Electroplating device

Abstract

The utility model discloses an electroplating device. The electroplating device comprises a current supply module, a set current supply end, at least two current transmission fixing structures and at least two current adjusting modules arranged in one-to-one correspondence with the current transmission fixing structures, the current supply end of the current supply module is electrically connected with the current input end of the current transmission fixing structure; the current adjusting module comprises a current adjusting end, a current setting end and a current supply end; the current adjusting end is electrically connected with the current output end of the current transmission fixing structure, each current setting end is electrically connected with the set current supply end, and the current supply end is electrically connected with the substrate to be plated. According to the technical scheme, the electroplating uniformity and reliability of the electroplating device can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, and particularly relates to an electroplating device. Background Art

[0002] Electroplating is an important process in the production of printed circuit boards (PCBs). It is a process of depositing a coating on a substrate through electrolysis. Usually, during electroplating, the coating metal serves as the anode and is oxidized into cations and enters the electroplating solution. The substrate to be plated serves as the cathode, and the cations of the coating metal are reduced on the surface of the substrate to be plated to form a coating.

[0003] During the electroplating process, a rectifier supplies current to the substrate to be plated to form a coating on the surface of the substrate to be plated. However, since the electrical signal transmission line between the rectifier and the substrate to be plated also includes devices such as conductive sliders and hanging tools, due to the resistance differences between devices, the current values actually transmitted to different substrates to be plated or different positions of the substrate to be plated are different, resulting in uneven coatings on the surface of the substrate to be plated. Summary of the Utility Model

[0004] The utility model provides an electroplating device to improve the electroplating uniformity and reliability of the electroplating device.

[0005] The utility model provides an electroplating device, including: a current supply module, a set current supply terminal, at least two current transmission fixing structures, and at least two current adjustment modules corresponding to the current transmission fixing structures one by one;

[0006] The current supply terminal of the current supply module is electrically connected to the current input terminal of the current transmission fixing structure;

[0007] The current adjustment module includes a current adjustment terminal, a current setting terminal, and a current supply terminal; the current adjustment terminal is electrically connected to the current output terminal of the current transmission fixing structure, each current setting terminal is electrically connected to the set current supply terminal, and the current supply terminal is electrically connected to the substrate to be plated.

[0008] Optionally, the current adjustment module includes:

[0009] A comparison unit, including a first input terminal, a second input terminal, and a comparison output terminal; the first input terminal is electrically connected to the current output terminal, and the second input terminal is electrically connected to the set current supply terminal;

[0010] A current conversion unit, including a conversion control terminal, a current supply terminal, and the current supply terminal; the conversion control terminal is electrically connected to the comparison output terminal, and the current supply terminal is electrically connected to the current output terminal.

[0011] Optionally, the current conversion unit includes:

[0012] A current amplification sub-unit, including a current amplification input terminal, a current amplification output terminal, and a current amplification control terminal. The current amplification control terminal is electrically connected to the comparison output terminal, the current amplification input terminal is electrically connected to the current output terminal, and the current amplification output terminal is electrically connected to the current supply terminal;

[0013] A current limiting sub-unit, including a current limiting input terminal, a current limiting output terminal, and a current limiting control terminal. The current limiting control terminal is electrically connected to the comparison output terminal, the current limiting input terminal is electrically connected to the current output terminal, and the current limiting output terminal is electrically connected to the current supply terminal;

[0014] A current holding sub-unit, including a current holding input terminal, a current holding output terminal, and a current holding control terminal. The current holding control terminal is electrically connected to the comparison output terminal, the current holding input terminal is electrically connected to the current output terminal, and the current holding output terminal is electrically connected to the current supply terminal.

[0015] Optionally, the current amplification sub-unit at least includes a triode and a resistor.

[0016] Optionally, the current limiting sub-unit at least includes a field effect transistor.

[0017] Optionally, the current holding sub-unit at least includes a switch.

[0018] Optionally, the current transmission fixing structure includes a conductive slider and a hanger;

[0019] The conductive slider is electrically connected to the hanger.

[0020] Optionally, the electroplating device further includes a conductive shaft;

[0021] The conductive slider is slidably connected to the conductive shaft.

[0022] Optionally, the electroplating device further includes a controller;

[0023] The set current transmitting end of the controller is connected to the current setting end.

[0024] Optionally, the controller includes a wireless transmitting unit, and the current adjustment module includes a wireless receiving unit;

[0025] The wireless transmitting unit is communicatively connected to the wireless receiving unit.

