Evaporation equipment
By using a multi-layer shading device in the vapor deposition equipment to control the deposition area of the vapor deposition material, the problem that traditional coating equipment cannot plating multiple film thicknesses at the same time is solved, and the coating thickness control and production efficiency are improved in different areas of the substrate.
Patent Information
- Application Number
- CN202422127330.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2034-08-30
AI Technical Summary
Traditional coating equipment cannot plating multiple film thicknesses at the same time, resulting in inefficiency in production, especially in products that require the deposit of multiple films or complex structures.
An evaporation device is designed, and a multi-layer shading device (including the first, second and third shading devices) is used to control the deposition area of the evaporation material. By adjusting the position of the baffle, the coating thickness control in different areas is achieved.
Continuous work on the substrate and plating films of different thicknesses are achieved, which improves production efficiency and coating quality.
Smart Images
Figure CN222975269U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of thin film deposition, and particularly to an evaporation coating device. Background Art
[0002] A vacuum coating machine is a surface treatment device mainly used for depositing thin films on the surfaces of various substrates in a vacuum environment.
[0003] When a traditional coating device is used, it can only deposit a thin film of one thickness at a time. For products that require depositing multiple layers of films or have complex structures, step-by-step coating is needed, that is, after coating one film thickness, another film thickness needs to be coated. This process requires frequent adjustment of device parameters, resulting in low production efficiency. Summary of the Utility Model
[0004] The purpose of this application is to provide an evaporation coating device to solve the technical problem that the evaporation coating device in the related art cannot deposit multiple film thicknesses simultaneously.
[0005] An embodiment of this application provides an evaporation coating device, including: an evaporation coating chamber having an evaporation coating cavity; a base disposed in the evaporation coating chamber and used for fixing a substrate to be coated; an evaporation source disposed in the evaporation coating chamber and used for heating an evaporation coating material; a first shielding device disposed in the evaporation coating chamber, the first shielding device includes a first baffle located between the base and the evaporation source along a first direction, and the first baffle can move in the evaporation coating chamber to isolate the base from the evaporation source or expose the base to the evaporation source; a second shielding device disposed in the evaporation coating chamber, the second shielding device includes a second baffle located between the first baffle and the base along the first direction, the second baffle can move in the evaporation coating chamber to isolate the base from the evaporation source or expose the base to the evaporation source, a first channel is provided at the center of the second baffle, the projection of the first baffle along the first direction falls within the projection of the second baffle along the first direction, and the first baffle can block the first channel.
[0006] In some embodiments, the first shielding device includes a first mounting frame connected to the side wall of the evaporation coating chamber, the first mounting frame is used for fixing the first baffle and can drive the first baffle to rotate around a second direction, where the second direction is perpendicular to the first direction.
[0007] In some embodiments, the second baffle includes two first sub-boards, and the two first sub-boards can be combined to enclose the first channel.
[0008] In some embodiments, the second shielding device includes two second mounting brackets which are spaced apart along the second direction and are respectively connected to the side walls of the evaporation chamber. The second mounting brackets are used to fix the first sub-board and can drive the first sub-board to rotate around a third direction, where the third direction is perpendicular to the first direction and the second direction.
[0009] In some embodiments, the evaporation equipment further includes a third shielding device which is disposed in the evaporation chamber and includes a third baffle located between the base and the second baffle along the first direction. The third baffle can move within the evaporation chamber to isolate the base from the evaporation source or expose the base to the evaporation source. The center of the third baffle has a second channel, and the projections of the first baffle and the second baffle along the first direction both fall within the projection of the third baffle along the first direction, and the first baffle and the second baffle jointly shield the second channel.
[0010] In some embodiments, the third baffle includes two second sub-boards which can be combined to enclose the second channel.
[0011] In some embodiments, the third shielding device includes two third mounting brackets which are spaced apart along the second direction and are respectively connected to the side walls of the evaporation chamber. The third mounting brackets are used to fix the second sub-board and can drive the second sub-board to rotate around the third direction.
[0012] In some embodiments, the first baffle is circular, and / or the second baffle is annular, and / or the third baffle is annular, and / or the first channel is circular, and / or the second channel is circular.
[0013] In some embodiments, a mask plate is disposed on the base, and the mask plate is used to cover the substrate. The mask plate includes a first part, a second part, and a third part. The first part is opposite to the first baffle, the second part is opposite to the second baffle, and the third part is opposite to the third baffle.
