Wafer thickness measuring instrument

Abstract

The utility model discloses a wafer thickness measuring instrument. The wafer thickness measuring instrument comprises a supporting platform, a rotating device and a sliding device, the supporting platform is used for placing a wafer; the rotating device comprises a connecting rod and a movable support, the connecting rod is fixedly connected to the edge position of the supporting platform, and the end, close to the connecting rod, of the movable support is rotatably connected to the connecting rod; the sliding device comprises a sliding block and a lifting assembly, the sliding block can be slidably connected to the movable support in the extending direction of the movable support, the lifting assembly comprises a connecting block and an adjusting piece, the connecting block is fixedly connected to the sliding block, one end of the adjusting piece can be slidably and adjustably connected to the connecting block in the vertical direction, and the other end of the adjusting piece is connected with a digital display meter. According to the wafer thickness measuring instrument, any position of the wafer can be measured by moving the digital display meter, and the measuring needle point can be lifted and the digital display meter can be moved away when the wafer is taken and placed, so that the risk of scratching or breaking the wafer is effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thickness measurement, in particular to a wafer thickness measuring instrument. Background Art

[0002] The overall size of the existing thickness measuring instrument is small, and it is only applicable to measuring the thickness of wafers with small sizes, and is not compatible with wafers larger than 8 inches. Moreover, the position of the measuring tip of the digital display is fixed, resulting in many risks in the process of measuring wafers. First of all, when measuring a wafer, most of the wafer is in a suspended state, which will not only lead to inaccurate measurement values, but also, if the operator operates improperly, it is easy to break the wafer. Secondly, when using the existing thickness measuring instrument to measure a wafer, one hand needs to lift the tip, and the other hand needs to move the wafer so that the measuring position of the wafer is aligned with the measuring tip. When taking out the wafer, it is also necessary to first lift the tip with one hand and move the wafer to be misaligned with the measuring tip with the other hand, and then the tip can be put down, and then the wafer can be taken out with both hands. Such an operation method for measuring wafers is complex, with a high operation difficulty and operation risk, and it is extremely easy to cause scratches or breakage of the wafer. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a wafer thickness measuring instrument, which can measure any position of the wafer by moving the digital display, and can lift the measuring tip and move the digital display away when placing and removing the wafer, effectively avoiding the risk of scratches or breakage of the wafer.

[0004] In order to achieve the above purpose, the utility model discloses a wafer thickness measuring instrument, which comprises:

[0005] A support platform for placing the wafer;

[0006] A rotating device, which comprises a connecting rod and a moving bracket. The connecting rod is fixedly connected to the edge position of the support platform, and one end of the moving bracket close to the connecting rod is rotatably connected to the connecting rod;

[0007] A sliding device, which comprises a slider and a lifting component. The slider is slidably connected to the moving bracket along the extending direction of the moving bracket. The lifting component comprises a connecting block and an adjusting member. The connecting block is fixedly connected to the slider, and one end of the adjusting member is slidably connected to the connecting block along the vertical direction, and the other end is connected with a digital display.

[0008] Optionally, the connecting rod includes a rod body portion and a positioning portion. The bottom end of the rod body portion is fixedly connected to the support platform. The positioning portion is disposed on the outer side surface of the rod body portion. One end of the moving bracket close to the connecting rod is provided with a connecting portion. The connecting portion is provided with a connecting hole penetrating vertically. The connecting portion is sleeved on the rod body portion through the connecting hole, and the bottom surface of the connecting portion abuts against the positioning portion.

[0009] Optionally, the connecting portion is provided with a first locking hole communicating with the connecting hole. The moving bracket is provided with a first locking member corresponding to the first locking hole. The first locking member is threadedly connected to the first locking hole to extend into the connecting hole and contact the rod body portion.