[0026] The technical solution of the present utility model provides a stable current signal source by setting a current supply module. By setting a current transmission fixing structure electrically connected to the current supply module and the current adjustment module respectively, the current signal provided by the current supply module is transmitted to the current adjustment module, and a supporting force is provided for fixing the substrate to be plated. By setting a current adjustment module and a set current supply end, the current adjustment module can adjust the current signal transmitted by the current transmission structure according to the set current value provided by the set current supply end, so that the current signals provided by each current adjustment module to the substrate to be plated are all set currents, improving the uniformity of the plating layer formed on the surface of the substrate to be plated by the electroplating device and improving the electroplating reliability of the electroplating device. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some specific embodiments of the present utility model. For those skilled in the art, according to the basic concepts of the device structure, driving method, and manufacturing method disclosed and prompted by various embodiments of the present utility model, they can be extended and extended to other structures and drawings. Undoubtedly, these should all be within the scope of the claims of the present utility model.

[0028] Figure 1 FIG. is a schematic structural diagram of an electroplating device provided by an embodiment of the present utility model;

[0029] Figure 2 FIG. is a schematic structural diagram of another electroplating device provided by an embodiment of the present utility model;

[0030] Figure 3 FIG. is a schematic structural diagram of yet another electroplating device provided by an embodiment of the present utility model;

[0031] Figure 4 FIG. is a schematic structural diagram of still another electroplating device provided by an embodiment of the present utility model;

[0032] Figure 5 FIG. is a schematic structural diagram of an electroplating device provided by an embodiment of the present utility model;

[0033] Figure 6 FIG. is a schematic structural diagram of another electroplating device provided by an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] To make the objectives, technical solutions and advantages of the present utility model clearer, the following will, with reference to the accompanying drawings in the embodiments of the present utility model, clearly and completely describe the technical solutions of the present utility model through implementation manners. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Based on the basic concepts disclosed and prompted by the embodiments in the present utility model, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present utility model.

[0035] Figure 1 It is a schematic structural diagram of a plating device provided by an embodiment of the present utility model. Figure 2 It is a schematic structural diagram of another plating device provided by an embodiment of the present utility model. Refer to Figure 1 and Figure 2 , the plating device includes a current supply module 10, a set current supply terminal Is, at least two current transmission and fixing structures 20, and at least two current adjustment modules 30 arranged in one-to-one correspondence with the current transmission and fixing structures 20; the current supply terminal of the current supply module 10 is electrically connected to the current input terminal of the current transmission and fixing structure 20; the current adjustment module 30 includes a current adjustment terminal, a current setting terminal, and a current supply terminal; the current adjustment terminal is electrically connected to the current output terminal of the current transmission and fixing structure 20, each current setting terminal is electrically connected to the set current supply terminal Is, and the current supply terminal is electrically connected to the substrate to be plated 40.

[0036] Among them, the current supply module 10 is used to provide a stable current signal, the set current supply terminal Is is used to provide a set current, the set current is related to parameters such as the coating thickness of the substrate to be plated 40 or the current signal provided by the current supply module 10 and the number of current adjustment modules 30. The substrate to be plated 40 includes a circuit board with an uncoated copper surface, etc., which can be set according to actual needs and will not be specifically limited here.

[0037] Specifically, the current supply module 10 includes a rectifier, which is electrically connected to an AC power supply. The AC power supply is used to provide an AC signal, and the rectifier is used to convert the AC current signal into a stable DC current signal, so that the current signal transmitted to the substrate 40 to be plated has strong stability. The current transmission and fixing structure 20 can, on the one hand, transmit the current signal provided by the current supply module 10 to the current adjustment module 30, and on the other hand, can also provide a supporting force for fixing the substrate 40 to be plated, preventing the substrate 40 to be plated from falling during the electroplating process and thus affecting the electroplating effect. The current adjustment module 30 is used to convert the current signal provided by the current transmission and fixing structure 20 into a set current according to the set current provided by the set current supply end Is, and then provide the converted set current to the substrate 40 to be plated, so that the substrate 40 to be plated can receive a current signal equal to the set current value. When the current signals provided by each current adjustment module 30 are respectively transmitted to different positions of the same substrate 40 to be plated, the setting of the current adjustment module 30 enables different positions of the substrate 40 to be plated to receive current signals with the same set current value, so as to improve the thickness uniformity of the electroplating layer at different positions of the substrate 40 to be plated. When the current signals provided by each current adjustment module 30 are respectively transmitted to different substrates 40 to be plated, the setting of the current adjustment module 30 enables different substrates 40 to be plated to receive current signals with the same set current value, so as to improve the electroplating uniformity of each substrate 40 to be plated. When using this electroplating device to electroplate a large number of substrates 40 to be plated, the coating differences of each substrate 40 to be plated can be reduced, and the electroplating uniformity of each substrate 40 to be plated can be improved.