[0014] In some embodiments, the evaporation equipment further includes a crystal oscillator probe disposed in the evaporation chamber, and the crystal oscillator probe is used to detect the coating rate.
[0015] The evaporation coating equipment provided by the embodiment of the present application is provided with a first shielding device and a second shielding device in an evaporation coating cavity. The first shielding device includes a first baffle plate that is movably arranged, and the second shielding device includes a second baffle plate that is movably arranged. A first channel is arranged on the second baffle plate, and the first baffle plate can also shield the first channel. In this way, by separately adjusting the positions of the first baffle plate and the second baffle plate, different areas of the substrate can be shielded or exposed. When the target area on the substrate is exposed, normal coating can be carried out for a period of time, while the unexposed area on the substrate cannot be coated during this period. As a result, the coating duration and coating thickness are different at different areas of the substrate, and the coating thickness of the area on the substrate opposite to the second channel is the largest. In summary, the above evaporation coating equipment is used for coating the surfaces of various substrates, and can continuously operate and deposit thin films with different thicknesses on the substrate. Description of the Drawings
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0017] Figure 1 One of the three-dimensional schematic diagrams of the evaporation coating equipment provided by the embodiment of the present application;
[0018] Figure 2 Another three-dimensional schematic diagram of the evaporation coating equipment provided by the embodiment of the present application;
[0019] Figure 3 The side view of the evaporation coating equipment provided by the embodiment of the present application;
[0020] Figure 4 The side view of the evaporation coating equipment from another perspective provided by the embodiment of the present application;
[0021] Figure 5 The top view of the evaporation coating equipment provided by the embodiment of the present application;
[0022] Figure 6 The structural schematic diagram of the shielding device in the evaporation coating equipment provided by the embodiment of the present application;
[0023] Figure 7 For Figure 6 The side view of the shown shielding device;
[0024] Figure 8 The structural schematic diagram of the mask plate provided by the embodiment of the present application.
[0025] Main element symbol description:
[0026] 100. Evaporation equipment;
[0027] 1. Evaporation chamber; 11. Evaporation cavity; 12. Evaporation stage; 2. Base; 21. Flat platform; 22. Fixture; 3. Evaporation source; 4. First shielding device; 41. First baffle; 42. First mounting frame; 43. First fixing frame; 5. Second shielding device; 51. Second baffle; 52. First channel; 511. First sub-plate; 53. Second mounting frame; 54. Second fixing frame; 6. Third shielding device; 61. Third baffle; 62. Second channel; 611. Second sub-plate; 63. Third mounting frame; 7. Mask; 71. First part; 72. Second part; 73. Third part; 74. Opening pattern; 75. Fixing structure; 8. Crystal oscillator probe. Detailed implementation manners
[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0029] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly disposed on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the patent. Terms "first" and "second" are only used for the purpose of convenient description, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of technical features. The meaning of "a plurality" is two or more, unless otherwise specifically defined.
[0030] The reference to "an embodiment", "some embodiments" or "embodiments" in the description of the present application means that specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Thus, the statements "in an embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, specific features, structures or characteristics can be combined in any suitable manner.
[0031] The present application provides a vapor deposition apparatus for depositing a thin layer of material on the surface of various substrates to form a coating film.
[0032] Please refer to Figure 1 and Figure 2 As shown in and, the vapor deposition apparatus 100 provided by an embodiment of the present application includes a vapor deposition chamber 1, a susceptor 2, an evaporation source 3, a first shielding device 4, and a second shielding device 5. Please refer to and together. Figure 3 and Figure 4 The vapor deposition chamber 1 has a vapor deposition cavity 11. The susceptor 2 is disposed in the vapor deposition cavity 11 and is used to fix the substrate to be coated (not shown in the figure). The evaporation source 3 is disposed in the vapor deposition cavity 11 and is used to heat the vapor deposition material. The first shielding device 4 is disposed in the vapor deposition cavity 11. The first shielding device 4 includes a first baffle 41 located between the susceptor 2 and the evaporation source 3 along the first direction Z. The first baffle 41 can move in the vapor deposition cavity 11 to isolate the susceptor 2 from the evaporation source 3 or expose the susceptor 2 to the evaporation source 3. The second shielding device 5 is disposed in the vapor deposition cavity 11. The second shielding device 5 includes a second baffle 51 located between the first baffle 41 and the susceptor 2 along the first direction Z. The second baffle 51 can move in the vapor deposition cavity 11 to isolate the susceptor 2 from the evaporation source 3 or expose the susceptor 2 to the evaporation source 3. The center of the second baffle 51 has a first channel 52. The projection of the first baffle 41 along the first direction Z falls within the projection of the second baffle 51 along the first direction Z, and the first baffle 41 can block the first channel 52.
