Communication module and intelligent device

Abstract

The utility model discloses a communication module and intelligent equipment, the communication module is applied to the intelligent equipment, the communication module comprises a circuit substrate, a first metal wire, a second metal wire, a chip, an antenna and a first pin bonding pad, and the circuit substrate comprises a first surface and a second surface which are oppositely arranged; the first metal wire is arranged on the circuit substrate in a penetrating manner; the second metal wire is located on the first surface; the chip is attached to the first surface; the antenna is located in the circuit substrate, and the antenna is electrically connected with the chip through the second metal wire; and the plurality of first pin bonding pads are located on the second surface, the first pin bonding pads are located between the antenna and the chip, and the first pin bonding pads are electrically connected with the chip through the first metal wires. Through the arrangement, the applicability of the communication module and the intelligent equipment is improved.

Description

Technical Field

[0001] This application relates to the field of Internet of Things technology, and in particular to a communication module and an intelligent device. Background Art

[0002] An intelligent device usually has a communication module. The intelligent device is connected to external devices (such as lights or speakers) through the communication module, so that the intelligent device can control the external devices.

[0003] In the prior art, the pin pads of the communication module are usually arranged on the side of the circuit board substrate. Then, the pin pads are connected to the chip through the metal traces located on the top layer. Since the antenna is also connected to the chip through the antenna traces located on the top layer, the substrate area between the antenna and the chip is occupied by the antenna traces. Therefore, in the prior art, the pads usually cannot be arranged between the antenna and the chip, resulting in a small number of pads in the prior art, thus unable to meet the usage requirements in diverse application scenarios. Summary of the Utility Model

[0004] In order to solve the deficiencies of the prior art, the purpose of this application is to provide a communication module and an intelligent device with high applicability.

[0005] To achieve the above purpose, the following technical solutions are adopted in this application:

[0006] A communication module is applied to an intelligent device. The communication module includes: a circuit board substrate, a first metal trace, a second metal trace, a chip, an antenna, and a first pin pad. The circuit board substrate includes a first surface and a second surface arranged opposite to each other; the first metal trace penetrates through the circuit board substrate; the second metal trace is located on the first surface; the chip is attached to the first surface; the antenna is located inside the circuit board substrate, and the antenna is electrically connected to the chip through the second metal trace; a plurality of first pin pads are located on the second surface, the first pin pads are located between the antenna and the chip, and the first pin pads are electrically connected to the chip through the first metal trace.

[0007] Further, the circuit board substrate includes a top layer and a bottom layer distributed in the front-rear direction. The top layer is in front of the bottom layer, and the antenna is located inside the top layer.

[0008] Further, the antenna extends in the left-right direction and is bent in a bow shape.

[0009] Further, the first pin pads are distributed in the left-right direction, and the distance between adjacent first pin pads is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

[0010] Further, the communication module further includes second pin pads, and a plurality of second pin pads are located on the second surface. The second pin pads are electrically connected to the chip through first metal traces, and the second pin pads and the first pin pads are arranged in a square shape.

[0011] Further, the distance between adjacent second pin pads is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

[0012] Further, the first pin pads are ground pads, and the second pin pads are interface pads for connecting external devices.

[0013] Further, a reference plane perpendicular to the front-back direction is defined, and the area of the projection of the communication module on the reference plane in the front-back direction is greater than or equal to 200 mm 2 and less than or equal to 240 mm 2 .

[0014] Further, the communication module further includes a shielding cover, and the shielding cover is disposed on the chip, and the chip is shielded from external magnetic fields through the shielding cover.

[0015] The present application also provides an intelligent device, and the intelligent device includes the communication module of any one of the above.

