Substrate carrier plate

Abstract

The utility model discloses a substrate carrying plate which comprises a bottom plate, a plurality of transverse limiting strips and a plurality of vertical limiting strips are arranged on the bottom plate, and the bottom plate is divided into a plurality of substrate placing cavities by the transverse limiting strips and the vertical limiting strips; a supporting structure is arranged in the substrate placing cavity; the transverse limiting strip and the vertical limiting strip are detachably connected with the bottom plate, each of the transverse limiting strip and the vertical limiting strip comprises a vertical section and a transverse section connected with the bottom of the vertical section, and the height of the supporting structure is larger than that of the transverse section. Therefore, when the carrier plate needs to be cleaned, only the limiting strips need to be replaced and cleaned. Compared with the prior art, the use cost of the carrier plate can be effectively reduced, the use efficiency of the carrier plate can be improved, meanwhile, the contact area between the substrate and the carrier plate can be reduced through the arrangement of the supporting structure, and damage to the substrate is reduced.

Description

Technical Field

[0001] The utility model relates to the field of substrate carriers, and particularly relates to a substrate carrier. Background Art

[0002] In the vacuum coating process where a carrier is required to support a substrate, while the substrate is being coated, the areas on the carrier that are not covered by the substrate will also be coated with a film layer. As the number of uses increases, the film layer in this area gradually thickens. The attachment of the thick film layer can affect production efficiency due to problems such as difficult degassing. At the same time, dust that is easily shed during transmission will pollute the chamber environment, and in severe cases, it will affect the performance of the product and cause a large number of defective products. Currently, the common practice is to take the carrier offline for maintenance and cleaning and then put it back online for use. However, this maintenance method takes a long time, and a large number of carriers need to be prepared for rotation, which greatly limits the use efficiency of the carrier and increases the use cost of the carrier. Summary of the Utility Model

[0003] The technical problem solved by the utility model is to provide a substrate carrier that is convenient for cleaning the carrier and can reduce damage to the substrate at the same time.

[0004] The technical solution adopted by the utility model to solve its technical problem is: a substrate carrier, including a bottom plate, on which a plurality of horizontal limiting strips and a plurality of vertical limiting strips are arranged. The plurality of horizontal limiting strips and the plurality of vertical limiting strips divide the bottom plate into a plurality of substrate placement cavities;

[0005] A support structure is arranged in the substrate placement cavity;

[0006] The horizontal limiting strips and the vertical limiting strips are detachably connected to the bottom plate. The horizontal limiting strips and the vertical limiting strips include vertical segments and horizontal segments connected to the bottoms of the vertical segments. The height of the support structure is higher than the height of the horizontal segments.

[0007] Further: The support structure is a cross-shaped support structure, a circular support structure or a square support structure.

[0008] Further: A plurality of air extraction holes are arranged on the bottom plate.

[0009] Further: A plurality of limiting screw holes are arranged on the bottom plate. The support structure, the plurality of horizontal limiting strips or the plurality of vertical limiting strips are detachably connected to the bottom plate through bolts.

[0010] Further: The plurality of vertical limiting strips are detachably connected to the bottom plate through bolts. The horizontal limiting strips are respectively located on both sides of the vertical limiting strips. The horizontal limiting strips are detachably connected to the bottom plate through bolts.

[0011] Furthermore, a plurality of vertical limiting strips are arranged on the bottom plate. A plurality of first mortise openings are arranged on the upper surface of the vertical limiting strips, and second mortise openings adapted to the first mortise openings are arranged on the lower surface of the horizontal limiting strip. The horizontal limiting strip is mortise-connected with the vertical limiting strip, and the horizontal limiting strip is detachably connected to the bottom plate through bolts.

[0012] The beneficial effects of the present utility model are as follows:

[0013] 1. In this structure, the horizontal limiting strip and the vertical limiting strip are designed as a detachable structure, so that when the carrier plate needs to be cleaned, only the limiting strips need to be replaced and cleaned. Compared with the prior art, the use cost of the carrier plate can be effectively reduced, and the use efficiency of the carrier plate can be improved.

[0014] 2. By arranging the support structure, the contact area between the substrate and the carrier plate can be reduced, and the damage to the substrate can be reduced.

[0015] 3. By arranging the air extraction holes, it is beneficial to increase the air extraction speed and ensure that the substrate is in a completely vacuum environment. Description of the Drawings

[0016] Figure 1 It is a side view of the substrate carrier plate of the embodiment of the present application.

[0017] Figure 2 It is a schematic diagram of Embodiment 1 in the present application.

[0018] Figure 3 It is a schematic diagram of the connection part between the horizontal limiting strip and the vertical limiting strip in Embodiment 1 of the present application.

