Piezoresistor chip thickness sorting machine

Abstract

The utility model discloses a piezoresistor chip thickness sorting machine which comprises a machine frame, a control device, at least one feeding conveying device and at least one screening vibration disc, the control device, the feeding conveying device and the screening vibration disc are respectively installed on the machine frame, and the discharging end of the feeding conveying device is located above the corresponding screening vibration disc. The signal input ends of the feeding conveying device and the screening vibration disc are electrically connected with the corresponding signal output ends of the control device respectively; at least one spiral chip output track is arranged on the side wall of a material disc of the screening vibration disc, the chip screening device is characterized in that the chip output track comprises a climbing section, a single chip conveying section and a defective product sending section, the climbing section, the single chip conveying section and the defective product sending section are sequentially connected in the conveying direction, and a first screening outlet is formed in the rear end of the single chip conveying section; a defective product outlet is formed in the rear end of the defective product sending-out section. The varistor chip thickness sorting machine can sort varistor chips according to the thicknesses of the varistor chips, and the varistor chips with qualified thicknesses are screened out.

Description

Technical Field

[0001] The utility model relates to production equipment for electronic components, in particular to a thickness sorter for varistor chips. Background Art

[0002] After the varistor chips are manufactured, since some varistor chips have burrs on the surface or different varistor chips are adhered to each other, these varistor chips need to be removed as unqualified products. At present, the method for screening varistor chips is thickness sorting. After the varistor chips are stacked in a screening tray for holding, a worker holds the screening tray and shakes it continuously, so that the varistor chips with qualified thickness pass through the strip-shaped screening opening at the rear end of the screening tray, while the varistor chips with too thick thickness cannot pass through the strip-shaped screening opening and will remain in the screening tray. However, the screening method is inconvenient and laborious to operate, requires a lot of labor, and has low work efficiency. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is to provide a thickness sorter for varistor chips, which can sort varistor chips according to their thickness and screen out varistor chips with qualified thickness.

[0004] In order to solve the above technical problem, the following technical scheme is adopted:

[0005] A thickness sorter for varistor chips, comprising a frame, a control device, at least one feeding and conveying device and at least one screening vibrating tray. The control device, the feeding and conveying device and the screening vibrating tray are respectively installed on the frame. The number of the feeding and conveying devices is the same as that of the screening vibrating trays and they correspond to each other one by one. The discharging end of the feeding and conveying device is located above the corresponding screening vibrating tray. The signal input ends of the feeding and conveying device and the screening vibrating tray are respectively electrically connected to the corresponding signal output ends of the control device. At least one spiral chip output track is arranged on the side wall of the material tray of the screening vibrating tray, and is characterized in that: the chip output track comprises a climbing section, a single-chip conveying section and a defective product discharging section, the climbing section, the single-chip conveying section and the defective product discharging section are connected in sequence along the conveying direction, a first screening outlet is arranged at the rear end of the single-chip conveying section; a defective product outlet is arranged at the rear end of the defective product discharging section.

[0006] In the above-mentioned thickness sorting machine for varistor chips, the opening size of the first screening outlet is set according to the required qualified thickness of the varistor chips (usually the width of the first screening outlet is slightly larger than the required qualified thickness of the varistor chips). When sorting the chips, the feeding and conveying device conveys the varistor chips in batches to the screening vibrating tray; under the vibration of the screening vibrating tray, each varistor chip is conveyed along the chip output track; the single-chip conveying section conveys the varistor chips one by one. When the varistor chip moves to the first screening outlet, the varistor chip with a thickness matching the first screening outlet can be sent out from the first screening outlet; the varistor chip with a thickness exceeding the opening size of the first screening outlet, or with burrs on the surface, or multiple adhered varistor chips cannot pass through the first screening outlet, and are continuously conveyed along the defective product sending section and sent out from the defective product outlet. This thickness sorting machine for varistor chips can screen out varistor chips with qualified thickness according to the thickness of the varistor chips, effectively saving labor and improving efficiency.

