Power cycle test platform adaptive to water-cooling heat dissipation module
By designing a power cycle test platform suitable for water-cooled heat dissipation modules, the problem that the existing test platform cannot adapt to the special package IGBT modules is solved, and the stable installation and efficient heat dissipation of a variety of special packaged devices are achieved, which improves the test stability and applicability.
Patent Information
- Application Number
- CN202421196542.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The existing power cycle and thermal testing platform cannot be adapted to a specially packaged IGBT module with water-cooled cooling design, and the weight of the large-section test cable causes stress on the device pins, affecting the test stability.
A power cycle test platform suitable for water-cooled cooling modules is designed, including test benches, water-cooled components and support components. The test bench is installed and fixed with special packaging devices through sliding guide rails and removable positioning plates. The water-cooled assembly realizes water-cooled heat dissipation of the heat dissipation clamp through the water inlet and outlet pipes. The support assembly supports and fixes the test cables through adjustable support and cable fixing clips to avoid cable stress.
It realizes adaptation and stable installation of a variety of special packaged devices, effectively avoiding damage to device pins due to cable stress, and improving test stability and applicability.
Smart Images

Figure CN222952444U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor detection devices, in particular to a power cycle test platform adapted to a water cooling module. Background Art
[0002] The existing power cycle and thermal test platform integrates a heat dissipation liquid cooling plate, a device clamping mechanism and an advanced test system unit, which can easily and automatically perform power cycle tests on semiconductor devices such as IGBT, MOSFET and diodes.
[0003] However, with the rapid development of new energy vehicles, the packaging form of automotive-grade IGBT modules has undergone major changes, such as HPD packaged devices with pin-fin heat dissipation pins and DSC packaged devices with double-sided water cooling. This type of specially packaged IGBT module adopts a water-cooling design and needs to work with the support of a heat dissipation fixture.
[0004] When using the existing power cycle and thermal test platform to perform power cycle testing on this special packaged device, although it can meet the power requirements required for the test, it cannot provide a suitable installation environment for this type of packaged device and its supporting heat dissipation fixture. In addition, the operating current of this type of packaged device is generally several hundred amperes, and large-section cables are required for electrical connection. However, large-section cables are heavy, and there is stress during the connection process between them and the device under test, which may cause damage to the device pins and easily affect the stability of the test environment.
[0005] At present, for these special packaged devices that need to be additionally equipped with heat dissipation fixtures, external test benches are generally customized. However, this type of test bench is specific and can only be adapted to devices of a certain specific package type. It has poor applicability and high customization costs. Utility Model Content
[0006] The purpose of the utility model is to provide a power cycle test platform adapted to a water-cooled heat dissipation module, which can install and fix a variety of special packaged devices, and effectively avoid the pins of the packaged devices from being damaged due to cable stress, thereby improving the test stability.
[0007] In order to achieve the above-mentioned purpose, the utility model discloses a power cycle test platform adapted to a water-cooled heat dissipation module, the water-cooled heat dissipation module includes a packaging device and a heat dissipation fixture, which includes:
[0008] A testing device, wherein the testing device is provided with a plurality of connection ports along a first direction;
[0009] A test bench, the test bench comprising a test platform, a sliding guide rail and a positioning plate, the sliding guide rail is fixedly connected to the test platform and extends along a first direction, the positioning plate is detachably slidably connected to the sliding guide rail, and the top surface of the positioning plate is provided with at least one positioning groove, and the positioning groove is used for the bottom of the heat dissipation fixture to be plugged in;
[0010] A water cooling assembly, the water cooling assembly is arranged on the test platform, the water cooling assembly comprises a water inlet pipe and a water outlet pipe, one end of the water inlet pipe and the water outlet pipe are connected to an external water supply device, the other end of the water inlet pipe is connected to the water inlet of the heat dissipation fixture, and the other end of the water outlet pipe is connected to the water outlet of the heat dissipation fixture;
[0011] A support assembly is arranged on the test platform, the support assembly includes a support frame and at least one support member, the support member can be adjusted on the support frame along a second direction perpendicular to the first direction, the support member is used to support multiple test cables, one end of the test cable is connected to the connection port, and the other end is connected to the power terminal of the packaged device.
