Wafer test angle fine adjustment device
By designing a wafer test angle fine-tuning device including a base, a rotating disk, an adjustment component and a limit disk, the problem of the wafer's angle shift caused by vibration in white light testing is solved, and the testing efficiency and accuracy are improved.
Patent Information
- Application Number
- CN202421450587.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-06-24
AI Technical Summary
In white light testing, the wafer may cause angular deviation due to vibration, resulting in low test efficiency and requires frequent shutdown and adjustment.
Design a wafer test angle fine-tuning device, including a base, a rotating disk, an adjustment assembly and a limiting disk, through the adjustment assembly, to ensure that the wafer maintains a set angle during testing.
It effectively reduces the number of frequent shutdown adjustments, improves testing efficiency, and ensures the accuracy of the wafer angle during white light testing.
Smart Images
Figure CN222963656U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wafer testing, and particularly relates to a wafer testing angle fine-tuning device. Background Art
[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer.
[0003] The white light test of the wafer is to detect the shape of the wafer. By irradiating the wafer with white light and then moving the wafer along the X-axis and the Y-axis, the white light can irradiate every part of the wafer to detect the shape of the wafer. However, during the movement of the wafer along the X-axis and the Y-axis, the angle of the wafer may shift due to vibration midway, so it is necessary to frequently stop the machine for adjustment, resulting in low test efficiency.
[0004] Therefore, in view of the above technical problems, it is necessary to provide a wafer testing angle fine-tuning device. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a wafer testing angle fine-tuning device, which can solve the problems of angle difference generated during wafer testing, inability to accurately position the wafer, and low test efficiency.
[0006] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:
[0007] A wafer testing angle fine-tuning device includes a base, a rotating disk, an adjusting component, and a limiting disk. The rotating disk is rotatably installed on the base; the adjusting component is cooperatively installed with the rotating disk to adjust the rotation angle of the rotating disk; the limiting disk is fixedly installed on the side of the rotating disk away from the base, and the limiting disk is used to carry and limit the wafer.
[0008] In one or more embodiments of the utility model, a convex block is installed on the side wall of the rotating disk. The adjusting component includes a mounting seat and a fine-tuning member. The mounting seat is provided with an adjusting groove, the convex block passes through the adjusting groove, and the fine-tuning member drives the convex block to move in the adjusting groove to drive the rotating disk to rotate.
[0009] In one or more embodiments of the utility model, the fine-tuning member is a micrometer. The micrometer is installed on the mounting seat. The micrometer includes a driving end and a moving end, and the moving end abuts against the convex block.
[0010] In one or more embodiments of the present utility model, the adjusting assembly further includes an abutting member, the abutting member includes an abutting rod slidably installed in the mounting seat, and the abutting member is configured such that the abutting rod has the potential energy to abut against the bump, so as to cooperate with the fine-tuning member to finely adjust the position of the bump.
[0011] In one or more embodiments of the present utility model, the abutting member further includes an elastic body cooperatively installed with the abutting rod, the abutting rod abuts against the bump to compress the elastic body to generate elastic potential energy; and / or the abutting rod includes a sleeve rod and a sleeve, the sleeve is slidably connected to the mounting seat, one end of the sleeve abuts against the bump, and the other end of the sleeve is threadedly connected to the sleeve rod.
[0012] In one or more embodiments of the present utility model, the adjusting assembly further includes an adjusting rod, the adjusting rod is sleeved and installed at the driving end of the micrometer, and a friction portion is provided at the end of the adjusting rod away from the micrometer.
[0013] In one or more embodiments of the present utility model, a limiting groove is formed in the limiting disk, in the direction away from the notch of the limiting groove, the limiting groove has at least two groove positions with decreasing sizes, and the projections of the at least two groove positions are all located within the projection of the largest-sized one.
[0014] In one or more embodiments of the present utility model, each of the at least two groove positions includes a wafer bearing surface adjacent to the notch of the limiting groove relative to its groove bottom.
[0015] In one or more embodiments of the present utility model, the wafer bearing surface is arranged around the notch of the corresponding groove position.
