Linkage type chip test equipment

Abstract

The utility model provides linkage type chip testing equipment. The linkage type chip testing equipment comprises a main body; an ejection assembly, a test assembly and a moving assembly, the ejection assembly comprises a bottom plate, a plurality of plate bodies and ejector pins, the plate bodies are arranged above the main body in parallel, and the ejector pins are arranged on the plate bodies respectively and face the test assembly; the bottom plate is arranged below the plate body and is provided with a rolling group; the test assembly comprises a plurality of circuit boards, a template and a bearing plate; the moving assembly comprises a transmission rod and a moving block, the transmission rod is rotationally connected with the moving block, and the moving block is in contact with or away from the rolling group and enables the ejection assembly to move in the vertical direction, so that the ejector pin moves in the through hole and ejects the chip out; according to the utility model, a plurality of chips in the multi-layer template can be tested, and after the test is completed, the bearing plate is far away from the chip test area, and the moving block moves to an initial position, so that the ejection assembly can eject out the chips clamped in the test assembly at one time, the test efficiency is greatly improved, and the test device is suitable for automatic production.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, and more specifically, to a rotary chip testing device. Background Art

[0002] During the chip packaging process, the chip is placed in a protective shell. The shell can not only provide physical protection but also ensure electrical connection between the chip and external devices. After packaging, the chip needs to go through a series of test items to verify its functions and performance.

[0003] The chip testing device in the prior art includes a test board, a template and a driving device. Among them, the lower surface of the test board has a plurality of probes, and the template has a plurality of chip slots. A plurality of chips to be tested are respectively placed in the plurality of chip slots of the template, and a plurality of solder balls are provided on the surface of each chip to be tested. The driving device of the chip testing device is used to make the solder balls of the chips to be tested contact the probes on the test board, so as to realize the electrical connection between the chips to be tested and the test board and perform electrical testing. However, during the testing process, both the probes and the solder balls will generate heat energy. When the testing is completed, the solder balls will stick to the probes. At this time, it is necessary to manually remove the chips one by one.

[0004] As described above, after the chip testing is completed, multiple chips are likely to stick to the probes, and manually removing them one by one will greatly affect the testing efficiency. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is that after the chip testing is completed, multiple chips are likely to stick to the probes, and manually removing them one by one will greatly affect the testing efficiency. In view of the above defects of the prior art, a rotary chip testing device is provided.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A linkage chip testing device is constructed, including a main body; among which, it includes: an ejecting component, a testing component and a moving component. The ejecting component and the testing component are respectively arranged on the main body, and the moving component is arranged below the ejecting component. The ejecting component includes a bottom plate, a plurality of plate bodies and ejecting pins. The plate bodies are arranged in parallel above the main body. The ejecting pins are respectively arranged on the plate bodies and face the testing component. The bottom plate is placed below the plate bodies and is provided with a rolling group. The testing component includes a plurality of circuit boards, a template and a carrier plate. The circuit boards, the template and the carrier plate are arranged in sequence from top to bottom. The circuit board is provided with through holes, and the ejecting pins penetrate through the through holes. The moving component includes a transmission rod and a moving block. The transmission rod is rotationally connected to the moving block. The moving block contacts or moves away from the rolling group, and makes the ejecting component move in the vertical direction, so that the ejecting pins move in the through holes and eject the chip.

[0008] As a further improvement of the present utility model, the moving component includes a plurality of fixed seats and a moving track. The moving block is provided with a matching hole. The transmission rod is rotationally connected to the fixed seat and penetrates through the matching hole. The fixed seat and the moving track are respectively fixedly arranged above the main body. The moving block is slidably connected to the moving track. The transmission rod rotates to drive the moving block to move along the moving track.

[0009] As a further improvement of the present utility model, one side of the moving block is provided with an inclined surface, and the inclined surface is arranged on one side of the forward movement direction of the moving block.

[0010] As a further improvement of the present utility model, the testing component further includes a plurality of probe groups and a controller for executing a testing program. The circuit board is arranged in parallel above the template and is fixedly connected to the main body. The probe groups are fixedly arranged on the surface of the circuit board and face the template. The controller is fixedly arranged inside the main body.

[0011] As a further improvement of the present utility model, the surface of the template is provided with a plurality of testing positions, and the testing positions are arranged in an array. The template is provided with a chip to be tested. Each testing position is provided with a groove, and the chip to be tested is placed in the groove. Each chip to be tested is provided with a testing surface, and the testing surface is provided with connecting balls and faces the testing component.

