Display driving IC structure

Abstract

The utility model discloses a display driving IC structure comprising a substrate and a plurality of IC point locations. The base body is arranged on the surface of the flexible circuit board; all the IC point positions are arranged on the surface of the base body, and a gap exists between every two adjacent IC point positions; two of the plurality of IC point locations are electrically connected to form a test loop; according to the utility model, through the electrical connection between the test loop and the test point position, rapid troubleshooting and random inspection can be realized, whether TP IC welding is normal or not can be determined in the test, the cost investment can be greatly reduced, the efficiency can be greatly improved, and the TP IC welding detection device can be applied to the field of TP IC welding detection and can be widely applied to the field of TP IC welding detection. Specifically, impedance detection is directly carried out on a test point position electrically connected with a test loop, and when the detected impedance is smaller than 1 ohm, good conduction is shown. If not, the welding is abnormal.

Description

Technical Field

[0001] The utility model relates to the field of display screens, and particularly to a display driving IC structure. Background Technique

[0002] AMOLED display screens are widely used, such as in smart bracelets, smart watches, smart homes, e-cigarette products, etc. The AMOLED display screen has an oncell structure and is generally paired with a TP IC in a BGA package. After SMT, BGA paste needs to be removed and cured to prevent the bonding pins of the BGA from falling off. Since the metal pins of the BGA package are hidden under the package, it is particularly important to confirm the bonding situation of the TP IC.

[0003] Typically, for example, in the patent document with the application number CN202111182444.8, it discloses a display driving IC and a display module. By redesigning the package structure of the display driving IC, connection pins are designed on both the bottom surface and the top surface. The bottom surface is connected to the IC bonding pins, and the top surface is bonded to the FPC (i.e., flexible printed circuit board). Thus, when it is applied, the existing necessary OLB routing area and FPC bonding area of the display driving IC can be eliminated, the area of the single-layer area can be further reduced, and further, the screen area ratio of the full-screen can be increased, making the TFT display screen closer to the limit design of the full-screen.

[0004] Although the technical solution disclosed in the above patent document discloses the package structure of the driving IC and solves the problem of how to increase the screen ratio, there are also problems not only after the package of the driving IC but also during the packaging process. That is, generally, to confirm whether the IC with a TP BGA package is soldered well, it is necessary to check on the XRAY device. However, due to the large production volume of smart watches, if each one is checked, the factory will have to invest a lot of manpower and material resources for confirmation, resulting in high costs and low efficiency. Content of the Utility Model

[0005] Based on this, it is necessary to provide a display driving IC structure, aiming to solve the problem that generally, to confirm whether the IC with a TP BGA package is soldered well, it is necessary to check on the XRAY device. However, due to the large production volume of smart watches, if each one is checked, the factory will have to invest a lot of manpower and material resources for confirmation, resulting in high costs and low efficiency as mentioned in the above background technique.

[0006] To solve the above technical problems, the utility model adopts the following technical solutions:

[0007] A display driving IC structure includes a substrate and a plurality of IC points;

[0008] The substrate is arranged on the surface of the flexible printed circuit board;

[0009] All of the IC points are arranged on the surface of the substrate, and there are gaps between adjacent IC points;

[0010] Two of the multiple IC points are electrically connected to form a test circuit;

[0011] The surface of the flexible circuit board is provided with test points, and the test points are connected to the test circuit.

[0012] In the above solution:

[0013] The utility model can realize rapid troubleshooting, spot checks, and confirmation of whether the TP IC welding is normal through the electrical connection between the test circuit and the test points. In this way, the input cost can be greatly reduced and the efficiency can be greatly improved. Specifically, directly perform impedance detection on the test points electrically connected to the test circuit. When the detected impedance is less than 1 ohm, it indicates good conduction. If the test fails, it means the welding is abnormal.

[0014] Further, all of the IC points are arranged in an array to form a point structure matching the surface of the substrate.

[0015] Further, in order to enable two IC points in the test circuit to be electrically connected to the first point and the second point respectively, there are two test points, which are divided into the first point and the second point.

[0016] Further, the first point is connected to one IC point constituting the test circuit through a wire arranged on the substrate, and the second point is also connected to the other IC point constituting the test circuit through a wire arranged on the substrate.

