Detection device

Abstract

The utility model discloses a detection device, comprising a sensor module which comprises an image sensor and a distance sensor and is used for detecting the distance between the periphery of a wafer and a focusing ring on a bearing platform and the distance between the edge position of the wafer and the distance sensor; the processor module is in communication connection with the sensor module so as to adjust the opening and closing of each sensor, and receives the detection data of each sensor so as to judge the calibration state of the wafer; the power supply module comprises an induction coil and a transmitting coil which are arranged at an interval, the transmitting coil is communicated with an alternating-current power supply, the induction coil generates induction current after the alternating-current power supply is started, the induction coil is connected with a capacitor and a rectifying circuit, and the rectifying circuit is used for converting alternating current into direct current; the induction coil is in conduction connection with the sensor module and the processor module through the integrated circuit board. According to the utility model, the influence of the battery on the levelness of the detection device is reduced through a wireless power supply mode, and effective calibration detection of the wafer is realized by combining different types of sensors.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production equipment, and particularly relates to a detection device. Background Art

[0002] In the process of semiconductor production, the picking and placing transportation of wafers are mostly realized by a robotic arm. At present, the end effectors of the robotic arm are mostly handle-shaped or spoon-shaped. During the process of picking up and transporting wafers, there will be a small relative drift between them and the wafers. Therefore, it is necessary to timely calibrate and detect each link of the transportation system. At present, the commonly used APS (Adaptive Positioning System) calibration device is used to calibrate the placement position of the wafers, so as to place the wafers at a roughly centered position on the carrier in the target chamber within an acceptable tolerance range. However, its calibration ability is limited, and due to the continuous action of the calibration device, a battery with a large capacity needs to be set, resulting in a large weight of the detection device. When it is located at the end effector, it will cause a certain degree of bending of the robotic arm, destroying the parallel relationship between the detection mechanism and the carrier and resulting in the detection result deviating from the actual result.

[0003] Therefore, how to achieve accurate and effective calibration detection of wafers during the placement and transportation process of wafers is a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Utility Model

[0004] In view of this, the purpose of the utility model is to provide a detection device to achieve accurate and effective calibration detection of wafers during the placement and transportation process of wafers.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] A detection device includes:

[0007] A sensor module, at least including an image sensor and a distance sensor. The image sensor is used to detect the distance between the outer periphery of the wafer and the focus ring on the carrier, and the distance sensor is used to detect the distance between the edge position of the wafer and the distance sensor;

[0008] A processor module, communicatively connected to the sensor module to adjust the opening and closing of each sensor in the sensor module, and receive the detection data of each sensor to judge the calibration state of the wafer;

[0009] The power supply module includes an induction coil and a transmitting coil which are arranged at intervals. The transmitting coil is connected to an AC power supply. After the AC power supply is started, the induction coil generates an induced current, and the induction coil is conductively connected to a capacitor and a rectifying circuit. The rectifying circuit is used to convert alternating current into direct current. The induction coil is conductively connected to the sensor module and the processor module through an integrated circuit board.

[0010] Preferably, in the above detection device, the processor module at least includes a central processor, a memory, and a signal transmitter. The central processor is used to control the opening and closing of each sensor and process the detection data of each sensor. The memory is used to record the original data and the processed result data. The signal transmitter is used to wirelessly transmit the data recorded by the memory to the user interface.

[0011] Preferably, in the above detection device, the induction coil and the transmitting coil are inclined and arranged at intervals at a first preset angle, or,

[0012] The induction coil and the transmitting coil are parallel and arranged in alignment in the vertical direction.

[0013] Preferably, in the above detection device, the transmitting coil is arranged on the robotic arm, or, the transmitting coil is arranged in the carrier table, or, the transmitting coil is arranged at the top wall position of the wafer placement cavity.

[0014] Preferably, in the above detection device, one or more groups of image sensors are evenly arranged in the circumferential direction, and one or more groups of distance sensors are also evenly arranged in the circumferential direction correspondingly.