[0033] As Figure 1 shown, the height direction of the vapor deposition chamber 1 is defined as the first direction Z, the length direction of the vapor deposition chamber 1 is defined as the second direction X, and the width direction of the vapor deposition chamber 1 is defined as the third direction Y. The first direction Z, the second direction X, and the third direction Y are perpendicular to each other.
[0034] The vapor deposition chamber 1 provides a sealed vapor deposition cavity 11. The inside of the vapor deposition cavity 11 can maintain a high vacuum state. Coating operations are carried out in the vacuum vapor deposition cavity 11, which can avoid the influence of impurities such as oxygen and moisture in the atmosphere on the coating layer, thereby ensuring the purity, density, and uniformity of the coating layer. It can be understood that the vapor deposition chamber 1 needs to be connected to a vacuum pump system for vacuum pumping when necessary. A pressure monitoring device, such as a vacuum gauge, can also be provided in the vapor deposition cavity 11. The pressure monitoring device is used to monitor the pressure change in the vapor deposition cavity 11 in real time to ensure that the vacuum degree in the vapor deposition cavity 11 meets the coating requirements.
[0035] The base 2 can be disposed at the top of the evaporation chamber 1 and is capable of fixing the substrate and exposing the deposition surface of the substrate within the evaporation cavity 11. The structure of the base 2 is not unique. For example, the base 2 may include a flat platform 21 and a fixture 22 disposed on the flat platform 21. The size of the fixture 22 is adjustable and can fix substrates of different sizes. The flat platform 21 can be fixedly disposed or rotatably disposed.
[0036] An evaporation stage 12 is provided at the bottom of the evaporation chamber 1, and one or more evaporation sources 3 are provided on the evaporation stage 12. The evaporation source 3 is used to convert the evaporation material into a gaseous state and deposit it on the substrate to form a thin film. In order to enable the evaporation material to be better deposited on the substrate, the evaporation source 3 can be disposed opposite to the base 2. Please refer to Figure 5 When multiple evaporation sources 3 are provided, the multiple evaporation sources 3 can be evenly distributed.
[0037] The first shielding device 4 and the second shielding device 5 are used to isolate the base 2 and the evaporation source 3. By defining the scattering range of the evaporation material, the evaporation material can be deposited in the target area of the substrate. Specifically, the first baffle 41 and the second baffle 51 are movably disposed, and the shielding range of the second baffle 51 is larger than that of the first baffle 41. When both the first baffle 41 and the second baffle 51 are located between the base 2 and the evaporation source 3, they act together, and the evaporation material cannot be deposited at the positions on the substrate opposite to the first baffle 41 and the second baffle 51. Move the first baffle 41 to expose the first channel 52. In this way, only the second baffle 51 has a shielding effect, and the evaporation material can be normally deposited at the position on the substrate opposite to the first channel 52, while the evaporation material cannot be deposited at the position on the substrate opposite to the second baffle 51. Using this evaporation device 100, two kinds of thin films with different thicknesses can be plated on the substrate. It can be understood that the projections of the first baffle 41 and the second baffle 51 on the substrate along the first direction Z are the effective shielding areas of the first baffle 41 and the second baffle 51.
[0038] In the evaporation device 100 provided in the above embodiment, a first shielding device 4 and a second shielding device 5 are provided in the evaporation cavity 11. The first shielding device 4 includes a movably disposed first baffle 41, and the second shielding device 5 includes a movably disposed second baffle 51. A first channel 52 is provided on the second baffle 51, and the first baffle 41 can also shield the first channel 52. In this way, by separately adjusting the positions of the first baffle 41 and the second baffle 51, different areas of the substrate can be shielded or exposed. When the target area on the substrate is exposed, normal coating can be performed for a period of time, while the unexposed area on the substrate cannot be coated during this period. As a result, the coating time and coating thickness at different areas on the substrate are different, and the coating thickness of the area on the substrate opposite to the second channel 62 is the largest. In summary, the above evaporation device 100 is used for coating the surfaces of various substrates, can operate continuously, and can deposit thin films with different thicknesses on the substrate.
[0039] In some embodiments, please refer to Figure 1 and Figure 2 , the first shielding device 4 includes a first mounting bracket 42. The first mounting bracket 42 is connected to the side wall of the evaporation chamber 1. The first mounting bracket 42 is used to fix the first baffle 41 and can drive the first baffle 41 to rotate around the second direction X, where the second direction X is perpendicular to the first direction Z.