[0007] In a preferred embodiment, the single-chip conveying section has an inclined side wall and a bearing part. The inclined side wall slopes upward gradually from outside to inside; the lower edge of the inclined side wall is connected to the inner edge of the bearing part. The bearing part extends from the front end of the inclined side wall to the rear of the inclined side wall, and the rear end of the bearing part is in front of the rear end of the inclined side wall; a first transition baffle is provided behind the bearing part. The first transition baffle extends from the rear end of the bearing part to the front end of the defective product sending section. There is a gap between the inner edge of the first transition baffle and the inclined side wall, and the gap between the inner edge of the first transition baffle and the inclined side wall forms the first screening outlet. When the varistor chip is conveyed on the single-chip conveying section, it can stand upright and lean against the inclined side wall, and line up one by one along the bearing part and move forward one by one. When the varistor chip moves to the gap between the first transition baffle and the inclined side wall, the varistor chip with a thickness less than the width of the gap can directly fall out from the gap, and the varistor chip with a thickness exceeding the width of the gap will cross the first screening outlet, pass through the first transition baffle and enter the defective product sending section. Most varistor chips are round wafers. Generally, the width of the bearing part is greater than the thickness of the varistor chip and less than the radius of the varistor chip, and the height of the inclined side wall matches the diameter of the varistor chip.

[0008] In a further preferred embodiment, a first transition baffle mounting seat and a first locking bolt are provided at the rear end of the single-chip conveying section. The first transition baffle mounting seat is provided with a first screw hole corresponding to the first locking bolt. A first connecting piece is provided on the outer edge of the first transition baffle, and a first elongated hole corresponding to the first screw hole is provided on the first connecting piece. The first locking bolt passes through the first elongated hole and is threadedly connected to the first screw hole. In this way, according to the required qualified thickness of the varistor chip, the distance between the first transition baffle and the inclined side wall can be adjusted accordingly to adjust the opening size of the first screening outlet.

[0009] In a preferred embodiment, at least one second screening outlet is provided on the defective product delivery section. Generally, the opening size of the second screening outlet also matches the required qualified thickness of the varistor chip. By providing the second screening outlet on the defective product delivery section, the varistor chips entering the defective product delivery section can be screened a second time to avoid omission of qualified products.

[0010] In a further preferred embodiment, the defective product delivery section has an inclined bottom and side walls. The upper surface of the inclined bottom slopes downward gradually from outside to inside. The lower edge of the side wall is connected to the inner edge of the inclined bottom. At least one notch is formed in the side wall of the defective product delivery section. At least one second transition baffle is also provided on the side wall of the defective product delivery section. The number of the second transition baffles is the same as and corresponds one by one to the number of the notches. The second transition baffle covers a partial position of the corresponding notch, and the gap between the lower edge of the second transition baffle and the upper surface of the inclined bottom forms the second screening outlet.

[0011] In a still further preferred embodiment, a second transition baffle mounting seat and a second locking bolt are provided on the defective product delivery section. The second transition baffle mounting seat corresponds to the position of the notch. A second connecting piece is provided on the outer edge of the second transition baffle. A second screw hole corresponding to the second locking bolt is formed in the second connecting piece. A second slot is formed in the second transition baffle mounting seat corresponding to the second screw hole. The second locking bolt passes through the second slot and is in threaded connection with the second screw hole. The second screening outlet opening size can also be adjusted by adjusting the distance between the second transition baffle and the inclined bottom.

[0012] In a preferred embodiment, the varistor chip thickness sorter further includes a discharge conveying device, which is installed on the frame and corresponds to the position of the first screening outlet; the signal input end of the discharge conveying device is electrically connected to the corresponding signal output end of the control device. The varistor chips with qualified thickness can be fed from the first screening outlet into the discharge conveying device and sent out by the discharge conveying device. In the case where a second screening outlet is provided, the position of the second screening outlet also corresponds to the discharge conveying device.

[0013] In a further preferred embodiment, the number of the screening vibrating trays is multiple, and the first screening outlets of the respective screening vibrating trays are respectively above the discharge conveying device.

[0014] In a further preferred embodiment, the thickness sorting machine for varistor chips further includes a weighing device, which is installed on the frame. A receiving container is provided on the weighing device, and the receiving container corresponds to the discharge end of the discharge conveying device in position; the signal input end of the control device is electrically connected to the signal output end of the weighing device. The varistor chips sent out from the discharge conveying device are collected by the receiving container, and the weighing device weighs the receiving container. When the weight of the receiving container reaches the preset weight (which means the receiving container is full at this time), the weighing device sends a signal to the control device, and the control device controls the discharge conveying device to suspend conveying, facilitating the staff to replace the receiving container.

[0015] In a preferred embodiment, a detection device is provided at the discharge end of the feeding conveying device, and the signal output end of the detection device is electrically connected to the signal input end of the control device. The detection device detects the varistor chips on the feeding conveying device. When it detects that there are no varistor chips on the feeding conveying device, the control device controls the feeding conveying device to stop working, avoiding the idling of the feeding conveying device.