[0015] Preferably, in the above detection device, multiple groups of power supply modules are provided. The first power supply module is only conductively connected to the image sensor through a first wire, the second power supply module is only conductively connected to the distance sensor through a second wire, and the third power supply module is only conductively connected to the processor module through a third wire.

[0016] Preferably, in the above detection device, the outer edge distance between the two transmitting coils in any two of the power supply modules is 10 mm - 300 mm.

[0017] Preferably, in the above detection device, the AC power supply for powering the transmitting coil in each power supply module is independently opened and closed.

[0018] Preferably, in the above detection device, the sensor module, the processor module, the induction coil, and the integrated circuit board are all fixed on the carrier backplane at a single assembly position.

[0019] Preferably, in the above detection device, the sensor module further includes a central sensor, a calibration mark is provided on the carrier table, and the central sensor calibrates the detection device directly above the carrier table with the calibration mark as a reference.

[0020] Preferably, in the above detection device, the sensor module further includes a vibration sensor, the vibration sensor contacts the robotic arm and detects the vibration degree during the transmission of the robotic arm and feeds it back to the processor module.

[0021] Preferably, in the above detection device, the outer shape is a disc-shaped or circular ring-shaped structure.

[0022] As can be seen from the above technical solutions, the detection device provided by the present utility model performs position detection on the wafer through at least two sensors, and respectively through an image sensor and a distance sensor, so as to detect the placement stability of the wafer from two dimensions of centering degree and flatness based on the centering degree of the wafer on the carrier table and the distance between the edge position of the wafer and the target sensor. At the same time, a processor module is set up for data analysis to receive and analyze the data of the sensors. This application also particularly sets up a power supply module including an induction coil and a transmitting coil. The induction coil and the transmitting coil are arranged in a spaced-apart and separate structure, so as to generate an induced magnetic field by connecting the transmitting coil to an AC power supply, and it can be arranged on the robotic arm or other positions close to the induction coil. Furthermore, while supplying power, the weight of the power supply module can be reduced, and the influence of the uneven weight of the power supply module on the flatness difference of the detection device can be reduced. The induction coil converts the alternating current into stable direct current through a capacitor and a rectifier circuit to supply power to the sensor module and the processor module. The capacitor and the rectifier circuit are both small-weight components, which improves the flatness of the detection device compared with the prior art and enhances its detection effect on the wafer. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0024] Figure 1 Structural schematic diagram of the detection device provided by the embodiment of the present utility model;

[0025] Figure 2 Structural schematic diagram of the detection device with four power supply modules;

[0026] Figure 3 Schematic diagram of the robotic arm and the transmitting coil;

[0027] Figure 4 Schematic diagram of the assembly of the detection device and the robotic arm;

[0028] Figure 5 is Figure 4 Schematic diagram of the structure after assembly;

[0029] Figure 6 is Figure 2 Schematic diagram of the setting of the transmitting coil on the corresponding robotic arm;

[0030] Figure 7 Schematic diagram of the structure of the transmitting coil arranged on the robotic arm;

[0031] Figure 8 Schematic diagram of the structure of the transmitting coil arranged on the top wall surface of the cavity;

[0032] Figure 9 Schematic diagram of the structure of the transmitting coil arranged in the carrier;

[0033] Figure 10 Schematic diagram of the structure of the annular detection device.

[0034] Wherein, 10 - sensor module; 110 - image sensor; 120 - distance sensor; 130 - central sensor; 140 - vibration sensor; 20 - processor module; 210 - central processing unit; 220 - memory; 230 - signal transmitter; 30 - power supply module; 310 - induction coil; 320 - transmitting coil; 330 - capacitor; 340 - rectifying circuit; 301 - first power supply module; 3010 - first wire; 302 - second power supply module; 3020 - second wire; 303 - third power supply module; 3030 - third wire; 304 - fourth power supply module; 40 - integrated circuit board; 50 - robotic arm; 60 - carrier backplane; 70 - carrier; 710 - focusing ring; 100 - detection device; 200 - wafer. Detailed implementation manners

[0035] The core of the present utility model lies in disclosing a detection device for accurately and effectively calibrating and detecting a wafer during the placement and transportation process of the wafer.