[0040] When the first baffle 41 rotates to the horizontal state, it can isolate the substrate table 2 from the evaporation source 3; when the first baffle 41 rotates to the vertical state, it can expose the substrate table 2 to the evaporation source 3.
[0041] It can be understood that the closer the first baffle 41 is to the substrate table 2, the better the shielding effect on the substrate on the substrate table 2. Optionally, in some embodiments, the first shielding device 4 further includes a first fixing bracket 43. The first fixing bracket 43 extends along the first direction Z and one end is fixed to the top of the evaporation chamber 1. The first mounting bracket 42 extends along the third direction Y. One end of the first mounting bracket 42 is rotatably connected to the first fixing bracket 43, and the other end is fixedly connected to the first baffle 41. The first mounting bracket 42 can rotate relative to the first fixing bracket 43 and drive the first baffle 41 to move between the horizontal state and the vertical state. The first mounting bracket 42 and the first fixing bracket 43 can be rotatably connected through structures such as a pin shaft, a bearing, a coupling, etc., but not limited thereto. The rotation action can be realized by a pneumatic valve and a pneumatic switch.
[0042] With the above design, the structure of the first shielding device 4 is reasonable, and the position of the first baffle 41 is easy to adjust.
[0043] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 6 , the second baffle 51 includes two first sub-boards 511, and the two first sub-boards 511 can be combined to enclose a first channel 52.
[0044] In order to enable the first baffle 41 and the second baffle 51 to be used normally, it is required that the outer contour dimension of the second baffle 51 is larger than the dimension of the first baffle 41, and the dimension of the first channel 52 is smaller than the dimension of the first baffle 41.
[0045] The internal space of the evaporation cavity 11 is limited, and structures such as the substrate table 2, the evaporation source 3, and the monitoring device are also arranged, so the moving space left for the shielding device is also limited. In the above embodiments, the two independent first sub-boards 511 are combined to form the second baffle 51. The size of the first sub-board 511 is relatively small, and the moving space required during rotation is also small. Therefore, this design improves the structural rationality of the second baffle 51 and reduces the interference risk of the second baffle 51.
[0046] It can be understood that in some embodiments, the second baffle 51 may also be a complete annular baffle.
[0047] In some embodiments, please refer to Figure 1 and Figure 2 , the second shielding device 5 includes two second mounting brackets 53, the two second mounting brackets 53 are arranged at intervals along the second direction X and are respectively connected to the side wall of the evaporation chamber 1, the second mounting bracket 53 is used to fix the first sub-plate 511, and can drive the first sub-plate 511 to rotate around the third direction Y, wherein the third direction Y is perpendicular to the first direction Z and the second direction X.
[0048] When the first sub-plate 511 rotates to the horizontal state, it can isolate the base 2 from the evaporation source 3; when the first sub-plate 511 rotates to the vertical state, it can expose the base 2 to the evaporation source 3.
[0049] Optionally, in some embodiments, the second shielding device 5 further includes two second fixing brackets 54, the two second fixing brackets 54 are arranged at intervals along the second direction X, the second fixing bracket 54 extends along the third direction Y and one end is fixed to the side wall of the evaporation chamber 1, the second mounting bracket 53 extends along the second direction X, one end of the second mounting bracket 53 is rotatably connected to the second fixing bracket 54, and the other end is fixedly connected to the first sub-plate 511, and the second mounting bracket 53 can rotate relative to the second fixing bracket 54 and drive the second sub-plate 611 to move between the horizontal state and the vertical state. The second mounting bracket 53 and the second fixing bracket 54 can be rotatably connected through structures such as a pin shaft, a bearing, and a coupling, but are not limited thereto, and the rotation action can be realized by a pneumatic valve and a pneumatic switch.
[0050] It can be understood that since the second baffle 51 needs to be located between the first baffle 41 and the base 2 in the horizontal state, in the first direction Z, the installation heights of the second fixing bracket 54 and the second mounting bracket 53 are higher than the installation heights of the first fixing bracket 43 and the first mounting bracket 42. During the coating process, it is necessary to first move the first baffle 41. When the first baffle 41 is in the vertical state, it can avoid the movement path of the first sub-plate 511 and give enough movement space for the first sub-plate 511.
