Interlayer alignment monitoring mechanism for processing multilayer printed circuit board

Abstract

The utility model relates to the technical field of detection mechanisms, in particular to an interlayer alignment monitoring mechanism for processing a multilayer printed circuit board. According to the technical scheme, the device comprises a mounting frame, an adjusting structure, a monitoring structure and a pressing structure, the monitoring structure is arranged in the mounting frame, and the monitoring structure comprises a lifting frame, proofreading plates located in the two sides of the lifting frame, a second motor located at the front ends of the proofreading plates and a second screw located at the output end of the second motor; the stroke plate is located on one side of the proofreading plate, the installation cylinder is located at one end of the stroke plate, the stroke column is located in the installation cylinder, the ball is rotationally installed in the stroke column, the spring is located on the outer side of the stroke column in a sleeved mode, the displacement sensor is located at one end of the stroke column, and the second nut is located at one end of the stroke plate. According to the utility model, through a three-coordinate displacement detection structure, layer-to-layer proofreading detection is carried out on the multi-layer printed circuit board, so that the problem of dislocation during bonding caused by the possibility of errors in manual stacking of the circuit board is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of detection mechanisms, in particular to an interlayer alignment monitoring mechanism for multi-layer printed circuit board processing. Background Art

[0002] A multi-layer printed circuit board is composed of multiple insulating substrates and conductive layers deposited by chemical methods, consisting of at least three layers, and is used to connect various electronic components, such as integrated circuits, resistors, capacitors, etc.

[0003] During the inner layer processing of a multi-layer printed circuit board, chemical or mechanical methods are used to remove unnecessary copper foils. After transferring the circuit pattern to the inner layer, the processed inner layer is laminated with the pre-prepared outer layer and insulating layer with copper foil impregnated. High temperature and high pressure are used to ensure that the layers are firmly bonded together. During this process, the interlayer alignment of the multi-layer printed circuit board is required. In most cases, this process is manually stacked by workers and placed into the equipment, relying on manual operation, which may cause errors, resulting in misalignment problems when the inner layer is bonded to the outer layer and insulating layer. For this reason, we propose an interlayer alignment monitoring mechanism for multi-layer printed circuit board processing to solve the existing problems. Summary of the Utility Model

[0004] The purpose of the utility model is to address the problems in the background art and propose an interlayer alignment monitoring mechanism for multi-layer printed circuit board processing.

[0005] To achieve the above purpose, the utility model provides the following technical solution: An interlayer alignment monitoring mechanism for multi-layer printed circuit board processing, including a mounting frame, an adjustment structure, a monitoring structure, and a pressing structure. The monitoring structure is arranged inside the mounting frame. The monitoring structure includes a lifting frame, alignment plates located inside both sides of the lifting frame, a motor two located at the front end of the alignment plate, a screw two located at the output end of the motor two, a travel plate located on one side of the alignment plate, a mounting cylinder located at one end of the travel plate, a travel column located inside the mounting cylinder, a ball rotatably installed inside the travel column, a spring sleeved outside the travel column, a displacement sensor located at one end of the travel column, and a nut two located at one end of the travel plate and rotatably sleeved on the outer wall of the screw two. Hydraulic rods are arranged inside both ends of the lifting frame, and an adjustment structure is arranged inside both sides of the mounting frame. The adjustment structure includes a motor one, a screw one located at the lower output end of the motor one, a nut one located at both ends of the lifting frame and rotatably sleeved on the outer wall of the screw one, and bearing seats located on the inner walls of both ends of the mounting frame and rotatably installed with the lower end of the screw one.

[0006] Preferably, brackets are arranged at both ends of the mounting frame, and mounting holes are respectively opened inside the brackets. The brackets mount and fix the mounting frame on the base, and the mounting holes are used for inserting rotating parts.

[0007] Preferably, a bottom plate is provided below the mounting frame. A third motor is provided at the upper end of the bottom plate, and a placement table is provided at the upper end of the third motor. The third motor is supported and fixed by the bottom plate, and the multi-layer printed circuit board is carried by the placement table.