[0038] The technical solution of the present utility model provides a stable current signal source by setting a current supply module. By providing a current transmission and fixing structure electrically connected to the current supply module and the current adjustment module respectively, the current signal provided by the current supply module can be transmitted to the current adjustment module, and a supporting force is provided for fixing the substrate to be plated. By setting a current adjustment module and a set current supply end, the current adjustment module can adjust the current signal transmitted by the current transmission structure according to the set current value provided by the set current supply end, so that the current signals provided by each current adjustment module to the substrate to be plated are all set currents, improving the uniformity of the electroplating layer formed on the surface of the substrate to be plated by the electroplating device and improving the electroplating reliability of the electroplating device.

[0039] Optionally, Figure 3 is a schematic structural diagram of another electroplating device provided by an embodiment of the present utility model, as Figure 3As shown, the current adjustment module 30 includes a comparison unit 31 and a current conversion unit 32. The comparison unit 31 includes a first input terminal A1, a second input terminal A2, and a comparison output terminal A3. The first input terminal A1 is electrically connected to the current output terminal, and the second input terminal A2 is electrically connected to the set current providing terminal Is. The current conversion unit 32 includes a conversion control terminal, a current supply terminal, and a current output terminal. The conversion control terminal is electrically connected to the comparison output terminal A3, and the current supply terminal is electrically connected to the current output terminal.

[0040] Among them, the comparison unit 31 includes a comparator, etc., and the current conversion unit 32 includes current adjustment devices such as resistors and diodes. On the premise of being able to realize the functions of the comparison unit 31 and the current conversion unit 32, the specific structures of the comparison unit 31 and the current conversion unit 32 can be set according to actual needs, and no specific limitation is made here.

[0041] Specifically, the current signal provided by the current transmission fixed structure 20 is transmitted to the comparison unit 31 through the first input terminal A1, and the set current provided by the set current providing terminal Is is transmitted to the comparison unit 31 through the second input terminal A2. The comparison unit 31 compares the current signal provided by the current transmission fixed structure 20 with the set current. When the current signal provided by the current transmission fixed structure 20 is equal to the set current, the comparison unit 31 provides a current holding control signal to the current conversion unit 32 through the comparison output terminal A3, so that the current conversion unit 32 directly transmits the current signal provided by the current transmission fixed structure 20 to the substrate to be plated 40 under the action of this control signal. When the current signal provided by the current transmission fixed structure 20 is greater than the set current, the comparison unit 31 provides a current reduction control signal to the current conversion unit 32 through the comparison output terminal A3, so that the current conversion unit 32 reduces the current signal provided by the current transmission fixed structure 20 to the set current and then transmits it to the substrate to be plated 40 under the action of this control signal. When the current signal provided by the current transmission fixed structure 20 is less than the set current, the comparison unit 31 provides a current increase control signal to the current conversion unit 32 through the comparison output terminal A3, so that the current conversion unit 32 increases the current signal provided by the current transmission fixed structure 20 to the set current and then transmits it to the substrate to be plated 40 under the action of this control signal. In this way, by setting the comparison unit 31 and the current conversion unit 32, the current adjustment module 30 can provide a current signal equal to the set current value to the substrate to be plated 40 to improve the electroplating uniformity of the substrate to be plated 40.

