Board card integrated assembly, quantum calculation measurement and control system and quantum computer

Abstract

The utility model discloses a board card integrated assembly, a quantum computing measurement and control system and a quantum computer. The board card integrated assembly comprises a case, a backboard, a signal source board card and a plurality of functional board cards, wherein the backboard, the signal source board card and the functional board cards are arranged in the case; the signal source board card and the plurality of functional board cards are arranged in parallel in an array and are perpendicular to the backboard; the signal source board card is used for providing reference signals for the plurality of functional board cards; the function board card is used for generating a control signal required by the quantum chip based on the reference signal; the backboard is provided with a first VPX connector and a second VPX connector which are electrically connected through a signal line. The signal source board card is provided with a third VPX connector, and the function board card is provided with a fourth VPX connector. The first VPX connector is connected with the third VPX connector in an inserted mode to achieve electric connection, and the second VPX connector is connected with the fourth VPX connector in an inserted mode to achieve electric connection. The board card integration assembly not only avoids the problem of inconvenient wiring in the prior art, but also improves the integration level.

Description

Technical Field

[0001] The utility model relates to the technical field of quantum computers, in particular to a board integrated component, a quantum computing measurement and control system and a quantum computer. Background Technique

[0002] The quantum chip is the core component for running quantum computing. Multiple quantum bits are integrated on the quantum chip. In order to ensure the normal operation of the quantum bits, a special quantum computing control system needs to be built, and many functional boards are arranged in the quantum computing control system to provide various control signals (such as frequency control signals, quantum state control signals, measurement control signals) for the quantum chip; these functional boards are all connected to the signal source and are used to generate the required control signals based on the signal source. In the prior art, these functional boards are usually integrated in a box and electrically connected to the signal source outside the box through signal transmission lines, which is inconvenient for wiring and not conducive to integration.

[0003] It should be noted that the information disclosed in the background art part of this application is only intended to deepen the understanding of the general background technology of this application, and should not be regarded as an admission or any form of suggestion that this information constitutes the prior art known to those skilled in the art. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a board integrated component, a quantum computing measurement and control system and a quantum computer, which not only avoid the problem of inconvenient wiring in the prior art, but also improve the integration degree.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The first aspect of the utility model provides a board integrated component, which is characterized in that it includes a chassis and a backplane, a signal source board and a plurality of functional boards arranged in the chassis;

[0007] The signal source board and the plurality of functional boards are arranged in a parallel array and perpendicular to the backplane; the signal source board is used to provide a reference signal for the plurality of functional boards; the functional boards are used to generate the control signals required by the quantum chip based on the reference signal;

[0008] A first VPX connector and a second VPX connector electrically connected by a signal line are arranged on the backplane; a third VPX connector is arranged on the signal source board, and a fourth VPX connector is arranged on the functional board; the first VPX connector is plugged into the third VPX connector to achieve electrical connection, and the second VPX connector is plugged into the fourth VPX connector to achieve electrical connection.

[0009] The board integration component as described above. Further, the signal source board includes a PCB board, and integrated on the PCB board are:

[0010] A crystal oscillator source for providing a 100M clock signal;

[0011] A first power splitter module for splitting the 100M clock signal into multiple 100M first signals;

[0012] Among them, any one of the several function boards is electrically connected to the first power splitter module for receiving the first signal as a reference signal.

[0013] The board integration component as described above. Further, also integrated on the PCB board are:

[0014] A frequency doubling module, electrically connected to the first power splitter module, for receiving one of the first signals, performing frequency doubling processing to obtain a second signal, and outputting the second signal to a second power splitter module;

[0015] A second power splitter module for splitting the second signal into multiple third signals;

[0016] Among them, at least one of the several function boards is used to receive the third signal.

[0017] The board integration component as described above. Further, it further includes a routing board, and the routing board is arranged perpendicular to the backplane;

[0018] A fifth VPX connector and a sixth VPX connector electrically connected by a signal line are further provided on the backplane, and a seventh VPX connector is further provided on the function board; an eighth VPX connector is provided on the routing board; the fifth VPX connector is plugged into the seventh VPX connector to achieve electrical connection; the sixth VPX connector is plugged into the eighth VPX connector to achieve electrical connection.