[0012] As a further improvement of the present utility model, the ejecting pins are vertically arranged on the lower surface of the plate body. The testing surface is provided with at least one placing area, and at least one through hole is provided at the corresponding position of the circuit board and the placing area. The ejecting pins respectively penetrate through the through holes and are placed in the placing area.

[0013] As a further improvement of the present utility model, each of the probe groups is provided with a plurality of probes, and the probes are arranged corresponding to the connection balls; the probes are communicatively connected to the chip to be tested and send instructions to the chip to be tested or obtain feedback signals.

[0014] As a further improvement of the present utility model, the main body is provided with a fixing assembly, the fixing assembly includes a placement groove and fixing members, the circuit boards are respectively placed in the placement grooves, and the fixing members are respectively arranged on both sides of the main body; the circuit boards are provided with fixing holes, and the fixing members sequentially pass through the main body, the placement groove and the fixing holes.

[0015] As a further improvement of the present utility model, the rolling group, the rolling group includes a plurality of sliding members, the rotation direction of the sliding members is the same as the moving direction of the moving block, and the moving block contacts or moves away from the sliding members.

[0016] As a further improvement of the present utility model, the main body is further provided with a driving assembly, the driving assembly is fixedly connected to the bearing plate and drives the bearing plate to move in the vertical direction; the driving assembly includes a driving member and a driving rod, the driving member is fixedly arranged in the main body, one end of the driving rod is slidably connected to the driving member, and the other end is fixedly connected to the bearing plate, and the driving member drives the driving rod and drives the bearing plate to move.

[0017] The beneficial effects of the present utility model are as follows: The test assembly is provided with multiple layers of templates and circuit boards, and can simultaneously test multiple packaged chips in the multiple layers of templates, and after the test is completed, through the multiple plate bodies and ejector pins provided, the chips stuck at the circuit boards can be simultaneously ejected; during the chip test process, the template is installed with the chip to be tested, and the templates are sequentially placed on the corresponding bearing plates, and the bearing plates move, so that the chips to be tested in the templates are tested with the circuit boards. When the chip test is completed, the bearing plates move away from the circuit boards. At this time, the moving block in the transmission assembly moves to the initial position, and then the ejecting assembly drops due to gravity and ejects the chips stuck at the circuit boards, and can eject the chips stuck in the test assembly at one time, avoiding the need to manually remove the chips stuck to the test assembly one by one after the chip test is completed, greatly improving the test efficiency, and at the same time, it also better meets the requirements of automated production. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will further illustrate the present utility model in conjunction with the drawings and embodiments. The drawings in the following description are only partial embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings:

[0019] Figure 1 It is the overall structure diagram of a linkage chip testing device in an embodiment of the present utility model;

[0020] Figure 2 It is a three-dimensional schematic diagram of another angle of a linkage chip testing device in an embodiment of the present utility model;

[0021] Figure 3 It is a three-dimensional schematic diagram of another angle of a linkage chip testing device in an embodiment of the present utility model;

[0022] Figure 4 It is of the present utility model Figure 3 The partial enlarged schematic diagram at position Q;

[0023] Figure 5 It is a three-dimensional schematic diagram of a linkage chip testing device in an embodiment of the present utility model;

[0024] Figure 6 It is a three-dimensional schematic diagram of another angle of a linkage chip testing device in an embodiment of the present utility model;

[0025] Figure 7 It is of the present utility model Figure 6 The partial enlarged schematic diagram at position I;

[0026] Figure 8 It is the front view schematic diagram of a linkage chip testing device in an embodiment of the present utility model;

[0027] Figure 9 It is of the present utility model Figure 8 The sectional view at A - A;

[0028] Label description: main body 1, template 21, chip to be tested 20, testing component 3, ejecting component 4, bottom plate 41, rolling group 411, bearing plate 5, driving component 11, moving component 6, moving block 61, transmission rod 62, fixed seat 63, moving track 64, inclined plane 611, testing position 212, testing surface 2111, connecting ball 21111, circuit board 31, probe group 32, plate body 42, ejector pin 43, placing area 21112, through hole 311, probe 321, fixing component 12, placing groove 123, fixing piece 122, sliding piece 4111, driving piece 113, driving rod 114. Specific embodiments