[0008] Preferably, a guide rail is provided on the outer wall of one side of the alignment plate, and a sliding groove for slidingly mounting on the outer wall of the guide rail is provided inside the travel plate. The travel plate is slidingly guided on one side of the alignment plate through the sliding groove.

[0009] Preferably, a guide sleeve is provided at the upper end of the travel column, and a guide plate slidingly inserted into the guide sleeve is provided at one end of the travel plate. When the travel column moves horizontally through the guide sleeve, sliding guidance is obtained.

[0010] Preferably, one end of the hydraulic rod is connected to the alignment plate. A limiting ring is sleeved on the outer wall of the travel column, and two ends of the spring are respectively connected to the limiting ring and the inner wall of the mounting cylinder. The hydraulic rod drives the alignment plate to move horizontally. The elastic force of the spring acts on the travel column through the limiting ring, so that the travel column is elastically reset by the spring after being squeezed.

[0011] Preferably, a sliding sleeve is provided at the upper end of the alignment plate, and a guide rod slidingly inserted into the sliding sleeve is provided inside the upper end of the mounting frame. The alignment plate is slidingly guided when moving horizontally inside the lifting frame through the sliding sleeve.

[0012] Preferably, a pressing structure is provided at the lower end of the lifting frame. The pressing structure includes a sleeve, a pressing rod slidingly mounted inside the lower end of the sleeve, a support ring sleeved on the outer wall of the pressing rod, a compression spring located above the support ring and connected to the lifting frame, and a flexible pressing block located at the lower end of the pressing rod. The elasticity of the compression spring acts on the pressing rod through the support ring. The flexible pressing block fits with the upper end of the circuit board, avoiding abrasion of the circuit board during pressing and keeping the circuit board stable during the pressing process.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. In the present utility model, the balls are in contact with the inner layer, outer layer and the side of the insulating layer of the stacked multi-layer printed circuit boards. During the movement of the balls, an elastic supporting force is provided by the spring. When the balls pass through the uneven places of the inner layer, outer layer and insulating layer of the multi-layer printed circuit boards stacked, the balance of the spring is broken, causing the travel column to displace. After the displacement sensor detects the displacement signal, it alarms to the terminal. When the inner layer, outer layer and insulating layer of the multi-layer printed circuit boards are bonded, effective detection between layers of the inner layer, outer layer and insulating layer of the multi-layer printed circuit boards is carried out, improving the qualification rate of the bonding process of the inner layer, outer layer and insulating layer of the multi-layer printed circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the front view three-dimensional structural schematic diagram of the present utility model;

[0016] Figure 2 is a perspective view from below of the three-dimensional structure of the present utility model;

[0017] Figure 3 is a perspective view from below of the three-dimensional structure of the pressing structure of the present utility model;

[0018] Figure 4 is a perspective view from the side of the three-dimensional structure of the monitoring structure of the present utility model;

[0019] Figure 5 is a perspective view of the main sectional view of the installation cylinder of the present utility model.

[0020] Reference numerals:

[0021] 100, mounting frame; 101, support; 102, placing table; 103, motor three; 104, bottom plate;

[0022] 200, adjusting structure; 201, screw one; 202, nut one; 203, bearing seat; 204, motor one; 205, lifting frame;

[0023] 300, monitoring structure; 301, hydraulic rod; 302, guide rod; 303, sliding sleeve; 304, motor two; 305, screw two; 306, nut two; 307, installation cylinder; 308, stroke column; 309, guide rail; 310, stroke plate; 311, alignment plate; 312, guide plate; 313, guide sleeve; 314, spring; 315, displacement sensor; 316, limit ring; 317, ball;

[0024] 400, pressing structure; 401, compression spring; 402, sleeve; 403, pressing rod; 404, flexible pressing block; 405, support ring. Detailed implementation manners