[0019] The board integration component as described above. Further, the chassis includes a top plate, a bottom plate, and a first side plate and a second side plate disposed between the top plate and the bottom plate and arranged oppositely;

[0020] A plurality of first slots and a plurality of second slots arranged oppositely are respectively provided on the first side plate and the second side plate, and the first slots and the second slots are respectively used to support both ends of the function board or the routing board or the signal source board; first air inlets and first air outlets arranged oppositely are respectively provided on the side walls of the first slots and the second slots;

[0021] A first fan is provided on a first surface of the first side plate away from the first slot, and a second fan is provided on a first surface of the second side plate away from the second slot.

[0022] For the board integration component as described above, further, a plurality of the first fans are arranged in an array, and the plurality of the first fans are arranged at different heights;

[0023] A plurality of the second fans are arranged in an array, and the plurality of the second fans are arranged at different heights.

[0024] For the board integration component as described above, further, a first partition is provided on the first surface of the first side plate, and the first partition is used to separate the first fans at different heights;

[0025] A second partition is provided on the first surface of the second side plate, and the second partition is used to separate the second fans at different heights.

[0026] For the board integration component as described above, further, heat dissipation plates are provided on the outer walls of the functional board, the routing board, and the signal source board, and a plurality of heat dissipation channels arranged in parallel are provided on the heat dissipation plates; the relatively arranged first air inlet and the first air outlet are respectively arranged at two ends of the heat dissipation channel;

[0027] Or, locking strips are provided on the outer walls at both ends of the functional board, the routing board, and the signal source board, and the locking strips are in contact with the groove walls of the relatively arranged first slot or the second slot, and the locking strips are made of aluminum alloy.

[0028] In a second aspect of the present invention, a quantum computing measurement and control system is provided, including the above board integration component and a central control module, and the central control module controls the functional board in the board integration component to output a control signal for a quantum chip.

[0029] In a third aspect of the present invention, a quantum computer is provided, including the above quantum computing measurement and control system and a quantum chip, and the quantum chip operates based on the control signal output by the quantum computing measurement and control system.

[0030] The beneficial effects of the present invention are as follows:

[0031] In this application, by integrating the signal source board, the functional board, and the backplane inside the chassis, since the signal source board and several of the functional boards are arranged in a parallel array and perpendicular to the backplane, the overall integration degree of the board integration component is improved. At the same time, since the first VPX connector and the second VPX connector on the backplane are electrically connected through signal lines, the first VPX connector on the backplane is plugged into the third VPX connector on the signal source board, and the second VPX connector on the backplane is plugged into the fourth VPX connector on the functional board, thus realizing the electrical connection between the signal source board and the functional board through the backplane. The connection is convenient and reliable, avoiding the problem of inconvenient wiring in the prior art.

[0032] The board integration component, the quantum computing measurement and control system, and the quantum computer provided by the present utility model include the above-mentioned chassis, so they have the same beneficial effects and will not be elaborated here. Brief Description of the Drawings

[0033] Figure 1 It is a schematic structural diagram of the board integration component provided by an embodiment of the present utility model, in which only the signal source board and one functional board are schematically shown;

[0034] Figure 2 It is a functional block diagram of the signal source board provided by an embodiment of the present utility model Figure 1 ;

[0035] Figure 3 It is a functional block diagram of the signal source board provided by an embodiment of the present utility model Figure 2 ;

[0036] Figure 4 It is a three-dimensional structural diagram of the chassis provided by an embodiment of the present utility model;

[0037] Figure 5 It is an exploded structural diagram of the chassis provided by an embodiment of the present utility model;

[0038] Figure 6 It is a front structural diagram of the first side plate provided by an embodiment of the present utility model;

[0039] Figure 7 It is a reverse structural diagram of the first side plate provided by an embodiment of the present utility model;

[0040] Figure 8 It is a front structural diagram of the second side plate provided by an embodiment of the present utility model;

[0041] Figure 9 It is a reverse structural diagram of the second side plate provided by an embodiment of the present utility model;

[0042] Figure 10Schematic diagram of the structure of the functional board card provided by the embodiment of the present invention after arranging the heat sink and the locking strip;

[0043] Figure 11 Schematic diagram of the structure of the signal source board card provided by the embodiment of the present invention after arranging the heat sink and the locking strip.

