Socket for testing high-temperature aging of chip on chip

Abstract

The utility model provides an on-chip chip high temperature aging test socket, which comprises a test seat, the rear side of the top of the test seat is fixedly connected with a torsion spring piece, the torsion spring piece is rotatably connected with a rotating shaft, the surface of the rotating shaft is fixedly connected with a gland plate through a connecting block, the top of the test seat is provided with a placing groove, and the placing groove is provided with a clamping groove. The two ends of the bottom of the inner wall of the placing groove are fixedly connected with a plurality of pins, the bottom ends of the pins extend to the outside of the testing seat, and the two ends of the bottom of the testing seat are detachably connected with connecting plates. According to the chip-on-chip high-temperature aging test socket, after the connecting plate is mounted at the bottom of the test socket, the transparent cover covers the exteriors of the plurality of pins, so that the plurality of gland plates are protected in the transportation process, the condition that the pins are stressed to be inclined in the transportation process is avoided, the stability in the subsequent detection process is further improved, and the detection efficiency is improved. And the accuracy of a semiconductor high-temperature aging test result is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip aging testing, in particular to a socket for on-chip high-temperature aging testing of chips. Background Technique

[0002] The high-temperature storage life test of integrated circuits is an indispensable test link for consumer electronics, automotive-grade integrated packages, military products and other devices. Different chip test requirements and application environments correspond to different high-temperature aging temperatures. On the one hand, high-temperature aging can force the device to withstand the load and reliability of the chip in high-temperature, high-humidity and other environments; on the other hand, through the chip tolerance, early failures of the chip can be found, which is used for product classification to verify and screen high-quality products.

[0003] In the prior art, during the semiconductor production process, a socket for on-chip high-temperature aging testing of chips is used to perform aging testing on semiconductors. However, in the existing socket for on-chip high-temperature aging testing of chips, during the use process, the externally exposed pins are prone to being deformed by force and skewed during transportation, thereby affecting the detection of the socket for on-chip high-temperature aging testing of chips and reducing the accuracy of the test results.

[0004] Therefore, it is necessary to provide a new socket for on-chip high-temperature aging testing of chips to solve the above technical problems. Summary of the Invention

[0005] The utility model provides a socket for on-chip high-temperature aging testing of chips, and the technical problem to be solved is that in the existing socket for on-chip high-temperature aging testing of chips, the externally exposed pins are prone to being deformed by force and skewed during transportation, thereby affecting the detection of the socket for on-chip high-temperature aging testing of chips.

[0006] To solve the above technical problems, the socket for on-chip high-temperature aging testing of chips provided by the utility model includes a test socket. A torsion spring member is fixedly connected to the rear side of the top of the test socket. A rotating shaft is rotatably connected to the torsion spring member. A pressing cover plate is fixedly connected to the surface of the rotating shaft through a connecting block.

[0007] A placement groove is formed in the top of the test socket. A plurality of pins are fixedly connected to both ends of the bottom of the inner wall of the placement groove. The bottom ends of the pins extend to the outside of the test socket. Both ends of the bottom of the test socket are detachably connected with connecting plates. A transparent cover is arranged on the surface of the connecting plate and covers the outside of multiple pins at the same end.

[0008] Receiving grooves are formed in both ends of the bottom of the test socket. A connecting piece adapted to the receiving groove is fixedly connected to the surface of the connecting plate. A clamping structure for fixing the connecting piece is arranged on the inner wall surface of the receiving groove.

[0009] Preferably, the clamping structure includes two receiving boxes and two clamping grooves. The receiving boxes are fixedly connected to the front end and the rear end of the inner wall of the receiving groove. A clamping ball is slidably arranged at the inner end of the receiving box. The outer end of the clamping ball extends into the inner cavity of the receiving box by pulling. A spring is fixedly connected between the outer end of the clamping ball and the inner wall surface of the receiving box. The two clamping grooves are respectively formed on the front end surface and the rear end surface of the connecting piece and are adapted to the clamping balls.

