Vapor deposition apparatus and mask for vapor deposition apparatus

Abstract

The utility model relates to an evaporation device and a mask for the evaporation device. The evaporation device is provided with a substrate; a mask disposed on a first surface of the substrate and including a mask frame supporting an edge region of the substrate; a through hole formed in the mask frame along an edge region of the substrate; a measurement member disposed between the substrate and the mask frame at a position corresponding to the through hole and including a measurement hole connected to the through hole; and a measurement camera disposed on a first surface of the mask frame at a position corresponding to the through hole, the measurement camera measuring a first distance to the measurement member exposed through the through hole and a second distance to the substrate exposed through the measurement hole.

Description

Technical Field

[0001] The utility model relates to an evaporation device, a mask for an evaporation device, and a method for measuring the gap between the mask for an evaporation device and a substrate. Background Art

[0002] With the development of the information society, the demand for display devices for displaying images has increased in various forms. For example, display devices are applicable to various electronic devices such as smart phones, digital cameras, notebook computers, navigators, and smart TVs.

[0003] As display devices, various display devices such as liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs) are being used. Among them, organic light emitting display devices display images using organic light emitting elements that generate light through the recombination of electrons and holes. The organic light emitting display device includes a plurality of transistors that supply a driving current to the organic light emitting element.

[0004] In the thin film transistor (TFT) manufacturing process in the manufacturing process of a display device, sputtering technology and plasma enhanced chemical vapor deposition (PECVD) technology can be used according to the substance to be evaporated. Sputtering technology, as a technology for bombarding the substance to be evaporated with ions in a vacuum state and evaporating the atoms sputtered from the substance to be evaporated onto glass, is mainly used for evaporating metal substances. Plasma enhanced chemical vapor deposition technology, as a technology for applying a high-frequency power supply to generate a potential difference between electrodes in a cavity and decomposing the gas containing the substance to be evaporated into a plasma state to evaporate the evaporation substance onto a substrate, is used when evaporating a semiconductor or an insulating film.

[0005] In an evaporation device for performing such an evaporation process, evaporation shadow defects may occur due to the gap between the substrate to be evaporated and the mask frame disposed below the substrate.

[0006] Evaporation shadow defects refer to defects in which, when a fine metal mask and a substrate are evaporated in a floating state, a region where the pattern evaporation thickness is evaporated to be less than the target thickness is generated, and here, the closer the gap is to 0 μm, the smaller the shadow size.

[0007] In order to confirm such a gap, after adjusting the flatness of the mask support portion and the electrostatic chuck respectively, for example, a gap gauge can be used to measure the gap when installing the evaporation device.

[0008] Thus, if the measurement is carried out while the gap gauge is in direct contact with the contact surfaces between the mask frame and the substrate, damage may occur to the mask frame and the substrate due to the gap gauge, and the gap may become different from the initial state before the measurement due to the damage during the measurement. If damage occurs during multiple measurements, it may be difficult to accurately measure the gap at the same position. SUMMARY OF THE UTILITY MODEL

[0009] The problem to be solved by the present utility model is to provide an evaporation device, a mask for an evaporation device, and a method for measuring the gap between the mask for an evaporation device and a substrate, which can measure the gap through a measuring component and a measuring camera without directly contacting between the mask frame and the substrate.

[0010] The problems of the present utility model are not limited to the above-mentioned problems, and those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0011] An evaporation device according to an embodiment for solving the above problems includes: a substrate; a mask disposed on a first surface of the substrate and including a mask mask frame that supports an edge region of the substrate; a through hole formed in the mask mask frame along the edge region of the substrate; a measuring component disposed between the substrate and the mask mask frame at a position corresponding to the through hole and including a measuring hole connected to the through hole; and a measuring camera disposed on a first surface of the mask mask frame at a position corresponding to the through hole, and the measuring camera measures a first distance to the measuring component exposed through the through hole and a second distance to the substrate exposed through the measuring hole.

[0012] It may be that the measuring component is located on a second surface of the mask frame, which is opposite to the first surface of the mask frame.

[0013] It may be that the measuring component further includes a region other than the measuring hole, i.e., a cover portion, and the measuring hole is located at the center of the cover portion and is formed to penetrate with a size smaller than that of the through hole.

[0014] It may be that the cover portion is attached to the second surface of the mask frame to open a part of the through hole with the same size as the measuring hole and cover the remaining region of the through hole.

[0015] It may be that the measuring component is formed of a thin film.

[0016] It may be that the evaporation apparatus further includes: a control unit that stores the first distance and the second distance measured by the measurement camera, and calculates the difference between the stored first distance and the second distance as the gap between the substrate and the mask.

[0017] It may be that the measurement camera is attached to and detached from the first surface of the mask frame at a position corresponding to the through hole.

[0018] It may be that the mask frame is formed of metal, and the measurement camera further includes a magnetic force applying unit that generates a magnetic force to attach the measurement camera to the mask frame and cuts off the magnetic force to detach the measurement camera from the mask frame.