[0017] Further, the two IC points constituting the test circuit are fixed by welding.

[0018] Further, a solder joint groove is provided on the surface of the substrate between the two IC points constituting the test circuit. With this design, the existence of the solder joint groove can prevent materials such as solder used when the two IC points are fixed by welding from contacting other IC points.

[0019] Further, the solder joint groove is of a rectangular structure. The rectangular structure can ensure to a certain extent that the heat generated in each area of the welding part is uniform during operation and the melting phenomenon will not easily occur. At the same time, in order to further prevent melting, a depression can be opened at the bottom of the rectangular solder joint groove 8 to further ensure a better anti-melting effect in each area of the welding part.

[0020] Further, the welding position groove includes two arc-shaped grooves disposed between two IC points constituting the test circuit. These two arc-shaped grooves are respectively arranged corresponding to the two IC points, and a connection section is provided between the two arc-shaped grooves. Since materials such as solder are prone to flow in a molten state and unevenness will occur after connecting the two IC points, to solve this problem, the arc-shaped grooves are used to expand the restricted flow range between the two IC points. Subsequently, to ensure uniformity, materials such as solder will be replenished. The setting of the arc-shaped grooves can prevent overflow and is also conducive to the material uniformity at the connection section.

[0021] Further, a guiding groove for limiting the wire is provided on the surface of the base body.

[0022] Further, the end of the guiding groove has an expansion opening.

[0023] Compared with the prior art, the present utility model has the following beneficial effects:

[0024] The present utility model can achieve rapid troubleshooting, spot checks, and test confirmations on whether the TP IC welding is normal through the electrical connection between the test circuit and the test points. In this way, the input cost can be greatly reduced and the efficiency can be greatly improved. Specifically, impedance detection is directly performed on the test points electrically connected to the test circuit. When the detected impedance is less than ohms, this indicates good conduction. If the test fails, it means the welding is abnormal. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of the base body provided by the present utility model;

[0026] Figure 2 is a schematic structural diagram of the flexible circuit board provided by the present utility model;

[0027] Figure 3 is a schematic diagram when two IC points are electrically connected to form a test circuit provided by the present utility model;

[0028] Figure 4 is a schematic structural diagram of the welding position groove provided by the present utility model;

[0029] Figure 5 is a schematic structural diagram of the guiding groove in the present utility model.

[0030] The reference numerals in the figures are explained as follows:

[0031] 1. Base body; 2. IC point; 3. Flexible circuit board; 4. Test point; 5. First point; 6. Second point; 7. Wire; 8. Welding position groove; 9. Arc-shaped groove; 10. Connection section; 11. Guiding groove; 12. Expansion opening. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] To enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0033] TP BGA is a packaging technology term, usually referring to "Through-Phone Ball Grid Array". This packaging technology is mainly used for the packaging of integrated circuits (ICs), especially in smart phones and other mobile devices. Specifically, TP BGA means encapsulating a chip in a ball grid array (BGA), but different from traditional BGA, it allows the chip to pass through the circuit board of a mobile phone or other device, thus saving space and helping to improve the overall performance and reliability of the system.

[0034] A driving IC (Integrated Circuit) is a semiconductor component used to control and manage the current and voltage in an electronic device. In the field of LED displays, the driving IC is particularly important because it is responsible for converting the signals sent by a microcontroller or other electronic devices into the current and voltage required for the LED display screen, ensuring that the LEDs work correctly and efficiently.

[0035] An XRAY device mainly utilizes the penetration ability of X-rays. An X-ray source emits X-rays and irradiates the object to be detected. Since the density and thickness of the internal structure of the object are different, the intensity of the X-rays after penetration will also be different. By detecting the intensity distribution of the X-rays passing through the object, detailed information about the internal structure of the object can be obtained.

[0036] As described in the background art, generally, to confirm whether an IC encapsulated by TP BGA is soldered well, it is necessary to check on an XRAY device. However, due to the large production volume of smart watches, if each one is checked, the factory will have to invest a lot of manpower and material resources for confirmation, resulting in high costs and low efficiency.

[0037] To solve this technical problem, the present utility model provides a structure of a display driving IC.