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model. Obviously, the described embodiments are partial embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0030] As Figures 1 - 4 shown, it is a schematic diagram of a linkage chip testing device provided by an embodiment of the present utility model, which can eject the chips stuck in the testing component 3 at one time, avoiding the need to manually remove the chips adhered to the testing component 3 one by one after the testing is completed, greatly improving the testing efficiency. At the same time, it also better meets the requirements of automated production and can be used to test multiple packaged chips in multiple templates 21. The linkage chip testing device of this embodiment includes a main body 1, an ejection component 4, a testing component 3, and a moving component 6. The ejection component 4 and the testing component 3 are respectively arranged on the main body 1, and the moving component 6 is arranged below the ejection component 4; the ejection component 4 includes a bottom plate 41, several plate bodies 42, and ejector pins 43. The plate bodies 42 are arranged in parallel above the main body 1, and the ejector pins 43 are respectively arranged on the plate bodies 42 and face the testing component 3; the bottom plate 41 is placed below the plate bodies 42 and is provided with a rolling group 411; the testing component 3 includes several circuit boards 31, a template 21, and a carrier plate 5. The circuit boards 31, the template 21, and the carrier plate 5 are arranged in sequence from top to bottom; the circuit board 31 is provided with through holes 311, and the ejector pins 43 penetrate through the through holes 311; the moving component 6 includes a transmission rod 62 and a moving block 61. The transmission rod 62 is rotatably connected to the moving block 61. The moving block 61 contacts or moves away from the rolling group 411, causing the ejection component 4 to move in the vertical direction, so that the ejector pins 43 move in the through holes 311 and eject the chips.

[0031] In this embodiment, the test component 3 includes a plurality of templates 21. A template 21 is placed above each carrier plate 5, and a test component 3 is provided above each carrier plate 5. A plate body 42 and a probe 321 are provided above the test component 3, and a moving component 6 is provided below the ejecting component 4. In a specific embodiment, the carrier plate 5 is in a flat plate shape and is horizontally arranged above the main body 1 to serve as a placement platform for the template 21 and the chip 20 to be tested. The template 21 is placed on the carrier plate and moves vertically together with the carrier plate 5. During the chip testing process, a plurality of chips 20 to be tested are installed on the template 21, and then the template 21 is sequentially placed above the carrier plate 5. After the carrier plate 5 reaches the preset chip testing area, it stops moving. At this time, the chip 20 to be tested in the template 21 contacts the test component 3 and is tested. At the same time, the moving component 6 is in a working state to ensure that the ejecting component 4 does not affect the chip testing. When the chip testing is completed, the carrier plate 5 moves away from the chip testing area. At this time, the moving block 61 provided on the moving component 6 moves to a preset position to form an initial state, and then the ejecting component 4 drops under the action of gravity and ejects the chip stuck at the test component 3. It can not only be applicable to automated production, but also test a plurality of chips 20 to be tested in a plurality of templates 21. In a specific embodiment, the chip 20 to be tested is a BGA package chip, that is, a Ball Grid Array package chip.

[0032] Please refer to Figures 1 - 5 , in an embodiment of the present utility model, the moving component 6 includes a moving block 61, a transmission rod 62, a plurality of fixed seats 63 and a moving track 64. The fixed seats 63 and the moving track 64 are fixedly arranged above the main body 1. The moving block 61 is provided with a mating hole. The transmission rod 62 is rotatably connected to the fixed seat 63 and passes through the mating hole. The moving block 61 is slidably connected to the moving track 64. When the transmission rod 62 rotates, it drives the moving block 61 to move along the moving track 64.

[0033] In one embodiment, the fixed seat 63 is fixed above the main body 1. In a specific embodiment, the fixed seat 63 is provided with a clamping position, and the transmission rod 62 and the moving track 64 are respectively clamped in the clamping positions provided on the fixed seat 63. In another specific embodiment, the transmission rod 62 is a lead screw, and a servo motor is provided at one end of the lead screw. The servo motor drives the lead screw to rotate, thereby driving the moving block 61 to move. In a specific embodiment, the moving block 61 is provided with a plurality of circular holes, and the moving track 64 passes through the circular holes provided on the moving block 61, so that the moving block 61 can move horizontally along the moving track 64. In a specific embodiment, the moving tracks 64 are cylindrical and there are two of them, which are respectively arranged on both sides of the transmission rod 62. In another specific embodiment, the mating hole provided on the moving block 61 is a threaded hole, and the threaded hole cooperates with the thread provided on the transmission rod 62, so that when the transmission rod 62 rotates, it can drive the moving block 61 to move along the moving track 64.

[0034] Moreover, one side of the moving block 61 is provided with an inclined surface 611, and the inclined surface 611 is arranged on one side of the moving block 61 in the forward movement direction.