[0019] Figure 4 It is a schematic diagram of Embodiment 2 in the present application.

[0020] Figure 5 It is a schematic diagram of the connection part between the horizontal limiting strip and the vertical limiting strip in Embodiment 2 of the present application.

[0021] Figure 6 It is a schematic diagram of the mortise connection between the horizontal limiting strip and the vertical limiting strip in Embodiment 2 of the present application.

[0022] In the figure, the marks are: bottom plate 1, horizontal limiting strip 2, vertical section 201, horizontal section 202, vertical limiting strip 3, substrate placement cavity 4, support structure 5, air extraction hole 6, limiting screw hole 7, first mortise opening 8, second mortise opening 9, substrate 10. Detailed Embodiments

[0023] In order to make the above objects, features and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given with reference to the accompanying drawings.

[0024] AsFigure 1 As shown, the embodiment of the present application discloses a substrate 10 carrier, comprising a bottom plate 1, on which a plurality of transverse limiting bars 2 and a plurality of vertical limiting bars 3 are arranged, and the plurality of transverse limiting bars 2 and the plurality of vertical limiting bars 3 divide the bottom plate 1 into a plurality of substrate 10 placement cavities 4;

[0025] The substrate 10 is placed in the cavity 4 and a support structure 5 is provided;

[0026] The transverse limiting strip 2 and the vertical limiting strip 3 are detachably connected to the bottom plate 1 , and the transverse limiting strip 2 and the vertical limiting strip 3 include a vertical section 201 and a transverse section 202 connected to the bottom of the vertical section 201 , and the height of the supporting structure 5 is higher than that of the transverse section 202 .

[0027] Specifically, the transverse limiting strips 2 and the vertical limiting strips 3 in the present structure may be solid structures or hollow structures.

[0028] In the present structure, each substrate 10 placement cavity 4 can carry a substrate 10, and according to actual needs, a carrier for coating substrates 10 of various sizes can be processed, such as vacuum coating of silicon wafers of 182mm*182mm, 210mm*210mm and other sizes commonly used in the photovoltaic field. When the carrier is in use, the substrate 10 is placed in the substrate 10 placement cavity 4, that is, at this time, the four sides of the substrate 10 are all located above the transverse section 202 of the transverse limit strip 2 or the vertical limit strip, and there is a gap between the upper surface of the transverse section 202 and the substrate 10. With a certain gap, the substrate 10 is supported as a whole on the supporting structure 5. At this time, the substrate 10 follows the substrate 10 carrier to move into the coating chamber for sputtering coating. During the sputtering coating process, the transverse limit strip 2 or the transverse section 202 of the vertical limit strip can be used to receive the parasitic film layer to prevent the film layer from sputtering to the surface of the bottom plate 1. After the use of the substrate 10 carrier is completed, the transverse limit strip 2 and the vertical limit strip 3 can be disassembled for cleaning, and then new transverse limit strips 2 and vertical limit strips 3 are installed on the bottom plate 1 so that the carrier bottom plate 1 can continue to be used.

[0029] The design of this structure can effectively reduce the cost of using the carrier. Every time the carrier needs to be cleaned, it is only necessary to disassemble and clean the horizontal limit strips 2 and the vertical limit strips 3 on the carrier. At the same time, this technical solution can effectively reduce the cost of using the carrier, improve the efficiency of using the carrier, and improve the coating quality.

[0030] In this embodiment, the support structure 5 is a cross-shaped support structure 5 , a circular support structure 5 or a square support structure 5 .

[0031] The support structure 5 in this structure is used to support the substrate 10. The preferred structure of this support structure 5 is a cross-shaped support structure 5. Using the cross-shaped support structure 5 can reduce the contact area between the support structure 5 and the substrate 10, and at the same time ensure the stability during support.

[0032] In this embodiment, a plurality of air extraction holes 6 are provided on the bottom plate 1.

[0033] Specifically, before entering the coating chamber, it will enter a plurality of vacuum chambers in sequence to ensure the vacuum degree in the coating chamber. Therefore, when the air extraction holes 6 are provided on the bottom plate 1, the air extraction speed can be increased when passing through the vacuum chamber, and the vacuum degree of the cavity between the substrate 10 and the carrier plate can be ensured.

[0034] In this embodiment, a plurality of limit screw holes 7 are provided on the bottom plate 1, and the support structure 5, multiple horizontal limit bars 2 or multiple vertical limit bars 3 are detachably connected to the bottom plate 1 through bolts.

[0035] In this structure, the support structure 5, multiple horizontal limit bars 2 or multiple vertical limit bars 3 are detachably connected to the bottom plate 1 through bolts. On the one hand, the connection firmness of the above structure can be improved, and on the other hand, the disassembly of each structure can be carried out quickly.

