Millimeter wave terahertz medium end-fire array antenna suitable for planar integrated circuit technology

Abstract

The utility model discloses a millimeter wave terahertz medium end-fire array antenna suitable for a planar integrated circuit technology, and relates to the technical field of radio frequency circuits. The antenna comprises an antenna main body, a microstrip line, a substrate integrated waveguide, a first transition metal plate and a second transition metal plate, wherein the substrate integrated waveguide comprises an upper-layer metal plate, a bottom-layer metal plate and a dielectric layer between the upper-layer metal plate and the bottom-layer metal plate; the two sides of the upper layer metal plate are connected with the two sides of the bottom layer metal plate through a plurality of metalized via holes. The upper-layer metal plate and the bottom-layer metal plate are respectively connected with the upper surface and the lower surface of the antenna main body; one end of the microstrip line is connected with one side of the upper-layer metal plate away from the antenna body; the first transition metal plate and the second transition metal plate are symmetrically arranged at the joint of the microstrip line and the upper metal plate. The antenna gain and the half-power width of the terahertz transmitter array system can be effectively improved, the structure is simple, and the antenna is suitable for a high-output-power millimeter wave terahertz integrated circuit transmitter array system.

Description

Technical Field

[0001] The present application relates to the technical field of radio frequency circuits, and particularly to a millimeter-wave terahertz dielectric end-fire array antenna applicable to planar integrated circuit processes. Background Art

[0002] For millimeter-wave terahertz transmitter array systems, the common research difficulties and key points are how to improve the output power of the transmitter. To improve the output power, common transmitter array systems include transmitter phased arrays, transmitter spatial power-combined linear arrays, and transmitter spatial power-combined planar arrays. The spatial power-combined linear and planar arrays generally use the method of uniformly varying the phase to excite the antenna array, and the transmitter structure is relatively simple. The phased array generally realizes radio frequency signals with arbitrary phases through the phase shifters in the transmitter, so as to realize the spatial angle control of the beam, and thus the transmitter structure is relatively complex.

[0003] Existing millimeter-wave terahertz transmitter chip systems usually use side-fire array antennas to improve the antenna gain, thereby improving the effective isotropic radiated power (EIRP) of the transmitter. The side-fire array antenna, that is, the maximum pointing direction of the main lobe of the antenna array is perpendicular to the array axis. However, the output power that the side-fire array antenna can improve is still limited. Therefore, generally, an off-chip silicon-based lens and a dielectric lens are designed to focus the terahertz wave to further improve the EIRP, making the overall structure relatively complex. Summary of the Utility Model

[0004] The purpose of the present application is to provide a millimeter-wave terahertz dielectric end-fire array antenna applicable to planar integrated circuit processes, which can effectively improve the antenna gain and half-power beamwidth of the terahertz transmitter array system, and has a simple structure and is applicable to high-output-power millimeter-wave terahertz integrated circuit transmitter array systems.

[0005] To achieve the above purpose, the present application provides the following solutions:

[0006] In a first aspect, the present application provides a millimeter-wave terahertz dielectric end-fire array antenna applicable to planar integrated circuit processes, including: an antenna main body, a microstrip line, a substrate integrated waveguide, a first transition metal plate, and a second transition metal plate;

[0007] The substrate integrated waveguide includes an upper metal plate, a lower metal plate, and a dielectric layer between the upper metal plate and the lower metal plate; the upper metal plate and the lower metal plate are arranged in parallel; both the upper metal plate and the lower metal plate are rectangular; the area of the upper metal plate is smaller than that of the lower metal plate; both sides of the upper metal plate are respectively connected to both sides of the lower metal plate through a plurality of metallized vias; the upper metal plate and the lower metal plate are respectively connected to the upper surface and the lower surface of the antenna body, and the upper surface of the upper metal plate and the upper surface of the antenna body are on the same horizontal plane, and the lower surface of the lower metal plate and the lower surface of the antenna body are on the same horizontal plane; from the left side where the antenna body is connected to the substrate integrated waveguide to the right side where the antenna body is away from the substrate integrated waveguide, the width gradually decreases;

[0008] The microstrip line is on the same horizontal plane as the upper metal plate, and the microstrip line is on the transverse axis of symmetry of the upper metal plate; one end of the microstrip line is connected to the side of the upper metal plate away from the antenna body; the other end of the microstrip line is connected to a signal source for feeding the millimeter-wave terahertz dielectric end-fire array antenna;

[0009] The first transition metal plate is in the shape of a right triangle; the second transition metal plate has the same shape as the first transition metal plate; both the first transition metal plate and the second transition metal plate are on the same horizontal plane as the upper metal plate; the first transition metal plate and the second transition metal plate are symmetrically arranged at the connection of the microstrip line and the upper metal plate; the first right-angle sides of the first transition metal plate and the second transition metal plate are connected to the upper metal plate, and the second right-angle sides are connected to the microstrip line.