[0016] Both the above-mentioned feeding conveying device and the discharge conveying device can adopt conveyor belts; the detection device can adopt a photoelectric eye; the control device can adopt a single-chip microcomputer.

[0017] The beneficial effect of the present utility model is that this thickness sorting machine for varistor chips can sort according to the thickness of the varistor chips and screen out the varistor chips with qualified thickness. Description of the Drawings

[0018] Figure 1 is a schematic structural diagram of the thickness sorting machine for varistor chips in the embodiment of the present utility model;

[0019] Figure 2 is a schematic structural diagram of the rear end of the single-chip conveying section in the embodiment of the present utility model;

[0020] Figure 3 is Figure 2 a cross-sectional view along the A direction in

[0021] Figure 4 is a schematic structural diagram of the defective product sending section with a second screening outlet in the embodiment of the present utility model;

[0022] Figure 5 is Figure 4 a cross-sectional view along the B direction in Detailed Embodiment

[0023] The present utility model will be further described below in conjunction with the drawings and specific embodiments:

[0024] As Figures 1-5The shown varistor chip thickness sorting machine includes a frame 1, a control device (invisible in the figure), two feeding conveying devices 2 and two screening vibrating bowls 3. The control device, the feeding conveying devices 2 and the screening vibrating bowls 3 are respectively installed on the frame 1. The feeding conveying devices 2 correspond to the screening vibrating bowls 3 one by one, and the discharging end of the feeding conveying device 2 is above the corresponding screening vibrating bowl 3. On the side wall of the material bowl of the screening vibrating bowl 3, there are two spiral chip output tracks 31. The chip output track 31 includes a climbing section 311, a single-piece conveying section 312 and a defective product discharging section 313. The climbing section 311, the single-piece conveying section 312 and the defective product discharging section 313 are connected in sequence along the conveying direction. The rear end of the single-piece conveying section 312 is provided with a first screening outlet 3121. The rear end of the defective product discharging section 313 is provided with a defective product outlet 3131. The signal input ends of the feeding conveying devices 2 and the screening vibrating bowls 3 are respectively electrically connected to the corresponding signal output ends of the control device.

[0025] In the above varistor chip thickness sorting machine, the opening size of the first screening outlet 3121 is set according to the qualified thickness required by the varistor chip 4 (usually the width of the first screening outlet 3121 is slightly larger than the qualified thickness required by the varistor chip 4). When sorting chips, the feeding conveying device 2 conveys the varistor chips 4 in batches into the screening vibrating bowl 3. Under the vibration of the screening vibrating bowl 3, each varistor chip 4 is conveyed along the chip output track 31. The single-piece conveying section 312 conveys the varistor chips 4 one by one. When the varistor chip 4 moves to the first screening outlet 3121, the varistor chip 4 with a thickness matching the first screening outlet 3121 can be sent out from the first screening outlet 3121. The varistor chip 4 with a thickness exceeding the opening size of the first screening outlet 3121 and with burrs on the surface, or multiple adhered varistor chips 4, cannot pass through the first screening outlet 3121, and continue to be conveyed along the defective product discharging section 313 and sent out from the defective product outlet 3131. Such a varistor chip thickness sorting machine can screen out the varistor chips 4 with qualified thickness according to the thickness of the varistor chips 4, effectively saving labor and improving efficiency.

[0026] The single-chip conveying section 312 has inclined side walls 3122 and a bearing part 3123. The inclined side walls 3122 are gradually inclined upward from the outside to the inside; the lower edge of the inclined side wall 3122 is connected to the inner edge of the bearing part 3123. The bearing part 3123 extends from the front end of the inclined side wall 3122 to the rear of the inclined side wall 3122, and the rear end of the bearing part 3123 is in front of the rear end of the inclined side wall 3122. A first transition baffle 31231 is provided behind the bearing part 3123. The first transition baffle 31231 extends from the rear end of the bearing part 3123 to the front end of the defective product discharging section 313. There is a gap between the inner edge of the first transition baffle 31231 and the inclined side wall 3122, and the gap between the inner edge of the first transition baffle 31231 and the inclined side wall 3122 forms a first screening outlet 3121. When the varistor chip 4 is conveyed on the single-chip conveying section 312, it can stand upright and lean against the inclined side wall 3122, and are arranged in sequence along the bearing part 3123 and move forward one by one. When the varistor chip 4 moves to the gap between the first transition baffle 31231 and the inclined side wall 3122, the varistor chip 4 with a thickness less than the width of the gap can directly fall out from the gap, and the varistor chip 4 with a thickness exceeding the width of the gap crosses the first screening outlet 3121, passes through the first transition baffle 31231 and enters the defective product discharging section 313. Most of the varistor chips 4 are wafers. Usually, the width of the bearing part 3123 is greater than the thickness of the varistor chip 4 and less than the radius of the varistor chip 4, and the height of the inclined side wall 3122 matches the diameter of the varistor chip 4.