[0016] In one or more embodiments of the present utility model, the at least two groove positions include an adjacent first groove position and a second groove position, the size of the first groove position is larger than that of the second groove position, a mounting groove communicating with the wafer bearing surface of the second groove position is formed at the groove bottom of the first groove position, and an abutting block is arranged in the mounting groove and is movably adjustable in a direction close to or away from the center of the second groove position.
[0017] Compared with the prior art, when the wafer test angle fine-tuning device of the present utility model is in use, the wafer is first fixedly installed in the limiting disk, and then the angle of the rotating disk is adjusted to a set angle value through the adjusting assembly, so that it can be ensured that the angle value of the wafer during white light test is always consistent with the set angle value, effectively reducing the number of times of frequent shutdown for adjustment and improving the test efficiency. Description of the Drawings
[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.
[0019] Figure 1 Structural schematic diagram of a wafer test angle fine-tuning device in an embodiment of the present invention;
[0020] Figure 2 Structural schematic diagram of a base, a rotating disk, and an adjusting assembly in an embodiment of the present invention;
[0021] Figure 3 Structural schematic diagram of a limiting disk in an embodiment of the present invention;
[0022] Figure 4 For Figure 3 Enlarged schematic diagram at position A in
[0023] Main reference numeral description:
[0024] 1. Base; 2. Rotating disk; 3. Adjusting assembly; 31. Mounting seat; 311. Adjusting groove; 32. Fine-tuning member; 33. Abutting member; 331. Abutting rod; 34. Adjusting rod; 341. Friction portion; 4. Limiting disk; 41. Limiting groove; 42. Wafer bearing surface; 43. Mounting groove; 5. Protrusion; 6. Abutting block. Detailed implementation manners
[0025] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0026] Refer to Figure 1 And Figure 2 In an embodiment of the present invention, a wafer test angle fine-tuning device includes a base 1, a rotating disk 2, an adjusting assembly 3, and a limiting disk 4.
[0027] Refer to Figure 2The base 1 can be directly installed in the test area of the white light test device, or can be installed in the test area of the white light test device through a transfer station. The rotating disk 2 is rotatably installed on the base 1, and the adjustment component 3 is installed in cooperation with the rotating disk 2 to adjust the rotation angle of the rotating disk 2. Figure 1 The limiting plate 4 is fixedly mounted on a side of the rotating plate 2 away from the base 1 , and the limiting plate 4 is used to carry and limit the wafer.
[0028] Reference Figure 2 The side wall of the rotating disk 2 is provided with a protrusion 5, and the protrusion 5 can be set to be detachably connected. The adjustment component 3 includes a mounting seat 31, a fine adjustment member 32 and an abutment member 33.
[0029] The mounting seat 31 is provided with an adjustment slot 311, and the protrusion 5 is inserted into the adjustment slot 311. The fine-tuning member 32 drives the protrusion 5 to move in the adjustment slot 311 to drive the rotating disk 2 to rotate. In this embodiment, the fine-tuning member 32 is a micrometer, and the micrometer is mounted on the mounting seat 31. The micrometer includes a driving end and a moving end, and the moving end abuts against the protrusion 5. The relevant staff can drive the moving end to move through the driving end, thereby pushing the protrusion 5 to move through the moving end, and then causing the rotating disk 2 to rotate.
[0030] The abutment member 33 includes an abutment rod 331 slidably mounted in the mounting seat 31. The abutment member 33 is configured so that the abutment rod 331 has the potential energy to abut against the protrusion 5, so as to cooperate with the fine-tuning member 32 to fine-tune the position of the protrusion 5. Specifically, one end of the abutment rod 331 passes through the mounting seat 31 and abuts against the protrusion 5. Since the abutment rod 331 has the potential energy to abut against the protrusion 5, it is equivalent to cooperating with the fine-tuning member 32 to clamp the protrusion 5; and by operating the fine-tuning member 32 to overcome the potential energy of the abutment rod 331, the two can fine-tune the position of the protrusion 5 on the premise of cooperating to clamp the protrusion 5.
[0031] In this embodiment, the abutment member 33 also includes an elastic body installed in cooperation with the abutment rod 331, and the abutment rod 331 abuts against the protrusion 5 to compress the elastic body to generate elastic potential energy. The elastic body is installed in the abutment rod 331, which is not shown in the figure. The elastic body can be a spring or a spring.