[0036] In order to enable those skilled in the art to better understand the solution of the present utility model, the embodiments of the present utility model will be described below with reference to the accompanying drawings. In addition, the embodiments shown below do not impose any limitation on the content of the utility model recorded in the claims. Furthermore, all the contents of the configurations shown in the following embodiments are not limited to those necessary for the solution of the utility model recorded in the claims.

[0037] Such as Figure 1 and Figure 3As shown in the figure, the detection device provided by the embodiment of the present utility model is arranged on the side of the robotic arm 50 facing away from the wafer, so as to cooperate with the robotic arm 50 to detect and determine the state of the wafer during the transportation and placement of the wafer. The detection device mainly includes a sensor module 10, a processor module 20, a power supply module 30, and an integrated circuit board 40. Among them, the sensor module 10 is used to detect parameters such as the placement position of the wafer and the flat placement state, so as to determine the stability of the wafer during transportation and placement. Different from sensors of a single recognition form, the sensor module 10 provided by the embodiment of the present application at least includes an image sensor 110 and a distance sensor 120. Among them, the image sensor 110 is used to identify the distance between the outer circumference of the wafer and the focusing ring 710 provided on the carrier 70 when the wafer is placed on the carrier 70, so as to feedback the centering degree of the wafer placed on the carrier 70. The distance sensor 120 is arranged towards the edge position of the wafer to detect the distance between the edge position of the wafer and the setting position of the distance sensor 120, and to judge whether there is a warping problem when the wafer is placed on the carrier 70. At the same time, the distance sensor 120 preferably adopts a capacitive 330 sensor to have good temperature stability and excellent dynamic response to meet the detection requirements.

[0038] It should be noted that wafer warping has an adverse impact on subsequent production, and the warped wafer will generate the maximum warping height at its edge position. Therefore, detecting the edge state of the wafer by setting the distance sensor 120 is an effective recognition method for judging wafer warping. At the same time, in the embodiment of the present application, one or more distance sensors 120 can be set for detecting wafer warping. When one distance sensor 120 is set, the distance sensor 120 or the processor module 20 communicatively connected thereto needs to pre-enter a preset distance, that is, the distance between the wafer edge and the distance sensor 120 when there is no warping, so as to compare the value detected by the distance sensor 120 in real time with the preset distance and judge whether the error is within the allowable range; when multiple distance sensors 120 are set, the multiple distance sensors 120 are arranged in the circumferential direction of the wafer to detect the distances between multiple edge positions on the wafer and the corresponding distance sensors 120, and to judge whether the errors of the multiple distance values are within the allowable range, so as to complete the detection of the wafer warping state.

[0039] It should be further noted that, in the above embodiments, the image sensor 110 can adopt a high-resolution CCD or CMOS sensor to capture the distance between the outer periphery of the wafer and the focus ring 710 on the carrier 70. Such a sensor converts the image of the wafer into a digital signal through optical imaging technology, and then analyzes the position and shape of the wafer through image processing algorithms. The high resolution and high sensitivity of the image sensor 110 enable it to accurately detect the minute changes of the wafer, thereby ensuring the precise positioning of the wafer during placement; the distance sensor 120 can adopt the principle of laser ranging, emit a laser beam and receive the reflected laser signal to calculate the distance between the wafer edge and the sensor. The laser ranging sensor has the characteristics of high precision and fast response, can accurately measure the distance within the micron level, and ensure the accuracy of the wafer warpage detection. In addition, the laser ranging sensor also has good anti-interference ability and can work stably in a complex industrial environment.

[0040] Through the combined action of the image sensor 110 and the distance sensor 120 in the above embodiments, the placement accuracy of the wafer is detected from two dimensions, thereby improving the calibration detection effect of the wafer.

[0041] Corresponding to the sensor module 10, the detection device provided in the embodiment of the present application further includes a processor module 20. The processor module 20 is communicatively connected to the sensor module 10 to receive and analyze the data information detected by each sensor in real time to determine the calibration state of the wafer. At the same time, the processor module 20 is also used to adjust the on-off states of each sensor, select some sensors to be turned on according to actual needs, and adjust some other sensors to be in the off state. On the one hand, it can save energy consumption, and on the other hand, it can also avoid the burden on the processor module 20 caused by excessive detection data.

