Wafer 360-degree dead-corner-free rotary spraying mechanism

Abstract

The utility model relates to a 360-degree no-dead-corner rotary spraying mechanism for a wafer. The mechanism comprises a vertical plate, a clamping piece rotating assembly which is arranged on the vertical plate and can clamp the edge of the wafer and drive the wafer to rotate, and a spraying assembly which can spray the top and the bottom of the wafer. The 360-degree no-dead-corner rotary spraying mechanism for the wafer can clamp the edge of the wafer, drive the wafer to rotate and cooperate with the spraying head to achieve 360-degree no-dead-corner rotary cleaning, so that the cleaning effect of the wafer is greatly improved, the clamping structure of the friction wheel reduces the contact area with the wafer as much as possible, the surface of the wafer cannot be damaged, and the wafer cleaning efficiency is improved. Therefore, the product quality is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning systems, in particular to a 360-degree non-dead-angle rotating spray mechanism for wafers. Background Art

[0002] When processing existing semiconductor wafers, surface cleaning is required. In the past, a trough-type cleaning device was used for cleaning in multiple workstations. The wafer was integrally sent into the cleaning trough by a manipulator. Since the cleaning trough is relatively large in volume, a large amount of liquid medicine is wasted. There is also a cleaning mechanism that uses a suction cup to adsorb the wafer for rotating cleaning. Due to the existence of the suction cup, the position of the suction cup cannot be cleaned, resulting in certain cleaning dead angles. There is also a method of using edge clamping for cleaning on the surface of the wafer. Since the wafer cannot rotate, the clamping points will cause certain cleaning dead angles. Summary of the Utility Model

[0003] In view of the above problems, the utility model provides a 360-degree non-dead-angle rotating spray mechanism for wafers with a simple structure, high cleaning efficiency, and good cleaning effect.

[0004] The utility model is realized by the following technical solutions:

[0005] A 360-degree non-dead-angle rotating spray mechanism for wafers includes a vertical plate, a wafer clamping and rotating assembly arranged on the vertical plate for clamping the edge of the wafer and driving it to rotate, and a spray assembly for spraying on the top and bottom of the wafer.

[0006] The wafer clamping and rotating assembly includes a lifting cylinder, a lifting support, a first stepping motor, a ball screw, a slider, a second stepping motor, a support plate, and a friction wheel. The lifting cylinder is fixed on the vertical plate and connected to the lifting support. The lifting cylinder can drive the lifting support to move up and down. The ball screw is rotatably connected to the lifting support, and a set of sliders is arranged on the ball screw. The first stepping motor is connected to the ball screw, and the first stepping motor can drive the two sliders to move along the ball screw. Support plates are respectively fixed on the two sliders. A second stepping motor is respectively fixed at one end of the support plate, and a set of friction wheels is respectively rotatably connected at the other end of the support plate. The second stepping motor is connected to the friction wheel. A clamping groove for the edge of the wafer to be embedded is formed on the friction wheel. The second stepping motor can drive the friction wheel to rotate, thereby driving the wafer to rotate.

[0007] The spray assembly includes an upper spray assembly and a lower spray assembly arranged oppositely. The upper spray assembly or the lower spray assembly includes a spray pipe fixed on the vertical plate and a plurality of spray heads uniformly distributed on the spray pipe.

[0008] In order to facilitate driving the friction wheel to rotate, the second stepping motor is connected to the friction wheel through a pulley group.

[0009] To avoid contamination of the pulley set by the cleaning liquid, the friction wheel is mounted on the support plate through a waterproof cover.

[0010] To accurately sense whether the slider has moved into place, an induction switch capable of sensing the position of the slider is fixed on the lifting support.

[0011] The beneficial effects of the present utility model are as follows: The 360-degree non-dead-angle rotating spraying mechanism for wafers can clamp the edge of the wafer and drive it to rotate. Cooperating with the spray head, it can achieve 360-degree non-dead-angle rotating cleaning, thus greatly improving the cleaning effect of the wafer. The clamping structure of the friction wheel minimizes the contact area with the wafer as much as possible and will not damage the surface of the wafer, thereby ensuring the product quality. Description of the Drawings

[0012] Figure 1 is a three-dimensional structural schematic diagram of the 360-degree non-dead-angle rotating spraying mechanism for wafers of the present utility model;

[0013] Figure 2 is a partial structural schematic diagram of the wafer clamping and rotating assembly of the present utility model. Detailed Embodiments

[0014] The following elaborates on the preferred embodiments of the present utility model in conjunction with the drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making the scope of protection of the present utility model more clearly defined. In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", "side", "end", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0015] As Figure 1 、 Figure 2 shown, a 360-degree non-dead-angle rotating spraying mechanism for wafers includes a vertical plate 1, a wafer clamping and rotating assembly arranged on the vertical plate 1 that can clamp the edge of the wafer 14 and drive it to rotate, and a spraying assembly that can spray the top and bottom of the wafer 14.