[0012] Optionally, the support member may be lockably provided with at least one cable fixing clamp, and the cable fixing clamp may be slidably adjusted along a first direction and used to lock the test cable.
[0013] Optionally, the test platform includes an insulating table top and a table top support frame, the support frame is a frame structure arranged on the insulating table top corresponding to the positioning plate, and the support member is a supporting beam extending along the first direction.
[0014] Optionally, the sliding guide rail comprises two guide rail members arranged side by side, the guide rail members are lockably slidably connected with a plurality of connection blocks, and the opposite sides of the positioning plate are respectively connected to the connection blocks of the two guide rail members.
[0015] Optionally, a control valve is provided between the water inlet pipe, the water outlet pipe and an external water supply device.
[0016] Optionally, the water outlet pipe is provided with a water outlet elbow, the water inlet pipe is provided with a water inlet elbow, the water outlet elbow is connected to the water inlet of the heat dissipation fixture through a pipeline, and the water inlet elbow is connected to the water outlets of the two heat dissipation fixtures through a pipeline.
[0017] Optionally, the water-cooled heat dissipation module is provided with two heat dissipation clamps, and the heat dissipation clamps clamp the packaging device along both sides vertically. The water outlet pipe is provided with a water outlet elbow, and the water inlet pipe is provided with a water inlet elbow. The water inlet elbow is provided with a first branching piece, and the water outlet elbow is provided with a second branching piece. The first branching piece is connected to the water inlets of the two heat dissipation clamps through two pipes, and the second branching piece is connected to the water outlets of the two heat dissipation clamps through two pipes.
[0018] The utility model is provided with a test bench, a support assembly and a water cooling assembly to adapt and connect the water cooling heat dissipation module with the test device, the test bench includes a test platform, a sliding guide rail and a detachable positioning plate, the heat dissipation fixture of the water cooling heat dissipation module is plugged into the positioning groove of the positioning plate, so that the positioning plate can drive the water cooling heat dissipation module to slide along the sliding guide rail, the water cooling assembly includes a water inlet pipe and a water outlet pipe, the water inlet pipe and the water outlet pipe are connected to an external water supply device and the heat dissipation fixture, so that the fluid of the external water supply device can dissipate heat to the packaged device of the water cooling heat dissipation module through the heat dissipation fixture, and the support assembly includes a support frame and a support member, the support member is movably arranged on the support frame to support the test cable connecting the connection port of the test device and the power terminal of the packaged device. The setting of the sliding guide rail and the detachable positioning plate of the test bench can install and fix a variety of special packaged devices, and the support member of the support assembly effectively prevents the pins of the packaged device from being damaged due to cable stress, thereby improving the test stability. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional structural diagram of the first embodiment of the power cycle test platform adapted for the water cooling and heat dissipation module of the utility model.
[0020] Figure 2 for Figure 1 Schematic diagram of the amplification mechanism of A in the figure.
[0021] Figure 3 for Figure 1 Three-dimensional structure diagram from another perspective.
[0022] Figure 4 This is a three-dimensional structural diagram of the HPD packaging device and the heat dissipation fixture in the first embodiment of the power cycle test platform adapted to the water-cooled heat dissipation module of the utility model.
[0023] Figure 5 It is a three-dimensional structural diagram of the second embodiment of the power cycle test platform adapted to the water cooling and heat dissipation module of the utility model.
[0024] Figure 6 It is a three-dimensional structural diagram of the DSC packaging device and the heat dissipation fixture in the second embodiment of the power cycle test platform adapted to the water-cooled heat dissipation module of the utility model. DETAILED DESCRIPTION
[0025] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation modes and the accompanying drawings.
