Packaging structure of IC chip
By designing an IC chip packaging structure including an outer shell, storage unit, interaxial gear and storage subunit, the problems of easy damage and cumbersome core removal in the prior art are solved, and higher safety and operational convenience are achieved.
Patent Information
- Application Number
- CN202422030243.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-20
AI Technical Summary
The existing IC chip packaging structure is susceptible to damage caused by vibration and accidental drop during transportation and storage, and the core extraction process is cumbersome and inconvenient.
A packaging structure of an IC chip is designed, including an outer shell, storage unit, interaxial gear and storage sub-unit. Through the meshing connection between the interaxial gear and the rotational half-tooth, the chip is ejected and fixed support, and kinetic energy buffer is provided through the design of the storage unit and storage sub-unit.
This package structure improves the safety of the IC chip during transportation and storage, facilitates the removal and disassembly of the chip, and improves the safety and operational convenience of the device.
Smart Images
Figure CN222988690U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of IC chips, and particularly relates to a packaging structure of an IC chip. Background Art
[0002] An IC chip (Integrated Circuit Chip) is a core component in modern electronic devices. It realizes complex electronic functions by integrating a large number of microelectronic components on a small chip. The IC chip mainly includes a wafer chip and a packaged chip. The wafer chip is the part that actually contains the circuit, while the packaged chip provides physical protection and external connections. This integration method makes the IC chip have the characteristics of miniaturization, low power consumption, and high reliability. Common IC packaging types include through-hole packaging and surface mount packaging. The former has longer pins that penetrate the PCB and are welded, while the latter has shorter pins that only adhere to the surface of the PCB. When transporting IC chips, severe vibration or accidental dropping may damage the IC chips, and when a large number of IC chips are placed in a packaging container, they need to be taken out one by one, which is rather inconvenient. Therefore, this application provides a packaging structure for IC chips. Summary of the Utility Model
[0003] To solve the above technical problems, the utility model proposes a packaging structure of an IC chip that can be rigidly fixed while providing flexible kinetic energy buffering, and can pop out the chip at the same time, facilitating access and storage.
[0004] The technical solution of the utility model is realized as follows:
[0005] A packaging structure of an IC chip includes an outer shell, a storage unit, an interaxial gear, and a storage subunit. Among them, a storage rack is fixedly connected inside the outer shell, the storage unit is movably connected inside the storage rack, a storage slot is opened outside the storage unit, the storage subunit is movably connected outside the storage slot, an interaxial chamber is opened inside the storage unit, a connecting bearing is fixedly connected inside the interaxial chamber, a rotating shaft is fixedly connected outside the connecting bearing, an interaxial gear is fixedly connected outside the rotating shaft, a telescopic rod is fixedly connected outside the rotating shaft away from the connecting bearing, a common connecting frame is fixedly connected outside the telescopic rod, and a rotating out semi-tooth is fixedly connected outside the storage subunit.
[0006] Further, a forward window is opened outside the outer shell, a pick-up slot is opened outside the outer shell, a side window is opened outside the outer shell, and the number of storage racks is multiple and symmetrically distributed inside the outer shell.
[0007] Furthermore, there are multiple sets of inter-axial bins evenly distributed inside the storage unit, multiple sets of inter-axial gears evenly distributed outside the rotating shaft, a gripping end fixedly connected to the outside of the co-connecting frame, and the storage unit is made of relatively soft material and provides kinetic energy buffering.
[0008] Furthermore, a communication groove is provided outside the storage slot, and the rotating half-tooth is meshed with the inter-axial gear through the communication groove.
[0009] Furthermore, there are multiple sets of storage slots evenly distributed outside the storage unit, and one side of the storage slot close to the inter-axial bin is provided with a certain arc.
[0010] Furthermore, a fitting groove is provided outside the storage unit, the fitting groove is movably connected to the inter-axial gear, and the fitting groove is fitted with the co-connecting frame.
[0011] Furthermore, a core-taking groove is provided outside the storage sub-unit fixedly connected to the outside of the co-connecting frame, and the storage sub-unit is made of relatively hard material and provides fixed support for the chip body.
[0012] Furthermore, a chip body is movably connected inside the storage sub-unit.