[0016] By providing the first metal traces passing through the circuit board and the first pin pads located between the chip and the antenna, the number of pin pads of the communication module is increased, so that the communication module can be connected to more external devices, and thus the communication module can meet the usage requirements in diverse application scenarios, thereby improving the applicability of the communication module. Description of the Drawings

[0017] Figure 1 is the front view of the communication module in the embodiment of the present application;

[0018] Figure 2 is the cross-sectional view of the communication module in the embodiment of the present application;

[0019] Figure 3 is the rear view of the communication module in the embodiment of the present application. Detailed Embodiments

[0020] In order to enable those skilled in the art to better understand the solution of the present application, the technical solutions in the specific embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0021] As shown in Figure 1 and Figure 2As shown in the figure, the present application provides a communication module 100, which is applied to intelligent devices, mainly to small intelligent devices such as intelligent lamps or intelligent speakers. The communication module 100 includes a circuit board 11, a first metal trace 12, a second metal trace 13, a chip 14, an antenna 15, and a first pin pad 16. The circuit board 11 is in a flat plate shape. The circuit board 11 includes a first surface 111 and a second surface 112, and the first surface 111 and the second surface 112 are distributed in the front-rear direction and are oppositely arranged. The first metal trace 12 penetrates through the circuit board 11 to connect related components located on the two surfaces of the circuit board 11. The second metal trace 13 is located on the first surface 111 of the circuit board 11. The chip 14 is attached to the first surface 111 of the circuit board 11 and is connected to the circuit board 11 by welding. The antenna 15 is located inside the circuit board 11, and the antenna 15 is connected to the chip 14 through the second metal trace 13, so that the chip 14 can communicate with an external communication device (such as a portable device) through the antenna 15, and then the external communication device can control the communication module 100. The number of the first pin pads 16 is several. The several first pin pads 16 are located on the second surface 112 of the circuit board 11, and the first pin pads 16 are located between the antenna 15 and the chip 14. The first pin pads 16 are connected to the chip 14 through the first metal trace 12. The first pin pads 16 can be connected to external devices such as lamps or speakers, and then the chip 14 can control the external devices. The first metal trace 12 and the second metal trace 13 are both copper foils. To clearly illustrate the technical solution of the application, the up, down, left, right, front, and rear directions as shown in Figure 1 and Figure 2 are also defined.

[0022] It should be noted that in the prior art, both the first metal trace and the second metal trace are located on the first surface of the circuit board. Since the antenna and the chip are connected through the second metal trace, the area between the antenna and the chip is occupied by the second metal trace, resulting in the inability to set the first pin pads between the antenna and the chip. In the present application, by setting the first metal trace 12 to penetrate through the circuit board 11 and setting the first pin pads 16 on the second surface 112 opposite to the first surface 111 where the chip 14 is located, the area between the antenna 15 and the chip 14 can be provided with the first pin pads 16, thereby increasing the number of pins of the communication module 100, enabling the communication module 100 to connect more external devices, enabling the communication module 100 to meet the usage requirements in diverse application scenarios, and thus improving the applicability of the communication module 100.

[0023] In the embodiment of the present application, the chip 14 is a 32-bit MCU with a frequency of 320 MHz, and the antenna 15 supports the latest WiFi6 communication standard. As a result, the communication module 100 provided by the present application has higher network speed and transmission efficiency compared to the communication modules in the prior art, while reducing network congestion. In addition, since the antenna 15 supporting the WiFi6 communication standard has low power consumption, the communication module 100 provided by the present application is also convenient to be applied in miniaturized intelligent devices.

[0024] As Figure 1 shown in Figure 2 FIG. [Specific figure number], as an implementation, the circuit board 11 is a multi-layer stacked board structure. The circuit board 11 at least includes a top layer 113, a bottom layer 114, a ground layer 115, and a power layer 116 distributed in the front-rear direction, wherein both the ground layer 115 and the power layer 116 are located between the top layer 113 and the bottom layer 114, and the top layer 113 is in front of the bottom layer 114, and the power layer 116 is in front of the ground layer 115. The antenna 15 is located in the top layer 113, and the antenna 15 extends in the left-right direction and is bent in a bow shape. Through the above settings, on the basis of ensuring the length of the antenna 15 remains unchanged, the length of the antenna 15 in the left-right direction can be reduced, and then while ensuring the radiation ability of the antenna 15 remains unchanged, the width of the circuit board 11 can be reduced, which is convenient for the communication module 100 to be applied in miniaturized intelligent devices.