[0044] In the attached drawing reference numerals: 10, chassis; 11, top plate; 12, bottom plate; 121, second groove; 13, first side plate; 131, first slot; 132, first air inlet; 133, first partition; 14, second side plate; 141, second slot; 142, first air outlet; 143, second partition 15, first outer cover plate; 16, second outer cover plate; 17, second fan; 20, functional board card; 30, signal source board card; 31, crystal oscillator source; 32, first power splitting module; 33, frequency doubling module; 34, second power splitting module; 40, backplane; 50, locking strip; 60, heat dissipation plate. Detailed implementation manners

[0045] In order to enable those skilled in the art to better understand the technical solutions in this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application. The embodiments described below with reference to the attached drawings are exemplary and are only used to explain this application, and cannot be construed as a limitation of this application.

[0046] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the attached drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0047] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0048] Figure 1 Schematic diagram of the structure of the board card integration component provided by the embodiment of the present invention; as Figure 1As shown in the figure: An embodiment of the present application discloses a board integrated component, including a chassis 10, a backplane 40, a signal source board 30, and a plurality of functional boards 20 disposed in the chassis 10.

[0049] The signal source board 30 and the plurality of functional boards 20 are arranged in a parallel array and perpendicular to the backplane 40; the signal source board 30 is used to provide a reference signal for the plurality of functional boards 20; the functional boards 20 are used to generate control signals required for a quantum chip based on the reference signal.

[0050] A first VPX connector and a second VPX connector electrically connected by a signal line are provided on the backplane 40; a third VPX connector is provided on the signal source board 30, and a fourth VPX connector is provided on the functional board 20; the first VPX connector is plugged into the third VPX connector to achieve electrical connection, and the second VPX connector is plugged into the fourth VPX connector to achieve electrical connection.

[0051] In this embodiment, by integrating the signal source board 30, the functional boards 20, and the backplane 40 in the chassis 10, since the signal source board 30 and the plurality of functional boards 20 are arranged in a parallel array and perpendicular to the backplane 40, the overall integration degree of the board integrated component is improved; at the same time, since the first VPX connector and the second VPX connector on the backplane 40 are electrically connected by a signal line, the first VPX connector on the backplane 40 is plugged into the third VPX connector on the signal source board 30, and the second VPX connector on the backplane 40 is plugged into the fourth VPX connector on the functional board 20, thereby realizing the electrical connection between the signal source board 30 and the functional boards 20 through the backplane 40. The connection is convenient and reliable, avoiding the problem of inconvenient wiring in the prior art.

[0052] In this embodiment, the functional board 20 includes a quantum state regulation board, a frequency regulation board, and a measurement board; wherein, the quantum state regulation board is used to provide a quantum state control signal for quantum bits; the frequency regulation board is used to provide a frequency control signal for quantum bits; the measurement board is used to provide a measurement and reading signal for quantum bits.

[0053] In this embodiment, since the chassis 10 integrates a plurality of functional boards 20, a plurality of reference signals are required. The plurality of reference signals can be provided one-to-one by a plurality of independent signal sources. At this time, the signal source board 30 needs to integrate a plurality of signal sources, which is not conducive to integration. In order to improve the integration degree of the signal source board 30 and thus improve the integration degree of the entire board integrated component, in some embodiments of this embodiment, Figure 2 is the functional block diagram of the signal source board 30 provided by the embodiment of the present invention Figure 1 ; as Figure 2As shown in the figure: The signal source board 30 includes a PCB board, on which the following components are integrated: a crystal oscillator source 31 for providing a 100M clock signal; a first power splitting module 32 for splitting the 100M clock signal into multiple 100M first signals. Among them, any one of the several function boards 20 is electrically connected to the first power splitting module 32 to receive the first signal as a reference signal.

[0054] In this embodiment, the signal source board 30 uses a single crystal oscillator source 31. The 100M clock signal provided by the crystal oscillator source 31 is split into multiple 100M first signals through the first power splitting module 32 and used as the reference signal for several function boards 20. This not only improves the integration level, but also ensures that the reference signals are from the same source, improves the phase difference stability between signals, and thus improves the final signal quality.

[0055] When the function board 20 includes a measurement board, since the measurement board requires not only a 100M reference signal but also an input signal with a higher frequency, directly connecting it to an external signal source is not only inconvenient for wiring but also affects the integration level. Therefore, in some embodiments of this example, continue as Figure 2 As shown in the figure: The PCB board also integrates the following components: a frequency doubling module 33, electrically connected to the first power splitting module 32, for receiving one of the first signals, performing frequency doubling processing to obtain a second signal, and outputting the second signal to a second power splitting module 34; the second power splitting module 34 for splitting the second signal into multiple third signals. Among them, at least one of the several function boards 20 is used to receive the third signal. The signal source board 30 of this embodiment generates multiple third signals with a higher frequency through the frequency doubling module 33 and the second power splitting module 34 to meet the working requirements of the function board 20. This not only improves the integration level, but also the multiple third signals are from the same source, reduces the phase difference, and improves the signal quality.