[0013] The utility model has the following beneficial effects:
[0014] 1. By providing the outer casing and the storage unit, the device can store a large number of IC chips in a three-dimensional space. Through the front window, the state of the stored chips can be observed more intuitively, greatly improving the number of chips transported and stored by the device.
[0015] 2. By providing the inter-axial gear, the storage sub-unit and the rotating half-tooth, when the chip body is taken out of the device, the rotating half-tooth connected to the inter-axial gear is rotated by rotating the rotating shaft, so as to lift one side of the storage sub-unit and eject the storage sub-unit, facilitating the disassembly of the chip body. At the same time, the storage sub-unit and the storage unit respectively provide fixation and kinetic energy buffering for the chip body, greatly improving the safety of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is the overall structural schematic diagram of the utility model;
[0017] Figure 2 is the utility model Figure 1 partial structural schematic diagram;
[0018] Figure 3 is the utility model Figure 1 partial structural schematic diagram;
[0019] Figure 4 is theFigure 3 Internal structure anatomical diagram in
[0020] Figure 5 is of the present utility model Figure 3 Partial structure schematic diagram in
[0021] Figure 6 is of the present utility model Figure 3 Partial structure schematic diagram in
[0022] Figure 7 is of the present utility model Figure 4 Enlarged view of part A in
[0023] Figure 8 is of the present utility model Figure 5 Enlarged view of part B in
[0024] Wherein: 1. Outer shell; 2. Storage unit; 3. Forward window; 4. Pick-up slot; 5. Lateral window; 6. Storage rack; 7. Storage slot; 8. Axial chamber; 9. Connecting groove; 10. Fitting groove; 11. Connecting bearing; 12. Rotating shaft; 13. Axial gear; 14. Common connecting frame; 15. Holding end; 16. Storage sub-unit; 17. Core-taking slot; 18. Ejected half-tooth; 19. Chip body; 20. Telescopic rod. Specific embodiments
[0025] Next, the technical solutions in the embodiments of the present utility model will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.
[0026] Please refer to Figures 1 to 8 As shown, a packaging structure for an IC chip provided by the present utility model includes an outer shell 1, a storage unit 2, an axial gear 13, and a storage sub-unit 16. A storage rack 6 is fixedly connected inside the outer shell 1. The storage unit 2 is movably connected inside the storage rack 6. A storage slot 7 is opened outside the storage unit 2. The storage sub-unit 16 is movably connected outside the storage slot 7. An axial chamber 8 is opened inside the storage unit 2. A connecting bearing 11 is fixedly connected inside the axial chamber 8. A rotating shaft 12 is fixedly connected outside the connecting bearing 11. An axial gear 13 is fixedly connected outside the rotating shaft 12. A telescopic rod 20 is fixedly connected outside the end of the rotating shaft 12 away from the connecting bearing 11. A common connecting frame 14 is fixedly connected outside the telescopic rod 20. An ejected half-tooth 18 is fixedly connected outside the storage sub-unit 16;
[0027] A connecting groove 9 is provided outside the storage slot 7. The rotating half tooth 18 and the intermediate shaft gear 13 are meshed and connected through the connecting groove 9. A storage sub-unit 16 is fixedly connected to the outside of the common connecting frame 14. A core-taking groove 17 is provided outside the storage sub-unit 16. The storage sub-unit 16 is made of relatively hard material and provides fixed support for the chip body 19. The chip body 19 is movably connected inside the storage sub-unit 16.
[0028] Specifically, when the chip body 19 needs to be transported, the chip body 19 is placed inside the storage sub-unit 16. After all the storage sub-units 16 outside the storage unit 2 are installed, the storage sub-unit 16 is then placed inside the storage slot 7. The storage sub-unit 16 is fixed inside the storage unit 2 through the flexible extrusion of the storage slot 7. Then, the above operation is repeated. After the remaining storage units 2 are loaded, the storage units 2 are placed inside the storage rack 6 for storage. During subsequent inspections, the status of the stored chip body 19 can be directly viewed through the side window 5.
