Semiconductor transfer robot test platform

Abstract

The utility model provides a semiconductor transfer robot test platform, comprising a backboard, the backboard is provided with a first wire duct, a second wire duct, a third wire duct, a fourth wire duct, a fifth wire duct and a sixth wire duct, the first wire duct, the second wire duct, the third wire duct and the fourth wire duct form a platform outer frame, and the fifth wire duct and the sixth wire duct are uniformly arranged between the second wire duct and the fourth wire duct. A first guide rail is arranged between the first wire duct and the fifth wire duct, a second guide rail is arranged between the fifth guide rail and the sixth guide rail, a third guide rail is arranged between the sixth wire duct and the third wire duct, and the first guide rail is provided with a first terminal strip, a relay, an IO switching module and a 24V power module. The second guide rail is provided with an R1-axis servo driver, a Z-axis servo driver, an R2-axis servo driver and a theta-axis servo driver. The third guide rail is provided with an encoder line switching module and a second terminal strip. The device is simple in structure, easy to operate and convenient to carry, and necessary function testing is achieved with low cost.

Description

Technical Field

[0001] The utility model belongs to the technical field of testing equipment, in particular to a testing platform for semiconductor handling robots. Background Art

[0002] A testing platform for semiconductor handling robots is a testing device used to test whether a repaired robot operates normally. Currently, after the robot is repaired, it must be tested at the customer's site. If there are still problems, it needs to be returned to the company for re-repair or the specific problems need to be found and repaired at the customer's site, which increases the instability of the equipment and is inconvenient for repair. Summary of the Invention

[0003] In view of this, the utility model aims to overcome the deficiencies of the above problems in the prior art and proposes a testing platform for semiconductor handling robots.

[0004] To achieve the above object, the technical solution of the utility model is realized as follows:

[0005] A testing platform for semiconductor handling robots includes a backplane. The backplane is provided with a first wire groove, a second wire groove, a third wire groove, a fourth wire groove, a fifth wire groove and a sixth wire groove. The first wire groove, the second wire groove, the third wire groove and the fourth wire groove form the outer frame of the platform. The fifth wire groove and the sixth wire groove are evenly arranged between the second wire groove and the fourth wire groove. A first guide rail is arranged between the first wire groove and the fifth wire groove. A second guide rail is arranged between the fifth wire groove and the sixth wire groove. A third guide rail is arranged between the sixth wire groove and the third wire groove. A first terminal block, a relay, an IO transfer module and a 24V power supply module are arranged on the first guide rail. The IO transfer module is connected to the 24V power supply module through the relay. An R1-axis servo driver, a Z-axis servo driver, an R2-axis servo driver and a θ-axis servo driver are arranged on the second guide rail. An encoder wire transfer module and a second terminal block are arranged on the third guide rail. The encoder wire transfer module is respectively connected to the R1-axis servo driver, the Z-axis servo driver, the R2-axis servo driver, the θ-axis servo driver and the R1, Z, R2, θ-axis servo motors of the robot.

[0006] Further, the first wire groove, the second wire groove, the third wire groove, the fourth wire groove, the fifth wire groove and the sixth wire groove are used for placing cables.

[0007] Further, the first guide rail, the second guide rail and the third guide rail are installed on the backplane and are used for fixing electrical components.

[0008] Further, the first terminal block and the second terminal block are used to achieve electrical connection, facilitating the connection and disconnection of wires.

[0009] Further, the 24V power supply module is used to convert the 220v power supply into a 24V power supply.

[0010] Further, the IO transfer module is used to control the brake of the z-axis servo motor.

[0011] Compared with the prior art, the semiconductor handling robot test platform of the present utility model has the following advantages:

[0012] The structure of the present utility model is simple, easy to operate, and convenient to carry. It realizes the necessary function tests at a low cost and is suitable for popularization and use. Description of the Drawings

[0013] The drawings constituting a part of the present utility model are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0014] Figure 1 is a schematic structural diagram of the semiconductor handling robot test platform of the present utility model;

[0015] Figure 2 is a schematic block diagram of the semiconductor handling robot test platform of the present utility model.

[0016] Description of the Reference Numerals:

[0017] 1 - backplane; 2 - first guide rail; 3 - first terminal block; 4 - first wire groove; 5 - relay; 6 - 24V power supply module; 7 - IO transfer module; 8 - second wire groove; 9 - fifth wire groove; 10 - R1-axis servo driver; 11 - Z-axis servo driver; 12 - second guide rail; 13 - sixth wire groove; 14 - encoder wire transfer module; 15 - third guide rail; 16 - third wire groove; 17 - fourth wire groove; 18 - second terminal block; 19 - R2-axis servo driver; 20 - θ-axis servo driver. Detailed Embodiments

[0018] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments may be combined with each other.

[0019] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0020] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

[0021] The present utility model will be described in detail below with reference to the drawings and in conjunction with embodiments.

