Blasting vibration meter capable of simultaneously monitoring vibration and sound pressure

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By designing a four-channel analog circuit unit in the blasting vibrator, combining the main control module and the AD conversion module, simultaneous monitoring of vibration and sound pressure during blasting is achieved, and the problem that the existing technology cannot fully understand the impact of blasting on buildings is solved.

CN222978934UActive Publication Date: 2025-06-13CHENGDU JIAOBO TECH CO LTD

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Patent Information

Application Number: CN202421760686.X
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-07-24
Publication Date: 2025-06-13
Estimated Expiration: 2034-07-24

AI Technical Summary

Technical Problem

Existing blasting vibrating instruments cannot monitor vibration and sound pressure at the same time, and cannot fully understand the impact of blasting on buildings.

Method used

A burst vibration vibrating meter is designed, adopting a four-channel analog circuit unit, combining the main control module and the AD conversion module, three channels are used for vibration signal reception and processing, and one channel is used for sound pressure signal reception and processing.

Benefits of technology

It realizes joint monitoring of vibration and sound pressure during blasting, and comprehensively understands the impact of blasting on buildings and the damage mechanism.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of vibration monitoring, and provides a blasting vibration meter capable of simultaneously monitoring vibration and sound pressure, which comprises a blasting vibration meter host, and the blasting vibration meter host comprises a main control module, a network module communicated with the main control module, an AD conversion module, a USB interface, a 4G interface, a charging interface module, a GPS module and an LAN interface. And the analog circuit module is communicated with the AD conversion module. According to the utility model, the design of the four-channel analog circuit unit is adopted, the design of the main control module and the AD conversion module is combined, three channels are used for receiving and processing vibration signals, and one channel is used for receiving and processing sound pressure signals, so that joint monitoring of vibration and sound pressure (noise) during blasting is realized.

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Description

Technical Field

[0001] The utility model belongs to the technical field of vibration monitoring. Specifically, it relates to a blasting vibration monitor that can simultaneously monitor vibration and sound pressure. Background Art

[0002] A blasting vibration monitor is a portable special device for long-term on-site collection, recording, and storage of blasting vibration and impact signals. By monitoring blasting vibration, the characteristics, propagation laws of blasting seismic waves, as well as the influence and damage mechanism on buildings can be understood and mastered. The blasting vibration monitor mainly includes a host part and a sensor part. During application, the sensor collects data and transmits it to the host. In the prior art, the blasting vibration monitor is mainly used to monitor vibration conditions and record relevant data such as the velocity, acceleration, and main vibration frequency of blasting vibration, but it cannot monitor the sound pressure (noise) during blasting. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a blasting vibration monitor that can simultaneously monitor vibration and sound pressure, so as to solve the technical problems existing in the prior art.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0005] A blasting vibration monitor that can simultaneously monitor vibration and sound pressure. The host of the blasting vibration monitor includes a main control module, a network module, an AD conversion module, a USB interface, a 4G interface, a GPS module, and a LAN interface that communicate with the main control module, and an analog circuit module that communicates with the AD conversion module. The main control module includes a main control chip U27 (model number STM32F407VGT6). Pins 70 and 71 of the main control chip U27 are connected to pins 2 and 3 of the USB interface. Pin 31 of the main control chip U27 is connected to the LAN interface. Pins 26 and 57 of the main control chip U27 are connected to the GPS module. Pin 31 of the main control chip U27 is connected to pin 8 of the 4G interface. The AD conversion module includes an AD chip U7 (model number ADS1724). One end of a resistor R111 is connected to pin 27 of the AD chip U7, and the other end of the resistor R111 is connected to pin 67 of the main control chip U27. One end of a resistor R112 is connected to pin 28 of the AD chip U7, and the other end of the resistor R112 is connected to pin 89 of the main control chip U27. One end of a resistor R110 is connected to pin 20 of the AD chip U7, and the other end of the resistor R110 is connected to pin 90 of the main control chip U27. One end of a resistor R113 is connected to pin 29 of the AD chip U7, and the other end of the resistor R113 is connected to pin 91 of the main control chip U27. One end of a resistor R114 is connected to pin 33 of the AD chip U7, and the other end of the resistor R114 is connected to pin 84 of the main control chip U27.

[0006] Furthermore, the analog circuit module includes a four-channel analog circuit unit: a first analog circuit unit, a second analog circuit unit, a third analog circuit unit, and a fourth analog circuit unit. Among them, the first analog circuit unit, the second analog circuit unit, and the third analog circuit unit are used for receiving and processing vibration signals, and the fourth analog circuit unit is used for receiving and processing sound pressure signals.