[0010] Optionally, the moving bracket is in a long strip shape and is provided with a guide rail portion extending horizontally. The slider is provided with a sliding guide groove corresponding to the guide rail portion. When the slider is slidably connected to the moving bracket, the guide rail portion extends into the sliding guide groove to guide the slider to move horizontally.

[0011] Optionally, the slider is provided with a second locking hole communicating with the sliding guide groove. The slider is provided with a second locking member corresponding to the second locking hole. The second locking member is threadedly connected to the second locking hole to extend into the sliding guide groove and contact the guide rail portion.

[0012] Optionally, one end of the moving bracket away from the connecting rod extends beyond the support platform in the horizontal direction.

[0013] Optionally, two guide rail grooves extending vertically are arranged side by side on one side of the connecting block facing the adjusting member. The adjusting member is provided with two sliding convex portions corresponding to the two guide rail grooves. The two sliding convex portions are correspondingly slidably arranged in the two guide rail grooves. The lifting assembly further includes an inserting member. The connecting block is provided with two positioning grooves vertically. The adjusting member is provided with positioning holes corresponding to the two positioning grooves. When the adjusting member slides vertically to adjust, the positioning hole is aligned with any one of the two positioning grooves. The inserting member passes through the positioning hole and is inserted into the positioning groove aligned with the positioning hole to fix the adjusting member.

[0014] Optionally, the digital display is provided with a needle detection portion extending vertically. The slider is provided with a limiting hole corresponding to the needle detection portion. The needle detection portion passes through the limiting hole. The adjusting member is provided with a limiting portion. The needle detection portion is provided with a fixing portion pressed against the limiting portion. When the adjusting member slides vertically to adjust, the limiting portion vertically lifts or resets the fixing portion to lift or lower the needle detection portion.

[0015] The utility model is provided with a rotating device and a sliding device to drive the digital display meter to move. The rotating device includes a connecting rod and a moving bracket. The connecting rod is fixedly connected to the edge position of the support platform on which the wafer is placed. The moving bracket is rotatably connected to the connecting rod. The sliding device includes a slider and a lifting component. The slider is slidably connected to the moving bracket. The lifting component includes a connecting block and an adjusting member. The connecting block is fixedly connected to the slider. The adjusting member connected with the digital display meter is vertically adjustably connected to the connecting block. Thus, the digital display meter is moved to any position on the wafer that needs to be measured through the cooperation of the rotatable moving bracket and the slidable slider. And when taking and placing the wafer, the measuring tip is lifted through the vertically adjustable adjusting member and the digital display meter can be moved accordingly, which can effectively avoid the risk of scratching or fragmenting the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. is a three-dimensional structure diagram of a wafer thickness measuring instrument according to an embodiment of the utility model.

[0017] Figure 2 FIG. is an exploded structure diagram of a wafer thickness measuring instrument according to an embodiment of the utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] In order to explain in detail the technical content, structural features, achieved purposes and effects of the present utility model, the following is described in detail in conjunction with the embodiments and with reference to the accompanying drawings.

[0019] Please refer to Figure 1 and Figure 2 , the present utility model discloses a wafer thickness measuring instrument, which includes: a support platform 1, a rotating device 2 and a sliding device 3; the support platform 1 is used for placing the wafer; the rotating device 2 includes a connecting rod 21 and a moving bracket 22. One end of the connecting rod 21 is fixedly connected to the edge position of the support platform 1. One end of the moving bracket 22 close to the connecting rod 21 is rotatably connected to the connecting rod 21; the sliding device 3 includes a slider 31 and a lifting component 32. The slider 31 is slidably connected to the moving bracket 22 along the extending direction of the moving bracket 22. The lifting component 32 includes a connecting block 321 and an adjusting member 322. The connecting block 321 is fixedly connected to the slider 31. One end of the adjusting member 322 is vertically slidably adjusted and connected to the connecting block 321, and the other end is connected with a digital display meter 4.