[0056] As the number of qubits integrated on the quantum chip increases, the signal source board 30 is required to provide more reference signals to meet the demand. In some embodiments of this example, Figure 3 This is the functional block diagram of the signal source board 30 provided by the embodiment of the present invention Figure 2 ; As Figure 3 shown in the figure: The PCB board also integrates a third power splitting module 35. The third power splitting module 35 is used to receive the first signal and split the first signal into multiple 100M fourth signals, and the fourth signals are output to the function board 20 as reference signals.

[0057] In the signal source board card 30 of this embodiment, the first power splitting module 32, the second power splitting module 34, and the third power splitting module 35 can all be power splitters; further, amplifiers can be selectively electrically connected to the front end and / or the back end of the power splitters in the first power splitting module 32, the second power splitting module 34, and the third power splitting module 35 according to actual requirements to ensure the signal quality after power splitting.

[0058] In actual application, these functional board cards 20 are all connected to the central control module, receive the task parameters of quantum computing through the central control module and forward them to each functional board card 20 for controlling the operation of each functional board card 20; in order to facilitate the wiring between these functional board cards 20 and the central control module and further improve the integration of the board card integrated component, in some embodiments of this embodiment, the board card integrated component further includes a routing board card, and the routing board card is arranged perpendicular to the backplane 40; a fifth VPX connector and a sixth VPX connector electrically connected by a signal line are further provided on the backplane 40, and a seventh VPX connector is further provided on the functional board card 20; an eighth VPX connector is provided on the routing board card; the fifth VPX connector is plugged into the seventh VPX connector to achieve electrical connection; the sixth VPX connector is plugged into the eighth VPX connector to achieve electrical connection.

[0059] In actual application, the central control module only needs to be electrically connected to the routing board card in this embodiment to achieve communication with each functional board card 20. Compared with electrically connecting to each functional board card 20, the wiring is more convenient. Specifically, the signal data output by the hollow module is forwarded to each functional board card 20 through the routing board card, and the functional board card 20 outputs a control signal to the quantum chip in the quantum computer to realize the quantum bit regulation and measurement operations on the quantum chip; at the same time, the feedback data of the functional board card 20 is also forwarded to the server through the routing board card for data processing.

[0060] By arranging the routing board card perpendicular to the backplane 40, the overall integration of the board card integrated component is improved. At the same time, since the fifth VPX connector and the sixth VPX connector on the backplane 40 are electrically connected by a signal line, the fifth VPX connector on the backplane 40 is plugged into the seventh VPX connector on the functional board card 20; the sixth VPX connector on the backplane 40 is plugged into the eighth VPX connector on the routing board card, thereby realizing the electrical connection between the routing board card and the functional board card 20 through the backplane 40, and then the central control module is electrically connected to the routing board card to achieve communication with each functional board card 20, which is convenient for wiring.

[0061] In this embodiment, since the working frequency of the quantum chip is relatively high, therefore, the frequency of the control signals generated by each functional board card 20 is also relatively high. Therefore, when the functional board card 20 is working, the heat generation is large. When multiple functional board cards 20 are integrated in the chassis 10, the heat dissipation problem needs to be solved.

[0062] Figure 4 Schematic three - dimensional structure diagram of the chassis 10 provided by the embodiment of the present utility model; Figure 5 Exploded structure diagram of the chassis 10 provided by the embodiment of the present utility model; Figure 6 Front structure diagram of the first side plate 13 provided by the embodiment of the present utility model; Figure 8 Front structure diagram of the second side plate 14 provided by the embodiment of the present utility model.

[0063] In order to solve the heat dissipation problem, in some embodiments of this embodiment, such as Figure 4 , 5 As shown in FIGS. 6 and 8: The chassis 10 includes a top plate 11, a bottom plate 12, and a first side plate 13 and a second side plate 14 that are disposed between the top plate 11 and the bottom plate 12 and are arranged oppositely.