[0019] It may be that the evaporation apparatus further includes: a connection support part that is located between the measurement camera and the magnetic force applying unit and connects the measurement camera to the magnetic force applying unit.

[0020] It may be that the mask further includes a mask pattern part that is located in the central opening area of the mask frame and is disposed on the first surface of the substrate.

[0021] It may be that the evaporation apparatus further includes: a mask support part that is located on the first surface of the mask frame together with the measurement camera and supports the mask on the first surface of the mask frame.

[0022] It may be that the evaporation apparatus further includes: an electrostatic chuck (ESC) that is located on the second surface, which is the opposite surface of the first surface of the substrate; and a magnetic force generating part that is located on the first surface of the electrostatic chuck.

[0023] In addition, a mask according to another embodiment for solving the above problem includes: a mask pattern part; a mask frame that is located at the edge of the mask pattern part; a through hole that is formed in the mask frame; and a measurement component that is located on the mask frame at a position corresponding to the through hole and has a measurement hole connected to the through hole.

[0024] It may be that the measurement component further includes a cover part, which is an area other than the measurement hole, and the measurement hole is located at the center of the cover part and is formed to penetrate with a size smaller than that of the through hole.

[0025] It may be that the cover part is attached to the mask frame to open a part of the through hole with the same size as the measurement hole and cover the remaining area of the through hole.

[0026] Specific matters of other embodiments are included in the detailed description and the drawings.

[0027] According to an evaporation apparatus of an embodiment, there is provided an evaporation apparatus, a mask for an evaporation apparatus, and a method for measuring a gap between the mask for an evaporation apparatus and a substrate, which can measure a gap by a measuring member and a measuring camera without directly contacting between a mask frame and the substrate.

[0028] The distance can be measured by a measuring hole of a measuring member and a through hole of a mask frame using a measuring camera, and the gap can be calculated based on the measured distance. Different from the prior art of directly contacting and measuring with a gap gauge, non-destructive measurement can be performed without damaging the substrate and the mask frame.

[0029] In addition, the measuring camera can be attached to and detached from the mask frame according to the gap measurement position where the measuring member is located. The attachment and detachment of the measuring camera are realized by magnetism, so that the position of the measuring camera can be simply changed while measuring the gap.

[0030] In addition, since the gap measurement position is specified by the measuring member, accurate gap measurement can be performed at the same position even when performing multiple gap measurements.

[0031] In addition, with the use of a measuring camera, there are few errors caused by light scattering, and the actual image can be confirmed and distinguished according to the measurement position.

[0032] The effects according to the embodiment are not limited to the above-exemplified contents, and more effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a cross-sectional view of an evaporation apparatus according to an embodiment.

[0034] Figure 2 is an enlarged view showing Figure 1 an enlarged cross-sectional view of the evaporation apparatus.

[0035] Figure 3 is an enlarged Figure 2 cross-sectional view of a measurement hole of a measuring member and a through hole region of a mask frame.

[0036] Figure 4 is a top plan view showing Figure 3 the measuring member from above.

[0037] Figure 5 is a bottom rear view showing Figure 3 the mask frame from below.

[0038] Figure 6 is a flowchart showing a method for measuring a gap between a mask and a substrate.

[0039] Figure 7 is a cross-sectional view of a mask and a mask support portion.

[0040] Figure 8 is an enlarged view Figure 7 of the through-hole of the mask frame that is magnified.

[0041] Figure 9 is a cross-sectional view of the measurement component, the mask, and the mask support portion.

[0042] Figure 10 is an enlarged view Figure 9 of the through-holes of the measurement component and the mask frame that are magnified.

[0043] Figure 11 is a view showing the state in which the substrate is disposed at intervals above the measurement component and the mask.

[0044] Figure 12 is Figure 11 an enlarged view of a partial area of the substrate, the measurement component, and the mask.

[0045] Figure 13 is a view showing the state in which the substrate is disposed on the measurement component and the mask.

[0046] Figure 14 is Figure 13 an enlarged view of a partial area of the substrate, the measurement component, and the mask.

[0047] Figure 15 is a top plan view showing from above Figure 13 the substrate, the measurement component, and the mask.

[0048] Figure 16 is a view showing the state in which the measurement camera module is disposed below the mask frame.

[0049] Figure 17 is an enlarged view Figure 16 of the setting area of the measurement camera module.

[0050] Figure 18 is a view showing Figure 17 the state in which the measurement camera measures the first distance.

[0051] Figure 19 is a view showing Figure 17 the state in which the measurement camera measures the second distance.

[0052] Figure 20 is a view showing together Figure 17 the first and second distances measured by the measurement camera.

[0053] Figure 21 is a view showing Figure 17 the bottom surface state of the mask frame when the measurement camera measures the second distance.