[0020] The utility model is provided with a rotating device 2 and a sliding device 3 to drive the digital display meter 4 to move. The rotating device 2 includes a connecting rod 21 and a moving bracket 22. The connecting rod 21 is fixedly connected to the edge position of the support platform 1 on which the wafer is placed. The moving bracket 22 is rotatably connected to the connecting rod 21. The sliding device 3 includes a slider 31 and a lifting component 32. The slider 31 is slidably connected to the moving bracket 22. The lifting component 32 includes a connecting block 321 and an adjusting member 322. The connecting block 321 is fixedly connected to the slider 31. The adjusting member 322 connected to the digital display meter 4 is vertically adjustably connected to the connecting block 321. Thus, through the cooperation of the rotatable moving bracket 22 and the slidable slider 31, the digital display meter 4 is moved to any position on the wafer that needs to be measured. And when loading and unloading the wafer, the measuring tip is lifted through the vertically adjustable adjusting member 322 and the digital display meter 4 can be moved accordingly, which can effectively avoid the risk of scratching or fragmenting the wafer.

[0021] Refer to Figure 1 and Figure 2 , the connecting rod 21 includes a rod body portion 211 and a positioning portion 212. The bottom end of the rod body portion 211 is fixedly connected to the support platform 1. The positioning portion 212 is arranged on the outer side surface of the rod body portion 211. One end of the moving bracket 22 close to the connecting rod 21 is provided with a connecting portion 221. The connecting portion 221 is provided with a connecting hole 222 penetrating vertically. The connecting portion 221 is sleeved on the rod body portion 211 through the connecting hole 222. The bottom surface of the connecting portion 221 abuts against the positioning portion 212.

[0022] Through the rotational connection between the connecting portion 221 and the rod body portion 211, the moving bracket 22 can be moved away from the base when loading the wafer and the wafer does not need to be moved when measuring the wafer. By moving the moving bracket 22 to measure any position of the wafer, it is beneficial to reduce the movement of the wafer and avoid abnormalities.

[0023] Specifically, in this embodiment, the rod body portion 211 of the connecting rod 21 is cylindrical, with a vertical dimension of 150 mm, a diameter of 20 mm, and the material is stainless steel. The connecting rod 21 is used to connect the moving bracket 22 and the support platform 1. The positioning portion 212 is also cylindrical and is located below the connecting portion 221 to fix the vertical position of the moving bracket 22. When measuring the wafer, through the connection between the connecting portion 221 and the rod body portion 211, the moving bracket 22 rotates around the rod body portion 211, thereby driving the digital display meter 4 to rotate to any measuring position of the wafer without moving the wafer. When loading and unloading the wafer, the moving bracket 22 can be first moved to the edge of the support platform 1, and then the wafer can be placed or taken out, which can effectively avoid wafer fragmentation, but not limited thereto.

[0024] Specifically, in this embodiment, the support platform 1 is a marble base, which is used to place the wafer to be measured and provide bottom support for the rotating device 2. Its length, width and height are 400 mm, 350 mm and 60 mm respectively, so as to completely accommodate wafers with a size of 12 inches (including) or less, avoid the situation that most of the wafers are suspended, effectively avoid the occurrence of chip breakage, but not limited to this.

[0025] Refer to Figure 1 and Figure 2 , the connecting part 221 is provided with a first locking hole 223 communicating with the connecting hole 222. The moving bracket 22 is provided with a first locking member 224 corresponding to the first locking hole 223. The first locking member 224 is threadedly connected to the first locking hole 223 so as to extend into the connecting hole 222 and contact the rod body part 211.

[0026] Fixing or loosening the moving bracket 22 through the first locking member 224 is beneficial to stably fixing the moving bracket 22 at the required position.

[0027] Specifically, in this embodiment, before moving the moving bracket 22, the locking of the moving bracket 22 is released by loosening the first locking member 224, and then the rotating position of the moving bracket 22 is adjusted. After moving the moving bracket 22 to the required position, the moving bracket 22 is locked by tightening the first locking member 224, but not limited to this.