[0010] Optionally, the lower metal plate is grounded.

[0011] Optionally, the millimeter-wave terahertz dielectric end-fire array antenna is a symmetric structure.

[0012] Optionally, the antenna body is a straight quadrangular prism; the upper and lower surfaces of the straight quadrangular prism are isosceles trapezoids, and the lower bases of the isosceles trapezoids on the upper and lower surfaces are respectively connected to the upper metal plate and the lower metal plate; the length of the side of the upper metal plate in contact with the first transition metal plate is equal to the length of the lower base of the isosceles trapezoid.

[0013] Optionally, the antenna body is a straight triangular prism; the upper and lower surfaces of the straight triangular prism are isosceles triangles, and the bases of the isosceles triangles on the upper and lower surfaces are respectively connected to the upper metal plate and the lower metal plate; the length of the side of the upper metal plate in contact with the first transition metal plate is equal to the length of the base of the isosceles triangle.

[0014] Optionally, the length of the connection line between the upper metal plate and the upper surface of the antenna body is W3, and W3 = 2×W2 + W1; where W2 is the length of the first right-angled side of the first transition metal plate; and W1 is the width of the microstrip line.

[0015] According to the specific embodiments provided in this application, the following technical effects are disclosed in this application:

[0016] This application provides a millimeter-wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit processes. By using a substrate integrated waveguide (SIW) suitable for planar processes to implement a millimeter-wave terahertz dielectric end-fire array antenna suitable for planar processes, and at the same time using symmetrically arranged first and second transition metal plates to achieve impedance matching between the microstrip line and the substrate integrated waveguide, thereby realizing a millimeter-wave terahertz dielectric end-fire array antenna fed by a microstrip line, effectively improving the antenna gain and half-power beamwidth of the terahertz transmitter array system, and having a simple structure, which is suitable for a millimeter-wave terahertz integrated circuit transmitter array system with high output power. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a three-dimensional structure schematic diagram of the millimeter-wave terahertz dielectric end-fire array antenna provided in Embodiment 1 of this application;

[0019] Figure 2 It is a top-view structure schematic diagram of the millimeter-wave terahertz dielectric end-fire array antenna provided in Embodiment 1 of this application;

[0020] Figure 3 It is a bottom-view structure schematic diagram of the millimeter-wave terahertz dielectric end-fire array antenna provided in Embodiment 1 of this application;

[0021] Figure 4 It is a top-view structure schematic diagram of the millimeter-wave terahertz dielectric end-fire array antenna provided in Embodiment 2 of this application;

[0022] Figure 5 It is a bottom-view structure schematic diagram of the millimeter-wave terahertz dielectric end-fire array antenna provided in Embodiment 2 of this application;

[0023] Figure 6 It is a top-view structure schematic diagram of the antenna body provided in Embodiment 3 of this application;

[0024] Figure 7 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 4 of the present application;

[0025] Figure 8 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 5 of the present application;

[0026] Figure 9 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 6 of the present application;

[0027] Figure 10 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 7 of the present application;

[0028] Figure 11 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 8 of the present application;

[0029] Figure 12 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 9 of the present application;

[0030] Figure 13 It is a top - view structural schematic diagram of the antenna main body provided in Embodiment 10 of the present application;

[0031] Figure 14 It is a three - dimensional structural schematic diagram of the millimeter - wave terahertz dielectric end - fire array antenna provided in Embodiment 11 of the present application;

[0032] Figure 15 It is a top - view structural schematic diagram of the millimeter - wave terahertz dielectric end - fire array antenna provided in Embodiment 11 of the present application;

[0033] Figure 16 It is a bottom - view structural schematic diagram of the millimeter - wave terahertz dielectric end - fire array antenna provided in Embodiment 11 of the present application. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0035] An end-fire array antenna refers to an antenna whose main lobe maximum pointing is in the direction of the array axis. Compared with a broadside array, the end-fire array antenna has a higher directivity coefficient and a higher beam width. This application provides a millimeter-wave terahertz dielectric end-fire array antenna applicable to planar integrated circuit technology, which can effectively improve the antenna gain and half-power width of a terahertz transmitter array system, and has a simple structure and is applicable to a millimeter-wave terahertz integrated circuit transmitter array system with high output power.