[0054] (Description of the reference numerals in the drawings)

[0055] 1: Evaporation device 10: Chamber

[0056] 100: Evaporation source 200: Magnetic force generation unit

[0057] 300: Electrostatic chuck 400: Substrate

[0058] 500: Mask 510: Mask frame

[0059] 511: Through hole 520: Mask pattern portion

[0060] 600: Mask support portion 700: Measuring component

[0061] 701: Measuring hole 720: Cover portion

[0062] 800: Measuring camera module 801: Measuring camera

[0063] 802: Magnetic force application portion 803: Connection support portion

[0064] 900: Control unit Detailed implementation manners

[0065] Referring to the embodiments described in detail later with the accompanying Figure One drawings, the advantages and features of the present utility model and the methods for realizing them will become clear. However, the present utility model is not limited to the embodiments disclosed below and can be implemented in various different forms. These embodiments are merely provided to make the disclosure of the present utility model complete and to fully convey the scope of the utility model to those with ordinary knowledge in the technical field to which the present utility model belongs. The present utility model is defined only by the scope of the claims.

[0066] Referring to an element or layer being "on" another element or layer includes all cases where it is directly on the other element or there are other layers or other elements in between. Similarly, referring to "below", "left", and "right" includes all cases where they are directly adjacent to or there are other layers or other elements in between. Throughout the specification, the same reference numerals refer to the same components.

[0067] Although first, second, etc. are used to describe various components, it is obvious that these components are not limited to these terms. These terms are only used to distinguish one component from other components. Therefore, it is obvious that the first component mentioned below can also be the second component within the technical concept of the present utility model.

[0068] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0069] The evaporation apparatus according to an embodiment may be a chemical vapor deposition apparatus, a physical vapor deposition apparatus, an atomic layer deposition apparatus, or a sputtering apparatus.

[0070] The evaporation apparatus may be used for manufacturing a thin film transistor manufacturing apparatus or a semiconductor manufacturing process for a substrate applicable to an integrated circuit (IC) device, a display device, a solar cell, etc. For example, the evaporation apparatus according to an embodiment may evaporate amorphous silicon (a-Si) or evaporate an insulating film and a protective film when manufacturing a thin film transistor (TFT).

[0071] Figure 1 It is a cross-sectional view of an evaporation apparatus according to an embodiment.

[0072] Referring to Figure 1 , the evaporation apparatus 1 may include a chamber 10, an evaporation source 100, a magnetic force generation unit 200, an electrostatic chuck 300, a substrate 400, and mask assemblies 500, 600.

[0073] The chamber 10 may provide a space for performing an evaporation process and be connected to a vacuum pump (not shown) such as an MP (turbo molecular pump; Turbo Molecular Pump) so that the inside of the chamber 10 is maintained in a vacuum state during the evaporation process. In addition, the chamber 10 may further include an anti-sticking plate (not shown) configured to surround the inner wall surface. Here, the anti-sticking plate may prevent the organic substances that are not evaporated onto the substrate 400 among the organic substances ejected from the evaporation source 100 from adsorbing to the inner wall surface of the chamber 10.

[0074] Referring to Figure 1 , the chamber 10 may be in the form of a hexahedron having a quadrilateral cross-sectional shape, but is not limited thereto, and may also have a polyhedron shape such as a heptahedron or an octahedron, or a cylindrical shape.

[0075] The evaporation source 100 is located below the mask assemblies 500, 600 inside the chamber 10 and supplies organic substances to the substrate 400 through a mask pattern portion 520 of the mask assemblies 500, 600 to be described later. That is, it functions to supply organic substances to the evaporation surface of the substrate 400 located above inside the chamber 10.

[0076] The evaporation source 100 may be in the form of a heating container (crucible) including organic substances inside and evaporate onto the substrate 400 by thermally evaporating the organic substances. The evaporation apparatus 1 may further include a heater (not shown) for heating the organic substances.

[0077] Here, a heater (not shown) is provided on both sides of the evaporation source 100, and serves to heat the evaporation source 100 to heat and sublime the organic substances contained in the evaporation source 100.

[0078] The magnetic force generation unit 200 can be disposed inside the chamber 10 on the first surface of the electrostatic chuck 300, that is, on the upper surface of the electrostatic chuck 300, and is disposed opposite to the mask assemblies 500 and 600 with the evaporation object, i.e., the substrate 400, therebetween.

[0079] The magnetic force generation unit 200 can be formed by a magnet unit. Through the magnetic force from the magnet unit, the mask pattern portion 520 (to be described later) of the mask assemblies 500 and 600 is brought into close contact with the substrate 400. As an example, it can be configured such that when the magnetic force generation unit 200 applies a magnetic force to the mask 500 (to be described later) of the mask assemblies 500 and 600, the mask 500 moves toward the substrate 400 side, but is not limited thereto. At this time, the mask 500 can also be formed of metal.

[0080] The electrostatic chuck 300 can be disposed inside the chamber 10 and is located above the substrate 400. The upper surface of the substrate 400 is the second surface opposite to the first surface of the substrate 400, i.e., the lower surface 403 of the substrate 400.