[0042] Considering that the setting of a larger-capacity battery in the prior art will affect the flatness of the detection device and the robotic arm 50, the detection device provided in the embodiment of the present application further includes a power supply module 30. Different from the battery, the power supply module 30 supplies electric energy through an induction coil 310 and a transmitting coil 320. Specifically, the induction coil 310 and the transmitting coil 320 are arranged at intervals. Among them, the transmitting coil 320 is connected to an AC power supply to generate a magnetic field through electromagnetic induction after being powered on. The induction coil 310 is arranged within the effective range of the magnetic field. After the AC power supply connected to the transmitting coil 320 is powered on, the induction coil 310 generates an induced current through electromagnetic induction or magnetic resonance effect for power supply. At the same time, the induction coil 310 is conductively connected to a capacitor 330 and a rectifying circuit 340. The alternating current generated in the induction coil 310 is stabilized by the capacitor 330 and then transmitted to the rectifying circuit 340 to convert the alternating current into direct current for use. In addition, it should be noted that the induction coil 310 is conductively connected to the sensor module 10 and the processor module 20 through an integrated circuit board 40, so that the stabilized direct current is transmitted to each sensor and processor component through the wires arranged on the integrated circuit board 40, and the detection device maintains a stable working state. The power supply module 30 disclosed in the embodiment of the present application, compared with the battery power supply structure in the prior art, supplies electric energy to the electrical components in the detection device through the spaced induction coil 310 and transmitting coil 320. The transmitting coil 320 does not need to be directly connected to the electrical components. For example, Figure 4 and Figure 5 as shown, it can be arranged on the robotic arm 50 or other positions, and only needs to ensure that the induced magnetic field can act on the induction coil 310. Therefore, the transmitting coil 320 and the AC power supply conductively connected thereto will not have a weight impact on the detection device. At the same time, the capacitor 330 and the rectifying circuit 340 are all small-weight components and will not have a large weight impact on the detection device like the battery power supply structure in the prior art, thus affecting the flatness of the detection device.

[0043] The detection device provided by the embodiment of the present utility model performs position detection on the wafer through at least two types of sensors, specifically through the image sensor 110 and the distance sensor 120 respectively. From the centering degree of the wafer on the carrier 70 and the distance between the wafer edge position and the target sensor, the placement stability of the wafer is detected from two dimensions of centering degree and flatness. At the same time, a processor module 20 is set up to perform data analysis, to receive and analyze the data of the sensors. This application also particularly sets up a power supply module 30 including an induction coil 310 and a transmitting coil 320. The induction coil 310 and the transmitting coil 320 adopt a structure of spaced-apart and separate arrangement. By connecting the transmitting coil 320 to an AC power supply to generate an induced magnetic field, and it can be set on the robotic arm 50 or other positions close to the induction coil 310. Thus, while power supply is carried out, the weight of the power supply module 30 can be reduced, and the influence of the uneven weight of the power supply module 30 on the flatness difference of the detection device can be reduced. The induction coil 310 converts the alternating current into stable direct current through the capacitor 330 and the rectifier circuit 340, and supplies power to the sensor module 10 and the processor module 20. The capacitor 330 and the rectifier circuit 340 are both small-weight components, which improves the flatness of the detection device compared with the prior art and enhances its detection effect on the wafer.

[0044] Further, in the detection device provided by the embodiment of the present utility model, the processor module 20 at least includes a central processor 210, a storage 220, and a signal transmitter 230. Among them, the central processor 210 is used to receive signals from the image sensor 110 and the distance sensor 120, and perform real-time processing on these signals. Preferably, the central processor 210 (CPU) adopts a high-performance microprocessor to have high-speed data processing capabilities and complex algorithm operation capabilities. It should be noted that a preset tolerance range can be set in the central processor 210. After it receives the image sensor 110 and the distance sensor 120 and compares them with the preset parameters, if the corresponding error is within the tolerance range, the normal operation of each module is maintained. If the corresponding error is outside the tolerance range, the central processor 210 will feedback a warning signal, or adjust modules such as the robotic arm 50 to stop working, waiting for the operator to repair and restart, and then perform subsequent transportation and placement actions. It should be noted that the feedback warning signal can be a digital signal or a signal such as sound and light that is easy to be directly detected.

