Transparent display module and terminal equipment

Abstract

The embodiment of the utility model discloses a transparent display module and terminal equipment, the transparent display module comprises a supporting back plate, a display panel, a protective cover plate and a heat dissipation layer, the heat dissipation layer is made of a heat conduction characteristic material with the transmittance greater than or equal to 97%, the influence of the heat dissipation layer on the light emitting brightness is reduced, and high light emitting brightness and high heat dissipation efficiency are both achieved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a transparent display module and a terminal device. Background Art

[0002] Transparent display products have gradually covered fields such as commercial display windows, automotive windows, and interior decorations. Due to their transparent requirements and structures, the implementation of heat dissipation solutions is restricted. Traditional means such as thermal conductive adhesives and heat dissipation backplates are not applicable to transparent displays. At the same time, transparent displays require high brightness for a better viewing experience, which brings higher heat dissipation requirements. In particular, current transparent display products have high heat generation power consumption, and the brightness attenuation increases geometrically at high temperatures, which in turn affects the high-brightness performance. Therefore, how to improve the heat dissipation efficiency while ensuring high brightness has become an urgent problem to be solved in transparent displays.

[0003] Therefore, there is a technical problem that it is difficult to balance high light output brightness and high heat dissipation efficiency in existing transparent display modules. Utility Model Content

[0004] Embodiments of this application provide a transparent display module and a terminal device, which can alleviate the technical problem that it is difficult to balance high light output brightness and high heat dissipation efficiency in existing transparent display modules.

[0005] Embodiments of this application provide a transparent display module, including:

[0006] A support backplane;

[0007] A display panel, disposed above the support backplane, the display panel including a transparent substrate, a metal wiring layer, and a light-emitting unit stacked in sequence;

[0008] A protection cover plate, disposed on a side of the display panel away from the support backplane;

[0009] A heat dissipation layer, disposed on at least one surface of the support backplane, the display panel, and the protection cover plate;

[0010] Wherein, the transmittance of the heat dissipation layer is greater than or equal to 97%.

[0011] Optionally, in some embodiments of this application, the heat dissipation layer is a graphene material layer, and the graphene material layer uniformly covers a side of the support backplane facing away from the protection cover plate, and the thickness of the graphene material layer is less than or equal to 0.4 nm.

[0012] Optionally, in some embodiments of this application, the heat dissipation layer is any one or a combination layer of two or more of a graphene material layer, a copper layer, and a graphite material layer, and a positive projection of the heat dissipation layer on the display panel falls within the metal wiring layer.

[0013] Optionally, in some embodiments of the present application, the display panel includes a display area and a non-display area. The heat dissipation layer is disposed in the display area and extends to the non-display area. The transparent display module further includes a metal frame, and the metal frame is in partial contact with the heat dissipation layer located in the non-display area.

[0014] Optionally, in some embodiments of the present application, the heat dissipation layer includes a grid-like structure located in the display area and a continuous structure located in the non-display area.

[0015] Optionally, in some embodiments of the present application, the heat dissipation layer is disposed on a surface of the transparent substrate facing the support backplane, and an edge of the support backplane facing the metal frame is recessed relative to an edge of the transparent substrate to expose a part of the heat dissipation layer. The metal frame is connected to the support backplane and is in contact with the exposed part of the heat dissipation layer.

[0016] Optionally, in some embodiments of the present application, within the display area, the shape of the grid-like structure of the heat dissipation layer is the same as the shape of the metal trace layer.

[0017] Optionally, in some embodiments of the present application, a thermal conductive silicone is further disposed between the heat dissipation layer and the metal frame, and the thermal conductive silicone is sandwiched between the heat dissipation layer and the metal frame.

[0018] Optionally, in some embodiments of the present application, a fan is further disposed on one side of the metal frame, and the air outlet direction of the fan is oriented towards the metal frame.

[0019] An embodiment of the present application provides a terminal device, including the transparent display module as described in any of the above embodiments.