[0081] The electrostatic chuck 300, as an ESC (Electro Static Chuck), can serve to hold the substrate 400 using an electrostatic force. That is, the electrostatic chuck 300 can serve to support and fix the substrate 400 inside the chamber 10.

[0082] Here, the electrostatic chuck 300 is used to fix the substrate 400, but is not limited thereto. Any device and structure that is disposed inside the chamber 10 and can support the substrate 400, such as a clamping member, a pin, an adhesive chuck, etc., can be applicable.

[0083] The substrate 400 can be located between the electrostatic chuck 300 and the mask assemblies 500 and 600, and can be disposed at a position corresponding to the mask pattern portion 520 (to be described later) of the mask assemblies 500 and 600.

[0084] The substrate 400 can be formed of an insulating material selected from the group consisting of glass, quartz, ceramics, plastics, etc., or can also be formed of a metallic material such as stainless steel, but is not limited thereto.

[0085] The mask assemblies 500 and 600 can be located below the lower surface 403 of the substrate 400 and include a mask 500 and a mask support portion 600.

[0086] The mask 500 may include a mask frame 510 located in the edge region and a mask pattern portion 520 located in the central region.

[0087] The mask frame 510 may function to support the edge region of the substrate 400 below the substrate 400, and may be formed of the same metal material as the mask pattern portion 520, or may be formed of a metal having a higher rigidity than the mask pattern portion 520.

[0088] The mask frame 510 may be formed in a quadrilateral frame shape having a central opening corresponding to the substrate 400 to be vapor-deposited, so that the vapor-deposition process of the substrate 400 can be performed.

[0089] The mask pattern portion 520 may be disposed in the central opening region of the mask frame 510 and located between the lower surface 403 of the substrate 400 and the vapor-deposition source 100.

[0090] Both end portions of the mask pattern portion 520 may be fixedly coupled to the mask frame 510, and may be formed of any one of stainless steel (SUS), Invar alloy, nickel, cobalt, nickel alloy, and nickel-cobalt alloy.

[0091] The mask pattern portion 520 may be formed in a quadrilateral plate form corresponding to the central opening region of the mask frame 510 and fixed to the mask frame 510, or a plurality of separately formed mask pattern portions 520 may be respectively fixed to the mask frame 510.

[0092] Here, both end portions of the mask pattern portion 520 may be fixedly coupled to the mask frame 510. At this time, the mask pattern portion 520 may be fixed to the mask frame 510 by a thermal bonding method, that is, a welding method. The welding may be spot welding, and multiple welding points may be set for separate welding to minimize deformation.

[0093] At this time, if the mask frame 510 is formed of a metal having a higher rigidity than the mask pattern portion 520, thermal deformation of the mask pattern portion 520 caused by welding when the mask pattern portion 520 is fixed to the mask frame 510 by welding can be suppressed.

[0094] The mask support portion 600 may be configured to contact the first contact surface of the mask frame 510, that is, the contact lower surface 513a, function to support the edge of the mask frame 510, and be disposed outside the movement path of the organic substance supplied from the vapor-deposition source 100 to the substrate 400.

[0095] Figure 2 Is an enlarged view showing Figure 1 The enlarged cross-sectional view of the vapor-deposition apparatus Figure 3 Is an enlarged Figure 2Cross-sectional views of the measurement hole of the measurement component and the through-hole area of the mask frame, Figure 4 which are shown from above Figure 3 top plan view of the measurement component, Figure 5 which are shown from below Figure 3 bottom rear view of the mask frame. In Figure 2 , in order to show the structure in an enlarged manner, the cavity 10 of Figure 1 is omitted.

[0096] Referring to Figure 2 , the evaporation apparatus 1 may further include a through-hole 511 of the mask frame 510, a measurement component 700 between the lower surface 403 of the substrate 400 and the mask frame 510, a measurement camera module 800 at the contact lower surface 513a of the mask frame 510, and a control unit 900.

[0097] Referring to Figure 2 , the measurement camera module 800 may include a measurement camera 801, a magnetic force application unit 802, and a connection support unit 803.

[0098] The measurement camera 801 may measure a first distance H1 from the measurement component 700 and a second distance H2 from the substrate 400 through the through-hole 511 (refer to Figure 20 ). Here, since the measurement camera 801 is used for gap measurement, compared with using a laser displacement sensor, there are fewer errors caused by light scattering due to the surface material of the material, and the actual image can be confirmed and distinguished according to the measurement position.

[0099] The measurement camera 801 may be disposed at the contact lower surface 513a of the mask frame 510 at a position corresponding to the through-hole 511.

[0100] The measurement camera 801 may be configured to be combined with and separated from the contact lower surface 513a of the mask frame 510 through the connection support unit 803 and the magnetic force application unit 802. It may also be configured to separately embed the measurement camera 801 into the mask frame 510. At this time, the battery of the measurement camera 801 is disposed together with the mask frame 510, and gap measurement can be performed even in a vacuum state. In addition, a laser displacement sensor or a capacitance sensor may be used instead of the measurement camera 801.