[0007] Furthermore, the first analog circuit unit includes an analog circuit chip U1 of model THS4521ID. Pin 1 and pin 8 of the analog circuit chip U1 are connected to pin 1 and pin 2 of diode D9, and pin 3 of diode D9 is grounded. One end of resistor R4 and capacitor C4 is connected to pin 4 of the analog circuit chip U1, the other end of capacitor C4 is connected to pin 1, the other end of resistor R4 is connected to one end of resistor R2 and node S1, one end of capacitor C1 is connected to node S1, and the other end of capacitor C1 is grounded. The other end of resistor R2 is connected to one end of resistor R1, the other end of resistor R1 is connected to one end of resistor R92, and the other end of resistor R92 is grounded. One end of resistor R9 and capacitor C18 is connected to pin 5 of the analog circuit chip U1, the other end of capacitor C18 is connected to pin 8, the other end of resistor R9 is connected to one end of resistor R11 and node S2, one end of capacitor C22 is connected to node S2, the other end of capacitor C22 is grounded, and capacitor C2 is connected between node S1 and node S2. The other end of resistor R11 has one end of resistor R10, the other end of resistor R10 is connected to one end of resistor R93. The other end of resistor R93 is connected to node S3, node S3 is connected to pin 2 and pin 6 of operational amplifier U13 (model OPA350), pin 3 of operational amplifier U13 is connected to capacitor C20 and the parallel-connected resistor R17 and capacitor C15, and one end of resistor R17 and capacitor C15 is connected to one end of resistor R23, and the other ends of resistor R23 and capacitor C20 are grounded.

[0008] Furthermore, the network module includes chips U12 (model DP83848) and U24 (model HR601680). Pin 2, pin 3, and pin 4 of the chip U12 are respectively connected to pin 48, pin 51, and pin 52 of the main control chip U27. Pin 43 and pin 44 of the chip U12 are respectively connected to pin 33 and pin 34 of the main control chip U27. Pin 40 and pin 31 of the chip U12 are respectively connected to pin 32 and pin 16 of the main control chip U27. Pin 13, pin 14, pin 16, and pin 17 of the chip U12 are respectively connected to pin 6, pin 8, pin 1, and pin 3 of the chip U24.

[0009] Furthermore, the main control module is electrically connected to a charging circuit module.

[0010] Further, the main control module is also electrically connected to a storage and memory chip circuit module.

[0011] Further, the main control module is also electrically connected to a key module, a display screen module, and a Bluetooth module.

[0012] Compared with the prior art, the present utility model has the following beneficial effects:

[0013] The present utility model adopts a four-channel analog circuit unit design, which combines the design of the main control module and the AD conversion module. Among them, three channels are used for receiving and processing vibration signals, and one channel is used for receiving and processing sound pressure signals, thereby realizing the joint monitoring of vibration and sound pressure (noise) during blasting. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the circuit schematic diagram of the AD conversion module in the present utility model.

[0015] Figure 2 It is the circuit principle of the analog circuit module in the present utility model Figure 1 (The first analog circuit unit).

[0016] Figure 3 It is the circuit principle of the analog circuit module in the present utility model Figure 2 (The second analog circuit unit).

[0017] Figure 4 It is the circuit principle of the analog circuit module in the present utility model Figure 3 (The third analog circuit unit).

[0018] Figure 5 It is the circuit principle of the analog circuit module in the present utility model Figure 4 (The fourth analog circuit unit).

[0019] Figure 6 It is the circuit principle of the analog circuit module in the present utility model Figure 5 .

[0020] Figure 7 It is the circuit schematic diagram of the 4G interface in the present utility model.

[0021] Figure 8 It is the circuit schematic diagram of the LAN interface in the present utility model.

[0022] Figure 9 It is the circuit schematic diagram of the USB interface in the present utility model.

[0023] Figure 10 It is the circuit schematic diagram of the charging interface in the present utility model.

[0024] Figure 11The circuit principle of the main control module in the present utility model Figure 1 。

[0025] Figure 12 The circuit principle of the main control module in the present utility model Figure 2 。

[0026] Figure 13 The circuit principle of the network module in the present utility model Figure 1 。

[0027] Figure 14 The circuit principle of the network module in the present utility model Figure 2 。

[0028] Figure 15 The circuit schematic diagram of the button module in the present utility model.

[0029] Figure 16 The circuit schematic diagram of the display screen module in the present utility model.

[0030] Figure 17 The circuit schematic diagram of the storage and memory chip circuit module in the present utility model.