[0020] Beneficial effects: By using a heat-conductive material with a transmittance greater than or equal to 97% for the heat dissipation layer, the influence of the heat dissipation layer on the light output brightness is reduced, so as to achieve both high light output brightness and high heat dissipation efficiency, and alleviate the technical problem that it is difficult to balance high light output brightness and high heat dissipation efficiency in the existing transparent display module. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1It is the first cross-sectional schematic diagram of the transparent display module provided by this application;

[0023] Figure 2 It is the top view schematic diagram of the heat dissipation layer in the transparent display module provided by this application;

[0024] Figure 3 It is the second cross-sectional schematic diagram of the transparent display module provided by this application.

[0025] Explanation of reference numerals:

[0026] Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of this application will be described with reference to the accompanying drawings in the embodiments of this application. The technical solutions described below are only used to explain and illustrate the idea of this application, and should not be regarded as a limitation on the protection scope of this application.

[0028] In addition, terms such as "first", "second" and similar words do not represent any order, quantity or importance, but are only used to distinguish different technical features. The term "a plurality of" and similar words mean two or more, unless otherwise clearly defined.

[0029] Please refer to Figure 1 、 Figure 2 The transparent display module 1 provided by this application includes a support backplane 10, a display panel 20, and a protection cover plate 30 arranged in sequence. The display panel 20 includes a transparent substrate 201, a metal wiring layer, and a light-emitting unit 202. A heat dissipation layer 40 is arranged on at least one surface of the support backplane 10, the display panel 20, and the protection cover plate 30. The preparation material of the heat dissipation layer 40 is any one of graphene, copper, and graphite. At least part of the heat dissipation layer 40 has a grid-like structure. In the film thickness direction, the metal wiring layer covers the heat dissipation layer 40.

[0030] Among them, any two adjacent ones of the support backplane 10, the display panel 20, the protection cover plate 30, and the heat dissipation layer 40 can be bonded through an adhesive layer.

[0031] Among them, the display panel 20 further includes a protection adhesive layer 203 that entirely covers the light-emitting unit 202. The protection adhesive layer 203 is arranged on the side of the light-emitting unit 202 away from the support backplane 10.

[0032] In this embodiment, by using a heat-conducting material with a transmittance greater than or equal to 97% for the heat dissipation layer 40, the influence of the heat dissipation layer 40 on the light output brightness is reduced, thereby achieving both high light output brightness and high heat dissipation efficiency, and alleviating the technical problem that it is difficult to balance high light output brightness and high heat dissipation efficiency in existing transparent display modules.

[0033] The technical solution of the present application will now be described in conjunction with specific embodiments.

[0034] The present application is only illustrated by taking a light-emitting diode display (Micro Light Emitting Diode Display, MLED) as an example, and the same applies to other transparent display solutions.

[0035] In addition, the preparation materials of the present application, the setting position of the heat dissipation layer 40, the thickness of the heat dissipation layer 40, etc. are only described in the best or better implementation manners. Other alternative solutions that can meet the requirements of achieving both high light output brightness and high heat dissipation efficiency of the transparent display module 1 should also fall within the protection scope of the present invention and will not be elaborated here.

[0036] In one embodiment, the preparation material of the heat dissipation layer 40 is any one of graphene, copper, and graphite. At least part of the heat dissipation layer 40 has a grid-like structure. In the film thickness direction, the orthographic projection of the heat dissipation layer 40 on the display panel falls within the metal wiring layer.

[0037] In this embodiment, by using a heat-conducting material such as graphene, copper, or graphite for the heat dissipation layer 40, the heat dissipation efficiency of the transparent display module 1 is improved. At the same time, part of the heat dissipation layer 40 is arranged in a grid-like structure, so that the metal wiring layer covers the heat dissipation layer 40 in the film thickness direction, reducing the influence of the heat dissipation layer 40 on the light output brightness, thereby achieving both high light output brightness and high heat dissipation efficiency, and alleviating the technical problem that it is difficult to balance high light output brightness and high heat dissipation efficiency in existing transparent display modules 1.