[0038] Specifically, please refer to Figures 1-5 the structure of the display driving IC, including a substrate 1 and a plurality of IC points 2;

[0039] The substrate 1 is disposed on the surface of the flexible circuit board 3;

[0040] All the IC points 2 are arranged on the surface of the substrate 1, and there are gaps between adjacent IC points 2;

[0041] Two of the multiple IC points 2 are electrically connected to form a test circuit;

[0042] The surface of the flexible circuit board 3 is provided with test points 4, and the test points 4 are connected to the test circuit.

[0043] The utility model can realize rapid troubleshooting, spot-checking, and testing to confirm whether the TP IC soldering is normal through the electrical connection between the test circuit and the test points 4. In this way, the cost investment can be greatly reduced and the efficiency can be greatly improved. Specifically, the impedance of the test points 4 electrically connected to the test circuit is directly detected. When the detected impedance is less than 1 ohm, it indicates good conduction. If the test fails, it means that the soldering is abnormal.

[0044] Figures 1-5 In the figure, the place marked as B represents the test circuit.

[0045] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings.

[0046] It should be noted that, without conflict, the embodiments and the features and technical solutions in the embodiments of the utility model can be combined with each other.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0048] Please refer to Figures 1-2 , which shows a display driving IC structure, including a substrate 1 and multiple IC points 2;

[0049] The substrate 1 is arranged on the surface of the flexible circuit board 3;

[0050] All the IC points 2 are arranged on the surface of the substrate 1, and there are gaps between adjacent IC points 2;

[0051] Two of the multiple IC points 2 are electrically connected to form a test circuit;

[0052] The surface of the flexible circuit board 3 is provided with test points 4, and the test points 4 are connected to a test circuit. In the present utility model, through the electrical connection between the test circuit and the test points 4, rapid troubleshooting, spot checks, and confirmation of whether the TP IC welding is normal during testing can be achieved. In this way, the input of costs can be greatly reduced and the efficiency can be greatly improved. Specifically, impedance detection is directly performed on the test points 4 electrically connected to the test circuit. When the detected impedance is less than 1 ohm, this indicates good conduction. If the test fails, it means that the welding is abnormal.

[0053] As Figure 3 , the display driving IC structure provided in Embodiment 1 is further optimized, and all the IC points 2 are arranged in an array to form a point structure matching the surface of the substrate 1.

[0054] In some specific embodiments, there are two test points 4, which are divided into a first point 5 and a second point 6. Such a setting is to enable two IC points 2 in the test circuit to be electrically connected to the first point 5 and the second point 6 respectively.

[0055] In some specific embodiments, the first point 5 is connected to an IC point 2 constituting the test circuit through a wire 7 provided on the substrate 1, and the second point 6 is also connected to another IC point 2 constituting the test circuit through a wire 7 provided on the substrate 1. Since the two IC points 2 need to be electrically connected to the first point 5 and the second point 6 respectively, there are many ways of electrical connection, such as welding through copper wires and leading connections through tin feet. Here, the wire 7 mainly serves for electrical connection and is not overly restricted.

[0056] In some specific embodiments, the two IC points 2 constituting the test circuit are fixed by welding. Such a setting is to enable a sufficient circuit to be formed between the two IC points 2, and the situation where the first point 5 and the second point 6 exist independently will not occur.

[0057] As Figure 4 , the display driving IC structure provided in Embodiment 1 or 2 is further optimized, and a solder joint groove 8 is provided on the surface of the substrate 1 between the two IC points 2 constituting the test circuit. The existence of the solder joint groove 8 can prevent materials such as solder used when the two IC points 2 are fixed by welding from contacting other IC points 2.

[0058] In some specific embodiments, the solder joint groove 8 is of a rectangular structure.

[0059] The rectangular structure can ensure to a certain extent that the heat is evenly generated in each area of the welding part, and the fusing phenomenon will not easily occur. At the same time, in order to further prevent fusing, a depression can be provided at the bottom of the welding position groove 8 of the rectangular structure to further ensure a better anti-fusing effect in each area of the welding part.