[0031] Figure 18 The circuit principle of the charging circuit module in the present utility model Figure 1 。

[0032] Figure 19 The circuit principle of the charging circuit module in the present utility model Figure 2 (The first part).

[0033] Figure 20 The circuit principle of the charging circuit module in the present utility model Figure 2 (The second part).

[0034] Figure 21 The circuit schematic diagram of the Bluetooth circuit module in the present utility model.

[0035] Figure 22 The circuit schematic diagram of the GPS module in the present utility model. Specific implementation manners

[0036] In order to enable those skilled in the art to have a clearer understanding and knowledge of the present utility model, the following further details the present utility model in conjunction with embodiments. It should be understood that the specific embodiments described below are only used to explain the present utility model for easy understanding, and the technical solutions provided by the present utility model are not limited to the technical solutions provided by the following embodiments, and the technical solutions provided by the embodiments should not limit the protection scope of the present utility model.

[0037] Unless otherwise defined, technical terms or scientific terms used in this application disclosure shall have the ordinary meaning as understood by persons of ordinary skill in the field to which this disclosure pertains. The words such as "including" or "comprising" used in this application mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents, without excluding other elements or objects. The positional relationship words such as "upper", "lower", "left", "right", "front", "rear", etc. are determined according to the layout direction of the specification drawings, and they are only used to represent the relative positional relationship. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0038] Embodiment

[0039] As Figures 1 to 22 As shown, this embodiment provides a blasting vibration monitor for realizing simultaneous monitoring of vibration and sound pressure, which includes a main body of the blasting vibration monitor. The main body of the blasting vibration monitor includes a main control module, a network module, an AD conversion module, a USB interface, a 4G interface, a charging interface module, a GPS module, a LAN interface that communicate with the main control module, and an analog circuit module that communicates with the AD conversion module; in addition, the main control module is also electrically connected to a charging interface, a charging circuit module, a storage and memory chip circuit module, a key module, a display screen module, and a Bluetooth module; the charging interface, the charging circuit module, the storage and memory chip circuit module, the key module, the display screen module, and the Bluetooth module can all adopt existing mature structures, so they will not be elaborated here.

[0040] In this embodiment, the main control module includes a main control chip U27 (U27A, U27B), with the model number STM32F407VGT6. The pin connection relationship between the main control chip U27 and other modules is as follows:

[0041] Pins 70 and 71 of the main control chip U27 are connected to pins 2 and 3 of the USB interface;

[0042] Pin 31 of the main control chip U27 is connected to pin 8 of the 4G interface;

[0043] Pins 26 and 57 of the main control chip U27 are connected to the GPS module;

[0044] Pin 31 of the main control chip U27 is connected to the LAN interface. Specifically, it is connected to pin 8 of the LAN interface through resistor R7;

[0045] Pins 67, 89, 90, 91, and 84 of the main control chip U27 are connected to the AD conversion module;

[0046] Pins 48, 51, 52, 33, 34, 32, and 16 of the main control chip U27 are connected to the network module;

[0047] Pin 92 and pin 93 of the main control chip U27 are connected to the button module. Specifically, they are connected to pin 8 and pin 9 of the chip U17 in the button module.

[0048] Pin 60, pin 86, pin 85, pin 61, pin 62, pin 81, pin 82, pin 38, pin 39, pin 40, pin 41, and pin 88 of the main control chip U27 are connected to the display module. Specifically, they are connected to pins 6 - 17 of the LCD. The wiring of other conventional pins will not be elaborated.

[0049] Pin 95 and pin 96 of the main control chip U27 are connected to pin 5 and pin 6 of the storage circuit chip U28 in the storage and memory chip circuit module. Pin 65, pin 66, pin 78, pin 79, pin 80, and pin 83 of the main control chip U27 are connected to pin 1, pin 2, pin 5, pin 7, pin 8, and pin 3 of the memory chip. The storage and memory chip circuit module uses the storage circuit chip U28 with the model number AT24C08 and an SD card.

[0050] Pin 77 and pin 15 of the main control chip U27 are connected to the charging circuit module.

[0051] Pin 29 and pin 30 of the main control chip U27 are connected to pin 14 and pin 6 of the Bluetooth module U30. Pin 63 and pin 64 of the main control chip U27 are connected to pin 17 and pin 16 of the Bluetooth module U30. Preferably, the Bluetooth module RF - BM - S02 is used.