[0027] A first transition baffle mounting seat 3124 and a first locking bolt 3125 are provided at the rear end of the single-chip conveying section 312. A first screw hole (invisible in the figure) corresponding to the first locking bolt 3125 is provided on the first transition baffle mounting seat 3124. A first connecting piece 312311 is provided on the outer edge of the first transition baffle 31231. A first elongated hole 312312 corresponding to the first screw hole is provided on the first connecting piece 312311. The first locking bolt 3125 passes through the first elongated hole 312312 and is threadedly connected to the first screw hole. In this way, according to the required qualified thickness of the varistor chip 4, the distance between the first transition baffle 31231 and the inclined side wall 3122 can be adjusted accordingly to adjust the opening size of the first screening outlet 3121.

[0028] A second screening outlet 3132 is provided on the defective product discharging section 313. Usually, the opening size of the second screening outlet 3132 also matches the required qualified thickness of the varistor chip 4. By providing the second screening outlet 3132 on the defective product discharging section 313, the varistor chips 4 entering the defective product discharging section 313 can be screened twice to avoid omission of qualified products.

[0029] The defective product discharging section 313 has an inclined bottom 3133 and a side wall 3134. The upper surface of the inclined bottom 3133 slopes downward gradually from the outside to the inside. The lower edge of the side wall 3134 is connected to the inner edge of the inclined bottom 3133. There is a notch on the side wall 3134 of the defective product discharging section 313. A second transition baffle 3135 is also provided on the side wall 3134 of the defective product discharging section 313. The number of the second transition baffles 3135 is the same as that of the notches and they correspond to each other one by one. The second transition baffle 3135 covers a partial position of the corresponding notch, and the gap between the lower edge of the second transition baffle 3135 and the upper surface of the inclined bottom 3133 forms a second screening outlet 3132.

[0030] A second transition baffle mounting seat 3136 and a second locking bolt 3137 are provided on the defective product discharging section 313. The second transition baffle mounting seat 3136 corresponds to the position of the notch. A second connecting piece 31351 is provided on the outer edge of the second transition baffle 3135. A second screw hole (invisible in the figure) corresponding to the second locking bolt 3137 is formed on the second connecting piece 31351. A second strip-shaped hole 31361 corresponding to the second screw hole is formed on the second transition baffle mounting seat 3136. The second locking bolt 3137 passes through the second strip-shaped hole 31361 and is in threaded connection with the second screw hole. The second screening outlet 3132 can also be adjusted by adjusting the distance between the second transition baffle 3135 and the inclined bottom 3133 to adjust the opening size of the second screening outlet 3132.

[0031] The varistor chip thickness sorting machine further includes a discharging conveying device 5. The discharging conveying device 5 is installed on the frame 1 and corresponds to the position of the first screening outlet 3121. The signal input end of the discharging conveying device 5 is electrically connected to the corresponding signal output end of the control device. The varistor chips 4 with qualified thickness can be sent from the first screening outlet 3121 into the discharging conveying device 5 and sent out by the discharging conveying device 5. In the case where there is a second screening outlet 3132, the position of the second screening outlet 3132 also corresponds to the discharging conveying device 5.

[0032] The varistor chip thickness sorting machine further includes a weighing device 6. The weighing device 6 is installed on the frame 1. A receiving container 61 is provided on the weighing device 6. The receiving container 61 corresponds to the discharging end position of the discharging conveying device 5. The signal input end of the control device is electrically connected to the signal output end of the weighing device 6. The varistor chips 4 sent out from the discharging conveying device 5 are collected by the receiving container 61. The weighing device 6 weighs the receiving container 61. When the weight of the receiving container 61 reaches the preset weight (which means the receiving container 61 is full at this time), the weighing device 6 sends a signal to the control device, and the control device controls the discharging conveying device 5 to suspend conveying, which is convenient for the staff to replace the receiving container 61.

[0033] The discharge end of the feed conveying device 2 is provided with a detection device, and the signal output end of the detection device is electrically connected to the signal input end of the control device. The detection device detects the piezoresistive chip 4 on the feed conveying device 2. When it detects that there is no piezoresistive chip 4 on the feed conveying device 2, the control device controls the feed conveying device 2 to stop working, avoiding the idling of the feed conveying device 2.