[0042] Optionally, Figure 4 is a schematic structural diagram of another electroplating device provided by an embodiment of the present invention, as Figure 4As shown, the current conversion unit 32 includes a current amplification subunit 321, a current limiting subunit 322, and a current holding subunit 323. The current amplification subunit 321 includes a current amplification input terminal, a current amplification output terminal, and a current amplification control terminal. The current amplification control terminal is electrically connected to the comparison output terminal A3. The current amplification input terminal is electrically connected to the current output terminal. The current amplification output terminal is electrically connected to the current supply terminal. The current limiting subunit 322 includes a current limiting input terminal, a current limiting output terminal, and a current limiting control terminal. The current limiting control terminal is electrically connected to the comparison output terminal A3. The current limiting input terminal is electrically connected to the current output terminal. The current limiting output terminal is electrically connected to the current supply terminal. The current holding subunit 323 includes a current holding input terminal, a current holding output terminal, and a current holding control terminal. The current holding control terminal is electrically connected to the comparison output terminal A3. The current holding input terminal is electrically connected to the current output terminal. The current holding output terminal is electrically connected to the current supply terminal.

[0043] Among them, the current output terminal of the current transmission fixed structure 20 and the current amplification subunit 321 can amplify the current. The current limiting subunit 322 can reduce the input current signal and then output it. The current holding subunit 323 can maintain the magnitude of the input current.

[0044] It can be understood that on the premise that the current amplification subunit 321, the current limiting subunit 322, and the current holding subunit 323 can achieve their respective functions, the specific structures of the current amplification subunit 321, the current limiting subunit 322, and the current holding subunit 323 are not limited in this application and can be set according to actual needs.

[0045] Specifically, the current output terminals of the current transmission fixed structure 20 are respectively electrically connected to the current amplification input terminal of the current amplification sub-unit 321, the current limitation input terminal of the current limitation sub-unit 322, and the current holding input terminal of the current holding sub-unit 323, so that the current conversion unit 32 controls the corresponding sub-units to perform corresponding conversion adjustments on the current signal provided by the current transmission fixed structure 20 according to the comparison result of the comparison unit 31, and outputs a current signal equal to the set current value to the substrate to be plated 40. When the current signal provided by the current transmission fixed structure 20 is equal to the set current, the comparison unit 31 outputs a control signal to control the current holding sub-unit 323 to be in the working state and control the current amplification sub-unit 321 and the current limitation sub-unit 322 to be in the non-working state. Under the action of this control signal, the current holding sub-unit 323 directly transmits the current signal provided by the current transmission fixed structure 20 to the substrate to be plated 40 through the current holding output terminal. Although the current amplification output terminal of the current amplification sub-unit 321, the current limitation output terminal of the current limitation sub-unit 322, and the current holding output terminal of the current holding sub-unit 323 are all electrically connected to the current supply terminal of the current conversion unit 32, when the current holding sub-unit 323 is in the working state and the current amplification sub-unit 321 and the current limitation sub-unit 322 are both in the non-working state, only the current holding output terminal outputs a current signal, and the current amplification output terminal and the circuit limitation output terminal do not output a current signal. At this time, the signal received by the current supply terminal is the current signal provided by the current holding output terminal, and the electrical signal of the current holding output terminal can then be transmitted to the substrate to be plated 40 through the current supply terminal. In an optional embodiment, the current holding sub-unit 323 at least includes a switch. The switch includes small switch devices such as relays to reduce the structure of the current holding sub-unit 323 and simplify the overall structure of the current conversion unit. The control signal output by the comparison unit 31 can control the switch of the current holding sub-unit 323 to be in the on or off state, so that when the switch is in the on state, the current holding sub-unit 323 can transmit the current signal output by the current transmission fixed structure 20 to the substrate to be plated 40 through the internal switch device.

[0046] Correspondingly, when the current signal provided by the current transmission fixed structure 20 is less than the set current, the comparison unit 31 outputs a control signal for controlling the current amplification sub-unit 321 to be in an operating state and controlling the current limiting sub-unit 322 and the current holding sub-unit 323 to be in a non-operating state. Under the action of this control signal, the current amplification sub-unit 321 amplifies the current signal provided by the current transmission fixed structure 20 and then outputs the amplified current signal to the substrate to be plated 40. Among them, the control signal output by the comparison unit 31 can control the amplification factor of the current amplification sub-unit 321, so that the current amplification sub-unit 321 amplifies the current signal provided by the current transmission fixed structure 20 to be equal to the set current value under the action of the control signal. In an optional embodiment, the current amplification sub-unit 321 includes at least a triode and a resistor. Among them, the triode includes an NPN-type triode or a PNP-type triode, which can be selected according to actual needs. Applying a small current signal to the control terminal of the triode can control the output of a larger current signal, that is, the triode has the characteristic of current amplification. The current amplification can be achieved by using the current amplification characteristic of the triode. The comparison output terminal of the comparison unit 31 can be electrically connected to the control terminal of the triode, the input terminal of the triode is electrically connected to the current output terminal of the current transmission fixed structure 20, the output terminal of the triode is electrically connected to the current supply terminal, and the resistor can be arranged at the control terminal and / or the output terminal of the triode. The control signal provided by the comparison unit 31 can control the amplification state of the triode. Different control signals correspond to different amplification factors of the triode to achieve different amplification effects, and then the current signal provided by the current transmission fixed structure 20 is amplified to different degrees, so that the amplified current signal is equal to the set current value, improving the electroplating uniformity of the substrate to be plated 40.