[0052] In this embodiment, the network module includes chips U12 and U24 with the model numbers DP83848 and HR601680. Pin 2, pin 3, and pin 4 of the chip U12 are respectively connected to pin 48, pin 51, and pin 52 of the main control chip U27. Pin 43 and pin 44 of the chip U12 are respectively connected to pin 33 and pin 34 of the main control chip U27. Pin 40 and pin 31 of the chip U12 are respectively connected to pin 32 and pin 16 of the main control chip U27. Pin 13, pin 14, pin 16, and pin 17 of the chip U12 are respectively connected to pin 6, pin 8, pin 1, and pin 3 of the chip U24. The chip U24 is connected to the 4G interface.

[0053] In this embodiment, the AD conversion module includes an AD chip U7, with the model number ADS1274. The connection relationship between the pins of the AD chip U7 and the main control chip U27 is as follows: One end of a resistor R111 is connected to pin 27 of the AD chip U7, and the other end of the resistor R111 is connected to pin 67 of the main control chip U27; one end of a resistor R112 is connected to pin 28 of the AD chip U7, and the other end of the resistor R112 is connected to pin 89 of the main control chip U27; one end of a resistor R110 is connected to pin 20 of the AD chip U7, and the other end of the resistor R110 is connected to pin 90 of the main control chip U27; one end of a resistor R113 is connected to pin 29 of the AD chip U7, and the other end of the resistor R113 is connected to pin 91 of the main control chip U27; one end of a resistor R114 is connected to pin 33 of the AD chip U7, and the other end of the resistor R114 is connected to pin 84 of the main control chip U27.

[0054] In this embodiment, VOUT1±, VOUT2±, VOUT3±, and VOUT4± are the connection pins between the analog circuit module and the AD conversion module. The analog circuit module is connected to the sensor through an external connector.

[0055] The analog circuit module includes a four-channel analog circuit unit: a first analog circuit unit, a second analog circuit unit, a third analog circuit unit, and a fourth analog circuit unit. Among them, the first analog circuit unit, the second analog circuit unit, and the third analog circuit unit are used for receiving and processing vibration signals, and the fourth analog circuit unit is used for receiving and processing sound pressure signals. It should be noted that the circuit structures of the first analog circuit unit, the second analog circuit unit, the third analog circuit unit, and the fourth analog circuit unit are the same. The following describes the first analog circuit unit as the reference:

[0056] The first analog circuit unit includes an analog circuit chip U1 of model THS4521ID. Pin 1 and pin 8 of the analog circuit chip U1 are connected to pin 1 and pin 2 of diode D9, and pin 3 of diode D9 is grounded; pin 4 of the analog circuit chip U1 is connected to one end of resistor R4 and capacitor C4, pin 1 is connected to the other end of capacitor C4, the other end of resistor R4 is connected to one end of resistor R2 and node S1, node S1 is connected to one end of capacitor C1, and the other end of capacitor C1 is grounded; the other end of resistor R2 is connected to one end of resistor R1, the other end of resistor R1 is connected to one end of resistor R92, and the other end of resistor R92 is grounded; pin 5 of the analog circuit chip U1 is connected to one end of resistor R9 and capacitor C18, pin 8 is connected to the other end of capacitor C18, the other end of resistor R9 is connected to one end of resistor R11 and node S2, node S2 is connected to one end of capacitor C22, and the other end of capacitor C22 is grounded. A capacitor C2 is connected between node S1 and node S2; the other end of resistor R11 has one end of resistor R10, and the other end of resistor R10 is connected to one end of resistor R93; the other end of resistor R93 is connected to node S3, node S3 is connected to pin 2 and pin 6 of an operational amplifier U13 of model OPA350. Pin 3 of the operational amplifier U13 is connected to capacitor C20 and the parallel-connected resistor R17 and capacitor C15. One end of resistor R17 and capacitor C15 is connected to one end of resistor R23, and the other ends of resistor R23 and capacitor C20 are grounded.

[0057] The technical solution provided in this embodiment adopts a four-channel analog circuit unit design, which combines the designs of the main control module and the AD conversion module to realize the joint monitoring of vibration and sound pressure (noise) during blasting.

[0058] The above is the preferred implementation scheme of the present invention. It should be noted that those skilled in the art can also make several improvements without departing from the design principle and technical solution of the present invention, and these improvements should also be regarded as the protection scope of the present invention.