[0038] In one embodiment, the heat dissipation layer 40 is a graphene material layer, and the graphene material layer evenly covers the side of the support backplane 10 facing away from the protection cover plate 30, and the thickness of the graphene material layer is less than or equal to 0.4 nm.

[0039] In one embodiment, the preparation material of the adhesive layer is a transparent material.

[0040] Among them, the adhesive layer can be at least one of a pressure-sensitive adhesive and a photosensitive adhesive.

[0041] Among them, the adhesive layer is a thermally conductive adhesive.

[0042] Among them, the adhesive layer can be a thermally conductive silica gel.

[0043] In this embodiment, the adhesive layer is used to bond adjacent film layers to increase the bonding strength between adjacent film layers. Meanwhile, the adhesive layer is made of transparent material, which can reduce the effect of the adhesive layer on the light transmittance of the light emitted by the light emitting unit 202 .

[0044] In one embodiment, the adhesive layer includes a first adhesive layer 60 and a second adhesive layer 70 , wherein the first adhesive layer 60 is located between the supporting back plate 10 and the display panel 20 , and the second adhesive layer 70 is located between the protective cover plate 30 and the display panel 20 .

[0045] The first adhesive layer 60 serves to bond the supporting back plate 10 and the display panel 20 , and the second adhesive layer 70 serves to bond the protective cover plate 30 and the display panel 20 .

[0046] In one embodiment, the display panel includes a display area 2 and a non-display area 3, the heat dissipation layer 40 is arranged in the display area 2 and extends to the non-display area 3, and the transparent display module 1 also includes a metal frame 50, and the metal frame 50 is arranged in contact with a portion of the heat dissipation layer 40 located in the non-display area 3.

[0047] The metal frame 50 is in surface contact with the heat dissipation layer 40 .

[0048] It is understandable that the metal frame 50 located in the non-display area 3 does not affect the light brightness, so the metal frame 50 in the non-display area 3 can be continuously arranged to increase the contact area between the metal frame 50 and the heat dissipation layer 40 and enhance the heat dissipation efficiency.

[0049] It is understandable that one end of the metal frame 50 overlaps the heat dissipation layer 40 , and the other end of the metal frame 50 is connected to the housing, so that the heat of the heat dissipation layer 40 can be discharged through the metal frame 50 to avoid heat accumulation.

[0050] In this embodiment, a metal frame 50 is provided in the non-display area 3 to conduct heat from the heat dissipation layer 40 , thereby avoiding a high temperature environment caused by heat accumulation of the heat dissipation layer 40 without affecting the brightness of the light.

[0051] In one embodiment, the heat dissipation layer includes a grid structure located in the display area 2 and a continuous structure located in the non-display area 3 .

[0052] The heat dissipation layer 40 of the display area 2 includes a hollow area, and the hollow area is arranged in alignment with the light-emitting unit 202 .

[0053] It can be understood that the metal wiring layer includes driving wirings such as scanning lines and data lines located in the display area 2, and also includes thin film transistors and related signal wirings located in the display area 2. By setting the heat dissipation layer 40 in the display area 2 as a grid-like structure, the heat dissipation layer 40 and the metal wiring layer can be overlapped or coincided with each other in the film thickness direction, reducing the influence of the heat dissipation layer 40 on the light output brightness.

[0054] It can be understood that the heat dissipation layer 40 in the non-display area 3 does not affect the light output brightness and can be continuously arranged to increase the contact area between the heat dissipation layer 40 and the metal frame 50, thereby improving the heat dissipation efficiency of the heat dissipation layer 40.

[0055] In one embodiment, the heat dissipation layer 40 is disposed on a surface of the transparent substrate 201 facing the support backplane 10, and an edge of the support backplane 10 facing the metal frame 50 is set to be retracted relative to an edge of the transparent substrate 201 to expose a part of the heat dissipation layer 40, and the metal frame 50 is connected to the support backplane 10 and contacts the exposed part of the heat dissipation layer 40.