[0101] The magnetic force application unit 802 may function to generate a magnetic force to fix the measurement camera 801 and cut off the magnetic force to separate the measurement camera 801.

[0102] The magnetic force applying part 802 may include an on-off switch 804, and generate a magnetic force in the on state to couple the measurement camera 801 to the contact surface 513a below of the mask frame 510, and cut off the magnetic force in the off state to separate the measurement camera 801 from the contact surface 513a below of the mask frame 510. At this time, the mask frame 510 may be made of metal.

[0103] If a magnetic force is generated from the magnetic force applying part 802, the connection support part 803 may be formed as a magnetic magnet. According to the magnetic force generated by the magnetic force applying part 802, the measurement camera 801 can be coupled to and separated from the contact surface 513a below of the mask frame 510.

[0104] The connection support part 803 may be located between the measurement camera 801 and the magnetic force applying part 802, integrally coupled to the measurement camera 801 on one side and integrally coupled to the magnetic force applying part 802 on the other side, and the upper surface of the connection support part 803 is in direct contact with the contact surface 513a below of the mask frame 510.

[0105] When a magnetic force is generated from the magnetic force applying part 802, the connection support part 803 may be magnetic, whereby the upper surface of the connection support part 803 is attached and fixed to the contact surface 513a below of the mask frame 510 made of a metal material, so that the measurement camera 801 integrally coupled to the connection support part 803 is disposed at a position corresponding to the through hole 511.

[0106] The control part 900 may be electrically connected to the measurement camera module 800, store the first distance H1 and the second distance H2 measured by the measurement camera 801, and calculate the difference between the stored first distance H1 and second distance H2 as the gap between the substrate 400 and the mask 500.

[0107] The control part 900 may calculate the focusing height at which the measurement camera 801 focuses on the measurement part 700, calculate the focusing height at which it focuses on the substrate 400, and calculate the difference therebetween to calculate the gap. That is, the control part 900 may receive the distance values which are the data measured in the measurement camera 801, perform operations, and calculate them as the gap.

[0108] Refer to Figure 3 , the through hole 511 may be formed in the mask frame 510, and penetrate through the first surface (i.e., the lower surface 513) and the second surface (i.e., the upper surface 512) of the mask frame 510 in the vertical direction. Here, at least one through hole 511 may also be formed along the edge region of the substrate 400.

[0109] The measurement part 700 may be disposed on the upper surface 512 of the mask frame 510 at a position corresponding to the through hole 511.

[0110] The measurement component 700, being an ultra-thin film, can be formed with a very thin thickness. As a result, the edge region of the substrate 400 is placed on the mask frame 510 and supported. That is, to the naked eye, the edge region of the substrate 400 and the mask frame 510 are in a nearly adhered state. The thickness of the measurement component 700 shown in the drawings and the gap between the edge region of the substrate 400 and the mask frame 510 are the thickness and gap shown for illustrative purposes and are not limited thereto.

[0111] The measurement component 700 may include a central region, namely the measurement hole 701, and a region outside the measurement hole 701, namely the cover portion 720.

[0112] The measurement hole 701 may be formed to penetrate the plate surface in the central region of the measurement component 700 and configured to be interconnected with the through hole 511.

[0113] The measurement hole 701 may be located at the center of the cover portion 720, and the diameter W2 of the measurement hole 701 is formed to be smaller than the diameter W1 of the through hole 511.

[0114] The cover portion 720, being the remaining region in the entire area of the measurement component 700 except for the measurement hole 701, may be attached to the upper surface 512 of the mask frame 510 to open a part of the through hole 511 with the same size as the measurement hole 701 and cover the remaining region of the through hole 511.

[0115] Refer to Figure 4 , when observing the measurement component 700 from the upper surface 702 of the cover portion 720 Figure 3 , the cover portion 720 covers a part of the through hole 511, and the inside of the through hole 511 can be observed through the measurement hole 701 smaller than the through hole 511.

[0116] Refer to Figure 5 , when observing the mask frame 510 from the lower surface 513 of the mask frame 510 Figure 3 , a part of the measurement component 700 can be observed through the through hole 511 exposed on the lower surface 513 of the mask frame 510, but the entire measurement component 700 cannot be observed.

[0117] Since the through hole 511 is larger than the measurement hole 701 of the measurement component 700, the intermediate measurement hole 701 and a part of the lower surface 703 of the cover portion 720 where the measurement hole 701 is located can be observed through the through hole 511.

[0118] A part of the lower surface 703 of the cover portion 720 where the intermediate measurement hole 701 is provided is in a state of being exposed from the through hole 511. Thus, a part of the lower surface 703 of the cover portion 720 can be observed through the through hole 511, and the inside of the measurement hole 701 can also be observed.

[0119] A description of the process of depositing a deposition material onto the deposition surface of the substrate 400 in the evaporation deposition apparatus 1 according to an embodiment is as follows.

