COB light bar

Abstract

The utility model discloses a COB light bar which comprises a substrate and a chip assembly, the chip assembly is arranged on the substrate, the chip assembly is electrically connected with the substrate, the chip assembly comprises a plurality of control chips and a plurality of light-emitting chips, the control chips and the light-emitting chips are arranged at intervals, the control chips are used for controlling the light-emitting chips, and the light-emitting chips are used for controlling the light-emitting chips. A box dam is arranged on the substrate in the circumferential direction of the chip assembly, the width of the bottom of the box dam is larger than that of the top of the box dam, the top of the box dam is in an arc shape, a reflecting layer is arranged in the box dam, the top of the reflecting layer is flush with the tops of the light-emitting chips, a fluorescent layer is further arranged in the box dam, and the fluorescent layer covers the light-emitting chips and the reflecting layer. The thickness of the fluorescent layer is larger than that of the reflecting layer, and a plurality of heat dissipation pieces are arranged on the face, back to the chip assembly, of the substrate. According to the utility model, the chip assembly is directly pasted on the substrate, and the box dam enables the irradiation angle of the light emitted by the light-emitting chip to be enlarged, so that the production cost is saved, and the production flow is optimized.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting, in particular to a COB light strip. Background Art

[0002] At present, the side-entry TV backlight strip mainly consists of a PCB board and lamp beads. The lamp beads are usually PCT or EMC lamp beads with brackets. After using bowl cup bracket pieces to make finished products through wire bonding, die bonding, and encapsulation with fluorescent glue, they are then SMT pasted onto the PCB board; the production requires too many equipment and processes, resulting in low production efficiency and high production costs.

[0003] In addition, the brightness of the existing side-entry TV backlight strip is not high. Summary of the Utility Model

[0004] In view of the above situation, it is necessary to provide a COB light strip to address the problems of complex encapsulation and low brightness of the side-entry TV backlight strip in the prior art.

[0005] A COB light strip includes a substrate and a chip assembly. The chip assembly is disposed on the substrate and electrically connected to the substrate. The chip assembly includes a plurality of control chips and a plurality of light-emitting chips. The plurality of control chips and the plurality of light-emitting chips are arranged at intervals. The plurality of control chips are used to control the plurality of light-emitting chips. A dam is disposed on the substrate along the circumferential direction of the chip assembly. The bottom width of the dam is greater than the top width of the dam. The top of the dam is arc-shaped. The dam is used to expand the light irradiation angle. A reflective layer is provided inside the dam. The top of the reflective layer is flush with the top of the light-emitting chips. The reflective layer is used to reflect the light emitted by the plurality of light-emitting chips. A fluorescent layer is also provided inside the dam. The fluorescent layer covers the plurality of light-emitting chips and the reflective layer. The thickness of the fluorescent layer is greater than the thickness of the reflective layer. A plurality of heat dissipation components are provided on the side of the substrate facing away from the chip assembly.

[0006] The utility model directly patches the chip component on the substrate through the COB packaging process. The heat of the chip component can be directly dissipated through the substrate and the heat sink. A dam is arranged around the chip component, and the bottom width of the dam is greater than the top width of the dam. The top of the dam is arc-shaped, so that the light emitted by the light-emitting chip has an enlarged irradiation angle. The fluorescent layer filled in the dam is formed by mixing fluorescent glue in different proportions. The blue light emitted by the light-emitting chip passes through the fluorescent layer and is converted into white light or other target color light. The reflective layer reflects the light to reduce light loss, thereby better improving the brightness of the light strip. Several control chips group-control several light-emitting chips, which is better for debugging and user experience. By adopting the COB packaging process, compared with the original process, the relevant production costs of the bracket are saved, the problem of secondary reflow of flip chips is solved, and the production process flow is also optimized.

[0007] Further, the material of the substrate is an aluminum-based material, and the substrate is rectangular.

[0008] Further, the control chips and the light-emitting chips are evenly distributed on the substrate. The substrate is provided with a pad group, and the pad group is adapted to the chip component.

[0009] In the utility model, the pad group includes several pads, and the several pads are respectively adapted to the control chips and the light-emitting chips.

[0010] Further, a protective layer is provided between the substrate and the reflective layer. The protective layer is used to protect the substrate and the light-emitting chips. The protective layer is made of a soft material and is light-transmissive.

[0011] Further, the reflective layer is a transparent solid silicone, and light-diffusing particles are mixed in the reflective layer.

[0012] Further, the dam is a reflective white glue layer.

[0013] Further, the top of the dam is flush with the top of the fluorescent layer in the vertical direction.

[0014] Further, several of the heat sinks are heat sinks or heat pipes, and several of the heat sinks are spaced apart. Description of the Drawings

[0015] Figure 1 It is the front view of the first embodiment of the utility model;

[0016] Figure 2 It is the top view of the first embodiment of the utility model;

[0017] Figure 3 It is the side view of the first embodiment of the utility model.

[0018] Reference numerals: 1, substrate; 2, chip assembly; 21, control chip; 22, light-emitting chip; 3, protective layer; 4, reflective layer; 5, dam; 6, fluorescent layer; 7, pad group; 8, heat sink. Detailed implementation mode

[0019] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present utility model belongs. The terms used herein in the description of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Moreover, the embodiments of the present utility model, the features between the embodiments, and the features of the embodiments can be freely combined on the premise of no obvious conflict or contradiction.

[0022] As Figures 1 to 3 shown, a COB light bar includes a substrate 1, a chip assembly 2, a protective layer 3, a reflective layer 4, a dam 5, a fluorescent layer 6, a pad group 7, and a heat sink 8.