[0032] Therefore, when the fine-tuning member 32 drives the protrusion 5 to move, the abutment rod 331 can effectively abut and limit the displacement of the protrusion 5 under the action of the elastic body, ensuring that the protrusion 5 is always located between the fine-tuning member 32 and the abutment rod 331, so as to minimize the shaking of the rotating disk 2 when fine-tuning the angle of the rotating disk 2.
[0033] For further information, please refer to Figure 2The abutment rod 331 includes a sleeve rod and a sleeve tube. The sleeve tube is slidably connected to the mounting seat 31. One end of the sleeve tube abuts against the protrusion 5, and the other end of the sleeve tube is threadedly connected to the sleeve rod. By rotating the sleeve rod, the sleeve rod and the sleeve tube can be moved closer or farther away from each other, so that the length of the abutment rod 331 can be adjusted, and the abutment force of the abutment rod 331 on the protrusion 5 can be further adjusted, so as to minimize the possibility of shaking of the two sides of the protrusion 5 due to too little force.
[0034] It can be understood that in addition to the above-mentioned manner, in other embodiments, the abutment rod 331 can also be set as other retractable structures to achieve the adjustment of the length of the abutment rod 331.
[0035] In this embodiment, in order to facilitate the adjustment of the micrometer, the adjustment assembly 3 also includes an adjustment rod 34, which is sleeved and installed on the driving end of the micrometer, and a friction portion 341 is provided at one end of the adjustment rod 34 away from the micrometer. The friction portion 341 can be formed by providing a knurling structure on the adjustment rod 34. The friction portion 341 is more conducive to the relevant personnel manually rotating the adjustment rod 34 so that the driving end of the micrometer drives its moving end to push the protrusion 5 to move. Of course, in other embodiments, the adjustment assembly 3 may not be provided with an adjustment rod 34.
[0036] Reference Figure 3 and Figure 4 The limiting plate 4 is provided with a limiting groove 41. In the direction away from the groove opening of the limiting groove 41, the limiting groove 41 has at least two grooves with decreasing sizes, and the projections of at least two grooves are located within the projection of the largest size. At least two grooves each include a wafer carrying surface 42 adjacent to the groove opening of the limiting groove 41 relative to the groove bottom thereof, and the wafer carrying surface 42 is arranged around the groove opening of the corresponding groove.
[0037] Since the wafer bearing surface 42 is closer to the notch of the limiting groove 41 relative to the corresponding groove bottom, when the wafer is placed on the wafer bearing surface 42, the bottom surface of the wafer does not contact the groove bottom of the groove where it is located, that is, most of the bottom surface of the wafer is suspended, which can minimize the possibility of deformation of the wafer caused by the force on the bottom surface of the wafer. In this embodiment, the sizes of the grooves are respectively set to 4 inches, 6 inches and 8 inches to carry and limit and fix wafers of different sizes.
[0038] It is understandable that in other embodiments, slots of other different sizes and numbers may be set according to the size requirements of the wafer to improve the adaptability of the wafer test angle fine-tuning device of the present invention to different wafers.
[0039] Reference Figure 3 and Figure 4, in this embodiment, at least two slots include adjacent first and second slots. The size of the first slot is larger than that of the second slot. An installation slot 43 communicating with the wafer bearing surface 42 of the second slot is formed at the bottom of the first slot. An abutting block 6 is arranged in the installation slot 43, and the abutting block 6 is movably adjustable in a direction close to or away from the center of the second slot.
[0040] It can be seen that since the installation slot 43 communicates with the wafer bearing surface 42 of the second slot, when the abutting block is adjusted to be close to or away from the center of the second slot, it is equivalent to being able to adapt to abut against the side surface of the wafer located in the second slot. In particular, since some types of wafers have straight edges formed after partial cutting, the abutting block 6 can reliably abut against the straight edges of such wafers, thereby further limiting and fixing the wafer and reducing the displacement that may occur due to vibration during the white light test of the wafer.