[0045] The memory 220 is the storage unit of the processor module 20. It is used to record the raw data collected by the sensors and the result data processed by the central processing unit 210, so as to facilitate the operator to view the processes and result data of each conveying and placing action. The memory 220 adopts high-speed flash technology to enable fast data writing and reading. In addition, the memory 220 also has a data protection function, which can ensure the integrity and security of the data even when the system is powered off. The signal transmitter 230 is the bridge for the processor module 20 to communicate with the outside world. It is used to wirelessly transmit the data in the memory 220 to the user interface. The signal transmitter 230 using wireless communication technology has a simple structure and is easy to install and use. The signal transmitter 230 can adopt ways such as Wi-Fi, Bluetooth or ZigBee to ensure the stability and security of data transmission. Through the signal transmitter 230, the operator can remotely monitor the status of the device and obtain the calibration information of the wafer in real time, thereby improving the production efficiency.

[0046] The above-mentioned processor module 20 can stably and effectively receive, process, store and send the detection data of the wafer during the transportation and placement process of the wafer, enabling the operator to intuitively obtain the detection results of the wafer and make corresponding operations, and also enabling the detection device to more accurately and efficiently complete the calibration detection task of the wafer, improving the production efficiency and product quality.

[0047] Furthermore, for the induction coil 310 to generate sufficient induced current, it needs to be within the effective induced magnetic field range of the transmitting coil 320. On this basis, the induction coil 310 and the transmitting coil 320 can be tilted at a first preset angle and arranged at intervals according to actual setting needs, and the first preset angle can be set according to the surrounding structure; preferably, the induction coil 310 and the transmitting coil 320 can also be arranged in parallel and aligned in the vertical direction. It should be noted that wireless power supply can also be carried out when the induction coil 310 and the transmitting coil 320 are not aligned in the vertical direction, but when the two coils are completely aligned in the vertical direction, it can make the magnetic induction lines pass through the induction coil 310 in the largest amount and ensure the generation efficiency of the induced current. The above structural settings enable the induction coil 310 and the transmitting coil 320 to have sufficient setting freedom and improve the structural adaptability of the detection device.

[0048] In addition, the parallel arrangement of the induction coil 310 and the transmitting coil 320 and the alignment setting in the vertical direction also allow the best electromagnetic coupling to be generated between the two coils, thereby realizing efficient power transmission. At the same time, the transmitting coil 320 generates an alternating magnetic field, and the induction coil 310 receives energy without physical connection through the principle of electromagnetic induction. This wireless power supply method not only improves the safety of the system, but also reduces the possible fault points introduced due to physical connection and lowers the maintenance cost of the system.

[0049] To further enhance the performance of the power supply module 30, the design of the transmitting coil 320 and the induction coil 310 can also consider the dynamic adjustment ability of the system, that is, the electronic control unit dynamically adjusts the power output of the transmitting coil 320 according to the actual energy demand and transmission efficiency, so as to adapt to different working conditions and environmental changes, and further improve the energy efficiency and adaptability of the detection device.

[0050] Based on the above embodiments, while the transmitting coil 320 can supply power to the induction coil 310, it can be set at any position, such as Figure 7 As shown, it can be set on the robotic arm 50, inside the carrier 70 for placing the wafer 200 or at the top wall position of the placement cavity of the wafer 200. When the transmitting coil 320 is set on the robotic arm 50, it can maintain a fixed relative position with the detection device 100, and maintain a stable current transmission effect. As Figure 9 shown, when the transmitting coil 320 is set inside the carrier 70, when the robotic arm 50 and the detection device 100 drive the wafer 200 to move directly above the carrier 70, the transmitting coil 320 supplies power to the induction coil 310 to detect the wafer 200. Setting the transmitting coil 320 inside the carrier 70 can also reduce external interference and improve the stability and safety of the system. As Figure 8 shown, when the transmitting coil 320 is set at the top wall position of the placement cavity of the wafer 200, it can have a sufficient magnetic field range, while reducing the occupation of the internal space of the placement cavity of the wafer 200, leaving more space for setting other devices and components.