[0026] See also Figures 1 to 6 The utility model discloses a power cycle test platform adapted for a water-cooling heat dissipation module 100. The water-cooling heat dissipation module 100 includes a packaging device 101 and a heat dissipation fixture 102, which includes:
[0027] A test device 1, wherein the test device 1 is provided with a plurality of connection ports 11 along a first direction;
[0028] The test bench 2 includes a test platform 21, a sliding guide rail 22 and a positioning plate 23. The sliding guide rail 22 is fixedly connected to the test platform 21 and extends along a first direction. The positioning plate 23 is detachably slidably connected to the sliding guide rail 22. The top surface of the positioning plate 23 is provided with at least one positioning groove 231. The positioning groove 231 is used for the bottom of the heat dissipation fixture 102 to be plugged in.
[0029] A water cooling assembly 3 is provided on the test platform 21. The water cooling assembly 3 includes a water inlet pipe 31 and a water outlet pipe 32. One end of the water inlet pipe 31 and the water outlet pipe 32 are connected to an external water supply device, the other end of the water inlet pipe 31 is connected to the water inlet of the heat dissipation fixture 102, and the other end of the water outlet pipe 32 is connected to the water outlet of the heat dissipation fixture 102;
[0030] The support assembly 4 is arranged on the test platform 21. The support assembly 4 includes a support frame 41 and at least one support member 42. The support member 42 can be adjusted on the support frame 41 along a second direction perpendicular to the first direction. The support member 42 is used to support multiple test cables 5. One end of the test cable 5 is connected to the connection port 11, and the other end is connected to the power terminal of the packaging device 101.
[0031] The utility model is provided with a test bench 2, a support assembly 4 and a water cooling assembly 3 to adapt and connect the water cooling heat dissipation module 100 with the test device 1. The test bench 2 includes a test platform 21, a sliding guide rail 22 and a detachable positioning plate 23. The heat dissipation clamp 102 of the water cooling heat dissipation module 100 is inserted into the positioning groove 231 of the positioning plate 23, so that the positioning plate 23 can drive the water cooling heat dissipation module 100 to slide along the sliding guide rail 22. The water cooling assembly 3 includes a water inlet pipe 31 and a water outlet pipe 32. The water inlet pipe 31 and the water outlet pipe 32 are connected to an external water supply device and the heat dissipation clamp 102, so that the fluid of the external water supply device can dissipate the packaging device 101 of the water cooling heat dissipation module 100 through the heat dissipation clamp 102, and the support assembly 4 includes a support frame 41 and a support member 42. The support member 42 is movably arranged on the support frame 41 to support the test cable 5 connecting the connection port 11 of the test device 1 and the power terminal of the packaging device 101. The setting of the sliding rail 22 and the detachable positioning plate 23 of the test bench 2 can install and fix a variety of special packaging devices 101, and the support member 42 of the support assembly 4 effectively prevents the pins of the packaging device 101 from being damaged due to cable stress, thereby improving the test stability.
[0032] Specifically, in this embodiment, Figure 1 , Figure 3 and Figure 5 As shown, the direction pointing to X is defined as the first direction, and the direction pointing to Y is defined as the second direction, but the present invention is not limited thereto.
[0033] See also Figures 1 to 6 The support member 42 is lockably provided with at least one cable fixing clamp 43, and the cable fixing clamp 43 can be slidably adjusted along a first direction and used to lock the test cable 5, thereby effectively preventing the large-section test cable 5 from moving and affecting the packaged device.
[0034] Specifically, in this embodiment, the cable fixing clamp 43 is installed on the support member 42 by bolts to achieve movement or fixation on the support member 42. The cable fixing clamp 43 is used to clamp and fix the high-current test cable 5 supported by the support member 42, but is not limited thereto.
[0035] See also Figures 1 to 6 The test platform 21 includes an insulating table 211 and a table support frame 212. The support frame 41 is a frame structure arranged on the insulating table 211 corresponding to the positioning plate 23. The support member 42 is a support beam extending along the first direction. The insulating table 211 integrates the movable and adjustable positioning plate 23 and the support member 42, which is convenient for adaptation and adjustment with the device under test.