[0041] The implementation principle of this embodiment is as follows: First, the entire device is cooperatively installed in the test area of the white light test device through the base 1, then the wafer is fixedly installed in the limiting disk 4, then the angle of the wafer is adjusted to the set test angle, and finally the white light test is performed on the wafer. When adjusting the angle, the fine adjustment member 32 drives the convex block 5 to move, and in cooperation with the potential energy of the abutting member 33 that always abuts tightly against the convex block 5, it can finely and stably drive the convex block 5 to move a small distance, so that the rotation angle of the rotating disk 2 can be accurately adjusted to ensure the accuracy of the wafer test angle.
[0042] Therefore, the wafer test angle fine adjustment device of the present utility model can ensure that the angle value of the wafer during the white light test is always consistent with the set angle value, can effectively reduce the number of times of frequent shutdown for adjustment, and effectively improves the test efficiency.
[0043] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-described exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.
[0044] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A wafer test angle fine-tuning device, characterized in that: include: Base (1); A rotating disk (2) is rotatably mounted on the base (1); An adjustment component (3) is installed in cooperation with the rotating disk (2) to adjust the rotation angle of the rotating disk (2); A limiting plate (4) is fixedly mounted on a side of the rotating plate (2) away from the base (1), and the limiting plate (4) is used to carry and limit the wafer.
2. The wafer test angle fine-tuning device according to claim 1, characterized in that: A convex block (5) is installed on the side wall of the rotating disk (2); the adjusting assembly (3) comprises a mounting seat (31) and a fine-tuning member (32); the mounting seat (31) is provided with an adjusting groove (311); the convex block (5) is inserted into the adjusting groove (311); and the fine-tuning member (32) drives the convex block (5) to move in the adjusting groove (311) to drive the rotating disk (2) to rotate.
3. The wafer test angle fine-tuning device according to claim 2, characterized in that: The fine-tuning member (32) is a micrometer, which is mounted on the mounting seat (31). The micrometer comprises a driving end and a moving end, and the moving end abuts against the protrusion (5).
4. The wafer test angle fine-tuning device according to claim 2, characterized in that: The adjustment assembly (3) further comprises an abutment member (33), wherein the abutment member (33) comprises an abutment rod (331) slidably mounted in the mounting seat (31), and the abutment member (33) is arranged so that the abutment rod (331) has the potential energy to abut against the protrusion (5) so as to cooperate with the fine-tuning member (32) to fine-tune the position of the protrusion (5).
5. The wafer test angle fine-tuning device according to claim 4, characterized in that: The abutment member (33) further comprises an elastic body mounted in cooperation with the abutment rod (331), wherein the abutment rod (331) abuts against the protrusion (5) to compress the elastic body to generate elastic potential energy; and / or The abutment rod (331) comprises a sleeve rod and a sleeve tube, the sleeve tube is slidably connected to the mounting seat (31), one end of the sleeve tube abuts against the protrusion (5), and the other end of the sleeve tube is threadedly connected to the sleeve rod.
6. The wafer test angle fine-tuning device according to claim 3, characterized in that: The adjustment assembly (3) further comprises an adjustment rod (34), wherein the adjustment rod (34) is sleeved and mounted on the driving end of the micrometer, and a friction portion (341) is provided at one end of the adjustment rod (34) away from the micrometer.
7. The wafer test angle fine-tuning device according to claim 1, characterized in that: The limiting plate (4) is provided with a limiting groove (41), and in a direction away from the groove opening of the limiting groove (41), the limiting groove (41) has at least two groove positions with decreasing sizes, and the projections of the at least two groove positions are both located within the projection of the one with the largest size.
8. The wafer test angle fine-tuning device according to claim 7, characterized in that: The at least two slots each include a wafer carrying surface (42) adjacent to the slot opening of the limiting slot (41) relative to the slot bottom.
9. The wafer test angle fine-tuning device according to claim 8, characterized in that: The wafer carrying surface (42) is arranged around the slot opening of the corresponding slot.
10. The wafer test angle fine-tuning device according to claim 8, characterized in that: The at least two slots include a first slot and a second slot that are adjacent to each other. The first slot is larger than the second slot. A mounting slot (43) communicating with a wafer carrying surface (42) of the second slot is provided at the bottom of the first slot. An abutment block (6) is provided in the mounting slot (43). The abutment block (6) can be adjusted to move in a direction close to or away from the center of the second slot.