[0047] Correspondingly, when the current signal provided by the current transmission fixed structure 20 is greater than the set current, the comparison unit 31 outputs a control signal for controlling the current limiting sub-unit 322 to be in an operating state and controlling the current amplification sub-unit 321 and the current holding sub-unit 323 to be in a non-operating state. Under the action of this control signal, the current limiting sub-unit 322 reduces the current signal provided by the current transmission fixed structure 20 and then outputs the reduced current signal to the substrate to be plated 40. Among them, the control signal output by the comparison unit 31 can control the reduction amount of the current limiting sub-unit 322 or control the current flowing through the current limiting sub-unit 322, so that the current limiting sub-unit 322 reduces the current signal provided by the current transmission fixed structure 20 to be equal to the set current value under the action of the control signal. In an optional embodiment, the current limiting sub-unit 322 includes at least a field effect transistor. The field effect transistor includes an insulated gate field effect transistor, etc. The field effect transistor has a lower internal resistance and a faster dynamic response speed. The impedance value of the field effect transistor can be changed by controlling the control electrode signal of the field effect transistor, thereby realizing the current limiting function.

[0048] Optionally, Figure 5 is a schematic structural diagram of an electroplating device provided by an embodiment of the present invention. As Figure 5 shown, the current transmission and fixing structure 20 includes a conductive slider 21 and a hanger 22; the conductive slider 21 is electrically connected to the hanger 22.

[0049] Among them, the conductive slider 21 and the hanger 22 are made of conductive materials such as copper, which can be set according to actual needs.

[0050] Specifically, the conductive slider 21 is electrically connected to the hanger 22 to provide an electrical signal to the hanger 22. In addition, the conductive slider 21 is also fixedly connected to the hanger 22 so that when the conductive slider 21 moves in a certain direction, the conductive slider 21 can drive the hanger 22 to move synchronously in this direction. The hanger 22 is used to fix the substrate to be plated 40. Therefore, when the conductive slider 21 drives the hanger 22 to move, it can drive the substrate to be plated 40 to move synchronously, so that when the substrate to be plated 40 needs to be moved from the first electroplating bath to the second electroplating bath, the substrate to be plated 40 can be driven to move by the conductive slider 21 and the hanger 22 to realize the electroplating of the substrate to be plated 40.

[0051] Optionally, referring to Figure 5 , the current transmission and fixing structure 20 further includes a conductive shaft 23; the conductive slider 21 is slidably connected to the conductive shaft 23.

[0052] Among them, the conductive shaft 23 at least includes a conductive material, and the specific structure of the conductive shaft 23 can be set according to actual needs, and no specific limitation is made here.

[0053] Specifically, by setting the conductive slider 21 to be slidably connected to the conductive shaft 23, the conductive slider 21 can move along the axial direction of the conductive shaft 23. The electroplating baths of the electroplating device can be arranged along the axial direction of the conductive shaft 23, so that when the conductive slider 21 moves along the axial direction of the conductive shaft 23, it can drive the hanger 22 and the substrate to be plated 40 to move synchronously, so that the substrate to be plated 40 can complete electroplating.

[0054] It can be understood that since the conductive shaft 23 has conductivity, the current supply module 10 can be only electrically connected to the conductive shaft 23 to transmit the current signal provided by the current supply module 10 to each conductive slider 21 through the conductive shaft 23, reducing the length of the electrical connection lines between the current supply module 10 and each conductive slider 21 and simplifying the overall structure of the electroplating device.