[0035] In one embodiment, one side of the moving block 61 is provided with an inclined surface 611. When the moving block 61 is in the initial position, after the transmission rod 62 rotates, the moving block 61 moves forward. Until the provided inclined surface 611 contacts the rolling group 411, then the rolling group 411 rolls up along the inclined surface 611. Finally, the moving block 61 presses against the rolling group 411. The moving block 61 is provided with an inclined surface 611, which can better contact the rolling group 411 and prevent damage caused by impact.

[0036] Please refer to Figures 1 - 7 , in an embodiment of the present invention, the test assembly 3 includes a circuit board 31, a plurality of probe groups 32, and a controller for executing a test program. The circuit board 31 is arranged parallel above the carrier board 5 and is fixedly connected to the main body 1. The probe groups 32 are fixedly arranged on the surface of the circuit board 31 and face the template 21, and the controller is fixedly arranged inside the main body 1.

[0037] In one embodiment, the circuit board 31 is arranged between the plate body 42 and the template 21, and is provided with a plurality of probe groups 32. The probe groups 32 are arranged facing the template 21. The controller is fixedly arranged inside the main body 1 and is electrically connected to the circuit board 31, and is used to execute a test program or be electrically connected to an upper computer with a test program. In a specific embodiment, the circuit board 31 is a printed circuit board 31 (Printed circuit board, PCB). In a specific embodiment, the printed circuit board 31 is fixed above the carrier board 5 in a manner parallel to the carrier board 5, and the surface of the circuit board 31 facing the carrier board 5 is provided with probe groups 32. The position and quantity of the probes 321 in each probe group 32 respectively correspond to the connection balls 21111 provided on each chip 20 to be tested on the template 21.

[0038] Please refer to Figures 2 - 8 , in an embodiment of the present utility model, several test positions 212 are provided on the surface of the template 21, and the test positions 212 are arranged in an array; each test position 212 is provided with a groove, and the chip 20 to be tested is placed in the groove; each chip 20 to be tested is provided with a test surface 2111, the test surface 2111 is provided with connection balls 21111, and is oriented towards the circuit board 31.

[0039] In one embodiment, the test positions 212 are arranged in an array on the upper surface of the template 21, the chip 20 to be tested is provided with a test surface 2111, and the test surface 2111 is provided with connection balls 21111. In a specific embodiment, the connection balls 21111 are solder balls, and the solder balls are arranged in one-to-one correspondence with the test positions 212; in another specific embodiment, the shape and size of the groove are the same as those of the chip 20 to be tested, so as to ensure that when the chip 20 to be tested moves to the chip test area, the probe 321 on the circuit board 31 can contact the corresponding solder ball, avoiding misconnection; in another specific embodiment, ten chips 20 to be tested are placed on the grooves provided in the test positions 212. Correspondingly, the test assembly 3 is provided with ten probe groups 32, and the number of probes 321 included in each probe group 32 is equal to the number of solder balls provided on the test surface 2111.

[0040] Specifically, each chip 20 to be tested is a BGA package chip. The pins of the chip 20 to be tested are composed of solder balls, and all the solder balls of the chip 20 to be tested are arranged on the same surface. The chip 20 to be tested is placed on the test position 212 of the template 21 with the surface where the solder balls are located facing upward; moreover, the surface of the chip 20 to be tested with solder balls, that is, the test surface 2111, is provided with at least one placement area 21112, and there are no solder balls in the placement area 21112.

[0041] Moreover, each probe group 32 is provided with several probes 321, and the probes 321 are arranged in correspondence with the connection balls 21111; the probes 321 are communicatively connected to the chip 20 to be tested and send instructions to the chip 20 to be tested or obtain feedback signals.

[0042] In one embodiment, the probes 321 are made of conductive materials. By contacting the solder balls provided on the chip 20 to be tested through the probes 321, communication connection between the test assembly 3 and the chip 20 to be tested can be achieved, so as to send instructions to the chip 20 to be tested or obtain feedback signals from the chip 20 to be tested.

[0043] Please refer to Figures 1 - 8, in an embodiment of the present utility model, the ejection assembly 4 is provided with a plate body 42 and ejector pins 43, and the ejector pins 43 are vertically arranged on the lower surface of the plate body 42; the test surface 2111 is provided with at least one placement area 21112, and at least one through hole 311 is provided at the corresponding position of the circuit board 31 and the placement area 21112. The ejector pins 43 respectively penetrate through the through holes 311 and are placed in the placement area 21112.