[0064] A plurality of first slots 131 and a plurality of second slots 141 that are arranged oppositely are respectively provided on the first side plate 13 and the second side plate 14. The first slots 131 and the second slots 141 are respectively used to support both ends of the functional board 20 or the routing board or the signal source board 30; Oppositely arranged first air inlets 132 and first air outlets 142 are respectively provided on the side walls of the first slots 131 and the second slots 141.

[0065] A first fan is provided on the first surface of the first side plate 13 away from the first slots 131, and a second fan 17 is provided on the first surface of the second side plate 14 away from the second slots 141.

[0066] In the chassis 10 of this embodiment, by respectively providing a plurality of first slots 131 and a plurality of second slots 141 that are arranged oppositely on the first side plate 13 and the second side plate 14, the first slots 131 and the second slots 141 are respectively used to support both ends of the functional board 20 or the routing board or the signal source board 30; By respectively providing oppositely arranged first air inlets 132 and first air outlets 142 on the side walls of the first slots 131 and the second slots 141, a first fan is provided on the first surface of the first side plate 13 away from the first slots 131, and a second fan 17 is provided on the first surface of the second side plate 14 away from the second slots 141. In this way, the first fan inhales external air from the first air inlet 132 and sends it into the interior of the chassis 10. The air passes through the functional board 20, and then the second fan 17 discharges the heated air out of the chassis 10 through the first air outlet 142, so as to efficiently dissipate the heat on the functional board 20, the routing board, and the signal source board 30 to the outside of the chassis 10 to meet the requirement of efficient heat dissipation.

[0067] In order to further improve the heat dissipation effect and reduce the weight of the chassis 10, in some embodiments of the present embodiment, continue as Figure 4 shown: A first groove is provided on one side of the top plate 11 opposite to the bottom plate 12; A second groove 121 is provided on one side of the bottom plate 12 opposite to the top plate 11.

[0068] In this embodiment, the number of the first grooves is not specifically limited, and can be 1 or multiple; The arrangement of multiple first grooves is not specifically limited either. Exemplarily, multiple first grooves are arranged in an array. The number of the second grooves 121 is not specifically limited, and can be 1 or multiple; The arrangement of multiple second grooves 121 is not specifically limited either. Exemplarily, multiple second grooves 121 are arranged in an array.

[0069] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, continue as Figure 4 shown: A plurality of the first slots 131 are arranged in parallel, and a plurality of the second slots 141 are arranged in parallel. By arranging a plurality of first slots 131 in parallel and a plurality of second slots 141 in parallel, it is such that the heat dissipation channels of each functional board 20, signal source board 30, and routing board are arranged in parallel, reducing the mutual interference between the heat dissipation channels of each board and improving the heat dissipation effect.

[0070] In this embodiment, the number of the first fans is not specifically limited, and can be 1 or multiple. In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, a plurality of the first fans are arranged in an array, and a plurality of the first fans are arranged along different heights. Exemplarily, 6 first fans are arranged along 3 height directions, with 2 first fans arranged in each height direction; Of course, a plurality of first fans can also be arranged along the same height direction. Exemplarily, 2 first fans are arranged, and the 2 first fans are arranged at intervals along the same height direction.

[0071] In this embodiment, the number of the second fans 17 is not specifically limited, and can be 1 or multiple. In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, a plurality of the second fans 17 are arranged in an array, and a plurality of the second fans 17 are arranged along different heights. Exemplarily, 6 second fans 17 are arranged along 3 height directions, with 2 second fans 17 arranged in each height direction (as Figure 5 shown); Of course, a plurality of second fans 17 can also be arranged along the same height direction. Exemplarily, 2 second fans 17 are arranged, and the 2 second fans 17 are arranged at intervals along the same height direction.

[0072] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, Figure 7Schematic diagram of the reverse side of the first side plate 13 provided by an embodiment of the present utility model, Figure 9 Schematic diagram of the reverse side of the second side plate 14 provided by an embodiment of the present utility model, as Figure 7 and Figure 9 shown: A first partition 133 is provided on the first surface of the first side plate 13, and the first partition 133 is used to separate the first fans at different heights; A second partition 143 is provided on the first surface of the second side plate 14, and the second partition 143 is used to separate the second fans 17 at different heights. By providing the first partition 133 and the second partition 143, the mutual interference between different heat dissipation channels is reduced, and the heat dissipation effect is improved.