[0023] Specifically, the substrate 1 is made of an aluminum-based material. A plurality of pad groups 7 are uniformly distributed on the substrate 1. The substrate 1 is rectangular. The chip assembly 2 is disposed on the substrate 1. The chip assembly 2 includes a plurality of control chips 21 and a plurality of light-emitting chips 22. The plurality of control chips 21 and the plurality of light-emitting chips 22 are arranged at intervals. The plurality of control chips 21 perform grouped control on the plurality of light-emitting chips 22, which is better for debugging and user experience. The plurality of control chips 21 and the plurality of light-emitting chips 22 are uniformly distributed on the substrate 1. Pad groups 7 are provided on the substrate. The pad groups 7 are respectively adapted to the plurality of control chips 21 and the plurality of light-emitting chips 22. The chip assembly 2 is electrically connected to the substrate 1.

[0024] Specifically, a protective layer 3 is provided between the substrate 1 and the reflective layer 4. The protective layer 3 protects the substrate 1 and the light-emitting chips 22. The protective layer 3 is made of a soft material and is light-transmissive.

[0025] Specifically, a reflective layer 4 is provided on the substrate 1. The reflective layer 4 is a transparent solid silicone. Light-diffusing particles are mixed in the reflective layer 4. The reflective layer 4 covers the protective layer 3. The top of the reflective layer 4 is not higher than the tops of the plurality of light-emitting chips 22. The reflective layer 4 is used to reflect the light emitted by the light-emitting chips 22.

[0026] Specifically, a dam 5 is formed around the plurality of light-emitting chips 22 using reflective white glue. The dam 5 surrounds the plurality of light-emitting chips 22. The bottom width of the dam 5 is greater than the top width of the dam 5. The top of the dam 5 is arc-shaped. The dam 5 is used to expand the light irradiation angle. A fluorescent layer 6 is filled in the dam 5 to form a fluorescent layer 6. The fluorescent layer 6 covers the plurality of light-emitting chips 22 and the substrate 1. Along the vertical direction, the top of the dam 5 is flush with the top of the fluorescent layer 6.

[0027] Specifically, a plurality of heat dissipation components 8 are provided on the side of the substrate 1 facing away from the plurality of chip components 2. The plurality of heat dissipation components 8 are heat sinks or heat pipes. The plurality of heat dissipation components 8 are spaced apart.

[0028] In the present utility model, through the COB packaging process, the chip components 2 are directly surface-mounted on the substrate 1. The heat of the chip components 2 can be directly dissipated through the substrate 1 and the heat dissipation components 8. A dam 5 is provided around the chip components 2. The bottom width of the dam 5 is greater than the top width of the dam 5. The top of the dam 5 is arc-shaped, so that the light emitted by the light-emitting chips 22 has an expanded irradiation angle. The fluorescent layer 6 filled in the dam 5 is formed by mixing fluorescent glue in different proportions. The blue light emitted by the light-emitting chips 22 passes through the fluorescent layer 6 and is converted into white light or other target color light. The reflective layer 4 is used to reflect the light, reducing light loss, thereby better improving the brightness of the light strip. The control chip controls the light-emitting chips in groups, which is better for debugging and user experience. By adopting the COB packaging process, compared with the original process, the relevant production costs of the bracket are saved, the problem of secondary reflow of flip chips is solved, and the production process flow is also optimized.

[0029] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0030] The above-described embodiments merely represent the implementation manners of the present utility model, and the descriptions are relatively specific and detailed. However, it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. A COB light strip, characterized in that: The invention comprises a substrate and a chip assembly, wherein the chip assembly is arranged on the substrate and is electrically connected to the substrate, wherein the chip assembly comprises a plurality of control chips and a plurality of light-emitting chips, wherein the plurality of control chips are arranged at intervals from the plurality of light-emitting chips, and the plurality of control chips are used to control the plurality of light-emitting chips, and a dam is arranged on the substrate along the circumference of the chip assembly, wherein the bottom width of the dam is greater than the top width of the dam, and the top of the dam is in an arc shape, and the dam is used to expand the angle of light irradiation, and a reflective layer is arranged in the dam, and the top of the reflective layer is flush with the top of the light-emitting chip, and the reflective layer is used to reflect the light emitted by the plurality of light-emitting chips, and a fluorescent layer is also arranged in the dam, and the fluorescent layer covers the plurality of light-emitting chips and the reflective layer, and the thickness of the fluorescent layer is greater than the thickness of the reflective layer, and a plurality of heat sinks are arranged on a side of the substrate facing away from the chip assembly.

2. The COB light strip according to claim 1, characterized in that: The substrate is made of aluminum-based material and is rectangular.

3. The COB light strip according to claim 2, characterized in that: The control chip and the light-emitting chip are evenly distributed on the substrate. A pad group is provided on the substrate, and the pad group is adapted to the chip assembly.

4. The COB light strip according to claim 1, characterized in that: A protective layer is provided between the substrate and the reflective layer, and the protective layer is used to protect the substrate and the light-emitting chip. The protective layer is made of a soft material and is light-transmissive.

5. The COB light strip according to claim 1, characterized in that: The reflective layer is transparent solid silica gel, and light diffusion particles are arranged in the reflective layer.

6. The COB light strip according to claim 1, characterized in that: The dam is a reflective white glue layer.

7. The COB light strip according to claim 1, characterized in that: The top of the dam is flush with the top of the fluorescent layer in the vertical direction.

8. The COB light strip according to claim 1, characterized in that: Some of the heat sinks are heat sinks or heat pipes, and some of the heat sinks are distributed at intervals.

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