[0028] Refer to Figure 1 and Figure 2 , one end of the moving bracket 22 away from the connecting rod 21 extends beyond the support platform 1 in the horizontal direction.

[0029] Specifically, in this embodiment, the lateral dimension of the moving bracket 22 is 440 mm, and the vertical dimension is 40 mm. The lateral length of the moving bracket 22 is greater than the lateral and longitudinal dimensions of the support platform 1 to meet the requirement of pushing the digital display 4 on the sliding device 3 to measure the edge of the wafer, but not limited to this.

[0030] Refer to Figure 1 and Figure 2 , the moving bracket 22 is strip-shaped and provided with a guide rail portion 225 extending in the lateral direction. The slider 31 is provided with a sliding guide groove 311 corresponding to the guide rail portion 225. When the slider 31 is slidably connected to the moving bracket 22, the guide rail portion 225 extends into the sliding guide groove 311 to guide the slider 31 to move in the lateral direction.

[0031] Specifically, in this embodiment, on the basis that the moving bracket 22 is rotatable, the slider 31 is arranged to cooperate with the guide rail portion 225 of the moving bracket 22, so that the digital display 4 connected to the slider 31 can move arbitrarily in the horizontal direction, and thus the digital display 4 can be moved to any position of the wafer to be measured, but not limited to this.

[0032] Refer toFigure 1 and Figure 2 The slider 31 is provided with a second locking hole 312 communicating with the sliding guide groove 311. A second locking member 313 is provided corresponding to the second locking hole 312 of the slider 31. The second locking member 313 is threadedly connected to the second locking hole 312 so as to extend into the sliding guide groove 311 and contact the guide rail portion 225.

[0033] Fixing or loosening the slider 31 through the second locking member 313 is conducive to stably fixing the digital display 4 connected to the slider 31 at the required position.

[0034] Specifically, in this embodiment, before moving the slider 31, the locking of the slider 31 is released by loosening the second locking member 313, and then the position of the slider 31 on the moving bracket 22 is adjusted horizontally. After moving the digital display 4 connected to the slider 31 to the required position, the slider 31 is locked by tightening the first locking member 224, and then the position of the digital display 4 is fixed, but it is not limited thereto.

[0035] Refer to Figure 1 and Figure 2 On one side of the connecting block 321 facing the adjusting member 322, two guide rail grooves 3211 extending vertically are arranged side by side. The adjusting member 322 is provided with two sliding protrusions 3221 corresponding to the two guide rail grooves 3211. The two sliding protrusions 3221 are correspondingly slid in the two guide rail grooves 3211. The lifting assembly 32 further includes an inserting member 323. The connecting block 321 is provided with two positioning grooves 3212 vertically. The adjusting member 322 is provided with positioning holes 3222 corresponding to the two positioning grooves 3212. When the adjusting member 322 slides vertically, the positioning hole 3222 is aligned with any one of the two positioning grooves 3212. The inserting member 323 passes through the positioning hole 3222 and is inserted into the positioning groove 3212 aligned with the positioning hole 3222 to fix the adjusting member 322.

[0036] Specifically, in this embodiment, the two positioning grooves 3212 arranged vertically on the connecting block 321 are the first positioning groove 32121 and the second positioning groove 32122 respectively. After the pushing adjusting member 322 slides upward along the guide groove 3211 of the connecting block 321, the positioning hole 3222 of the adjusting member 322 is aligned with the first positioning groove 32121, and the inserting fixing member 323 is inserted into the positioning hole 3222 and the first positioning groove 32121 to fix the adjusting member 322, so that the digital display 4 is lifted by increasing the height of the connecting block 321, avoiding scratching the wafer by the measuring tip of the digital display 4 when moving the digital display 4 horizontally; when measuring the thickness of the wafer, the inserting fixing member 323 is taken out so that the adjusting member 322 can slide downward along the guide groove 3211 of the connecting block 321, the positioning hole 3222 of the adjusting member 322 is aligned with the second positioning groove 32122, and then the inserting fixing member 323 is inserted into the positioning hole 3222 and the second positioning groove 32122 to fix the adjusting member 322, so as to reset the digital display 4 connected to the adjusting member 322 and use the digital display 4 to measure the thickness of the wafer, but not limited to this.