[0073] Furthermore, any two adjacent first fans can also be separated by partitions; this can further reduce the air flow interference between the first fans, improve the heat dissipation efficiency of each heat dissipation channel, and improve the heat dissipation effect.

[0074] Furthermore, any two adjacent second fans 17 can also be separated by partitions; this can further reduce the air flow interference between the second fans 17, improve the heat dissipation efficiency of each heat dissipation channel, and improve the heat dissipation effect.

[0075] Continuing as Figure 4 and Figure 5 shown, in some embodiments of the present embodiment, the chassis 10 further includes a first outer cover plate 15 covering the first surface of the first side plate 13 and a second outer cover plate 16 covering the first surface of the second side plate 14; A second air inlet is provided on the first outer cover plate 15, and a second air outlet is provided on the second outer cover plate 16. By providing the first outer cover plate 15 and the second outer cover plate 16, and at the same time, a second air inlet is provided on the first outer cover plate 15 and a second air outlet is provided on the second outer cover plate 16, in this way, while ensuring the heat dissipation effect, it also plays a role in dust prevention.

[0076] In the present embodiment, the second air inlet can be a plurality of through holes arranged in an array; the second air outlet can be a plurality of through holes arranged in an array.

[0077] Figure 10 Schematic diagram of the structure of the functional board 20 provided by an embodiment of the present utility model after arranging heat sinks and locking bars 50; Figure 11 Schematic diagram of the structure of the signal source board 30 provided by an embodiment of the present utility model after arranging heat sinks and locking bars 50.

[0078] In order to further improve the heat dissipation effect, in some embodiments of the present embodiment, as Figure 10 and Figure 11As shown: Heat dissipation plates 60 are provided on the outer walls of the functional board 20, the routing board, and the signal source board 30. A plurality of heat dissipation channels arranged in parallel are provided on the heat dissipation plates 60; the relatively arranged first air inlet 132 and the first air outlet 142 are respectively arranged at both ends of the heat dissipation channels. Specifically, generally, the functional board 20, the routing board, and the signal source board 30 are each composed of a PCB board integrating electronic components and a cover plate covering the PCB board, and the heat dissipation plate 60 is arranged on the outer wall of the cover plate.

[0079] In this embodiment, by providing heat dissipation plates 60 on the outer walls of the functional board 20, the routing board, and the signal source board 30, and a plurality of heat dissipation channels arranged in parallel are provided on the heat dissipation plates 60; the relatively arranged first air inlet 132 and the first air outlet 142 are respectively arranged at both ends of the heat dissipation channels; with such an arrangement, the mutual interference between different heat dissipation channels is reduced, and the heat dissipation effect is improved.

[0080] To further improve the heat dissipation effect, in some embodiments of this embodiment, continue as Figure 10 and Figure 11 As shown: Locking strips 50 are provided on the outer walls at both ends of the functional board 20, the routing board, and the signal source board 30. The locking strips 50 are in contact with the inner walls of the relatively arranged first slots 131 or the second slots 141, and the locking strips 50 are made of aluminum alloy.

[0081] In this embodiment, by using the locking strips 50 made of aluminum alloy, while ensuring locking, it also ensures efficient heat conduction between the functional board 20, the routing board, and the signal source board 30 and the first slots 131 and the second slots 141, that is, it ensures efficient heat conduction between the functional board 20 and the chassis 10, thereby improving the heat dissipation effect.

[0082] Based on the same inventive concept, the embodiment of the present application also proposes a quantum computing measurement and control system, including the above-mentioned board integration component and a central control module. The central control module controls the functional board 20 in the board integration component to output a control signal for the quantum chip. The quantum computing measurement and control system of the present application includes the above-mentioned board integration component, so it has the same beneficial effects as the above-mentioned board integration component, which will not be elaborated here.

[0083] Based on the same inventive concept, the embodiment of the present application also proposes a quantum computer, including the above-mentioned quantum computing measurement and control system and a quantum chip. The quantum chip operates based on the control signal output by the quantum computing measurement and control system. The quantum computer of the present application includes the above-mentioned quantum computing measurement and control system, so it has the same beneficial effects as the above-mentioned quantum computing measurement and control system, which will not be elaborated here.