[0036] Specifically, in this embodiment, the table top support frame 212 and the support frame 41 are frames constructed of aluminum profiles, which are easy to assemble and have a stable structure.
[0037] Specifically, in this embodiment, the two ends of the support member 42 respectively span the two sides of the support frame 41 along the first direction, and the position of the support member 42 on the support frame 41 can be moved along the second direction to adjust the position of the support member 42. After the adjustment is completed, it is fixedly connected to the two sides of the support frame 41 by bolts to suspend and support the high-current cable.
[0038] See also Figures 1 to 6 The sliding guide rail 22 includes two guide rail members 221 arranged side by side, and the guide rail members 221 are lockably slidably connected with a plurality of connection blocks 222, and the two opposite sides of the positioning plate 23 are respectively connected with the connection blocks 222 of the two guide rail members 221. The cooperation between the positioning plate 23 and the guide rail member 221 facilitates the adaptation of the power cycle test of different water cooling modules 100.
[0039] Specifically, in this embodiment, the two guide rail members 221 are fixedly mounted on the insulating table top 211, and the width between the two is equivalent to the width of the positioning plate 23, so that the four diagonals of the positioning plate 23 can be connected to the four connecting blocks 222 on the two guide rail members 221 by bolts. The connecting blocks 222 drive the positioning plate 23 to slide along the guide rail members 221, and then the connecting blocks 222 are locked on the guide rail members 221 to fix the position of the positioning plate 23.
[0040] Specifically, in this embodiment, the positioning plate 23 can move along the sliding guide rail 22 through the connecting block 222. When the heat dissipation clamp 102 is placed in the positioning groove 231, the heat dissipation clamp 102 moves to a suitable position with the positioning plate 23 so that the power terminal of the packaged device 101 corresponds to the connection port 11 of the test device 1.
[0041] Specifically, in this embodiment, a plurality of positioning plates 23 of the same size but with different positioning grooves 231 are customized according to the shape and size of the bottom of different heat dissipation clamps 102. With the replaceable setting of the positioning plates 23, when testing different water-cooled heat dissipation modules 100, the corresponding positioning plates 23 can be replaced, so that the positioning grooves 231 of the positioning plates 23 are adapted to the heat dissipation clamps 102 to limit the displacement of the heat dissipation clamps 102 placed in the positioning grooves 231.
[0042] like Figures 1 to 4 As shown, in the first embodiment, the water outlet pipe 32 is provided with a water outlet elbow 321, and the water inlet pipe 31 is provided with a water inlet elbow 311. The water outlet elbow 321 is connected to the water inlet of the heat dissipation fixture 102 through a pipeline, and the water inlet elbow 311 is connected to the water outlets of the two heat dissipation fixtures 102 through a pipeline.
[0043] Specifically, in this embodiment, the packaging device 101 in the water-cooled heat dissipation module 100 is an HPD packaging device 1011, whose substrate and pin-fin-shaped heat dissipation structure are integrally formed. The HPD packaging device 1011 uses direct water cooling to dissipate heat. Therefore, an HPD packaging device 1011 needs to be installed on a heat dissipation fixture 102 and sealed by a sealing ring. The pin-fin-shaped heat dissipation structure on the substrate of the HPD packaging device 1011 is in direct contact with the fluid in the heat dissipation fixture 102.
[0044] like Figure 5 and Figure 6 As shown, in the second embodiment, the water-cooled heat dissipation module 100 is provided with two heat dissipation clamps 102, and the heat dissipation clamps 102 clamp the packaged device 101 along both sides of the vertical direction. The water outlet pipe 32 is provided with a water outlet elbow 321, and the water inlet pipe 31 is provided with a water inlet elbow 311. The water inlet elbow 311 is provided with a first bifurcation piece 312, and the water outlet elbow 321 is provided with a second bifurcation piece 322. The first bifurcation piece 312 is connected to the water inlets of the two heat dissipation clamps 102 through two pipes, and the second bifurcation piece 322 is connected to the water outlets of the two heat dissipation clamps 102 through two pipes.