[0051] With the above design, the second shielding device 5 has a reasonable structure, the position of the second baffle 51 is easy to adjust and the second baffle 51 is not prone to interference during the movement process.
[0052] In some embodiments, please refer to Figure 1 and Figure 2, the evaporation deposition apparatus 100 further includes a third shielding device 6. The third shielding device 6 is disposed in the evaporation deposition chamber and includes a third baffle 61 located between the substrate stage 2 and the second baffle 51 along the first direction Z. The third baffle 61 is movable within the evaporation deposition chamber 11 to isolate the substrate stage 2 from the evaporation source 3 or expose the substrate stage 2 to the evaporation source 3. The center of the third baffle 61 has a second channel 62. The projections of the first baffle 41 and the second baffle 51 along the first direction Z fall within the projection of the third baffle 61 along the first direction Z, and the first baffle 41 and the second baffle 51 jointly shield the second channel 62.
[0053] Please refer to Figure 6 and Figure 7 , to enable the second baffle 51 and the third baffle 61 to be used properly, it is required that the outer contour size of the third baffle 61 is larger than the outer contour size of the second baffle 51, and the size of the second channel 62 is smaller than the outer contour size of the second baffle 51.
[0054] Please refer to Figure 1 , Figure 2 and Figure 7 , the first baffle 41, the second baffle 51, and the third baffle 61 are spaced apart along the first direction Z to prevent collision between multiple layers of baffles.
[0055] When the first baffle 41, the second baffle 51, and the third baffle 61 are all located between the substrate stage 2 and the evaporation source 3, the three of them act together, and the positions on the substrate opposite to the first baffle 41, the second baffle 51, and the third baffle 61 cannot deposit the evaporation deposition material. Move the first baffle 41 to expose the first channel 52. In this way, only the second baffle 51 and the third baffle 61 have the shielding effect, and the position on the substrate opposite to the first channel 52 can deposit the evaporation deposition material normally, while the positions on the substrate opposite to the second baffle 51 and the third baffle 61 cannot deposit the evaporation deposition material; move the first baffle 41 and the second baffle 51 to expose the second channel 62. In this way, only the third baffle 61 has the shielding effect, and the position on the substrate opposite to the second channel 62 can deposit the evaporation deposition material normally, while the positions on the substrate opposite to the third baffle 61 cannot deposit the evaporation deposition material. Using this evaporation deposition apparatus 100, three films with different thicknesses can be deposited on the substrate. It can be understood that the projection of the third baffle 61 on the substrate along the first direction Z is the effective shielding area of the third baffle 61.
[0056] In the above embodiment, by adding the third shielding device 6, the practicability of the evaporation deposition apparatus 100 can be further improved.
[0057] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 6 , the third baffle 61 includes two second sub - plates 611, and the two second sub - plates 611 can be combined to enclose the second channel 62.
[0058] In the above embodiments, two independent second sub-boards 611 are combined to form a third baffle 61. The size of the second sub-board 611 is relatively small, and the required movement space during rotation is also small. This design improves the structural rationality of the third baffle 61 and reduces the interference risk of the third baffle 61 at the same time.
[0059] It can be understood that in some embodiments, the third baffle 61 can also be a complete annular baffle.
[0060] In some embodiments, please refer to Figure 1 and Figure 2 , the third shielding device 6 includes two third mounting brackets 63. The two third mounting brackets 63 are arranged at intervals along the second direction X and are respectively connected to the side wall of the evaporation chamber 1. The third mounting bracket 63 is used to fix the second sub-board 611 and can drive the second sub-board 611 to rotate around the third direction Y.
[0061] When the second sub-board 611 rotates to the horizontal state, it can isolate the base 2 from the evaporation source 3; when the second sub-board 611 rotates to the vertical state, it can expose the base 2 to the evaporation source 3.
[0062] Optionally, in some embodiments, the two third mounting brackets 63 are arranged at intervals along the second direction X. The third fixing bracket extends along the third direction Y and one end is fixed to the side wall of the evaporation chamber 1, and the other end is rotatably connected to the second sub-board 611. The second sub-board 611 can rotate relative to the third mounting bracket 63 to move between the horizontal state and the vertical state. The second sub-board 611 and the third mounting bracket 63 can be rotatably connected through structures such as a pin shaft, a bearing, a coupling, etc., but not limited thereto. The rotation action can be realized by a pneumatic valve and a pneumatic switch.