[0051] It should be noted that in other embodiments of the present invention, an RF (radio frequency) coil set at the top wall of the wafer placement cavity and an RF bias inside the carrier 70 can also be used to supply power to the induction coil 310. The setting structure and principle are similar to those of the setting method and structure of the transmitting coil 320, and will not be elaborated herein.

[0052] To further improve the detection accuracy of the sensor module 10 for the wafer, one or more groups of image sensors 110 and distance sensors 120 are evenly arranged in the circumferential direction of the wafer to meet the detection requirements under different working conditions. The following takes an embodiment in which there are three groups of image sensors 110 and distance sensors 120 respectively in the circumferential direction of the wafer for illustration. Specifically, three groups of image sensors 110 and distance sensors 120 are respectively arranged in the circumferential direction of the wafer to provide a comprehensive detection range, ensuring that the sensor can monitor the edge of the wafer in all directions. The image sensor 110 is responsible for capturing the image of the wafer, while the distance sensor 120 measures the distance between the edge of the wafer and the sensor. Through the collaborative work of the three groups of sensors, the position and flat placement state of the wafer can be accurately determined, thus achieving high-precision calibration; each group of sensors is precisely calibrated and positioned to ensure its uniform distribution in the circumferential direction. The combined effect of the three groups of sensors not only improves the detection accuracy but also enhances the anti-risk ability of the system. Even if one group of sensors fails, the other two groups of sensors can still continue to provide accurate detection data, thus ensuring the reliability of the system.

[0053] In the above embodiment, the three groups of sensors can achieve comprehensive monitoring of the edge of the wafer, without detection blind spots, ensuring that the wafer can be accurately detected at any position and improving the detection accuracy. It also has a larger detection range, allowing the sensor module 10 to adapt to wafers of different sizes and shapes.

[0054] To further optimize the above technical solution, in some embodiments of the present invention, as Figure 2 and Figure 6 shown, the power supply module 30 is provided with multiple groups of structures to enable the possibility of zoned power supply for the detection device, and at the same time make the design of the power supply module 30 have the concepts of modularization and independent power supply to improve the flexibility and reliability of the system. Specifically, taking a specific embodiment of the present application for illustration, the power supply module 30 is provided with three independent groups, namely the first power supply module 301, the second power supply module 302, and the third power supply module 303. Among them, the first power supply module 301 is specially designed to provide power for several image sensors 110. It includes an independent induction coil 310, a transmitting coil 320, a capacitor 330, and a rectifying circuit 340, so that the first power supply module 301 can generate current independently. At the same time, the first power supply module 301 is conductively connected to the image sensor 110 through the first wire 3010 to ensure that the sensor can stably receive the required power. Based on this, the power supply of the image sensor 110 can be independently controlled, which is convenient for maintenance and upgrade, and also reduces power interference.

[0055] The second power supply module 302 is similar to the first power supply module 301. That is, the second power supply module 302 is dedicated to supplying power to the distance sensor 120, and it is conductively connected to the distance sensor 120 through the second wire 3020. On this basis, the third power supply module 303 is connected to the processor module 20 through the third wire 3030 to supply power to the processor module 20. The modular design and grouped independent design of the power supply module 30 simplify the system maintenance and upgrade process, improve the system scalability. At the same time, each group of power supply modules 30 can be independently controlled to open and close, that is, the AC power supply for the transmitting coil 320 in each group of power supply modules 30 is independently controlled to open and close, so as to optimize the opening and closing states according to the specific requirements of different sensors or the processor module 20, and select the operating state of the corresponding area. In addition, when a certain power supply module 30 has a problem, the grouped structure can quickly locate and solve it without affecting the normal operation of other modules.