[0056] Wherein, an edge of the transparent substrate 201 is flush with an edge of the heat dissipation layer 40.

[0057] It can be understood that by directly disposing the heat dissipation layer 40 on a surface of the transparent substrate 201, the edge of the support backplane 10 can be retracted relative to the edge of the transparent substrate 201, and the edge of the heat dissipation layer 40 is flush with the edge of the transparent substrate 201, so that the bottom surface of the heat dissipation layer 40 is exposed, facilitating the contact between the metal frame 50 and the exposed surface of the heat dissipation layer 40.

[0058] It should be noted that due to the retracted setting of the edge of the support backplane 10, the width of the border can also be reduced to achieve a narrow border.

[0059] In this embodiment, through the retracted setting of the edge of the support backplane 10, on the one hand, one surface of the heat dissipation layer 40 can be exposed and contact with the metal frame 50, thereby enhancing the heat dissipation efficiency. On the other hand, the retraction of the support backplane 10 can also reduce the width of the border to achieve a narrow border design.

[0060] In one embodiment, please refer to Figure 3 , the heat dissipation layer 40 is disposed on a surface of the support backplane 10 facing the protection cover plate 30, an edge of the transparent substrate 201 facing the metal frame 50 is set to be retracted relative to an edge of the support backplane 10, and the metal frame 50 contacts a surface of the heat dissipation layer 40 far from the support backplane 10 and a side surface of the heat dissipation layer 40.

[0061] It can be understood that when the heat dissipation layer 40 is directly prepared on the surface of the transparent substrate 201, the display panel 20 has the following defects: it is prone to abnormalities due to being unable to withstand the high temperature generated during graphene coating, or in some transparent display devices, it is impossible to coat the heat dissipation layer 40 on the transparent substrate 201 due to process limitations. Therefore, setting the heat dissipation layer 40 on one side surface of the support backplane 10 can avoid the occurrence of the above defects.

[0062] In one embodiment, the heat dissipation layer 40 can be disposed on one side surface of the protection cover plate 30 facing the display panel 20.

[0063] In some embodiments, the heat dissipation layer 40 can also be disposed on the outer side surfaces of the protection cover plate 30 and the support backplane 10.

[0064] In one embodiment, a thermal conductive silica gel is further disposed between the heat dissipation layer 40 and the metal frame 50, and the thermal conductive silica gel is clamped between the heat dissipation layer 40 and the metal frame 50.

[0065] Wherein, the heat dissipation layer 40 and the metal frame 50 are indirectly in contact through the thermal conductive silica gel.

[0066] In this embodiment, by adding the thermal conductive silica gel between the metal frame 50 and the heat dissipation layer 40, the thermal conductive effect between the metal frame 50 and the heat dissipation layer 40 is improved by using the thermal conductive silica gel, and the heat dissipation efficiency of the transparent display module 1 is enhanced.

[0067] In one embodiment, a fan is further disposed on one side of the metal frame 50, and the air outlet direction of the fan is set to face the metal frame 50.

[0068] In this embodiment, the heat dissipation efficiency of the metal frame 50 is improved by setting the fan, so that the heat of the metal frame 50 will not accumulate, thereby enhancing the heat dissipation efficiency.

[0069] In one embodiment, within the display area 2, the shape of the grid-like structure of the heat dissipation layer 40 is the same as the shape of the metal wiring layer.

[0070] In one embodiment, the heat dissipation layer 40 is a single-layer structure of graphene, and the thickness of the single-layer structure of graphene is less than 0.34 nanometers.

[0071] It can be understood that the thickness of the single-layer structure of graphene is small, and the light transmittance is high, and its light transmittance is greater than 97%.

[0072] In this embodiment, by making the heat dissipation layer 40 a single-layer structure of graphene, the light output brightness of the transparent display module 1 is further improved.

[0073] In one embodiment, the heat dissipation layer may also be a multi-layer structure.

[0074] Wherein, the multi-layer structure may be a stacked structure of multi-layer graphene.

