drain hole 501 is in communication with the liquid collection cavity 50. Of course, the drain hole 501 can also be provided in multiple numbers, which is not limited here. A drain connector is installed on the drain hole 501, and a drain pump is installed on the drain connector. The drain pump is turned on to discharge the liquid in the liquid collection cavity 50.

[0069] As an example, an electric ball valve (not shown in the figure) is provided on the drain connector, and the electric ball valve is used to control the on-off of the drain connector.

[0070] Specifically, the volume of the electric ball valve is relatively small, it is convenient to install and occupies little space. In practical applications, the electric ball valve automatically controls the opening and closing of the valve through an electrical signal. The electric ball valve is externally connected to an electrical control end, and the electrical control end controls the on-off of the drain connector through the electric ball valve. When the electroplating equipment is in the cleaning state, the electric ball valve needs to be in the open state, and when the electroplating equipment is in the working state, the electric ball valve needs to be closed.

[0071] As an example, the isolation part 30 and the bottom end of the base 10 are integrally formed.

[0072] Specifically, the isolation part 30 and the base 10 are integrally formed by machining.

[0073] As an example, referring to Figure 4 , the inner diameter of the isolation part 30 is not greater than the inner diameter of the reflux outlet 101.

[0074] The present invention also provides an electroplating equipment, and the electroplating equipment includes the above-mentioned air knife valve body.

[0075] Specifically, the electroplating equipment further includes a process tank 1 and an auxiliary tank 2. The air knife valve body is located between the process tank 1 and the auxiliary tank 2. The inlet 201 on the cover plate 20 has a flange protruding outside the cover plate 20, and this flange is connected to the bottom end of the process tank 1. The reflux outlet 101 at the bottom end of the base 10 is connected and communicated with the top end of the auxiliary tank 2, so that the electroplating equipment in the present utility model can be used for liquid diversion discharge in both the cleaning and working states.

[0076] In summary, the air knife valve body in the present utility model includes a base, a cover plate, a separator, an air knife assembly, and a liquid collection cavity, and can be used for liquid discharge in both the cleaning and working states of the electroplating equipment. Without increasing the equipment investment, it realizes the discharge of waste liquid to a special recovery tank during the cleaning operation, and the normal reflux of the electroplating solution during the electroplating in the working state; the setting of the diversion cavity gradually transitions the circular air cavity into a strip-shaped air knife. When in the cleaning state, compressed air enters the diversion cavity from the air inlet, then blows out from the air knife outlet, and a uniformly distributed air knife is formed at the top of the first separator. The air knife blows the waste liquid flowing down from the inlet into the liquid collection cavity outside the second separator. The setting of the separator further improves the waste liquid collection efficiency; when in the working state, the opening or closing of the electric ball valve is realized through electrical control to achieve the opening and closing of the liquid discharge hole. The liquid discharge hole is closed during the working state, so that the electroplating solution can realize normal reflux through this air knife valve body. The air knife valve body in the present utility model can effectively reduce the equipment height, has the characteristics of small volume, easy control, and easy cleaning, and can be widely used in electroplating and process equipment with easily crystallizable solutions. Therefore, the present utility model effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0077] The above description is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed in the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application; without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. The structural member materials, dimensions, shapes, etc. mentioned in the embodiments of the present application are all schematic descriptions and do not form strict limitations or absolute limitations. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An air knife valve body for silicon wafer electroplating, characterized in that: The air knife valve body comprises: A base, wherein a reflux outlet is provided at the bottom end of the base; A cover plate, the cover plate is mounted on the top of the base, the cover plate is provided with an inlet corresponding to the reflux outlet, and the inlet has a flange protruding from the outside of the cover plate; an isolating member, the isolating member being arranged at the bottom end of the base, the interior of the isolating member being a hollow structure, the interior of the isolating member being connected to the reflux outlet, the isolating member comprising a first isolating portion and a second isolating portion, the top end of the first isolating portion being higher than the second isolating portion in a vertical direction, and a gap being formed between the top end of the first isolating portion and the cover plate; A wind knife assembly, the wind knife assembly is located on a side of the base adjacent to the first isolation portion, an air inlet is provided at one end of the wind knife assembly away from the first isolation portion, a wind knife outlet is formed between one end of the wind knife assembly adjacent to the first isolation portion and the cover plate, compressed air enters from the air inlet and is blown out of the wind knife outlet, and a wind knife is formed at the wind knife outlet; A liquid collecting chamber is formed inside the base and is located on a side of the base adjacent to the second isolation portion. A drainage hole is provided at one end of the liquid collecting chamber adjacent to the side wall of the base, and the drainage hole is used to discharge the liquid in the liquid collecting chamber.

2. The air knife valve body for silicon wafer electroplating according to claim 1, characterized in that: A diversion chamber is provided between the air inlet and the wind knife outlet, one end of the diversion chamber is connected to the air inlet, and the other end is connected to the wind knife outlet. The compressed air entering from the air inlet is diverted by the diversion chamber, flows out through the wind knife outlet and forms a wind knife.

3. The air knife valve body for silicon wafer electroplating according to claim 2, characterized in that: The diversion cavity is arranged to be stepped and tilted upward, and the inner diameter of the diversion cavity increases along the direction from the air inlet to the air knife outlet.

4. The air knife valve body for silicon wafer electroplating according to claim 1, characterized in that: The input end of the air inlet is connected to compressed air through an input pipeline, and a throttle valve and a pressure valve are arranged on the input pipeline. The throttle valve and the pressure valve are used to adjust the pressure and flow of the compressed air entering the air inlet, thereby regulating the blowing force and flow of the wind knife formed.

5. The air knife valve body for silicon wafer electroplating according to claim 1, characterized in that: The distance between the wind knife outlet and the cover plate is not greater than the height of the gap between the first isolation portion and the cover plate.

6. The air knife valve body for silicon wafer electroplating according to claim 1, characterized in that: The drainage hole is provided with a drainage joint, and the output end of the drainage joint is connected to a drainage pump, and the drainage pump is used to discharge the liquid in the liquid collecting cavity into a dedicated recovery tank.

7. The air knife valve body for silicon wafer electroplating according to claim 6, characterized in that: The drain joint is provided with an electric ball valve, and the electric ball valve is used to control the on-off of the drain joint.

8. The air knife valve body for silicon wafer electroplating according to claim 1, characterized in that: The isolating member is integrally formed with the bottom end of the base.

9. The air knife valve body for silicon wafer electroplating according to claim 1, characterized in that: The inner diameter of the isolating element is not greater than the inner diameter of the reflux outlet.

10. An electroplating device, characterized in that: The electroplating equipment comprises the air knife valve body according to any one of claims 1 to 9.

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