[0056] It should be noted that since the processor module 20 needs to be kept in the on state during the operation of each module, the method of power supply by partition can also effectively reduce the operation and processing pressure of the processor module 20. That is, the processor module 20 adopts a dedicated power supply module 30 to enable power regulation and adopt high-quality power management and filtering technologies to ensure the stable and effective operation of the processor module 20.

[0057] Based on the above embodiments, too close intervals may cause electromagnetic field interference with each other, reduce the charging efficiency, and even may damage the device. Multiple groups of power supply modules 30 need to be spaced apart while maintaining a stable effect to reduce the overlap and interference of the magnetic fields. Specifically, the outer edge spacing between the two transmitting coils 320 in any two adjacent power supply modules 30 is in the range of 10 mm to 300 mm to optimize the magnetic field distribution by means of spacing. At the same time, a certain amount of heat is generated during the wireless charging process, and an appropriate interval helps with heat dissipation to maintain the stable operation of the device; at the same time, it avoids the problem of excessive space requirements for the setting of the transmitting coil 320 caused by a large spacing.

[0058] Furthermore, in some embodiments of the present application, the sensor module 10, the processor module 20, the induction coil 310, and the integrated circuit board 40 are all fixed to the carrier backplane 60 at a single assembly position. The carrier backplane 60 serves as the structural foundation of the entire detection device, providing necessary support and stability, and positioning each component. The sensor module 10 can be fixed by shock-proof materials and fastening screws on the basis of accurate setting to reduce the influence of external vibration on the detection accuracy; the processor module 20 can be installed at the center or near the center of the carrier backplane 60 to facilitate the processor module 20 to quickly receive data from the sensor module 10 and process these data in a timely manner. The fixation of the processor module 20 can adopt a heat dissipation structure design to ensure its good temperature state during long-term operation; the integrated circuit board 40, as a bridge connecting each component, is fixed on the carrier backplane 60 to ensure the stable and reliable connection between all electronic components. The fixation of the integrated circuit board 40 uses anti-static materials to protect sensitive electronic components from electrostatic damage.

[0059] To further improve the accuracy of the sensor module 10 for detecting the position of the wafer, in some embodiments of the present application, the sensor module 10 further includes a central sensor 130. The central sensor 130 is an image-type sensor. Correspondingly, calibration marks are provided on the carrier stage 70. When the central sensor 130 detects and identifies the calibration marks as a reference, the detection device is calibrated directly above the carrier stage 70. That is, before the detection device performs calibration detection on the wafer, the flatness of the detection device itself is first adjusted based on the carrier stage 70 as a reference, so as to improve the credibility of the data detected by the image sensor 110 and the distance sensor 120 during subsequent detection processes.

[0060] It should be noted that the calibration marks can adopt different forms, such as reflective marks, two-dimensional codes, or special-shaped patterns, as long as they can be accurately placed at the predetermined position of the carrier stage 70 and are convenient for the central sensor 130 to identify and read. The settings of the central sensor 130 and the calibration marks achieve high-precision positioning of the detection device, improve the accuracy of wafer detection, and at the same time, the automated calibration process reduces manual intervention and improves the efficiency and consistency of calibration.

[0061] Based on the above embodiments, the sensor module 10 further includes a vibration sensor 140. The vibration sensor 140 is in contact with the robotic arm 50 so that the detection device can monitor and feedback the vibration condition of the robotic arm 50 during the transmission process. Correspondingly, the vibration sensor 140 preferably adopts a high-sensitivity accelerometer or vibrometer, which can accurately detect the vibration generated by the robotic arm 50 during the movement process, and transmit the detected vibration data to the processor module 20 in real time. The processor module 20 evaluates the operating state of the robotic arm 50 based on these data, determines whether there is abnormal vibration that may affect the handling and processing quality of the wafer, and feeds back to the operator for adjustment.

[0062] It should be further noted that if the processor module 20 detects abnormal vibration, the processor module 20 can also condition the motion parameters of the robotic arm 50, such as speed or acceleration, etc., to reduce vibration. In some cases, the processor module 20 can also trigger an alarm to prompt the operator to check or maintain.

[0063] In addition, in combination with other embodiments of the present application, the power supply module 30 can also be provided with a fourth power supply module 304, a fifth power supply module, etc., to independently supply power to other sensor structures. Its structure is similar to the foregoing embodiments and will not be elaborated herein.