[0025] It should be noted that in the prior art, if in order to ensure the length of the antenna remains unchanged while reducing the length of the antenna in the left-right direction, usually a part of the antenna is located in the top layer and another part of the antenna is located in the bottom layer, that is, the antenna is arranged in the multi-layer board of the circuit board through the antenna via holes, which will lead to the loss of the antenna efficiency performance. In the embodiment of the present application, by placing the antenna 15 entirely in the top layer 113, the loss of the performance of the antenna 15 due to the antenna via holes is avoided, thereby improving the performance of the antenna 15.

[0026] As Figure 2 shown in

[0027] As Figure 3As shown, as an implementation manner, a plurality of first pin pads 16 are evenly distributed in the left - right direction. The distance L1 between adjacent first pin pads 16 is greater than or equal to 0.3 mm and less than or equal to 0.5 mm. Further, the distance L1 between adjacent first pin pads 16 is greater than or equal to 0.35 mm and less than or equal to 0.45 mm. More preferably, the distance L1 between adjacent first pin pads 16 is equal to 0.4 mm. If the distance L1 between adjacent first pin pads 16 is too large, the number of first pin pads 16 is small, and further, the communication module 100 cannot connect to a large number of external devices. Since each first pin pad 16 is connected to the chip 14 through the first metal trace 12, if the distance L1 between adjacent first pin pads 16 is too small, the distance between the first metal traces 12 is small, that is, interference is likely to occur between adjacent first metal traces 12, making the layout of the first metal traces 12 difficult. Through the above settings, while increasing the number of external devices connected to the communication module 100, it is also convenient for the layout of the first metal traces 12.

[0028] Further, the communication module 100 further includes second pin pads 18. A plurality of second pin pads 18 are located on the second surface 112 of the circuit board 11. The second pin pads 18 and the first pin pads 16 together form a square - shaped arrangement, and the second pin pads 18 are also electrically connected to the chip 14 through the first metal traces 12. In the embodiment of the present application, the sum of the number of the first pin pads 16 and the second pin pads 18 is 53.

[0029] Specifically, some of the second pin pads 18 are distributed in the up - down direction, and some of the second pin pads 18 are also distributed in the left - right direction. The distance L2 between adjacent second pin pads 18 is greater than or equal to 0.3 mm and less than or equal to 0.5 mm. Further, the distance L2 between adjacent second pin pads 18 is greater than or equal to 0.35 mm and less than or equal to 0.45 mm. More preferably, the distance L2 between adjacent second pin pads 18 is equal to 0.4 mm. If the distance L2 between adjacent second pin pads 18 is too large, the number of second pin pads 18 is small, and further, the communication module 100 cannot connect to a large number of external devices. Since each second pin pad 18 is connected to the chip 14 through the first metal trace 12, if the distance L2 between adjacent second pin pads 18 is too small, the distance between the second metal traces 13 is small, that is, interference is likely to occur between adjacent second metal traces 13, making the layout of the second metal traces 13 difficult. Through the above settings, while increasing the number of external devices connected to the communication module 100, it is also convenient for the layout of the second metal traces 13.

[0030] Such as Figure 3As shown, as an implementation, a reference plane 101 perpendicular to the front-back direction is defined, and the area of the projection of the communication module 100 on the reference plane 101 in the front-back direction is greater than or equal to 200 mm 2 and less than or equal to 240 mm 2 . Further, the area of the projection of the communication module 100 on the reference plane 101 in the front-back direction is greater than or equal to 210 mm 2 and less than or equal to 230 mm 2 . More preferably, the area of the projection of the communication module 100 on the reference plane 101 in the front-back direction is equal to 220 mm 2 . It should be noted that since the pin pads of the communication module in the prior art are usually arranged on the left side, right side or lower side of the circuit board, that is, the pin pads in the prior art extend away from the circuit board, so the area of the projection of the communication module in the prior art on the reference plane in the front-back direction is relatively large. In this application, by arranging the first pin pad 16 and the second pin on the second surface 112 of the circuit board 11, the first pin pad 16 and the second pin pad 18 are prevented from protruding away from the circuit board 11. Therefore, the area of the projection of the communication module 100 provided in this application on the reference plane 101 in the front-back direction is relatively small, that is, the volume of the communication module 100 is relatively small. Furthermore, the communication module 100 provided in this application is convenient to be applied in miniaturized intelligent devices.