[0036] To make the above objects, features, and advantages of this application more obvious and understandable, the following further details this application in conjunction with the accompanying drawings and specific embodiments.

[0037] Embodiment 1

[0038] See Figures 1 to 3 , a millimeter-wave terahertz dielectric end-fire array antenna disclosed in this application, includes: an antenna body 1, a substrate integrated waveguide 2, a microstrip line 3, a first transition metal plate 4, and a second transition metal plate 5. Among them, the input radio frequency signal is fed into the millimeter-wave terahertz dielectric end-fire array antenna through the microstrip line 3, and then the impedance matching from the microstrip line 3 to the substrate integrated waveguide 2 is realized through the first transition metal plate 4 and the second transition metal plate 5, and finally the radio frequency signal is radiated into space by the antenna body 1.

[0039] The substrate integrated waveguide 2 includes an upper metal plate 201, a lower metal plate 203, and a dielectric layer between the upper metal plate 201 and the lower metal plate 203. Among them, the lower metal plate 203 is grounded. The upper metal plate 201 and the lower metal plate 203 are arranged in parallel. Both the upper metal plate 201 and the lower metal plate 203 are rectangular. The area of the upper metal plate 201 is smaller than the area of the lower metal plate 203. Both sides of the upper metal plate 201 are respectively connected to both sides of the lower metal plate 203 through a plurality of metallized vias 202 to form the substrate integrated waveguide 2. The upper metal plate 201 and the lower metal plate 203 are respectively connected to the upper surface and the lower surface of the antenna body 1, and the upper metal plate 201 and the upper surface of the antenna body 1 are in the same horizontal plane, and the lower metal plate 203 and the lower surface of the antenna body are in the same horizontal plane. Therefore, the vertical distance H1 between the upper metal plate 201 and the lower metal plate 203 is equal to the height H2 between the upper and lower surfaces of the antenna body 1. From the left side where the antenna body 1 is connected to the substrate integrated waveguide 2 to the right side where the antenna body 1 is far from the substrate integrated waveguide 2, the width gradually decreases.

[0040] As a specific embodiment, as Figure 1 and 2As shown, the antenna body 1 is a straight quadrangular prism with isosceles trapezoidal upper and lower surfaces. The four endpoints of its upper surface are B1, B2, B3, and B4 respectively. The lower bases (the sides where B1 and B2 are located) of the isosceles trapezoids on the upper and lower surfaces are connected to the upper metal plate 201 and the bottom metal plate 203 respectively. The length of the side of the upper metal plate 201 in contact with the first transition metal plate 4 is equal to the length of the lower base of the isosceles trapezoid. The antenna body 1 is realized through a dielectric layer.

[0041] The microstrip line 3 is on the same horizontal plane as the upper metal plate 201, and the microstrip line 3 is located on the lateral ( Figure 2 left - right direction) axis of symmetry line of the upper metal plate 201. One end of the microstrip line 3 is connected to the side of the upper metal plate 201 away from the antenna body 1. The other end of the microstrip line 3 is connected to a millimeter - wave and terahertz signal source for feeding the millimeter - wave terahertz dielectric end - fire array antenna.

[0042] As Figure 2 shown, the microstrip line 3 and the substrate integrated waveguide 2 are impedance - matched through symmetrically arranged first transition metal plate 4 (with three endpoints T1, T2, T3 respectively) and second transition metal plate 5 (with three endpoints T4, T5, T6 respectively). Specifically, the first transition metal plate 4 is in the shape of a right - angled triangle. The second transition metal plate 5 has the same shape as the first transition metal plate 4. The first transition metal plate 4 and the second transition metal plate 5 are both on the same horizontal plane as the upper metal plate 201. The first transition metal plate 4 and the second transition metal plate 5 are symmetrically arranged at the connection of the microstrip line 3 and the upper metal plate 201. The first right - angled sides of the first transition metal plate 4 and the second transition metal plate 5 are connected to the upper metal plate 201, and the second right - angled sides are connected to the microstrip line 3.