[0010] Preferably, a positioning rod is fixedly connected to the surface of the connecting plate, and a positioning groove adapted to the positioning rod is formed at the bottom of the test seat.

[0011] Preferably, a plurality of mounting holes are formed in the test seat.

[0012] Preferably, a plurality of grooves are formed on the surface of the pressing cover plate, and a convex block adapted to the grooves is fixedly connected to the top of the test seat.

[0013] Preferably, a buckle is fixedly connected to the surface of the pressing cover plate, and a clamping groove adapted to the buckle is formed on the front side of the top of the test seat.

[0014] Preferably, a rubber block capable of being embedded into the placement groove is fixedly connected to the surface of the pressing cover plate.

[0015] Compared with the related art, the on-chip chip high-temperature aging test socket provided by the present utility model has the following beneficial effects:

[0016] The present utility model provides an on-chip chip high-temperature aging test socket. After being installed on the bottom of the test seat through a connecting plate, a transparent cover is arranged outside a plurality of pins to protect a plurality of pressing cover plates during transportation, avoiding the situation that the pins are stressed and skewed during transportation, thereby improving the stability in the subsequent detection process, improving the accuracy of the semiconductor high-temperature aging test result, and during the disassembly and assembly process of the connecting plate, after the connecting piece is embedded into the inner part of the receiving groove, by squeezing the clamping ball, when the spring contracts to generate an elastic force, the clamping groove moves to the corresponding position of the clamping ball, and after the clamping ball is embedded into the clamping groove, the connecting plate can be clamped and fixed. The disassembly and assembly operation is simple and fast, facilitating the test operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of a preferred embodiment of the on-chip chip high-temperature aging test socket provided by the present utility model;

[0018] Figure 2 is Figure 1 a schematic structural diagram of the test seat and the placement groove shown in

[0019] Figure 3 is Figure 1Schematic structural diagram of the test socket and the connection board shown

[0020] Figure 4 For Figure 3 Schematic structural diagram of the snap-fit structure shown

[0021] Reference numerals in the figure: 1, test socket; 2, torsion spring member; 3, rotating shaft; 4, pressing cover plate; 5, connecting block; 6, groove; 7, positioning groove; 8, convex block; 9, rubber block; 10, buckle; 11, card slot; 12, mounting hole; 13, placement groove; 14, pin; 15, connection board; 16, transparent cover; 17, receiving groove; 18, connecting piece; 19, snap-in groove; 20, receiving box; 21, spring; 22, ball; 23, positioning rod Specific implementation mode

[0022] The present utility model will be further described below in conjunction with the accompanying drawings and the implementation mode

[0023] Please refer to in conjunction with Figure 1 , Figure 2 , Figure 3 And Figure 4 , where Figure 1 Is a schematic structural diagram of a preferred embodiment of the on-chip chip high-temperature aging test socket provided by the present utility model Figure 2 For Figure 1 Schematic structural diagram of the test socket and the placement groove shown Figure 3 For Figure 1 Schematic structural diagram of the test socket and the connection board shown Figure 4 For Figure 3 Schematic structural diagram of the snap-fit structure shown. The on-chip chip high-temperature aging test socket includes a test socket 1. A torsion spring member 2 is fixedly connected to the rear side of the top of the test socket 1. A rotating shaft 3 is rotatably connected to the torsion spring member 2. A pressing cover plate 4 is fixedly connected to the surface of the rotating shaft 3 through a connecting block 5

[0024] A placement groove 13 is opened at the top of the test socket 1. A plurality of pins 14 are fixedly connected to both ends of the bottom inner wall of the placement groove 13. The bottom ends of the pins 14 extend to the outside of the test socket 1

[0025] Both ends of the bottom of the test socket 1 are detachably connected with a connection board 15. A transparent cover 16 covering the outside of multiple pins 14 at the same end is arranged on the surface of the connection board 15