Claims

1. A varistor chip thickness sorting machine, comprising a frame, a control device, at least one feed conveying device and at least one screening vibration disk, wherein the control device, the feed conveying device and the screening vibration disk are respectively mounted on the frame, the number of the feed conveying devices is the same as that of the screening vibration disk and they correspond one to one, and the discharge end of the feed conveying device is located above the corresponding screening vibration disk; the signal input ends of the feed conveying device and the screening vibration disk are respectively electrically connected to the corresponding signal output ends of the control device; at least one spiral chip output track is provided on the side wall of the material disk of the screening vibration disk, characterized in that: The chip output track includes a climbing section, a single chip conveying section and a defective product delivery section, which are connected in sequence along the conveying direction. The rear end of the single chip conveying section is provided with a first screening outlet; the rear end of the defective product delivery section is provided with a defective product outlet.

2. The varistor chip thickness sorting machine according to claim 1, characterized in that: The single-piece conveying section has an inclined side wall and a bearing portion, and the inclined side wall is gradually inclined upward from the outside to the inside; the lower edge of the inclined side wall is connected to the inner edge of the bearing portion, and the bearing portion extends from the front end of the inclined side wall to the rear end of the inclined side wall, and the rear end of the bearing portion is in front of the rear end of the inclined side wall; a first transition baffle is provided behind the bearing portion, and the first transition baffle extends from the rear end of the bearing portion to the front end of the defective product delivery section, and there is a gap between the inner edge of the first transition baffle and the inclined side wall, and the gap between the inner edge of the first transition baffle and the inclined side wall constitutes the first screening outlet.

3. The varistor chip thickness sorting machine according to claim 2, characterized in that: A first transition baffle mounting seat and a first locking bolt are provided at the rear end of the single-piece conveying section. A first screw hole corresponding to the first locking bolt is opened on the first transition baffle mounting seat. A first connecting plate is provided on the outer edge of the first transition baffle. A first strip hole corresponding to the first screw hole is opened on the first connecting plate. The first locking bolt passes through the first strip hole and is threadedly connected to the first screw hole.

4. The varistor chip thickness sorting machine according to claim 1, characterized in that: The defective product delivery section is provided with at least one second screening outlet.

5. The varistor chip thickness sorting machine according to claim 4, characterized in that: The defective product delivery section has an inclined bottom and side walls, the upper surface of the inclined bottom gradually inclines downward from the outside to the inside, the lower edge of the side wall is connected to the inner edge of the inclined bottom, and at least one notch is opened on the side wall of the defective product delivery section. At least one second transition baffle is also provided on the side wall of the defective product delivery section. The number of the second transition baffles is the same as that of the notches and they correspond one to one. The second transition baffle covers part of the position corresponding to the notch, and the gap between the lower edge of the second transition baffle and the upper surface of the inclined bottom constitutes the second screening outlet.

6. The varistor chip thickness sorting machine according to claim 5, characterized in that: The defective product delivery section is provided with a second transition baffle mounting seat and a second locking bolt, the second transition baffle mounting seat corresponds to the position of the notch, a second connecting plate is provided on the outer edge of the second transition baffle, a second screw hole corresponding to the second locking bolt is opened on the second connecting plate, a second strip hole corresponding to the second screw hole is opened on the second transition baffle mounting seat, and the second locking bolt passes through the second strip hole and is threadedly connected with the second screw hole.

7. The varistor chip thickness sorting machine according to claim 1, characterized in that: The varistor chip thickness sorting machine also includes a discharging conveying device, which is installed on the frame and corresponds to the position of the first screening outlet; the signal input end of the discharging conveying device is electrically connected to the signal output end corresponding to the control device.

8. The varistor chip thickness sorting machine according to claim 7, characterized in that: There are multiple screening vibration plates, and the first screening outlets of the respective screening vibration plates are located above the discharge conveying device.

9. The varistor chip thickness sorting machine according to claim 7, characterized in that: The varistor chip thickness sorting machine also includes a weighing device, which is installed on the frame. The weighing device is provided with a material receiving container, and the material receiving container corresponds to the discharge end position of the discharge conveying device; the signal input end of the control device is electrically connected to the signal output end of the weighing device.

10. The varistor chip thickness sorting machine according to claim 1, characterized in that: A detection device is provided at the discharge end of the feed conveying device, and a signal output end of the detection device is electrically connected to a signal input end of the control device.

Images