[0031] As an implementation, the first pin pad 16 is a ground pad, that is, the first pin pad 16 is connected to the ground wire, thereby realizing the grounding of the chip 14. The second pin pad 18 is an interface pad for connecting external devices, such as a network interface, an input / output interface, a PWM (Pulse Width Modulation) interface, a print log interface, and a power interface. The network interface is used to connect to an external network, the input / output interface is used for data interaction with external devices, the PWM interface is used to output a PWM waveform to control external devices. For example, when the PWM interface is connected to a lamp, increasing the duty cycle of the output PWM waveform can increase the brightness of the lamp. The print log interface is used to output the working log of the chip 14 to an external device, and the power interface is used to supply power to components such as the chip 14 and the antenna 15. Through the above settings, the communication module 100 can meet the usage requirements in different scenarios, thereby improving the applicability of the communication module 100.

[0032] This application also provides an intelligent device, which includes the above-mentioned communication module 100.

[0033] Exemplarily, the smart device is set as a smart lamp. The user can communicate with the communication module 100 through the antenna 15 by using a portable device, and then control the smart lamp through the chip 14 to realize functions such as turning on the light, turning off the light, and adjusting the brightness. When there are a large number of smart lamps, several smart lamps can also be simultaneously connected to the second pin pad 18 on the communication module 100, so as to realize the simultaneous control of several smart lamps. In addition, devices such as smart lamps and smart speakers can also be simultaneously connected to the second pin pad 18 on the communication module 100. It can be understood that the communication module 100 provided in this application can meet the connection and control of multiple devices, thereby improving the applicability of the communication module 100.

[0034] It should be understood that for those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this application.

Claims

1. A communication module, applied to a smart device, characterized in that: The communication module comprises: A circuit substrate, the circuit substrate comprising a first surface and a second surface arranged opposite to each other; a first metal wiring, the first metal wiring passing through the circuit substrate; a second metal trace, the second metal trace being located on the first surface; A chip, wherein the chip is attached to the first surface; an antenna, the antenna being located in the circuit substrate and electrically connected to the chip through the second metal trace; A first pin pad, a plurality of the first pin pads are located on the second surface, the first pin pad is located between the antenna and the chip, and the first pin pad is electrically connected to the chip through the first metal trace.

2. The communication module according to claim 1, characterized in that: The circuit substrate includes a top layer and a bottom layer distributed along a front-to-back direction, the top layer is located in front of the bottom layer, and the antenna is located in the top layer.

3. The communication module according to claim 2, characterized in that: The antenna extends in the left-right direction and is bent in a bow shape.

4. The communication module according to claim 1, characterized in that: The first pin pads are distributed along the left-right direction, and the distance between adjacent first pin pads is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

5. The communication module according to claim 1, characterized in that: The communication module also includes second pin pads, a plurality of which are located on the second surface, the second pin pads are electrically connected to the chip through the first metal traces, and the second pin pads and the first pin pads are arranged in a U-shaped pattern.

6. The communication module according to claim 5, characterized in that: The distance between adjacent second pin pads is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

7. The communication module according to claim 5, characterized in that: The first pin pad is a ground pad, and the second pin pad is an interface pad for connecting to external devices.

8. The communication module according to claim 1, characterized in that: Define a reference plane perpendicular to the front-to-back direction, and the projection area of ​​the communication module on the reference plane along the front-to-back direction is greater than or equal to 200 mm 2 And less than or equal to 240mm 2 .

9. The communication module according to claim 1, characterized in that: The communication module further comprises a shielding cover, wherein the shielding cover is disposed on the chip, and the chip is shielded from external magnetic fields by the shielding cover.

10. A smart device, characterized in that: The smart device includes the communication module described in any one of claims 1-9.

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