[0075] The present utility model takes into account the realization of high light extraction brightness and high heat dissipation efficiency of the transparent display module 1 through the design of the heat dissipation layer 40. On the one hand, a high thermal conductivity material is used to improve the heat dissipation efficiency of the heat dissipation layer 40. On the other hand, the heat dissipation layer 40 has a grid-like structure, and the metal wiring layer can cover the heat dissipation layer 40 in the film thickness direction, so that the heat dissipation layer 40 is hidden under the metal wiring layer without affecting the transmittance, thereby improving the light extraction brightness.

[0076] The present application also provides a terminal device, which includes the above-mentioned transparent display module. Among them, the terminal device includes, but is not limited to, mobile phones, laptop computers, and tablet computers.

[0077] The transparent display module provided by the embodiment of the present application includes a support backplane, a display panel, and a protection cover plate arranged in sequence. The heat dissipation layer is arranged on at least one surface of the support backplane, the display panel, and the protection cover plate. By using a heat-conducting material with a transmittance greater than or equal to 97% for the heat dissipation layer, the influence of the heat dissipation layer on the light extraction brightness is reduced, so as to take into account the realization of high light extraction brightness and high heat dissipation efficiency, and alleviate the technical problem that it is difficult to balance high light extraction brightness and high heat dissipation efficiency in the existing transparent display module.

[0078] The above has introduced in detail the transparent display module provided by the embodiment of the present application. Without departing from the spirit and essential points of the present application, those skilled in the art can make various corresponding changes and deformations according to the present application, but these corresponding changes and deformations should all fall within the protection scope of the claims attached to the present application.

Claims

1. A transparent display module, characterized in that: include: Support back panel; A display panel is arranged above the supporting backplane, and the display panel comprises a transparent substrate, a metal wiring layer and a light-emitting unit which are stacked in sequence; A protective cover plate, arranged on a side of the display panel away from the supporting back plate; A heat dissipation layer, disposed on at least one of the surface of the supporting back plate, the display panel, and the protective cover plate; Wherein, the transmittance of the heat dissipation layer is greater than or equal to 97%.

2. The transparent display module according to claim 1, characterized in that: The heat dissipation layer is a graphene material layer, the graphene material layer is evenly covered on a side of the supporting back plate away from the protective cover plate, and the thickness of the graphene material layer is less than or equal to 0.4 nm.

3. The transparent display module according to claim 1, wherein: The heat dissipation layer is any one of a graphene material layer, a copper layer, and a graphite material layer, or a combination of two or more thereof. The orthographic projection of the heat dissipation layer on the display panel falls within the metal wiring layer.

4. The transparent display module according to claim 3, characterized in that: The display panel includes a display area and a non-display area, the heat dissipation layer is arranged in the display area and extends to the non-display area, and the transparent display module also includes a metal frame, and the metal frame is arranged in contact with the heat dissipation layer portion located in the non-display area.

5. The transparent display module according to claim 4, characterized in that: The heat dissipation layer includes a grid structure located in the display area and a continuous structure located in the non-display area.

6. The transparent display module according to claim 5, characterized in that: The heat dissipation layer is arranged on a surface of one side of the transparent substrate facing the supporting back plate, and the edge of the supporting back plate facing the metal frame is retracted relative to the edge of the transparent substrate to expose a portion of the heat dissipation layer, and the metal frame is connected to the supporting back plate and contacts with the exposed portion of the heat dissipation layer.

7. The transparent display module according to claim 5, characterized in that: In the display area, the shape of the grid structure of the heat dissipation layer is the same as the shape of the metal wiring layer.

8. The transparent display module according to claim 7, wherein: A heat-conducting silica gel is also arranged between the heat dissipation layer and the metal frame, and the heat-conducting silica gel is sandwiched between the heat dissipation layer and the metal frame.

9. The transparent display module according to claim 4, wherein: A fan is also arranged on one side of the metal frame, and the air outlet direction of the fan is arranged toward the metal frame.

10. A terminal device, characterized in that: It comprises the transparent display module as claimed in any one of claims 1 to 9.

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