[0026] Both ends of the bottom of the test socket 1 are provided with receiving grooves 17. A connecting piece 18 adapted to the receiving grooves 17 is fixedly connected to the surface of the connection board 15. A snap-fit structure for fixing the connecting piece 18 is arranged on the inner wall surface of the receiving grooves 17

[0027] After the connecting plate 15 is installed at the bottom of the test socket 1, the transparent cover 16 is sleeved outside the multiple pins 14 to protect the multiple pressure cover plates 4 during transportation, avoid the pins 14 from being stressed and skewed during transportation, thereby improving the stability in the subsequent detection process and the accuracy of the semiconductor high-temperature aging test results.

[0028] The clamping structure includes two receiving boxes 20 and two clamping grooves 19. The receiving boxes 20 are fixedly connected to the front end and the rear end of the inner wall of the receiving groove 17. A clamping ball 22 is slidably arranged at the inner end of the receiving box 20, and the outer end of the clamping ball 22 extends and pulls into the inner cavity of the receiving box 20.

[0029] A spring 21 is fixedly connected between the outer end of the clamping ball 22 and the inner wall surface of the receiving box 20. The two clamping grooves 19 are respectively opened on the front end surface and the rear end surface of the connecting piece 18 and are adapted to the clamping ball 22.

[0030] During the disassembly and assembly process of the connecting plate 15, after the connecting piece 18 is inserted into the receiving groove 17, by squeezing the clamping ball 22 to make the spring 21 contract and generate elastic force, the clamping groove 19 moves to the corresponding position of the clamping ball 22. After the clamping ball 22 is inserted into the clamping groove 19, the connecting plate 15 can be clamped and fixed. The disassembly and assembly operations are simple and fast, which is convenient for the test operation.

[0031] A positioning rod 23 is fixedly connected to the surface of the connecting plate 15, and a positioning groove 7 adapted to the positioning rod 23 is opened at the bottom of the test socket 1.

[0032] During the installation process of the connecting plate 15, the positioning rod 23 is inserted into the positioning groove 7 for positioning, which improves the stability during the clamping operation.

[0033] A plurality of mounting holes 12 are opened on the test socket 1, and the plurality of mounting holes 12 facilitate the installation of the test socket 1 before the test operation.

[0034] A plurality of grooves 6 are opened on the surface of the pressure cover plate 4, and a convex block 8 adapted to the grooves 6 is fixedly connected to the top of the test socket 1.

[0035] During the splicing process of the pressure cover plate 4 and the test socket 1, the convex block 8 is inserted into the grooves 6 to position between the pressure cover plate 4 and the test socket 1.

[0036] A buckle 10 is fixedly connected to the surface of the pressure cover plate 4, and a card slot 11 adapted to the buckle 10 is opened on the front side of the top of the test socket 1.

[0037] After the pressure cover plate 4 and the test socket 1 are spliced, the buckle 10 is inserted into the card slot 11, and the pressure cover plate 4 and the test socket 1 can be clamped and spliced.

[0038] A rubber block 9 capable of being embedded in the placement groove 13 is fixedly connected to the surface of the gland plate 4. After the semiconductor is placed in the inner cavity of the placement groove 13, the rubber block 9 resists the semiconductor to improve the detection stability.

[0039] The working principle of the on-chip high temperature aging test socket provided by the utility model is as follows:

[0040] During transportation, after the connecting plate 15 is installed at the bottom of the test socket 1, the transparent cover 16 is set on the outside of the multiple pins 14 to protect the multiple pressure cover plates 4 during transportation. During inspection, the connecting plate 15 is removed, and the semiconductor is placed in the inner cavity of the placement groove 13. The pressure cover plate 4 is spliced ​​with the test socket 1, and the buckle 10 is embedded in the inside of the card slot 11. The pressure cover plate 4 and the test socket 1 can be snap-connected and spliced, and the rubber block 9 resists the semiconductor to improve the detection stability.