[0060] As Figure 5 In the further optimization of the display driving IC structure provided in each of the above embodiments, a welding position groove 8 is provided on the surface of the substrate 1 between two IC points 2 constituting the test circuit. The existence of the welding position groove 8 can prevent the materials such as solder used when fixing the two IC points 2 by welding from contacting other IC points 2.

[0061] In some specific embodiments, the welding position groove 8 includes two arc-shaped grooves 9 provided between two IC points 2 constituting the test circuit. These two arc-shaped grooves 9 are respectively arranged corresponding to the two IC points 2, and a connecting section 10 is provided between these two arc-shaped grooves 9. Since the materials such as solder are easy to flow in the molten state and will produce unevenness after connecting the two IC points 2, in order to solve this problem, the arc-shaped grooves 9 are used to expand the restricted flow range between the two IC points 2. At the same time, in order to ensure uniformity later, materials such as solder will be continuously supplemented. The setting of the arc-shaped grooves 9 can prevent overflow and is also beneficial to the material uniformity at the connecting section 10.

[0062] In some specific embodiments, a guiding groove 11 for limiting the wire 7 is provided on the surface of the substrate 1. Such a setting is for limiting the wire 7.

[0063] In some specific embodiments, the end of the guiding groove 11 has an expansion opening 12. Such a setting is to prevent the wire 7 from breaking at the end of the guiding groove 11.

[0064] The using process of the display driving IC structure provided by the present utility model is as follows: The present utility model can realize rapid troubleshooting, spot checking, and testing to confirm whether the TP IC welding is normal through the electrical connection between the test circuit and the test point 4. In this way, the input of cost can be greatly reduced and the efficiency can be greatly improved. Specifically, directly perform impedance detection on the test point 4 electrically connected to the test circuit. When the detected impedance is less than 1 ohm, this indicates good conduction. If the test fails, it means that the welding is abnormal.

[0065] In the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral one; it may be a mechanical connection, an electrical connection, or communication with each other; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0066] Obviously, the embodiments described above are only a part of the embodiments of the present utility model, rather than all of them. The accompanying drawings show the preferred embodiments of the present utility model, but do not limit the patent scope of the present utility model. The present utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present utility model in other related technical fields is similarly within the scope of the patent protection of the present utility model.

Claims

1. A display driver IC structure, characterized in that: It includes a substrate (1) and a plurality of IC points (2); The substrate (1) is arranged on the surface of the flexible circuit board (3); All of the IC points (2) are arranged on the surface of the substrate (1), and there are gaps between adjacent IC points (2); Two of the IC points (2) among the plurality of IC points (2) are electrically connected to form a test loop; The surface of the flexible circuit board (3) is provided with a test point (4), and the test point (4) is connected to a test circuit.

2. The display driver IC structure according to claim 1, characterized in that: All of the IC points (2) are arranged in an array to form a point structure that matches the surface of the substrate (1).

3. The display driver IC structure according to claim 1, characterized in that: The test points (4) have two, namely a first point (5) and a second point (6).

4. The display driver IC structure according to claim 3, characterized in that: The first point (5) is connected to an IC point (2) constituting a test loop via a wire (7) arranged on the substrate (1), and the second point (6) is also connected to another IC point (2) constituting the test loop via a wire (7) arranged on the substrate (1).

5. The display driver IC structure according to claim 1, characterized in that: The two IC points (2) constituting the test loop are fixed by welding.

6. The display driver IC structure according to claim 1, characterized in that: A soldering groove (8) is provided on the surface of the substrate (1) between two IC points (2) forming the test loop.

7. The display driver IC structure according to claim 6, characterized in that: The welding slot (8) is a rectangular structure.

8. The display driver IC structure according to claim 6, characterized in that: The welding position groove (8) comprises two arc grooves (9) arranged between two IC points (2) constituting the test loop, the two arc grooves (9) being arranged corresponding to the two IC points (2) respectively, and a connecting section (10) being arranged between the two arc grooves (9).

9. The display driver IC structure according to claim 4, characterized in that: The surface of the base body (1) is provided with a guide groove (11) for limiting the position of the wire (7).

10. The display driver IC structure according to claim 9, characterized in that: The end of the guide groove (11) has an expansion opening (12).

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