Claims

1. A blasting vibration meter for simultaneously monitoring vibration and sound pressure, comprising a blasting vibration meter host, characterized in that: The main body of the blasting vibrometer includes a main control module, a network module communicating with the main control module, an AD conversion module, a USB interface, a 4G interface, a GPS module, a LAN interface, and an analog circuit module communicating with the AD conversion module; the main control module includes a main control chip U27; pins 70 and 71 of the main control chip U27 are connected to pins 2 and 3 of the USB interface, pin 31 of the main control chip U27 is connected to the LAN interface, pins 26 and 57 of the main control chip U27 are connected to the GPS module, and pin 31 of the main control chip U27 is connected to pin 8 of the 4G interface; the AD conversion module includes an AD chip U7, and pins 70 and 71 of the main control chip U27 are connected to pins 2 and 3 of the USB interface, and pin 31 of the main control chip U27 is connected to pin 8 of the 4G interface. Pin 27 is connected to one end of resistor R111, and the other end of resistor R111 is connected to pin 67 of the main control chip U27; pin 28 of the AD chip U7 is connected to one end of resistor R112, and the other end of resistor R112 is connected to pin 89 of the main control chip U27; pin 20 of the AD chip U7 is connected to one end of resistor R110, and the other end of resistor R110 is connected to pin 90 of the main control chip U27; pin 29 of the AD chip U7 is connected to one end of resistor R113, and the other end of resistor R113 is connected to pin 91 of the main control chip U27; pin 33 of the AD chip U7 is connected to one end of resistor R114, and the other end of resistor R114 is connected to pin 84 of the main control chip U27.

2. The explosion vibrometer for simultaneously monitoring vibration and sound pressure according to claim 1, characterized in that: The analog circuit module includes four-channel analog circuit units: a first analog circuit unit, a second analog circuit unit, a third analog circuit unit and a fourth analog circuit unit; wherein the first analog circuit unit, the second analog circuit unit and the third analog circuit unit are used for receiving and processing vibration signals, and the fourth analog circuit unit is used for receiving and processing sound pressure signals.

3. The explosion vibrometer for simultaneously monitoring vibration and sound pressure according to claim 2, characterized in that: The first analog circuit unit includes an analog circuit chip U1 of model THS4521ID, wherein pins 1 and 8 of the analog circuit chip U1 are connected to pins 1 and 2 of a diode D9, and pin 3 of the diode D9 is grounded; pin 4 of the analog circuit chip U1 is connected to a resistor R4 and one end of a capacitor C4, pin 1 is connected to the other end of the capacitor C4, the other end of the resistor R4 is connected to one end of a resistor R2 and a node S1, node S1 is connected to one end of a capacitor C1, and the other end of the capacitor C1 is grounded; the other end of the resistor R2 is connected to one end of a resistor R1, the other end of the resistor R1 is connected to one end of a resistor R92, and the other end of the resistor R92 is grounded; pin 5 of the analog circuit chip U1 is connected to the resistor R9 and the capacitor C18. One end, pin 8 is connected to the other end of capacitor C18, the other end of resistor R9 is connected to one end of resistor R11 and node S2, node S2 is connected to one end of capacitor C22, the other end of capacitor C22 is grounded, and capacitor C2 is connected between node S1 and node S2; the other end of resistor R11 has one end of resistor R10, and the other end of resistor R10 is connected to one end of resistor R93; the other end of resistor R93 is connected to node S3, node S3 is connected to pin 2 and pin 6 of operational amplifier U13, pin 3 of operational amplifier U13 is connected to capacitor C20 and parallel resistor R17 and capacitor C15, one end of resistor R17 and capacitor C15 is connected to one end of resistor R23, and the other end of resistor R23 and capacitor C20 is grounded.

4. The explosion vibrometer for simultaneously monitoring vibration and sound pressure according to claim 3, characterized in that: The network module includes chips U12 and U24, pin 2, pin 3, and pin 4 of the chip U12 are respectively connected to pin 48, pin 51, and pin 52 of the main control chip U27, pin 43 and pin 44 of the chip U12 are respectively connected to pin 33 and pin 34 of the main control chip U27, pin 40 and pin 31 of the chip U12 are respectively connected to pin 32 and pin 16 of the main control chip U27; pin 13, pin 14, pin 16, and pin 17 of the chip U12 are respectively connected to pin 6, pin 8, pin 1, and pin 3 of the chip U24.

5. The explosion vibrometer for simultaneously monitoring vibration and sound pressure according to claim 4, characterized in that: The main control module is also electrically connected to a charging circuit module.

6. The explosion vibrometer for simultaneously monitoring vibration and sound pressure according to claim 5, characterized in that: The main control module is also electrically connected to a storage and memory chip circuit module.

7. The explosion vibrometer for simultaneously monitoring vibration and sound pressure according to claim 6, characterized in that: The main control module is also electrically connected to a key module, a display screen module and a Bluetooth module.