[0044] In one embodiment, the ejector pins 43 are vertically arranged below the plate body 42. The test surface 2111 of the chip to be tested 20 is provided with at least one placement area 21112, and at least one through hole 311 is provided at the corresponding position of the circuit board 31 and the placement area 21112. The through hole 311 penetrates through the upper surface and the lower surface of the circuit board 31. After the ejector pins 43 pass through the through holes 311, they are placed in the placement area 21112. In another specific embodiment, there are 10 chips to be tested 20 in total. Each test surface 2111 of the chip to be tested 20 is provided with one placement area 21112, and there are 10 ejector pins 43. After the ejector pins 43 pass through the through holes 311, they are located in the placement area 21112. In another specific embodiment, the test surface 2111 of each chip to be tested 20 is provided with four placement areas 21112. Then, one ejector pin 43 is provided in each placement area 21112, that is, four ejector pins 43 are distributed on one test surface 2111. The ejector pins 43 and the test surface 2111 form multiple point-to-surface contacts, so that when the chip to be tested 20 is ejected, the force is more uniform and the chip damage can be avoided. In a specific embodiment, when the chip to be tested 20 is tested, the horizontal height of the ejector pins 43 is lower than the horizontal height of the probe 321. After the chip test is completed, the driving assembly 11 drives the carrier plate 5 to move, and the movement trajectory is away from the side with the circuit board 31. When the driving assembly moves to a preset distance, the moving assembly 6 moves. During the movement, the ejection assembly 4 will slowly drop until the ejector pins 43 eject the chip stuck at the probe 321. At this time, the horizontal height of the ejector pins 43 is higher than the horizontal height of the probe 321.

[0045] Please refer to Figures 1 - 8 , in an embodiment of the present utility model, the main body 1 is provided with a fixing assembly 12. The fixing assembly 12 includes a placement groove 123 and fixing members 122. The circuit boards 31 are respectively placed in the placement groove 123, and the fixing members 122 are respectively arranged on both sides of the main body 1; the circuit board 31 is provided with fixing holes, and the fixing members 122 sequentially pass through the main body 1, the placement groove 123 and the fixing holes.

[0046] In one embodiment, the circuit board 31 is placed in the placement groove 123, and the fixing holes provided on the circuit board 31 are placed corresponding to the holes provided on the main body 1. Then, the fixing member 122 passes through the main body 1 until it cooperates with the fixing holes provided on the circuit board 31, thereby realizing the installation of the circuit board 31. In a specific embodiment, the fixing member 122 is a screw with threads; in another specific embodiment, the fixing member 122 is a bolt.

[0047] Please refer to Figures 1 - 8 , in one embodiment of the present utility model, the rolling group 411 includes a plurality of sliding members 4111. The rotation direction of the sliding members 4111 is the same as the moving direction of the moving block 61. The moving block 61 abuts against or moves away from the sliding members 4111.

[0048] In one embodiment, the rolling group 411 includes sliding members 4111. In a specific embodiment, the sliding members 4111 are rollers. When the moving block 61 contacts the rollers, the rollers will rotate accordingly and be abutted by the moving block 61. When the chip is being tested, the transmission rod 62 drives the moving block 61 to move until the moving block 61 contacts the rollers. After the chip test is completed, the moving block 61 gradually moves away from below the rollers.

[0049] Specifically, when the moving assembly 6 moves to a preset position, the sliding members 4111 provided on the rolling group 411 contact the moving assembly 6 and are forced to move upward, causing the plurality of plate bodies 42 and the thimble 43 to move upward simultaneously. When the moving assembly 6 moves to the preset position, the horizontal height of the thimble 43 provided on the plurality of plate bodies 42 is lower than the horizontal height of the probe 321 and forms a working state. When the test is completed, the driving assembly 11 drives the plurality of carrier plates 5 to move, and the moving trajectory is away from the side with the circuit board 31. When the driving assembly 11 moves to a preset distance, the moving assembly 6 moves. During the moving process, the bottom plate 41 will slowly drop. When the moving assembly 6 moves to the preset distance, the thimble 43 of the plurality of plate bodies 42 will eject the chip stuck at the probe 321 and form an initial state. When the chip is being tested, the moving assembly 6 moves to the preset distance and forms a working state.