[0016] Specifically, the wafer clamping and rotating assembly includes a lifting air cylinder 2, a lifting support 3, a first stepping motor 5, a ball screw 4, a slider 6, a second stepping motor 7, a support plate 8, and a friction wheel 10. The lifting air cylinder 2 is fixed to one side of the vertical plate 1 and connected to the lifting support 3. The lifting air cylinder 2 can drive the lifting support 3 to move up and down. The ball screw 4 is rotatably connected to the bottom end of the lifting support 3. The ball screw 4 is a double-thread ball screw with opposite threads. A set of sliders 6 is arranged on the ball screw 4. An induction switch 13 capable of sensing the position of the slider 6 is fixed on the lifting support 3. The first stepping motor 5 is connected to the ball screw 4. The first stepping motor 5 can drive the two sliders 6 to move towards or away from each other along the ball screw 4. Support plates 8 are respectively fixed on the two sliders 6. A second stepping motor 7 is respectively fixed at one end of each support plate 8. A set of friction wheels 10 is respectively rotatably connected to the other end of each support plate 8. The friction wheels 10 are installed on the support plates 8 through waterproof covers 9. The second stepping motor 7 is connected to the friction wheels 10 through a pulley group 15. A clamping groove capable of embedding the edge of the wafer 14 is formed on the friction wheel 10. The second stepping motor 7 can drive the friction wheel 10 to rotate, thereby driving the wafer 14 to rotate;

[0017] The spraying assembly includes an upper spraying assembly and a lower spraying assembly which are arranged oppositely. The upper spraying assembly or the lower spraying assembly includes a spraying pipe 11 fixed on the vertical plate 1 and a plurality of spray heads 12 uniformly distributed on the spraying pipe 11.

[0018] During processing, the manipulator sends the wafer 14 to the corresponding position of the wafer clamping and rotating assembly. The lifting air cylinder 2 drives the lifting support 3 to rise. The first stepping motor 5 drives the ball screw 4 to rotate. The two sliders 6 drive the two support plates 8 to move inward simultaneously. The wafer 14 is clamped on both sides by the four friction wheels 10. The two second stepping motors 7 drive the four friction wheels 10 to rotate at the same speed, thereby driving the wafer 14 to rotate. At the same time, the spray heads 12 above and below the wafer 14 start to spray the reagent, and the top and bottom surfaces of the wafer are cleaned by 360-degree non-dead-angle rotation.

[0019] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "set", "provided with", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0020] Finally, it should be noted that the above embodiments are only specific implementation manners of the present utility model, used to illustrate the technical solutions of the present utility model, rather than limiting it. The protection scope of the present utility model is not limited thereto. Although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that any person skilled in the technical field can still modify the technical solutions recorded in the foregoing embodiments, or can easily think of changes, or perform equivalent replacements on some of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present utility model, and should all be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A wafer 360-degree non-dead-angle rotating spray mechanism, characterized in that: It includes a vertical plate, a clamp rotating assembly arranged on the vertical plate and capable of clamping the edge of a wafer and driving it to rotate, and a spray assembly capable of spraying the top and bottom of the wafer; The clamping piece rotating assembly includes a lifting cylinder, a lifting support, a first stepper motor, a ball screw, a slider, a second stepper motor, a support plate and a friction wheel, the lifting cylinder is fixed on the vertical plate and connected to the lifting support, the lifting cylinder can drive the lifting support to move up and down, the ball screw is rotatably connected to the lifting support, a group of sliders are arranged on the ball screw, the first stepper motor is connected to the ball screw, the first stepper motor can drive the two sliders to move along the ball screw, the two sliders are respectively fixed with support plates, one end of the support plate is respectively fixed with the second stepper motor, the other end of the support plate is respectively rotatably connected with a group of friction wheels, the second stepper motor is connected to the friction wheel, the friction wheel is provided with a clamping groove for the edge of the wafer to be embedded, and the second stepper motor can drive the friction wheel to rotate, thereby driving the wafer to rotate; The spray assembly comprises an upper spray assembly and a lower spray assembly which are arranged relatively, and the upper spray assembly or the lower spray assembly comprises a spray pipe fixed on the vertical plate and a plurality of spray heads evenly distributed on the spray pipe.

2. The wafer 360-degree non-dead-angle rotating spraying mechanism according to claim 1 is characterized in that: The second stepping motor is connected to the friction wheel through a pulley set.

3. The wafer 360-degree non-dead-angle rotating spraying mechanism according to claim 2 is characterized in that: The friction wheel is installed on the support plate through a waterproof cover.

4. The wafer 360-degree non-dead-angle rotating spraying mechanism according to claim 1 is characterized in that: An induction switch capable of sensing the position of the sliding block is fixed on the lifting support.

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