[0120] First, the mask 500 is fixed to the mask support portion 600, and the substrate 400 is disposed above the mask 500.

[0121] Next, the evaporation source 100 located in the lower part of the cavity 10 sprays an organic material toward the mask 500. Specifically, when power is applied to a heater (not shown) connected to the evaporation source 100, the evaporation source 100 containing the organic material is heated. As a result, the organic material is heated and sublimated and sprayed toward the mask 500. At this time, a high vacuum and a high temperature are maintained inside the cavity 10.

[0122] When the organic material is sprayed, the organic material is deposited onto the deposition surface of the substrate 400 due to the pattern of the mask pattern portion 520. This process can be repeated to form a multi-layer organic film on the substrate 400. Obviously, the deposition material is not limited to organic materials.

[0123] In addition, although not shown, the evaporation deposition apparatus 1 according to an embodiment may further include a thickness monitoring sensor for measuring the speed of the evaporated organic material, a thickness controller for controlling the evaporation source 100 according to the measured thickness, a shutter capable of blocking the evaporated organic material from the evaporation source 100, and an aligner for aligning the substrate 400 and the mask 500, but is not limited thereto.

[0124] Hereinafter, reference will be made to Figures 6 to 21 A method for measuring the gap between the mask 500 and the substrate 400 will be described. Here, as Figure 1 shown, the mask 500 includes a mask pattern portion 520, but the illustration is omitted in the following description of the gap measurement method. Figures 7 to 21 In

[0125] Figure 6 FIG. is a flowchart showing a method for measuring the gap between the mask and the substrate. The method for measuring the gap between the mask 500 and the substrate 400 may include the following steps.

[0126] First, it may include a step of preparing the mask 500 ( Figure 6 S110).

[0127] Here, the mask 500 is a mask for an evaporation deposition apparatus for the evaporation deposition apparatus 1, and the mask 500 including the mask frame 510 having the through hole 511 may be prepared.

[0128] Figure 7It is a cross-sectional view of a mask and a mask support part. Figure 8 It is an enlarged Figure 7 view of a through-hole of a mask frame.

[0129] Referring to Figure 7 and Figure 8 the mask 500 may include a mask frame 510, and a through-hole 511 penetrating the plate surface is formed on one side of the mask frame 510, and the other side of the mask frame 510 is placed on the mask support part 600 and supported by it.

[0130] Second, it may include the step of arranging the measuring component 700 on the mask frame 510 ( Figure 6 S120 in ).

[0131] Here, a measuring component 700 including a measuring hole 701 penetrating the central region and a cover part 720 corresponding to the remaining region except the measuring hole 701 may be prepared.

[0132] Figure 9 It is a cross-sectional view of a measuring component, a mask, and a mask support part. Figure 10 It is an enlarged Figure 9 view of a through-hole of the measuring component and the mask frame.

[0133] Referring to Figure 9 the measuring component 700 may be attached to the mask frame 510 in a region corresponding to the through-hole 511 of the mask frame 510, and may be attached in a thermally joined manner, that is, a welding manner. For example, after arranging the measuring component 700 corresponding to the through-hole 511 of the mask frame 510, the border region of the measuring component 700 may be welded to thermally join and fix the measuring component 700 to the mask frame 510. The welding may be spot welding.

[0134] Referring to Figure 10 in the measuring component 700 fixed to the mask frame 510 in a thermally joined manner, the lower surface 703 of the cover part 720 is attached to the upper surface 512 of the mask frame 510 at a position covering a part of the through-hole 511, and the measuring hole 701 is connected to the through-hole 511 with a size smaller than that of the through-hole 511.

[0135] Third, it may include the step of arranging the substrate 400 on the upper side of the mask frame 510 ( Figure 6 S130 in ).

[0136] Here, the substrate 400 may be arranged on the upper side of the mask frame 510 in a state supported by the electrostatic chuck 300 located below the magnetic force generating part 200.

[0137] Figure 11It is a diagram showing the state where the substrate is disposed above the measurement component and the mask with a gap therebetween. Figure 12 It is Figure 11 an enlarged view of a partial area of the substrate, the measurement component, and the mask. Figure 13 It is a diagram showing the state where the substrate is disposed on the measurement component and the mask. Figure 14 It is Figure 13 an enlarged view of a partial area of the substrate, the measurement component, and the mask. Figure 15 It is a top plan view showing Figure 13 the substrate, the measurement component, and the mask from above.

[0138] Referring to Figure 11 and Figure 12 As the initial position, the substrate 400 can be disposed at a distance from the upper surface 702 of the cover portion 720 and the upper surface 512 of the mask frame 510 while being supported by the electrostatic chuck 300 located below the magnetic force generation portion 200.

[0139] Referring to Figure 13 and Figure 14 it can be moved from Figure 11 and Figure 12 the initial position to finally dispose the substrate 400 on the mask frame 510. At this time, the substrate 400 can be moved toward the mask 500 side, or the mask 500 can be moved toward the substrate 400 side.