[0063] It can be understood that since the third baffle 61 needs to be located between the second baffle 51 and the base 2 in the horizontal state, in the first direction Z, the installation height of the third fixing bracket is higher than the installation heights of the second fixing bracket 54 and the second mounting bracket 53. The third mounting bracket 63 and the second fixing bracket 54 can be connected to the same side wall or different side walls of the evaporation chamber 1. During the coating process, it is necessary to first move the first baffle 41 and the second baffle 51. When the first baffle 41 and the second baffle 51 are in the vertical state, they can avoid the movement path of the second sub-board 611 and provide enough movement space for the second sub-board 611.
[0064] With the above design, the third shielding device 6 has a reasonable structure, the position of the third baffle 61 is easy to adjust, and the third baffle 61 is not prone to interference during the movement process.
[0065] In some embodiments, the first baffle 41 is circular, and / or the second baffle 51 is annular, and / or the third baffle 61 is annular, and / or the first channel 52 is circular, and / or the second channel 62 is circular.
[0066] Optionally, in a specific embodiment, please refer to Figure 1 , Figure 2 and Figure 6 , the first baffle 41 is a circular plate, the second baffle 51 and the third baffle 61 are annular plates, and the first channel 52 and the second channel 62 are circular channels.
[0067] With the above design, the structures of the first baffle 41, the second baffle 51 and the third baffle 61 are reasonable, and the space utilization rate is relatively high, which can effectively shield the base 2 and the substrate.
[0068] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 8 , a mask 7 is provided on the base 2, and the mask 7 is used to cover the substrate. The mask 7 includes a first part 71, a second part 72 and a third part 73. The first part 71 is opposite to the first baffle 41, the second part 72 is opposite to the second baffle 51, and the third part 73 is opposite to the third baffle 61.
[0069] Specific opening patterns 74 are designed on the mask 7, and these opening patterns 74 correspond to the target areas on the surface of the substrate to be deposited, and are used to precisely control the distribution of the deposited material on the substrate.
[0070] Optionally, in some embodiments, the base 2 includes a flat platform 21 and a fixture 22 provided on the flat platform 21. The fixture 22 can hold the mask 7, and the substrate can be fixed between the mask 7 and the flat platform 21.
[0071] With the above design, on the one hand, using the mask 7 to assist in fixing the substrate can improve the stability of the substrate. On the other hand, the partition structure on the mask 7 is reasonable and has a good correspondence with the baffles of the shielding device, which can improve the accuracy of film coating.
[0072] Furthermore, in some embodiments, the mask 7 is a circular plate, and the mask 7 and the substrate are rotatably arranged in the evaporation chamber 11. During the film coating process, the mask 7 and the substrate can rotate around the first direction Z. To enable the mask 7 to rotate effectively, fixing structures 75 are provided on opposite sides of the mask 7 to improve the reliability of the mask 7.
[0073] In some embodiments, please refer to 3 and Figure 4 , the evaporation device 100 further includes a crystal oscillator probe 8 provided in the evaporation chamber 1. The crystal oscillator probe 8 is used to monitor the film coating rate.
[0074] Optionally, the crystal oscillator probe 8 is fixed in the evaporation chamber 11 through a mounting bracket. Along the first direction Z, the crystal oscillator probe 8 is located between the substrate table 2 and the evaporation source 3.
[0075] The crystal oscillator probe 8 is used to monitor the film deposition rate in real time. According to the monitoring data of the crystal oscillator probe 8, the film thickness on the substrate can be analyzed. In this way, according to the monitoring results of the crystal oscillator probe 8, the position of the shielding device, the evaporation time and other process parameters can be adjusted in time to ensure the film deposition accuracy.