[0043] Since the millimeter - wave terahertz dielectric end - fire array antenna provided in this application, which is applicable to planar integrated circuit processes, is a symmetric structure, the antenna beam is also symmetric in spatial distribution, and there will be no beam deflection problem caused by layout asymmetry.

[0044] The millimeter - wave terahertz dielectric end - fire array antenna provided in this application is applicable to planar processes, such as planar PCB processes, planar integrated circuit processes such as SiGe BiCMOS processes and CMOS processes, etc. The PCB process can use the simplest double - layer board process to realize the millimeter - wave terahertz dielectric end - fire array antenna, simplifying the antenna design. Planar integrated circuit processes such as SiGe BiCMOS processes and CMOS processes can use double - layer metals to realize the millimeter - wave terahertz dielectric end - fire array antenna.

[0045] This application is applicable to the implementation of a millimeter-wave terahertz dielectric end-fire array antenna in planar integrated circuit technology. The operating frequency f and gain of the antenna body 1 can be designed by first adjusting the length W3 of the connecting line on the upper surface between the upper metal plate 201 and the antenna body 1, the length W4 of the side of the upper surface of the antenna body 1 that is not in contact with the upper metal plate 201, the length L4 of the antenna body 1, and the vertical distance H1 between the upper metal plate 201 and the bottom metal plate 203. Among them, the substrate integrated waveguide 2 operates in the single-mode region with the TE10 mode as the main mode. W3 and H1 are determined according to the formula of the TE10 mode of the substrate integrated waveguide. This formula is common knowledge and will not be elaborated here.

[0046] Generally, the antenna gain of the millimeter-wave terahertz dielectric end-fire array antenna of this application increases as the value of the length L4 of the antenna body 1 increases.

[0047] Subsequently, the millimeter-wave terahertz dielectric end-fire array antenna is realized by adjusting the impedance matching between the microstrip line 3 and the substrate integrated waveguide 2. Specifically, the microstrip line 3 is matched to 50 ohms. According to the impedance formula of the microstrip line 3, its impedance is determined by W1 and L1. Therefore, its impedance matching can be achieved by adjusting the width W1 and length L1 of the microstrip line. The impedance matching between the microstrip line 3 and the substrate integrated waveguide 2 can be achieved by adjusting the length W2 of the first right-angled side and the length L2 of the second right-angled side of the first transition metal plate 4 and the second transition metal plate 5, the length W3 of the side of the upper metal plate 201 in contact with the first transition metal plate 4, and the length L3 of the side of the upper metal plate 201 where the metallized vias 202 are provided. To achieve better impedance matching and smaller losses, as a preferred embodiment, W3 = 2×W2 + W1 and W3 > W4 are set.

[0048] In addition, this application also includes and protects antenna bodies 1 of various other shapes, as long as the left width of the antenna body 1 is greater than the right width and gradually decreases, such as the antenna body 1 composed of a straight triangular prism, the antenna body 1 composed of the combination of a straight quadrangular prism with isosceles trapezoidal upper and lower surfaces and a cuboid, the antenna body 1 composed of the combination of a straight quadrangular prism with isosceles trapezoidal upper and lower surfaces and a straight triangular prism, the antenna body 1 composed of the combination of multiple straight quadrangular prisms with isosceles trapezoidal upper and lower surfaces and a cuboid or a straight triangular prism, etc., as shown in the following embodiments.

[0049] Embodiment 2

[0050] As a specific embodiment, as Figures 4 to 5 shown, the antenna body 1 is a straight triangular prism with isosceles triangular upper and lower surfaces, and the bases (the sides where B1 and B2 are located) of the isosceles triangles on the upper and lower surfaces are respectively connected to the upper metal plate 201 and the bottom metal plate 203. The length of the side of the upper metal plate 201 in contact with the first transition metal plate 4 is equal to the base length of the isosceles triangle, both being W3.

[0051] Example 3

[0052] As a specific embodiment, as Figure 6 shown, the antenna body 1 is composed of a straight quadrangular prism with isosceles trapezoid upper and lower surfaces and a cuboid combined, and the length of the side at the connection of the upper base of the isosceles trapezoid and the cuboid is equal.

[0053] Example 4

[0054] As a specific embodiment, as Figure 7 shown, the antenna body 1 is composed of a straight quadrangular prism with isosceles trapezoid upper and lower surfaces and a straight triangular prism with isosceles triangle upper and lower surfaces combined, and the length of the upper base of the isosceles trapezoid is equal to the length of the base of the isosceles triangle.