[0140] Referring to Figure 14 the substrate 400 contacts the measurement component 700 while being supported by the electrostatic chuck 300 located below the magnetic force generation portion 200, and the measurement hole 701 of the measurement component 700 is closed by the substrate 400. Therefore, a part of the lower surface 403 of the substrate 400 can be exposed through the through hole 511 connected to the measurement hole 701.

[0141] Referring to Figure 15 in the state where the substrate 400 is located on the mask frame 510, based on the top plan view of the substrate 400 observed from above, the edge area of the substrate 400 can be configured to cover a part of the edge area of the measurement hole 701, the measurement component 700, the through hole 511, and the mask frame 510.

[0142] Fourth, it may include the step of disposing the measurement camera module 800 below the mask frame 510 ( Figure 6 S140 of

[0143] Here, the measurement camera module 800 including the measurement camera 801, the magnetic force application portion 802, and the connection support portion 803 can be coupled to the lower side of the mask frame 510 at a position corresponding to the through hole 511.

[0144] Figure 16 FIG. is a view showing a state in which a measurement camera module is disposed on the lower side of a mask frame. Figure 17 is an enlarged Figure 16 view of the setting area of the measurement camera module.

[0145] Referring to Figure 16 and Figure 17 , in a state where the measurement camera 801 is coupled to the connection support portion 803, when the magnetic force of the magnetic force applying portion 802 is applied to the connection support portion 803, the connection support portion 803 can be attached to the metal mask frame 510 by the magnetic force.

[0146] For example, in a state where the measurement camera module 800 in which the measurement camera 801, the connection support portion 803, and the magnetic force applying portion 802 are integrated is in contact with the contact surface 513a of the mask frame 510, if the on / off switch 804 of the magnetic force applying portion 802 is changed to the on state, the magnetic force applying portion 802 can generate a magnetic force, and the magnetic force of the magnetic force applying portion 802 is applied to the connection support portion 803. As a result, the magnet, that is, the connection support portion 803, is coupled to the contact surface 513a of the metal mask frame 510 by the magnetic force. Therefore, the measurement camera module 800 can be fixed to the lower side of the mask frame 510.

[0147] Here, the measurement camera module 800 can be coupled by the magnetic force. However, the coupling member is not limited thereto, and the illumination can be integrally formed, but is not limited thereto.

[0148] Fifth, it may include a step of measuring a distance by the measurement camera 801 ( Figure 6 S150).

[0149] The measurement camera 801 can measure the distance to the measurement member 700 and the substrate 400 through the through hole 511 and the measurement hole 701.

[0150] Figure 18 is a view showing a state in which the measurement camera Figure 17 measures the first distance. Figure 19 is a view showing a state in which the measurement camera Figure 17 measures the second distance. Figure 20 is a view showing together the first and second distances measured by the measurement camera Figure 17 . Figure 21 is a view showing the state of the lower surface of the mask frame when the measurement camera Figure 17 measures the second distance.

[0151] Referring to Figure 18 , Figure 20 and Figure 21, since the measurement hole 701 has a size smaller than that of the through hole 511, a part of the lower surface 703 of the cover portion 720 is exposed to the through hole 511. Thus, the measurement camera 801 can measure the first distance H1 to the lower surface 703 of the cover portion 720 exposed through the through hole 511.

[0152] Refer to Figure 19 , Figure 20 and Figure 21 , since one side of the measurement hole 701 is covered by the lower surface 403 of the substrate 400 and the other side is connected to the through hole 511, a part of the lower surface 403 of the substrate 400 is exposed through the measurement hole 701 and the through hole 511. Thus, the measurement camera 801 can measure the second distance H2 to the lower surface 403 of the substrate 400 exposed through the through hole 511 and the measurement hole 701.

[0153] As described above, when the measurement of the first distance H1 from the measurement camera 801 to the lower surface 703 of the cover portion 720 and the second distance H2 from the measurement camera 801 to the lower surface 403 of the substrate 400 is completed, the difference (H1 - H2) between the first distance H1 and the second distance H2 can be calculated as the gap between the substrate 400 and the mask 500 in the control unit 900. For example, if the difference (H1 - H2) is less than 0, the control unit 900 can determine that the gap between the substrate 400 and the mask 500 is large; if it is close to 0, it can be determined that the gap is small; if it converges to almost 0, it can be determined that no gap is generated between the substrate 400 and the mask 500.

[0154] On the other hand, the method for measuring the gap between the mask 500 and the substrate 400 may further include a camera separation step of separating the measurement camera 801 from the mask frame 510 when the distance measurement by the measurement camera 801 is completed.

[0155] For example, in a state where the measurement camera module 800 is coupled to the contact lower surface 513a of the mask frame 510, when the distance measurement is completed, if the on - off switch 804 of the magnetic force application unit 802 is changed to the off state, the magnetic force applied to the connecting support portion 803 by the magnetic force application unit 802 is cut off. Thus, the bonding force by magnetic force between the connecting support portion 803 and the contact lower surface 513a of the metal mask frame 510 is released, and therefore the measurement camera module 800 can be separated from the lower side of the mask frame 510.