[0050] Please refer to Figure 1 and Figure 9 , in one embodiment of the present utility model, the driving assembly 11 includes a driving member 113 and a driving rod 114. The driving member 113 is fixedly arranged in the main body 1. One end of the driving rod 114 is slidably connected to the driving member 113, and the other end is fixedly connected to the carrier plate 5. The driving member 113 drives the driving rod 114 and drives the carrier plate 5 to move

[0051] In one embodiment, the driving member 113 is fixedly disposed in the main body 1. In a specific embodiment, the driving member 113 is a cylinder, the driving rod 114 is a pneumatic rod, and the driving member 113 drives the driving rod 114 to move in the vertical direction. The driving rod 114 is fixedly connected to the bearing plate 5, that is, the driving member 113 drives the bearing plate 5 to move in the vertical direction. In another specific embodiment, the driving member 113 is provided with a motor and a gear, and the driving rod 114 is provided with a rack, and the rotation of the driving member 113 drives the driving rod 114 to move.

[0052] The foregoing are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A linkage chip testing device, comprising a main body; characterized in that: include: An ejection assembly, a test assembly and a moving assembly, wherein the ejection assembly and the test assembly are respectively arranged on the main body, and the moving assembly is arranged below the ejection assembly; The ejector assembly includes a bottom plate, a plurality of plate bodies and ejector pins, wherein the plate bodies are arranged parallel to the main body, and the ejector pins are arranged on the plate bodies and face the test assembly; The bottom plate is placed below the plate body and is provided with a rolling group; The test assembly includes a plurality of circuit boards, templates and a carrier board, wherein the circuit boards, the templates and the carrier board are arranged in sequence from top to bottom; The circuit board is provided with a through hole, and the ejector pin passes through the through hole; The moving assembly includes a transmission rod and a moving block, the transmission rod is rotatably connected to the moving block, the moving block contacts or moves away from the rolling group, and makes the ejection assembly move in the vertical direction, so that the ejector pin moves in the through hole and ejects the chip.

2. The linked chip testing device according to claim 1, characterized in that: The moving assembly includes a plurality of fixed seats and moving rails, the moving block is provided with a matching hole, the transmission rod is rotatably connected with the fixed seat and passes through the matching hole; The fixing seat and the moving track are respectively fixedly arranged above the main body, the moving block is slidably connected with the moving track, and the transmission rod rotates to drive the moving block to move along the moving track.

3. The linked chip testing device according to claim 2, characterized in that: A slope is provided on one side of the moving block, and the slope is provided on one side of the forward moving direction of the moving block.

4. The linked chip testing device according to claim 1, characterized in that: The test assembly also includes a plurality of probe groups and a controller for executing a test program. The circuit board is arranged above the template in parallel and fixedly connected to the main body; The probe group is fixed on the surface of the circuit board and faces the template, and the controller is fixed in the main body.

5. The linked chip testing device according to claim 4, characterized in that: The surface of the template is provided with a plurality of test positions, and the test positions are distributed in an array; the template is provided with a chip to be tested; Each of the test positions is provided with a groove, and the chip to be tested is placed in the groove; Each of the chips to be tested is provided with a test surface, the test surface is provided with connection balls and faces the test component.

6. The linkage chip testing device according to claim 5, characterized in that: The ejector pin is vertically arranged on the lower surface of the plate body; The test surface is provided with at least one placement area, the circuit board is provided with at least one through hole at a position corresponding to the placement area, and the ejector pins respectively pass through the through holes and are placed in the placement area.

7. The linked chip testing device according to claim 6, characterized in that: Each of the probe groups is provided with a plurality of probes, and the probes are arranged corresponding to the connecting balls; The probe is in communication connection with the chip to be tested, and sends instructions to the chip to be tested or obtains a feedback signal.

8. The linkage chip testing device according to claim 7, characterized in that: The main body is provided with a fixing assembly, the fixing assembly includes a placement groove and a fixing piece, the circuit boards are respectively placed in the placement grooves, and the fixing pieces are respectively arranged on both sides of the main body; The circuit board is provided with a fixing hole, and the fixing piece passes through the main body, the placement groove and the fixing hole in sequence.

9. The linked chip testing device according to claim 1, characterized in that: The rolling group includes a plurality of sliding members, the rotation direction of the sliding members is the same as the moving direction of the moving block, and the moving block contacts or moves away from the sliding members.

10. The linked chip testing device according to claim 1, characterized in that: The main body is also provided with a driving assembly, which is fixedly connected to the carrying plate and drives the carrying plate to move in a vertical direction; The driving assembly includes a driving member and a driving rod. The driving member is fixedly arranged in the main body. One end of the driving rod is slidably connected to the driving member, and the other end is fixedly connected to the supporting plate. The driving member drives the driving rod and drives the supporting plate to move.

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