[0084] In the description of this specification, the description referring to terms such as "some embodiments" or "examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0085] The above are only the preferred embodiments of the present utility model and do not impose any limitation on the present utility model. Any person skilled in the art within the technical field, without departing from the technical solution of the present utility model, makes any form of equivalent replacement or modification and other changes to the technical solution and technical content disclosed by the present utility model, all of which belong to the content within the technical solution of the present utility model and still fall within the protection scope of the present utility model.

Claims

1. A board-to-card integrated component, characterized in that: It includes a chassis, a backplane arranged in the chassis, a signal source board and a plurality of function boards; The signal source board and the plurality of function boards are arranged in parallel array and perpendicular to the backplane; the signal source board is used to provide a reference signal for the plurality of function boards; the function board is used to generate a control signal required by the quantum chip based on the reference signal; The backplane is provided with a first VPX connector and a second VPX connector electrically connected through a signal line; the signal source board is provided with a third VPX connector, and the function board is provided with a fourth VPX connector; the first VPX connector is plugged into the third VPX connector to achieve electrical connection, and the second VPX connector is plugged into the fourth VPX connector to achieve electrical connection.

2. The board-to-card integrated component according to claim 1, characterized in that: The signal source board includes a PCB board, and the PCB board is integrated with: Crystal oscillator source, used to provide 100M clock signal; A first power division module, used for power-dividing the 100M clock signal into multiple 100M first signals; Among them, any one of the several function boards is electrically connected to the first power division module and is used to receive the first signal as a reference signal.

3. The board-to-card integrated assembly according to claim 2, characterized in that: The PCB board also integrates: A frequency multiplication module, electrically connected to the first power division module, configured to receive the first signal and perform frequency multiplication processing to obtain a second signal and output the second signal to the second power division module; A second power splitting module, used for power splitting the second signal into multiple third signals; Among them, at least one of the plurality of function boards is used to receive the third signal.

4. The board-to-card integrated assembly according to claim 1, characterized in that: Also included is a routing board, wherein the routing board is arranged perpendicular to the backplane; The backplane is also provided with a fifth VPX connector and a sixth VPX connector electrically connected through a signal line, and the functional board is also provided with a seventh VPX connector; the routing board is provided with an eighth VPX connector; the fifth VPX connector is plugged into the seventh VPX connector to achieve electrical connection; the sixth VPX connector is plugged into the eighth VPX connector to achieve electrical connection.

5. The board-to-card integrated assembly according to claim 4, characterized in that: The chassis comprises a top plate, a bottom plate, and a first side plate and a second side plate which are arranged between the top plate and the bottom plate and are opposite to each other; The first side panel and the second side panel are respectively provided with a plurality of first slots and a plurality of second slots arranged opposite to each other, and the first slots and the second slots are respectively used to support two ends of the function board or the routing board or the signal source board; the side walls of the first slot and the second slot are respectively provided with a first air inlet and a first air outlet arranged opposite to each other; A first fan is disposed on a first surface of the first side plate away from the first slot, and a second fan is disposed on a first surface of the second side plate away from the second slot.

6. The board-to-card integrated assembly according to claim 5, characterized in that: There are a plurality of first fan arrays, and the plurality of first fans are arranged at different heights; A plurality of the second fan arrays are arranged, and the plurality of second fans are arranged at different heights.

7. The board-to-card integrated assembly according to claim 6, characterized in that: A first partition is provided on the first surface of the first side plate, and the first partition is used to separate the first fans at different heights; A second partition is provided on the first surface of the second side plate, and the second partition is used to separate the second fans at different heights.

8. The board-to-card integrated assembly according to claim 5, characterized in that: The outer walls of the functional board, the routing board and the signal source board are all provided with a heat sink, and the heat sink is provided with a plurality of heat dissipation channels arranged in parallel; The first air inlet and the first air outlet are arranged opposite to each other at two ends of the heat dissipation channel respectively; Alternatively, locking strips are provided on outer walls at both ends of the function board, the routing board and the signal source board, the locking strips are in contact with the slot walls of the first slot or the second slot arranged oppositely, and the locking strips are made of aluminum alloy.

9. A quantum computing measurement and control system, characterized in that: It comprises a board-card integrated component as described in any one of claims 1 to 8, and a central control module, wherein the central control module controls a functional board in the board-card integrated component to output a control signal for a quantum chip.

10. A quantum computer, characterized in that: It comprises the quantum computing measurement and control system as claimed in claim 9 and a quantum chip, wherein the quantum chip operates based on a control signal output by the quantum computing measurement and control system.

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