[0156] Here, the steps of combining and separating the measurement camera module 800 for gap measurement can be repeatedly executed corresponding to the number of through-holes 511 to be measured. For example, when a plurality of through-holes 511 are formed, it is set at a position corresponding to one through-hole 511, separated after measurement, and the setting, measurement, and separation are repeatedly executed in another through-hole 511. Obviously, it can also be configured to prepare measurement camera modules 800 in accordance with the number corresponding to all through-holes 511 and simultaneously set them in each through-hole 511, and simultaneously separate them after measurement.

[0157] As described above, according to the evaporation device 1 of an embodiment, in gap measurement, non-destructive measurement can be performed without damaging the substrate 400 and the mask frame 510. The position of the measurement camera 801 can be simply changed while performing gap measurement, and the gap measurement position is specified by the measurement component 700. Therefore, accurate gap measurement can be performed at the same position even when performing multiple gap measurements. In addition, with the use of the measurement camera 801, there are few errors caused by light scattering, and the actual image can be confirmed and distinguished according to the measurement position.

[0158] As mentioned above, although the description has been centered on the embodiments of the present invention, this is merely illustrative and does not limit the present invention. Those with ordinary knowledge in the field to which the present invention pertains should know that various deformations and applications not illustrated above can be made without exceeding the essential features of the embodiments of the present invention. For example, each component specifically shown in the embodiments of the present invention can be deformed and implemented. Moreover, the differences related to such deformations and applications should be interpreted as being included within the scope of the present invention defined in the appended claims.

Claims

1. A vapor deposition device, characterized in that: have: substrate; A mask, disposed on the first surface of the substrate and comprising a mask frame supporting an edge region of the substrate; a through hole formed in the mask frame along an edge region of the substrate; a measuring member disposed between the substrate and the mask frame at a position corresponding to the through hole and including a measuring hole connected to the through hole; as well as a measuring camera arranged on the first surface of the mask frame at a position corresponding to the through hole, The measuring camera measures a first distance from the measuring member exposed through the through hole and a second distance from the substrate exposed through the measuring hole.

2. The evaporation device according to claim 1, characterized in that: The measuring component is located on a second surface of the mask frame which is an opposite surface of the first surface of the mask frame.

3. The evaporation device according to claim 2, characterized in that: The measuring component further includes a cover portion, which is an area outside the measuring hole. The measuring hole is located at the center of the cover and is formed to penetrate the cover in a smaller size than the through hole.

4. The evaporation device according to claim 3, characterized in that: The cover is attached to the second surface of the mask frame, opens a portion of the through hole to the same size as the measurement hole and covers the remaining area of ​​the through hole.

5. The evaporation device according to claim 1, characterized in that: The measuring member is formed of a thin film.

6. The evaporation device according to claim 1, characterized in that: The evaporation device also includes: The control unit stores the first distance and the second distance measured by the measuring camera, and calculates a difference between the stored first distance and the second distance as a gap between the substrate and the mask.

7. The evaporation device according to claim 1, characterized in that: The measuring camera is coupled to and separated from the first surface of the mask frame at a position corresponding to the through hole.

8. The evaporation device according to claim 7, characterized in that: The mask frame is formed of metal, The measuring camera further includes a magnetic force applying unit that generates a magnetic force to couple the measuring camera to the mask frame and cuts off the magnetic force to separate the measuring camera from the mask frame.

9. The evaporation device according to claim 8, characterized in that: The evaporation device also includes: The connection support part is located between the measuring camera and the magnetic force applying part, and connects the measuring camera to the magnetic force applying part.

10. The evaporation device according to claim 1, characterized in that: The mask further includes a mask pattern portion, which is located in a central opening area of ​​the mask frame and is disposed on the first surface of the substrate.

11. The evaporation device according to claim 1, characterized in that: The evaporation device also includes: A mask support portion is located on the first surface of the mask frame together with the measuring camera, and supports the mask on the first surface of the mask frame.

12. The evaporation device according to claim 1, characterized in that: The evaporation device also includes: an electrostatic chuck located on a second surface of the substrate opposite to the first surface; and The magnetic force generating portion is located on the first surface of the electrostatic chuck.

13. A mask for a vapor deposition device, characterized in that: include: a mask pattern section; A mask frame, located at the edge of the mask pattern portion; a through hole formed in the mask frame; as well as The measuring member is located on the mask frame at a position corresponding to the through hole and has a measuring hole connected to the through hole.

14. The mask for a vapor deposition device according to claim 13, wherein: The measuring component further includes a cover portion, which is an area outside the measuring hole. The measuring hole is located at the center of the cover and is formed to penetrate the cover in a smaller size than the through hole.

15. The mask for a vapor deposition device according to claim 14, wherein: The cover is attached to the mask frame, opens a portion of the through hole to the same size as the measurement hole and covers the remaining area of ​​the through hole.

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