[0076] The structure of the evaporation equipment 100 provided by the present application will be described below in conjunction with a specific embodiment. Please refer to Figure 1 、 Figure 2 and Figure 8, the evaporation deposition apparatus 100 includes an evaporation deposition chamber 1, a susceptor 2, an evaporation source 3, a first shielding device 4, a second shielding device 5, and a third shielding device 6. The evaporation deposition chamber 1 has an evaporation deposition cavity 11. The susceptor 2 is disposed within the evaporation deposition cavity 11. A substrate and a mask 7 are provided on the susceptor 2. The substrate includes a first target area, a second target area, and a third target area. The mask 7 includes a first portion 71, a second portion 72, and a third portion 73. Specific opening patterns 74 are designed on the first portion 71, the second portion 72, and the third portion 73 of the mask 7, and the first portion 71 is opposite to the first target area, the second portion 72 is opposite to the second target area, and the third portion 73 is opposite to the third target area. The first shielding device 4 includes a first baffle 41. The first baffle 41 is located between the susceptor 2 and the evaporation source 3 along the first direction Z. The first baffle 41 is movable within the evaporation deposition cavity 11 and is used to shield the first target area of the substrate or expose the first target area to the evaporation source 3. The second shielding device 5 includes a second baffle 51. The second baffle 51 is located between the susceptor 2 and the first baffle 41 along the first direction Z. The second baffle 51 is movable within the evaporation deposition cavity 11 and is used to shield the second target area of the substrate or expose the second target area to the evaporation source 3. A first channel 52 is further provided at the center of the second baffle 51. The projection of the first baffle 41 along the first direction Z falls within the projection of the second baffle 51 along the first direction Z, and the first baffle 41 can shield the first channel 52. The third shielding device 6 includes a third baffle 61. The third baffle 61 is located between the susceptor 2 and the second baffle 51 along the first direction Z. The third baffle 61 is movable within the evaporation deposition cavity 11 and is used to shield the third target area of the substrate or expose the third target area to the evaporation source 3. A second channel 62 is further provided at the center of the third baffle 61. The projections of the first baffle 41 and the second baffle 51 along the first direction Z fall within the projection of the third baffle 61 along the first direction Z, and the first baffle 41 and the second baffle 51 can shield the second channel 62. Among them, the first baffle 41 is a circular plate, the second baffle 51 and the third baffle 61 are annular plates, the first channel 52 and the second channel 62 are circular channels, the size of the first baffle 41 is larger than the size of the first channel 52, and the outer contour size of the second baffle 51 is larger than the size of the second channel 62.
[0077] The above evaporation deposition apparatus 100 is used for coating the surface of a substrate, and can operate continuously to deposit three kinds of thin films with different thicknesses on the substrate. Among them, the coating thickness of the first target area of the substrate is the largest, and the coating thickness of the third target area is the smallest.
[0078] Taking Sc2O3 as the evaporation material, with the coating thickness of the first target area of the substrate being 15 nm, the coating thickness of the second target area being 10 nm, and the coating thickness of the third target area being 5 nm as an example, the specific usage method of the evaporation equipment 100 is as follows: First, put 1 g of Sc2O3 into the evaporation source 3, and evacuate the evaporation chamber 11; then, when the vacuum degree of the evaporation chamber 11 reaches 1.0E-3 or 1.5E-3, turn on the evaporation source 3 to heat Sc2O3, where the voltage of the evaporation source 3 is designed to be 0.5 V - 0.6 V, the current is designed to be 120 A - 140 A, and the evaporation rate is designed to be 0.1 A / s; then, when the evaporation rate of the evaporation source 3 stabilizes at 0.1 A / s, rotate the first baffle 41 to expose the first target area of the substrate and deposit the evaporation material; then, when the coating thickness of the first target area of the substrate reaches 5 nm, rotate the second baffle 51 to expose the first target area and the second target area of the substrate simultaneously and deposit the evaporation material; then, when the coating thickness of the first target area of the substrate reaches 10 nm and the coating thickness of the second target area reaches 5 nm, rotate the third baffle 61 to expose the first target area, the second target area, and the third target area of the substrate simultaneously and deposit the evaporation material; then, when the coating thickness of the first target area of the substrate reaches 15 nm, the coating thickness of the second target area reaches 10 nm, and the coating thickness of the third target area reaches 5 nm, shut down the evaporation equipment 100.
[0079] Taking the evaporation material as MgO, with the coating thickness of the first target area of the substrate being 100 nm, the coating thickness of the second target area being 70 nm, and the coating thickness of the third target area being 50 nm as an example, the specific usage method of the evaporation equipment 100 is as follows: First, put 3 g of MgO into the evaporation source 3 and evacuate the evaporation chamber 11; then, when the vacuum degree of the evaporation chamber 11 reaches 1.0E-3 or 1.5E-3, turn on the evaporation source 3 to heat MgO. Among them, the voltage of the evaporation source 3 is designed to be 1.25 V - 1.3 V, the current is designed to be 190 A - 200 A, and the evaporation rate is designed to be 0.1 Å / s; then, when the evaporation rate of the evaporation source 3 is stable at 0.1 Å / s, rotate the first baffle 41 to expose the first target area of the substrate and deposit the evaporation material. During this process, the parameters of the evaporation source 3 also need to be adjusted so that the voltage reaches 1.45 V - 1.55 V, the current reaches 210 A - 225 A, and the evaporation rate reaches 1 Å / s; then, when the coating thickness of the first target area of the substrate reaches 30 nm, rotate the second baffle 51 to expose the first target area and the second target area of the substrate simultaneously and deposit the evaporation material; then, when the coating thickness of the first target area of the substrate reaches 50 nm and the coating thickness of the second target area reaches 20 nm, rotate the third baffle 61 to expose the first target area, the second target area, and the third target area of the substrate simultaneously and deposit the evaporation material; then, when the coating thickness of the first target area of the substrate reaches 100 nm, the coating thickness of the second target area reaches 70 nm, and the coating thickness of the third target area reaches 50 nm, shut down the evaporation equipment 100.