[0045] Specifically, in this embodiment, the bifurcation is a water diverter, and the packaged device 101 in the water-cooled heat dissipation module 100 is a DSC packaged device 1012. The DSC packaged device 1012 adopts a double-sided heat dissipation structure, and heat dissipation substrates are provided on both sides. Therefore, two heat dissipation fixtures 102 are provided in a matching manner, and a water outlet and a water inlet are provided on both sides of each heat dissipation fixture 102, respectively. The two water inlets are connected to the first bifurcation 312 through two pipes, respectively, and the two water outlets are connected to the second bifurcation 322 through two pipes, respectively, and it is a cold water plate with a fluid channel provided inside. The two heat dissipation substrates of the DSC packaged device 1012 are in direct contact with the two heat dissipation fixtures 102 and conduct heat dissipation, and the heat dissipation fixture 102 exchanges heat with the internal fluid, and the DSC packaged device 1012 is small in size, supporting three DSC packaged devices 1012 to be placed in a single heat dissipation fixture 102 for simultaneous testing.
[0046] See also Figures 1 to 6 A control valve 33 is provided between the water inlet pipe 31, the water outlet pipe 32 and the external water supply device.
[0047] Specifically, in this embodiment, the water outlet elbow 321 and the water inlet elbow 311 are respectively arranged on both sides of the insulating table top 211 along the first direction, and the water inlet pipe 31 and the water outlet pipe 32 are arranged below the insulating table top 211. The fluid of the external water supply device is controlled by the control valve 33 to flow through the water inlet pipe 31 to the water inlet elbow 311, and then flows through the heat dissipation clamp 102 and refluxes through the water outlet elbow 321 and the water outlet pipe 32, but is not limited to this.
[0048] See also Figures 1 to 6 The specific operation of performing a power cycle test on the water cooling module 100 using the power cycle test platform is as follows:
[0049] Select a positioning plate 23 having a positioning groove 231 matching the heat dissipation fixture 102 of the water-cooled heat dissipation module 100 currently being tested, and install and connect a corresponding number of positioning plates 23 to the connecting blocks 222 of the two guide rail members 221, and then place the packaged device 101 currently being tested and its matching heat dissipation fixture 102 into the positioning groove 231 of the corresponding positioning plate 23;
[0050] Select pipes of appropriate length to connect the water inlet and outlet of each heat dissipation fixture 102 in series, and connect them to the water inlet elbow 311 and the water outlet elbow 321 respectively, so that the heat dissipation fixture 102 is connected to the external water supply device through the water inlet pipe 31 and the water outlet pipe 32, and the fluid is controlled to flow into the heat dissipation fixture 102 through the control valve 33;
[0051] After adjusting each positioning plate 23 by moving the connection block 222, all the connection blocks 222 are locked to fix the position of the packaged device 101 and the matching heat dissipation fixture 102 through the positioning plate 23;
[0052] Next, the test cable 5 is installed. First, the test cable 5 is connected to the connection port 11 of the power cycle test device 1 and led out to the support 42, so that the test cable 5 is straddled between the support 42 and the support frame 41, and the end of the test cable 5 is hung from the support 42, and the excess part of the test cable 5 is placed behind the support frame 41;
[0053] Adjust the position of the support member 42 on the support frame 41 and the position of the cable fixing clamp 43 on the support member 42, then pull the test cables 5 to adjust the length of the hanging portion of each test cable 5, so that the cable terminal is located just above the pin of the package device 101 and just abuts against the pin terminal of the package device 101, and then clamp and fix the test cable 5 with the cable fixing clamp 43;
[0054] The support member 42 is locked to the support frame 41 by bolts, and the cable fixing clamp 43 on the support member 42 is locked to fix the position of the test cable 5 and the length of the hanging part of the test cable 5. Finally, the terminals of the test cable 5 are connected to the pins of the packaging device 101 by bolts.