[0064] Furthermore, for the detection device provided in the embodiments of the present application, its outer shape structure, that is, the outer shape structure of the carrier backplane 60 is preferably Figure 1 the pie-shaped or Figure 10 the circular ring-shaped structure and other centrosymmetric structures shown. The pie-shaped structure helps it to be flexibly deployed in an environment with limited space, and the central part of the pie-shaped structure can accommodate the sensor module 10, the processor module 20 and the power supply module 30, while the edge part can arrange the induction coil 310 and the transmitting coil 320; the design of the circular ring-shaped structure enables the detection device to be arranged around the wafer or the carrier table 70, providing 360-degree detection coverage, ensuring comprehensive monitoring of the wafer, and is suitable for application scenarios that require omnidirectional detection.

[0065] The terms "first", "second", "third", "left side" and "right side" in the specification, claims and above-mentioned drawings of the present utility model are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.

[0066] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to the embodiments shown herein, but rather to the broadest scope consistent with the principles and novel features disclosed herein.

Claims

1. A detection device, characterized in that: include: The sensor module comprises at least an image sensor and a distance sensor, wherein the image sensor is used to detect the distance between the periphery of the wafer and the focusing ring on the carrier, and the distance sensor is used to detect the distance between the edge position of the wafer and the distance sensor; A processor module is connected to the sensor module for adjusting the opening and closing of each sensor in the sensor module, and receives detection data of each sensor to determine the calibration state of the wafer; The power supply module includes an induction coil and a transmitting coil arranged at intervals, the transmitting coil is connected to an AC power supply, the induction coil generates an induced current after the AC power supply is started, and the induction coil is conductively connected to a capacitor and a rectifier circuit, the rectifier circuit is used to convert AC power into DC power, and the induction coil is conductively connected to the sensor module and the processor module through an integrated circuit board.

2. The detection device according to claim 1, characterized in that The processor module includes at least a central processing unit, a storage device and a signal transmitter. The central processing unit is used to adjust the opening and closing of each sensor and process the detection data of each sensor. The storage device is used to record the original data and the processed result data. The signal transmitter is used to wirelessly transmit the data recorded in the storage device to the user interface.

3. The detection device according to claim 1, characterized in that: The induction coil and the transmitting coil are inclined at a first preset angle and spaced apart from each other, or, The induction coil and the transmitting coil are arranged in parallel and aligned in a vertical direction.

4. The detection device according to claim 3, characterized in that: The transmitting coil is arranged on the robot arm, or the transmitting coil is arranged in the supporting platform, or the transmitting coil is arranged on the top wall of the wafer placement cavity.

5. The detection device according to claim 1, characterized in that: The image sensors are evenly arranged in one or more groups in the circumferential direction, and the distance sensors are also evenly arranged in one or more groups in the circumferential direction.

6. The detection device according to claim 1, characterized in that: The power supply modules are arranged in multiple groups, the first power supply module is only connected to the image sensor via a first wire, the second power supply module is only connected to the distance sensor via a second wire, and the third power supply module is only connected to the processor module via a third wire.

7. The detection device according to claim 6, characterized in that: The outer edge spacing between the two transmitting coils in any two of the power supply modules is 10 mm-300 mm.

8. The detection device according to claim 6, characterized in that: The AC power supply for supplying power to the transmitting coil in each power supply module is independently turned on and off.

9. The detection device according to claim 1, characterized in that: The sensor module, the processor module, the induction coil and the integrated circuit board are all fixed on the carrying backplane at a single assembly position.

10. The detection device according to claim 1, characterized in that: The sensor module further comprises a center sensor. A calibration mark is arranged on the support platform. The center sensor calibrates the detection device to be directly above the support platform based on the calibration mark.

11. The detection device according to claim 10, characterized in that: The sensor module also includes a vibration sensor, which contacts the mechanical arm and detects the vibration degree of the mechanical arm during transmission and feeds back to the processor module.

12. The detection device according to claim 1, characterized in that: The appearance is a pie or ring structure.

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