[0025] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0026] Such as Figures 1 - 5As shown in the figure, a layer alignment monitoring mechanism for processing multi-layer printed circuit boards proposed by the present utility model includes a mounting frame 100, an adjustment structure 200, a monitoring structure 300, and a pressing structure 400. Brackets 101 are provided at both ends of the mounting frame 100. Mounting holes are respectively opened inside the brackets 101. A bottom plate 104 is provided below the mounting frame 100. A third motor 103 is provided at the upper end of the bottom plate 104. A placement table 102 is provided at the upper end of the third motor 103. A monitoring structure 300 is provided inside the mounting frame 100. The monitoring structure 300 includes a lifting frame 205, alignment plates 311 located inside both sides of the lifting frame 205, a second motor 304 located at the front end of the alignment plate 311, a second screw 305 located at the output end of the second motor 304, a travel plate 310 located on one side of the alignment plate 311, a mounting cylinder 307 located at one end of the travel plate 310, a travel column 308 located inside the mounting cylinder 307, a ball 317 rotatably installed inside the travel column 308, a spring 314 sleeved outside the travel column 308, a displacement sensor 315 located at one end of the travel column 308, a second nut 306 located at one end of the travel plate 310 and rotatably sleeved on the outer wall of the second screw 305. A guide rail 309 is provided on the outer wall of one side of the alignment plate 311. A sliding groove for slidably installing on the outer wall of the guide rail 309 is opened inside the travel plate 310. A guide sleeve 313 is provided at the upper end of the travel column 308. A guide plate 312 slidably inserted inside the guide sleeve 313 is provided at one end of the travel plate 310. Hydraulic rods 301 are respectively provided inside both ends of the lifting frame 205. One end of the hydraulic rod 301 is connected to the alignment plate 311. A limit ring 316 is sleeved on the outer wall of the travel column 308. Both ends of the spring 314 are respectively connected to the inner wall of the limit ring 316 and the mounting cylinder 307.

[0027] Based on the implementation steps of Embodiment 1: After the inner layer, outer layer, and insulating layer of the multi-layer printed circuit board are stacked, they are placed on the placement table 102. The hydraulic rod 301 drives the adjustment plate to move relatively, and the ball 317 fits with the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit board. At the same time, the second motor 304 drives the second screw 305 to rotate, pushes the second nut 306, and drives the travel plate 310 to reciprocate. When the ball 317 is squeezed or loses contact, the spring 314 changes and performs telescopic operation. At the same time, the travel column 308 displaces. After the displacement sensor 315 detects the signal, it alarms the terminal, and both sides of the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit board are detected at one time. After the detection, the third motor 103 drives the placement table 102 to rotate, so that the untested ends correspond to the monitoring structure 300. Repeat the above operations, and the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit board are conveniently detected, improving the qualification rate of the bonding process of the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit board.

[0028] As Figures 1 - 5As shown in the figure, compared with the first embodiment, the layer alignment monitoring mechanism for processing multi-layer printed circuit boards proposed by the present utility model further includes: a sliding sleeve 303 is provided at the upper end of the calibration plate 311, a guide rod 302 that is slidably inserted into the inner part of the sliding sleeve 303 is provided inside the upper end of the mounting frame 100, a pressing structure 400 is provided at the lower end of the lifting frame 205. The pressing structure 400 includes a sleeve 402, a pressing rod 403 slidably installed inside the lower end of the sleeve 402, a support ring 405 sleeved on the outer wall of the pressing rod 403, a compression spring 401 located above the support ring 405 and connected to the lifting frame 205, and a flexible pressing block 404 located at the lower end of the pressing rod 403. Adjusting structures 200 are provided inside both sides of the mounting frame 100. The adjusting structures 200 include a first motor 204, a first screw rod 201 at the lower output end of the first motor 204, a first nut 202 located at both ends of the lifting frame 205 and rotatably sleeved on the outer wall of the first screw rod 201, and bearing seats 203 located on the inner walls at both ends of the mounting frame 100 and rotatably installed at the lower end of the first screw rod 201.