[0055] By placing the test cable 5 in a suspended manner on the support 42, and utilizing the support 42 and the support frame 41 to eliminate the stress of the test cable 5, the terminals of the test cable 5 can abut against the pins of the packaged device 101 under test with less pressure, thereby reducing deformation damage to the pins of the packaged device 101 due to the pressure of the test cable 5 and its weight.
[0056] It should be noted that the test cable 5 in this embodiment is a large current power cable, which is connected to the power terminal of the packaging device 101. The large current power cable is heavy and needs to be supported and arranged using a support frame 41 and a support member 42. This embodiment also provides a small current drive cable, and the two ends of the small current drive cable are respectively connected to the test device 1 and the drive terminals of the packaging device 101. The small current drive cable is light in weight and can be laid flat on the insulating table 211.
[0057] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.
Claims
1. A power cycle test platform adapted to a water-cooled heat dissipation module, the water-cooled heat dissipation module includes a packaging device and a heat dissipation fixture, characterized in that: include: A testing device, wherein the testing device is provided with a plurality of connection ports along a first direction; A test bench, the test bench comprising a test platform, a sliding guide rail and a positioning plate, the sliding guide rail is fixedly connected to the test platform and extends along a first direction, the positioning plate is detachably slidably connected to the sliding guide rail, and the top surface of the positioning plate is provided with at least one positioning groove, and the positioning groove is used for the bottom of the heat dissipation fixture to be plugged in; A water cooling assembly, the water cooling assembly is arranged on the test platform, the water cooling assembly comprises a water inlet pipe and a water outlet pipe, one end of the water inlet pipe and the water outlet pipe are connected to an external water supply device, the other end of the water inlet pipe is connected to the water inlet of the heat dissipation fixture, and the other end of the water outlet pipe is connected to the water outlet of the heat dissipation fixture; A support assembly is arranged on the test platform, the support assembly includes a support frame and at least one support member, the support member can be adjusted on the support frame along a second direction perpendicular to the first direction, the support member is used to support multiple test cables, one end of the test cable is connected to the connection port, and the other end is connected to the power terminal of the packaged device.
2. The power cycle test platform adapted for water cooling and heat dissipation module according to claim 1, characterized in that: The support member is lockably provided with at least one cable fixing clamp, and the cable fixing clamp can be slidably adjusted along a first direction and is used to lock the test cable.
3. The power cycle test platform adapted for water cooling and heat dissipation module according to claim 1, characterized in that: The test platform includes an insulating table top and a table top support frame, the support frame is a frame structure arranged on the insulating table top corresponding to the positioning plate, and the support member is a supporting beam extending along a first direction.
4. The power cycle test platform adapted for water cooling and heat dissipation module according to claim 1, characterized in that: The sliding guide rail comprises two guide rail members arranged side by side, the guide rail members are lockably and slidably connected with a plurality of connection blocks, and the opposite sides of the positioning plate are respectively connected with the connection blocks of the two guide rail members.
5. The power cycle test platform adapted for water cooling and heat dissipation module according to claim 1, characterized in that: The water outlet pipe is provided with a water outlet elbow, and the water inlet pipe is provided with a water inlet elbow. The water outlet elbow is connected to the water inlet of the heat dissipation fixture through a pipeline, and the water inlet elbow is connected to the water outlets of the two heat dissipation fixtures through a pipeline.
6. The power cycle test platform adapted for water cooling and heat dissipation module according to claim 1, characterized in that: The water-cooled heat dissipation module is provided with two heat dissipation clamps, and the heat dissipation clamps clamp the packaging device along both sides in the vertical direction. The water outlet pipe is provided with a water outlet elbow, and the water inlet pipe is provided with a water inlet elbow. The water inlet elbow is provided with a first bifurcation piece, and the water outlet elbow is provided with a second bifurcation piece. The first bifurcation piece is connected to the water inlets of the two heat dissipation clamps through two pipes, and the second bifurcation piece is connected to the water outlets of the two heat dissipation clamps through two pipes.
7. The power cycle test platform adapted for water cooling and heat dissipation module according to claim 1, characterized in that: A control valve is arranged between the water inlet pipe, the water outlet pipe and the external water supply device.