[0041] Compared with the related art, the on-chip high temperature aging test socket provided by the utility model has the following beneficial effects:

[0042] The utility model provides an on-chip chip high-temperature aging test socket. After a connecting plate 15 is installed on the bottom of a test seat 1, a transparent cover 16 is arranged on the outside of a plurality of pins 14 to protect a plurality of pressure cover plates 4 during transportation, so as to prevent the pins 14 from being skewed due to force during transportation, thereby improving the stability in subsequent detection processes and improving the accuracy of semiconductor high-temperature aging test results. In addition, during the disassembly and assembly of the connecting plate 15, only the connecting plate 18 needs to be embedded in the interior of the accommodating groove 17, and then the spring 21 is contracted to generate elastic force by squeezing the card ball 22, and then the card groove 19 is moved to the corresponding position of the card ball 22. After the card ball 22 is embedded in the card groove 19, the connecting plate 15 can be carded and fixed. The disassembly and assembly operation is simple and fast, and the test operation is convenient.

[0043] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip-on-chip high temperature aging test socket, comprising a test socket (1), characterized in that: A torsion spring member (2) is fixedly connected to the rear side of the top of the test seat (1); a rotating shaft (3) is rotatably connected to the torsion spring member (2); and a pressure cover plate (4) is fixedly connected to the surface of the rotating shaft (3) via a connecting block (5); The top of the test seat (1) is provided with a placement groove (13), and the two ends of the bottom of the inner wall of the placement groove (13) are fixedly connected with a plurality of pins (14), and the bottom ends of the pins (14) extend to the outside of the test seat (1), and the two ends of the bottom of the test seat (1) are detachably connected with a connecting plate (15), and the surface of the connecting plate (15) is provided with a transparent cover (16) arranged outside the plurality of pins (14) at the same end; Both ends of the bottom of the test seat (1) are provided with receiving grooves (17); a connecting piece (18) adapted to the receiving groove (17) is fixedly connected to the surface of the connecting plate (15); and a clamping structure for fixing the connecting piece (18) is provided on the inner wall surface of the receiving groove (17).

2. The chip-on-chip high temperature aging test socket according to claim 1, characterized in that: The clamping structure comprises two accommodating boxes (20) and two clamping grooves (19); the accommodating box (20) is fixedly connected to the front end and the rear end of the inner wall of the accommodating groove (17); the inner end of the accommodating box (20) is slidably provided with a clamping ball (22); the outer end of the clamping ball (22) is pulled and extended to the inner cavity of the accommodating box (20); a spring (21) is fixedly connected between the outer end of the clamping ball (22) and the inner wall surface of the accommodating box (20); the two clamping grooves (19) are respectively opened on the front end surface and the rear end surface of the connecting piece (18) and are adapted to the clamping ball (22).

3. The chip-on-chip high temperature aging test socket according to claim 1, characterized in that: A positioning rod (23) is fixedly connected to the surface of the connecting plate (15), and a positioning groove (7) adapted to the positioning rod (23) is provided at the bottom of the test seat (1).

4. The chip-on-chip high temperature aging test socket according to claim 1, characterized in that: The test seat (1) is provided with a plurality of mounting holes (12).

5. The chip-on-chip high temperature aging test socket according to claim 1, characterized in that: A plurality of grooves (6) are provided on the surface of the pressure cover plate (4), and a protrusion (8) adapted to the grooves (6) is fixedly connected to the top of the test seat (1).

6. The chip-on-chip high temperature aging test socket according to claim 1, characterized in that: A buckle (10) is fixedly connected to the surface of the pressure cover plate (4), and a clamping groove (11) adapted to the buckle (10) is provided on the front side of the top of the test seat (1).

7. The chip-on-chip high temperature aging test socket according to claim 1, characterized in that: A rubber block (9) capable of being embedded in the placement groove (13) is fixedly connected to the surface of the pressure cover plate (4).

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