[0029] Furthermore, a forward window 3 is provided outside the outer shell 1. A pick-up slot 4 is provided outside the outer shell 1. A side window 5 is provided outside the outer shell 1. There are multiple groups of storage racks 6 symmetrically distributed inside the outer shell 1. There are multiple groups of intermediate shaft bins 8 evenly distributed inside the storage unit 2. There are multiple groups of intermediate shaft gears 13 evenly distributed outside the rotating shaft 12. A holding end 15 is fixedly connected to the outside of the common connecting frame 14. The storage unit 2 is made of relatively soft material and provides kinetic energy buffering. There are multiple groups of storage slots 7 evenly distributed outside the storage unit 2. One side of the inside of the storage slot 7 close to the intermediate shaft bin 8 is provided with a certain arc. A fitting groove 10 is provided outside the storage unit 2. The fitting groove 10 is movably connected to the intermediate shaft gear 13. The fitting groove 10 is fitted and connected to the common connecting frame 14.
[0030] By making the above settings, when the chip body 19 needs to be taken out, hold the holding end 15 and pull out the common connecting frame 14. Then, push the common connecting frame 14 to drive the rotation of the rotating shaft 12. The rotation of the rotating shaft 12 drives the intermediate shaft gear 13. The rotation of the intermediate shaft gear 13 drives the rotating half tooth 18. The rotating half tooth 18 rotates outside the intermediate shaft gear 13 to make one side of the storage sub-unit 16 pop out of the storage slot 7. In this process, all the storage sub-units 16 inside the storage unit 2 can be popped out simultaneously. Finally, the chip body 19 can be taken out through the core-taking groove 17. While providing fixed support for the chip body 19, it can also absorb the kinetic energy of the chip body 19, preventing damage to the chip body 19 caused by accidental tipping of the device, and greatly improving the safety of the device.
[0031] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.
Claims
1. A packaging structure of an IC chip, characterized in that: The invention comprises an outer shell (1), a storage unit (2), an inter-axial gear (13) and a storage sub-unit (16), wherein the outer shell (1) is fixedly connected to a storage rack (6), the storage unit (2) is movably connected to the storage rack (6), a storage slot (7) is provided on the outside of the storage unit (2), the storage sub-unit (16) is movably connected to the outside of the storage slot (7), an inter-axial warehouse (8) is provided on the inside of the storage unit (2), a connecting bearing (11) is fixedly connected to the inside of the inter-axial warehouse (8), a rotating shaft (12) is fixedly connected to the outside of the connecting bearing (11), the inter-axial gear (13) is fixedly connected to the outside of the rotating shaft (12), a telescopic rod (20) is fixedly connected to the outside of the rotating shaft (12) at one end away from the connecting bearing (11), the telescopic rod (20) is fixedly connected to the common connecting rack (14), and the storage sub-unit (16) is fixedly connected to the outside of the rotating half gear (18).
2. The IC chip packaging structure according to claim 1, characterized in that: The outer shell (1) is provided with a front window (3), the outer shell (1) is provided with a piece taking slot (4), the outer shell (1) is provided with a side window (5), and the storage racks (6) are provided in multiple groups and are symmetrically distributed inside the outer shell (1).
3. The IC chip packaging structure according to claim 1, characterized in that: The inter-axial bins (8) are provided in a plurality of groups and are evenly distributed inside the storage unit (2); the inter-axial gears (13) are provided in a plurality of groups and are evenly distributed outside the rotating shaft (12); a holding end (15) is fixedly connected to the outside of the common connecting frame (14); and the storage unit (2) is relatively soft and provides a kinetic energy buffering effect.
4. The IC chip packaging structure according to claim 1, characterized in that: A connecting groove (9) is provided outside the storage groove (7), and the output half-tooth (18) is meshingly connected with the inter-shaft gear (13) via the connecting groove (9).
5. The IC chip packaging structure according to claim 1, characterized in that: The storage grooves (7) are provided in multiple groups and are evenly distributed outside the storage unit (2); a certain curvature is provided on one side of the storage grooves (7) close to the inter-axle compartment (8).
6. The IC chip packaging structure according to claim 1, characterized in that: The storage unit (2) is provided with an embedding groove (10) on the outside, the embedding groove (10) is movably connected to the inter-shaft gear (13), and the embedding groove (10) is embeddedly connected to the common connecting frame (14).
7. The IC chip packaging structure according to claim 1, characterized in that: The common frame (14) is fixedly connected to a storage subunit (16) on the outside and is provided with a core removal groove (17) on the outside. The storage subunit (16) is relatively hard and provides fixed support for the chip body (19).
8. The IC chip packaging structure according to claim 1, characterized in that: The storage subunit (16) is movably connected to a chip body (19) inside.