[0055] Example 5

[0056] As a specific embodiment, as Figure 8 shown, the antenna body 1 is composed of two first straight quadrangular prisms, a second straight quadrangular prism with isosceles trapezoid upper and lower surfaces and a cuboid combined, and the length of the upper base of the isosceles trapezoid of the first straight quadrangular prism is equal to the length of the lower base of the isosceles trapezoid of the second straight quadrangular prism, and the length of the upper base of the isosceles trapezoid of the second straight quadrangular prism is equal to the length of the side at the connection with the cuboid. The lower base of the isosceles trapezoid of the first straight quadrangular prism is connected to the substrate integrated waveguide 2.

[0057] Therefore, by analogy, the antenna bodies with geometric structures composed of n straight quadrangular prisms with isosceles trapezoid upper and lower surfaces and 1 cuboid are all within the protection scope of this application.

[0058] Example 6

[0059] As a specific embodiment, as Figure 9 shown, the antenna body 1 is composed of two first straight quadrangular prisms, a second straight quadrangular prism with isosceles trapezoid upper and lower surfaces and a straight triangular prism with isosceles triangle upper and lower surfaces combined, and the length of the upper base of the isosceles trapezoid of the first straight quadrangular prism is equal to the length of the lower base of the isosceles trapezoid of the second straight quadrangular prism, and the length of the upper base of the isosceles trapezoid of the second straight quadrangular prism is equal to the length of the base of the isosceles triangle. The lower base of the isosceles trapezoid of the first straight quadrangular prism is connected to the substrate integrated waveguide 2.

[0060] Therefore, by analogy, the antenna bodies with geometric structures composed of n straight quadrangular prisms with isosceles trapezoid upper and lower surfaces and 1 straight triangular prism with isosceles triangle upper and lower surfaces are also within the protection scope of this application.

[0061] Example 7

[0062] As a specific embodiment, as Figure 10As shown, the upper and lower surfaces of the antenna body 1 are a curved surface graph that is wide on the left and narrow on the right and is composed of two symmetric curves. This curved surface graph scans in height to form a curved surface straight column with a height of H1. The wide side of the curved surface graph of the curved surface straight column is connected to the substrate integrated waveguide 2.

[0063] Embodiment 8

[0064] As a specific embodiment, as Figure 11 shown, the upper and lower surfaces of the antenna body 1 are composed of a combination of a curved surface graph that is wide on the left and narrow on the right and is composed of two symmetric curves and a rectangle. The side of the rectangle that is not connected to the curved surface graph is connected to the substrate integrated waveguide 2.

[0065] Embodiment 9

[0066] As a specific embodiment, as Figure 12 shown, the upper and lower surfaces of the antenna body 1 are composed of a combination of a curved surface graph that is wide on the left and narrow on the right and is composed of two symmetric curves and an isosceles trapezoid. The upper base of the isosceles trapezoid is connected to the wide side of the curved surface graph. The side of the isosceles trapezoid that is not connected to the curved surface graph is connected to the substrate integrated waveguide 2.

[0067] Embodiment 10

[0068] As a specific embodiment, as Figure 13 shown, the upper and lower surfaces of the antenna body 1 are composed of a combination of a curved surface graph that is wide on the left and narrow on the right and is composed of two symmetric curves, a rectangle, and an isosceles trapezoid. The upper base of the isosceles trapezoid is connected to one side of the rectangle. The other side of the rectangle is connected to the wide side of the curved surface graph. The side of the isosceles trapezoid that is not connected to the rectangle is connected to the substrate integrated waveguide 2.

[0069] Therefore, by analogy, the antenna body with a geometric structure that gradually narrows from left to right and is composed of n straight quadrangular prisms with isosceles trapezoid upper and lower surfaces or straight quadrangular prisms with rectangular upper and lower surfaces and 1 curved surface straight column is also within the protection scope of this application.

[0070] Embodiment 11

[0071] As a specific embodiment, as Figures 14 to 16 shown, this application also discloses a variant of the microstrip line, such as the microstrip line becoming a coplanar waveguide with a CPW ground. In the PCB antenna design, the designed feeding microstrip line is a coplanar waveguide for connecting an end-launch connector.