[0022] Such as Figure 1-2As shown in the figure, the present utility model provides a semiconductor handling robot test platform, including a backplane 1, on which a first wire groove 4, a second wire groove 8, a third wire groove 16, a fourth wire groove 17, a fifth wire groove 9 and a sixth wire groove 13 are provided. The first wire groove 4, the second wire groove 8, the third wire groove 16 and the fourth wire groove 17 form the outer frame of the platform. The fifth wire groove 9 and the sixth wire groove 13 are evenly arranged between the second wire groove 8 and the fourth wire groove 17. A first guide rail 2 is provided between the first wire groove 4 and the fifth wire groove 9, a second guide rail 12 is provided between the fifth wire groove 9 and the sixth wire groove 13, and a third guide rail 15 is provided between the sixth wire groove 13 and the third wire groove 16. A first terminal block 3, a relay 5, an IO transfer module 7 and a 24V power module 6 are provided on the first guide rail 2. The IO transfer module 7 is connected to the 24V power module 6 through the relay 5. An R1-axis servo driver 10, a Z-axis servo driver 11, an R2-axis servo driver 19 and a θ-axis servo driver 20 are provided on the second guide rail 12, which respectively control the R1, Z, R2 and θ-axis servo motors of the robot. An encoder wire transfer module 14 and a second terminal block 18 are provided on the third guide rail 15. The encoder wire transfer module 14 is located between the servo driver and the servo motor. The encoder on the servo driver is first connected to the encoder wire transfer module and then to the servo motor, which is used to integrate the encoders of the four servo motors on the robot together for convenient control. In the present utility model, the model of the encoder wire transfer module is ADAM-3937.

[0023] The semiconductor robot used in the present utility model is a wafer handling robot. The R1 and R2 axes on the robot are used to control the arm, the Z axis is used to control the lifting, and the θ axis is used to control the rotation angle.

[0024] Specifically, the first wire groove 4, the second wire groove 8, the third wire groove 16, the fourth wire groove 17, the fifth wire groove 9 and the sixth wire groove 13 are used to place cables and regulate and organize the cables.

[0025] Specifically, the first guide rail 2, the second guide rail 12 and the third guide rail 15 are installed on the backplane 1 and used to fix electrical components.

[0026] Specifically, the first terminal block 3 and the second terminal block 18 are used to achieve electrical connection, which is convenient for the connection and disconnection of wires.

[0027] Specifically, the input of the IO transfer module comes from the Z-axis servo driver, and it outputs a 12V power signal to control the operation of the relay 5. The relay 5 controls the on-off of the 24V power supply, thereby controlling the release of the brake of the z-axis servo motor. In the present utility model, the model of the IO transfer module is XT-SCSI50, and the model of the 24V power module is EDR-75-24.

[0028] The testing process using the present utility model is as follows:

[0029] Step 1: Connect the motor wires, encoder wires, and brake wires of the semiconductor handling robot to the test platform.

[0030] Step 2: Power on the test platform and drive the servo motors of the Z-axis, R1-axis, R2-axis, and θ-axis respectively. If it is normal, proceed to Step 3; otherwise, remove the cables and re-check for problems.

[0031] Step 3: Copy the program to test the overall movement of the robot.

[0032] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. Semiconductor handling robot test platform, characterized by: The invention comprises a back plate (1), wherein the back plate (1) is provided with a first wire groove (4), a second wire groove (8), a third wire groove (16), a fourth wire groove (17), a fifth wire groove (9) and a sixth wire groove (13), wherein the first wire groove (4), the second wire groove (8), the third wire groove (16) and the fourth wire groove (17) form a platform outer frame, the fifth wire groove (9) and the sixth wire groove (13) are evenly arranged between the second wire groove (8) and the fourth wire groove (17), a first guide rail (2) is arranged between the first wire groove (4) and the fifth wire groove (9), a second guide rail (12) is arranged between the fifth wire groove (9) and the sixth wire groove (13), a third guide rail (15) is arranged between the sixth wire groove (13) and the third wire groove (16), and the first guide rail (2) is provided with a plurality of guide rails. A first terminal block (3), a relay (5), an IO adapter module (7), and a 24V power supply module (6) are provided, wherein the IO adapter module (7) is connected to the 24V power supply module (6) via the relay (5); an R1 axis servo driver (10), a Z axis servo driver (11), an R2 axis servo driver (19), and a θ axis servo driver (20) are provided on the second guide rail (12); an encoder line adapter module (14) and a second terminal block (18) are provided on the third guide rail (15); and the encoder line adapter module (14) is respectively connected to the R1 axis servo driver (10), the Z axis servo driver (11), the R2 axis servo driver (19), the θ axis servo driver (20) and the robot R1, Z, R2, and θ axis servo motors.

2. The semiconductor handling robot test platform according to claim 1, characterized in that: The first wire trough (4), the second wire trough (8), the third wire trough (16), the fourth wire trough (17), the fifth wire trough (9) and the sixth wire trough (13) are used for placing cables.

3. The semiconductor handling robot test platform according to claim 1, characterized in that: The first guide rail (2), the second guide rail (12) and the third guide rail (15) are mounted on the back plate (1) and are used to fix electrical components.

4. The semiconductor handling robot testing platform according to claim 1, characterized in that: The first terminal row (3) and the second terminal row (18) are used to achieve electrical connection, facilitating the connection and disconnection of wires.

5. The semiconductor handling robot testing platform according to claim 1, characterized in that: The 24V power supply module (6) is used to convert a 220V power supply into a 24V power supply.

6. The semiconductor handling robot testing platform according to claim 1, characterized in that: The IO adapter module (7) is used to control the brake of the z-axis servo motor.

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