[0029] In this embodiment, sometimes due to the large number of layers, the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit boards, the first motor 204 drives the first screw rod 201 to rotate, pushing the first nut 202, thereby causing the lifting frame 205 to move longitudinally. During this process, the flexible pressing block 404 presses on the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit boards. The flexible pressing block 404 squeezes the compression spring 401 under force, and the pressing rod 403 contracts, firmly clamping the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit boards. At the same time, the monitoring structure 300 moves longitudinally, enabling the ball 317 to roll longitudinally on the side of the inner layer, outer layer, and insulating layer of the stacked multi-layer printed circuit boards, effectively monitoring the layer between printed circuit boards with different numbers of layers, and improving the flexibility of the monitoring equipment.

[0030] The above specific embodiments are merely several preferred embodiments of the present utility model. Based on the technical solution of the present utility model and the relevant revelations of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0031] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, it is intended to encompass all changes falling within the meaning and scope of the equivalent elements of the claims in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A layer alignment monitoring mechanism for processing a multi-layer printed circuit board, comprising a mounting frame (100), an adjustment structure (200), a monitoring structure (300) and a holding structure (400), characterized in that: A monitoring structure (300) is arranged inside the mounting frame (100), and the monitoring structure (300) comprises a lifting frame (205), a calibration plate (311) located inside both sides of the lifting frame (205), a second motor (304) located at the front end of the calibration plate (311), a second screw (305) located at the output end of the second motor (304), a stroke plate (310) located at one side of the calibration plate (311), a mounting tube (307) located at one end of the stroke plate (310), a stroke column (308) located inside the mounting tube (307), a ball (317) rotatably mounted inside the stroke column (308), a spring (314) sleeved on the outside of the stroke column (308), and a screw (315) located at the output end of the second motor (304). A displacement sensor (315) is provided at one end of the travel plate (310), a nut (306) is provided at one end of the travel plate (310) and is rotatably sleeved on the outer wall of the screw rod (305), hydraulic rods (301) are provided inside both ends of the lifting frame (205), and adjustment structures (200) are provided inside both sides of the mounting frame (100), and the adjustment structure (200) includes a motor (204), a screw rod (201) located at the output end of the lower end of the motor (204), a nut (202) is provided at both ends of the lifting frame (205) and is rotatably sleeved on the outer wall of the screw rod (201), and a bearing seat (203) is provided on the inner wall at both ends of the mounting frame (100) and is rotatably mounted with the lower end of the screw rod (201).

2. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: Brackets (101) are provided at both ends of the mounting frame (100), and mounting holes are provided inside the brackets (101).

3. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: A bottom plate (104) is arranged below the mounting frame (100), a motor three (103) is arranged at the upper end of the bottom plate (104), and a placement platform (102) is arranged at the upper end of the motor three (103).

4. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: A guide rail (309) is provided on the outer wall of one side of the calibration plate (311), and a sliding groove is provided inside the travel plate (310) and is slidably mounted on the outer wall of the guide rail (309).

5. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: A guide sleeve (313) is disposed at the upper end of the travel column (308), and a guide plate (312) slidably inserted into the guide sleeve (313) is disposed at one end of the travel plate (310).

6. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: One end of the hydraulic rod (301) is connected to the calibration plate (311), the outer wall of the travel column (308) is sleeved with a limit ring (316), and the two ends of the spring (314) are respectively connected to the limit ring (316) and the inner wall of the installation cylinder (307).

7. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: The upper end of the calibration plate (311) is provided with a sliding sleeve (303), and the upper end of the mounting frame (100) is provided with a guide rod (302) which is slidably inserted into the sliding sleeve (303).

8. The interlayer alignment monitoring mechanism for multilayer printed circuit board processing according to claim 1, characterized in that: A holding structure (400) is provided at the lower end of the lifting frame (205), and the holding structure (400) comprises a sleeve (402), a holding rod (403) slidably mounted inside the lower end of the sleeve (402), a support ring (405) sleeved on the outer wall of the holding rod (403), a compression spring (401) located at the upper end of the support ring (405) and connected to the lifting frame (205), and a flexible pressure block (404) located at the lower end of the holding rod (403).

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