[0072] Compared with the side - radiating array antenna of the millimeter - wave terahertz dielectric end - fire array antenna of this application, it has higher gain and higher half - power beamwidth, and is applicable to the terahertz transmitter array system with high output power requirements. In addition, the millimeter - wave terahertz dielectric end - fire array antenna provided by this application has a simple structure and can be realized only by a simple double - layer planar PCB circuit board, or an integrated circuit planar process including two metal layers such as SiGe BiCMOS process and CMOS process.

[0073] By designing a millimeter - wave terahertz dielectric end - fire array antenna suitable for planar processes, this application improves the antenna array gain and beamwidth of the terahertz transmitter array system, thereby improving the equivalent isotropic radiated power (EIRP) of the terahertz transmitter array system and reducing the requirement for the physical accuracy between the transmitter and the receiver, which is beneficial to the future popularization of terahertz technology from the laboratory to engineering applications such as consumer electronics and commercial markets.

[0074] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0075] In this article, specific examples are used to elaborate on the principle and implementation mode of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application; at the same time, for those of ordinary skill in the art, based on the idea of this application, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be construed as a limitation to this application.

Claims

1. A millimeter wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit technology, characterized in that: include: Antenna body, microstrip line, substrate integrated waveguide, first transition metal plate and second transition metal plate; The substrate integrated waveguide comprises an upper metal plate, a bottom metal plate and a dielectric layer between the upper metal plate and the bottom metal plate; the upper metal plate is arranged in parallel with the bottom metal plate; the upper metal plate and the bottom metal plate are both rectangular; the area of ​​the upper metal plate is smaller than that of the bottom metal plate; the two sides of the upper metal plate are connected to the two sides of the bottom metal plate through a plurality of metallized vias respectively; the upper metal plate and the bottom metal plate are connected to the upper surface and the lower surface of the antenna body respectively, and the upper metal plate and the upper surface of the antenna body are located in the same horizontal plane, and the bottom metal plate and the lower surface of the antenna body are located in the same horizontal plane; the width gradually decreases from the left side surface of the antenna body connected to the substrate integrated waveguide to the right side surface of the antenna body away from the substrate integrated waveguide; The microstrip line and the upper metal plate are located on the same horizontal plane, and the microstrip line is located on the horizontal axis symmetry line of the upper metal plate; One end of the microstrip line is connected to a side of the upper metal plate away from the antenna body; the other end of the microstrip line is connected to a signal source for feeding the millimeter wave terahertz dielectric end-fire array antenna; The first transition metal plate is in the shape of a right triangle; the second transition metal plate is in the same shape as the first transition metal plate; the first transition metal plate and the second transition metal plate are both located in the same horizontal plane as the upper metal plate; the first transition metal plate and the second transition metal plate are symmetrically arranged at the connection between the microstrip line and the upper metal plate; the first right-angled side of the first transition metal plate and the second transition metal plate are respectively connected to the upper metal plate, and the second right-angled side of the first transition metal plate and the second right-angled side are respectively connected to the microstrip line.

2. The millimeter wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit technology according to claim 1, characterized in that: The bottom metal plate is grounded.

3. The millimeter wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit technology according to claim 1, characterized in that: The millimeter wave terahertz dielectric end-fire array antenna has a symmetrical structure.

4. The millimeter wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit technology according to claim 1, characterized in that: The antenna body is a right quadrangular prism; the upper and lower surfaces of the right quadrangular prism are isosceles trapezoids, and the lower bases of the isosceles trapezoids on the upper and lower surfaces are respectively connected to the upper metal plate and the bottom metal plate; the length of one side of the upper metal plate in contact with the first transition metal plate is equal to the length of the lower base of the isosceles trapezoid.

5. The millimeter wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit technology according to claim 1, characterized in that: The antenna body is a right triangular prism; the upper and lower surfaces of the right triangular prism are isosceles triangles, and the bases of the isosceles triangles on the upper and lower surfaces are respectively connected to the upper metal plate and the bottom metal plate; the length of one side of the upper metal plate in contact with the first transition metal plate is equal to the length of the base of the isosceles triangle.

6. The millimeter wave terahertz dielectric end-fire array antenna suitable for planar integrated circuit technology according to claim 1, characterized in that: The length of the connection line between the upper metal plate and the upper surface of the antenna body is W3, W3 = 2×W2 + W1; wherein W2 is the length of the first right-angle side of the first transition metal plate; and W1 is the width of the microstrip line.

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