[0080] It should be noted that in the above embodiments, for the convenience of description, it is set that the substrate includes a first target area, a second target area, and a third target area. In actual applications, the base 2 can fix multiple substrates with different coating thickness requirements, and the installation positions of the multiple substrates respectively correspond to the positions of the first baffle 41, the second baffle 51, and the third baffle 61.
[0081] In summary, the evaporation equipment 100 provided by the embodiments of the present application, by improving the structure of the shielding device, enables the coating equipment to operate continuously and deposit thin films with different thicknesses on the substrate. When using the evaporation equipment 100 for coating, the coating quality and work efficiency can be effectively improved.
[0082] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A vapor deposition device, characterized in that: include: The evaporation chamber comprises an evaporation cavity; A base, disposed in the evaporation chamber and used to fix the substrate to be coated; An evaporation source is disposed in the evaporation cavity and is used to heat the evaporation material; A first shielding device is disposed in the evaporation chamber, the first shielding device includes a first baffle located between the base and the evaporation source along a first direction, the first baffle can move in the evaporation chamber to isolate the base from the evaporation source or expose the base to the evaporation source; A second shielding device is arranged in the evaporation chamber, and the second shielding device includes a second baffle located between the first baffle and the base along the first direction, and the second baffle can move in the evaporation chamber to isolate the base from the evaporation source or expose the base to the evaporation source. The center of the second baffle has a first channel, the projection of the first baffle along the first direction falls within the projection of the second baffle along the first direction, and the first baffle can shield the first channel.
2. The evaporation device according to claim 1, characterized in that: The first shielding device includes a first mounting frame connected to a side wall of the evaporation chamber, the first mounting frame is used to fix the first baffle plate, and can drive the first baffle plate to rotate around a second direction, wherein the second direction is perpendicular to the first direction.
3. The evaporation device according to claim 2, characterized in that: The second baffle includes two first sub-plates, and the two first sub-plates can be aligned to enclose the first channel.
4. The evaporation device according to claim 3, characterized in that: The second shielding device includes two second mounting frames, which are spaced apart along the second direction and respectively connected to the side walls of the evaporation chamber. The second mounting frames are used to fix the first sub-board and can drive the first sub-board to rotate around a third direction, wherein the third direction is perpendicular to the first direction and the second direction.
5. The evaporation device according to claim 4, characterized in that: It also includes a third shielding device, which is arranged in the evaporation chamber and includes a third baffle located between the base and the second baffle along the first direction, and the third baffle can move in the evaporation chamber to isolate the base from the evaporation source or expose the base to the evaporation source, and the center of the third baffle has a second channel, the projections of the first baffle and the second baffle along the first direction both fall within the projection of the third baffle along the first direction, and the first baffle and the second baffle jointly shield the second channel.
6. The evaporation device according to claim 5, characterized in that: The third baffle includes two second sub-plates, and the two second sub-plates can be coupled to form the second channel.
7. The evaporation device according to claim 6, characterized in that: The third shielding device includes two third mounting frames, which are spaced apart along the second direction and respectively connected to the side walls of the evaporation chamber. The third mounting frames are used to fix the second sub-board and can drive the second sub-board to rotate around the third direction.
8. The evaporation device according to claim 7, characterized in that: The first baffle is circular, and / or the second baffle is annular, and / or the third baffle is annular, and / or the first channel is circular, and / or the second channel is circular.
9. The evaporation device according to claim 7, characterized in that: A mask is arranged on the base, the mask is used to cover the substrate, the mask includes a first part, a second part and a third part, the first part is opposite to the first baffle, the second part is opposite to the second baffle, and the third part is opposite to the third baffle.
10. The evaporation device according to any one of claims 1 to 9, characterized in that: It also includes a crystal oscillator probe disposed in the evaporation chamber, and the crystal oscillator probe is used to detect the coating rate.