[0037] Refer to Figure 1 and Figure 2 , the digital display 4 is provided with a needle measuring portion 41 extending vertically, the slider 31 is correspondingly provided with a limiting hole 314 for the needle measuring portion 41, the needle measuring portion 41 passes through the limiting hole 314, the adjusting member 322 is provided with a limiting portion 3223, and the needle measuring portion 41 is provided with a fixing portion 411 pressed against the limiting portion 3223. When the adjusting member 322 slides vertically to adjust, the limiting portion 3223 vertically lifts or resets the fixing portion 411, so that the needle measuring portion 41 is lifted or lowered.

[0038] By controlling the needle measuring portion 41 of the digital display 4 to be at different heights, the thickness measurement of the digital display 4 is realized and the contact between the needle measuring portion 41 and the wafer when moving the digital display 4 is avoided, which is beneficial to protecting the wafer.

[0039] Specifically, in this embodiment, the digital display 4 is a thousandth digital display. When measuring the wafer, first, the needle measuring portion 41 is lifted upward by a certain height and fixed by the limiting portion 3223 of the adjusting member 322. The limiting hole 314 facilitates the movement of the needle measuring portion 41. Then, the horizontal position of the digital display 4 is adjusted through the slider 31 and the moving bracket 22, so that the needle measuring portion 41 of the digital display 4 is aligned with the measuring position of the wafer, and then the needle measuring portion 41 is reset. The operation is the same when accessing the wafer, which can effectively prevent the situation of holding the needle tip with one hand and moving the wafer with the other hand, and avoid the risk of wafer scratching or fragmentation.

[0040] Refer to Figure 1 and Figure 2 , the operation steps of the wafer thickness measuring instrument of the present utility model are as follows:

[0041] Push the adjusting member 322 to slide upward along the guide rail groove 3211 of the connecting block 321, so that the positioning hole 3222 of the adjusting member 322 is aligned with the first positioning groove 32121, and insert the plugging member 323 into the positioning hole 3222 and the first positioning groove 32121 to fix the adjusting member 322;

[0042] Loosen the first locking member 224, and push the connecting bracket to rotate around the rod body portion 211 to move the moving bracket 22 away to facilitate placing the wafer;

[0043] Place the wafer to be measured on the top surface of the support platform 1;

[0044] Push the connecting bracket to rotate to the position where the wafer needs to be measured, and lock the first locking member 224 to fix the moving bracket 22;

[0045] Push the slider 31 connected with the digital display 4 to move horizontally along the guide rail portion 225 of the moving bracket 22, so that the needle measuring portion 41 of the digital display 4 is aligned with the position where the wafer needs to be measured, and lock the second locking member 313 to fix the slider 31;

[0046] Push the adjusting member 322 to slide downward along the guide rail groove 3211 of the connecting block 321, so that the positioning hole 3222 of the adjusting member 322 is aligned with the second positioning groove 32122, and insert the plugging member 323 into the positioning hole 3222 and the second positioning groove 32122 to restore the height position of the needle measuring portion 41 of the digital display 4. At this time, the measuring tip contacts the wafer to measure the thickness of the wafer, and the value displayed by the digital display 4 is the thickness of the wafer;

[0047] After the wafer thickness measurement is completed, push the adjusting member 322 to slide upward along the guide rail groove 3211 of the connecting block 321 again, so that the positioning hole 3222 of the adjusting member 322 is aligned with the first positioning groove 32121, and insert the plugging member 323 into the positioning hole 3222 and the first positioning groove 32121 to lift the digital display 4 by using the adjusting member 322;

[0048] Loosen the first locking member 224, and push the connecting bracket to rotate around the rod body portion 211 to move the moving bracket 22 away to be misaligned with the wafer to facilitate taking out the wafer.