[0055] Optionally, Figure 6 is a schematic structural diagram of another electroplating device provided by an embodiment of the present invention. As Figure 6As shown, the electroplating device further includes a controller 50; the set current transmitting end of the controller 50 is connected to the current setting end. The controller 50 can determine the set current according to the current signal provided by the current supply module 10 and the number of current transmission fixing structures 20. Exemplarily, if the current signal provided by the current supply module 10 is 120A and the number of current transmission fixing structures 20 is 4, then the controller 50 takes the ratio of the current signal provided by the current supply module 10 to the number of current transmission fixing structures 20 as the set current, that is, 30A as the set current, and sends it to the current setting end of the current adjustment module 30 through the set current transmitting end, so that the current adjustment module 30 adjusts the current according to this set current.

[0056] It can be understood that the connection manner between the controller 50 and the current adjustment module 30 can be set according to actual needs. Figure 6 Only the connection manner in which the controller 50 is directly electrically connected to the current adjustment module 30 is shown. The controller 50 can also be wirelessly communicatively connected to the current adjustment module 30. In an optional embodiment, the controller 50 includes a wireless transmitting unit, and the current adjustment module 30 includes a wireless receiving unit; the wireless transmitting unit is communicatively connected to the wireless receiving unit. In this way, the wireless transmitting unit in the controller 50 transmits the calculated set current to the wireless receiving unit in the current adjustment module 30, and the wireless structure unit transmits the received set current to the internal adjustment subunit to adjust the current signal provided by the current transmission fixing structure 20 according to the set current, and outputs a current signal equal to the set current value to the substrate to be plated 40, improving the electroplating uniformity of the substrate to be plated 40.

[0057] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described here, and various obvious changes, re-adjustments, mutual combinations and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments only. Without departing from the concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. An electroplating device, characterized in that: include: A current supply module, a set current supply terminal, at least two current transmission fixed structures, and at least two current adjustment modules arranged in one-to-one correspondence with the current transmission fixed structures; The current supply end of the current supply module is electrically connected to the current input end of the current transmission fixed structure; The current adjustment module includes a current adjustment end, a current setting end and a current supply end; the current adjustment end is electrically connected to the current output end of the current transmission fixed structure, each current setting end is electrically connected to the set current supply end, and the current supply end is electrically connected to the substrate to be plated.

2. The electroplating device according to claim 1, characterized in that: The current adjustment module comprises: A comparison unit, comprising a first input terminal, a second input terminal and a comparison output terminal; the first input terminal is electrically connected to the current output terminal, and the second input terminal is electrically connected to the set current providing terminal; The current conversion unit comprises a conversion control terminal, a current supply terminal and the current supply output terminal; the conversion control terminal is electrically connected to the comparison output terminal, and the current supply terminal is electrically connected to the current output terminal.

3. The electroplating device according to claim 2, characterized in that: The current conversion unit comprises: A current amplification subunit, comprising a current amplification input terminal, a current amplification output terminal and a current amplification control terminal, wherein the current amplification control terminal is electrically connected to the comparison output terminal, the current amplification input terminal is electrically connected to the current output terminal, and the current amplification output terminal is electrically connected to the current supply terminal; A current limiting subunit, comprising a current limiting input terminal, a current limiting output terminal and a current limiting control terminal, wherein the current limiting control terminal is electrically connected to the comparison output terminal, the current limiting input terminal is electrically connected to the current output terminal, and the current limiting output terminal is electrically connected to the current supply terminal; The current holding subunit comprises a current holding input terminal, a current holding output terminal and a current holding control terminal, wherein the current holding control terminal is electrically connected to the comparison output terminal, the current holding input terminal is electrically connected to the current output terminal, and the current holding output terminal is electrically connected to the current supply terminal.

4. The electroplating device according to claim 3, characterized in that: The current amplifying subunit at least includes a triode and a resistor.

5. The electroplating device according to claim 3, characterized in that: The current limiting subunit at least includes a field effect transistor.

6. The electroplating device according to claim 3, characterized in that: The current maintaining subunit at least includes a switch.

7. The electroplating device according to claim 1, characterized in that: The current transmission fixed structure includes a conductive slider and a hanger; The conductive slider is electrically connected to the hanger.

8. The electroplating device according to claim 7, characterized in that: Also includes: Conductive shaft; The conductive sliding block is slidably connected to the conductive shaft.

9. The electroplating device according to claim 1, characterized in that: Also includes: Controller; The setting current transmitting end of the controller is connected to the current setting end.

10. The electroplating device according to claim 9, characterized in that: The controller includes a wireless transmitting unit, and the current adjustment module includes a wireless receiving unit; The wireless transmitting unit is communicatively connected with the wireless receiving unit.

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