[0049] The above-disclosed are only the preferred embodiments of the present invention. Of course, the scope of rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A wafer thickness measuring instrument, characterized in that: include: A supporting platform, wherein the supporting platform is used to place a wafer; A rotating device, the rotating device comprising a connecting rod and a movable bracket, the connecting rod being fixedly connected to an edge of the supporting platform, and the movable bracket being rotatably connected to the connecting rod at one end close to the connecting rod; A sliding device, the sliding device includes a slider and a lifting assembly, the slider can be slidably connected to the mobile bracket along the extension direction of the mobile bracket, the lifting assembly includes a connecting block and an adjusting member, the connecting block is fixedly connected to the slider, one end of the adjusting member can be vertically slidably connected to the connecting block, and the other end is connected to a digital display.

2. The wafer thickness measuring instrument according to claim 1, characterized in that: The connecting rod includes a rod body and a positioning portion, the bottom end of the rod body is fixedly connected to the supporting platform, the positioning portion is arranged on the outer side of the rod body, the movable bracket is provided with a connecting portion at one end close to the connecting rod, the connecting portion is provided with a connecting hole penetrating vertically, the connecting portion is sleeved on the rod body through the connecting hole, and the bottom surface of the connecting portion abuts against the positioning portion.

3. The wafer thickness measuring instrument according to claim 2, characterized in that: The connecting portion is provided with a first locking hole connected to the connecting hole, and the movable bracket is provided with a first locking piece corresponding to the first locking hole. The first locking piece is threadedly connected to the first locking hole to extend into the connecting hole and contact the rod body.

4. The wafer thickness measuring instrument according to claim 1, characterized in that: The movable bracket is in the shape of an elongated strip and is provided with a guide rail portion extending in the transverse direction. The slider is provided with a sliding guide groove corresponding to the guide rail portion. When the slider is slidably connected with the movable bracket, the guide rail portion extends into the sliding guide groove to guide the slider to move in the transverse direction.

5. The wafer thickness measuring instrument according to claim 4, characterized in that: The slider is provided with a second locking hole connected to the sliding guide groove, and the slider is provided with a second locking piece corresponding to the second locking hole. The second locking piece is threadedly connected to the second locking hole to extend into the sliding guide groove and contact the guide rail portion.

6. The wafer thickness measuring instrument according to claim 1, characterized in that: One end of the movable bracket away from the connecting rod extends beyond the supporting platform in a horizontal direction.

7. The wafer thickness measuring instrument according to claim 1, characterized in that: The connecting block is provided with two guide rail grooves extending vertically in parallel on one side facing the adjusting member, the adjusting member is provided with two sliding protrusions corresponding to the two guide rail grooves, the two sliding protrusions are slidably arranged on the two guide rail grooves correspondingly, the lifting component also includes an insert, the connecting block is provided with two positioning grooves vertically, the adjusting member is provided with positioning holes corresponding to the two positioning grooves, when the adjusting member is adjusted by vertical sliding, the positioning hole is aligned with any one of the two positioning grooves, the insert passes through the positioning hole and is inserted into the positioning groove aligned with the positioning hole to fix the adjusting member.

8. The wafer thickness measuring instrument according to claim 1, characterized in that: The digital display meter is provided with a needle measuring part extending in a vertical direction, the slider is provided with a limiting hole corresponding to the needle measuring part, the needle measuring part is penetrated through the limiting hole, the adjusting member is provided with a limiting part, the needle measuring part is provided with a fixing part crimped on the limiting part, when the adjusting member is adjusted by sliding vertically, the limiting part vertically lifts or resets the fixing part to lift or fall back the needle measuring part.

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