[0036] Specifically, there are the following two embodiments for the connection method of the horizontal limit bar 2 and the vertical limit bar 3:

[0037] Embodiment 1: The multiple vertical limit bars are detachably connected to the bottom plate 1 through bolts. The horizontal limit bars 2 are respectively located on both sides of the vertical limit bars, and the horizontal limit bars 2 are detachably connected to the bottom plate 1 through bolts.

[0038] Specifically, as Figure 2 shown, three vertical limit bars 3 are of an integral structure, and twelve horizontal limit bars 2 are sequentially located on both sides of the three vertical limit bars 3, dividing the entire carrier plate into twelve substrate 10 placement cavities 4;

[0039] It can also be the following structure: that is, three horizontal limit bars 2 are of an integral structure, and twelve vertical limit bars 3 are sequentially located on both sides of the three horizontal limit bars 2, dividing the entire carrier plate into twelve substrate 10 placement cavities 4.

[0040] Embodiment 2: The multiple vertical limit bars are arranged on the bottom plate 1. A plurality of first mortise openings 8 are provided on the upper surface of the vertical limit bars, and second mortise openings 9 adapted to the first mortise openings 8 are provided on the lower surface of the horizontal limit bars 2. The horizontal limit bars 2 are mortise-and-tenon inserted with the vertical limit bars, and the horizontal limit bars 2 are detachably connected to the bottom plate 1 through bolts.

[0041] Specifically, as Figure 3As shown in the figure: Three vertical limiting strips 3 are located on the bottom plate 1. Three horizontal limiting strips 2 are mortise-tenon inserted into the three vertical limiting strips 3. The three horizontal limiting strips 2 press and limit the three vertical limiting strips 3. The first mortise opening 8 and the second mortise opening 9 are located at the insertion joints of the vertical limiting strips 3 and the horizontal limiting strips 2.

[0042] It can also be the following structure: Three horizontal limiting strips 2 are located on the bottom plate 1. Three vertical limiting strips 3 are mortise-tenon inserted into the three horizontal limiting strips 2. The three vertical limiting strips 3 press and limit the three horizontal limiting strips 2. The first mortise opening 8 and the second mortise opening 9 are located at the insertion joints of the vertical limiting strips 3 and the horizontal limiting strips 2.

[0043] When designing the above structure, the design is simple. There is no need to dig grooves on the bottom plate 1 to install the vertical limiting strips 3 and the horizontal limiting strips 2. Thus, on the one hand, the processing and manufacturing cost can be effectively reduced, and on the other hand, it is convenient to disassemble the horizontal limiting strips 2 and the vertical limiting strips 3.

[0044] In the specific embodiments described above, the purpose, technical solutions, and beneficial effects of the present invention have been further described in detail. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. A substrate carrier, characterized in that: It comprises a bottom plate (1), on which a plurality of transverse limiting strips (2) and a plurality of vertical limiting strips (3) are arranged, and the plurality of transverse limiting strips (2) and the plurality of vertical limiting strips (3) divide the bottom plate (1) into a plurality of substrate placement cavities (4); A support structure (5) is arranged in the substrate placement cavity (4); The transverse limiting strip (2) and the vertical limiting strip (3) are detachably connected to the bottom plate (1); the transverse limiting strip (2) and the vertical limiting strip (3) comprise a vertical section (201) and a transverse section (202) connected to the bottom of the vertical section (201); and the height of the supporting structure (5) is higher than the height of the transverse section (202).

2. The substrate carrier according to claim 1, characterized in that: The support structure (5) is a cross-shaped support structure (5), a circular support structure (5) or a square support structure (5).

3. The substrate carrier according to claim 1, characterized in that: The bottom plate (1) is provided with a plurality of air extraction holes (6).

4. The substrate carrier according to claim 1, characterized in that: The bottom plate (1) is provided with a plurality of limiting screw holes (7), and the supporting structure (5), the plurality of transverse limiting strips (2) or the plurality of vertical limiting strips (3) are detachably connected to the bottom plate (1) via bolts.

5. The substrate carrier according to claim 1, characterized in that: The plurality of vertical limit strips are detachably connected to the bottom plate (1) via bolts, the transverse limit strips (2) are respectively located on both sides of the vertical limit strips, and the transverse limit strips (2) are detachably connected to the bottom plate (1) via bolts.

6. The substrate carrier according to claim 1, characterized in that: The plurality of vertical limit strips are arranged on the bottom plate (1); the upper surface of the vertical limit strips is provided with a plurality of first mortise and tenon openings (8); the lower surface of the transverse limit strips (2) is provided with second mortise and tenon openings (9) matched with the first mortise and tenon openings (8); the transverse limit strips (2) are mortise and tenon plugged with the vertical limit strips; the transverse limit strips (2) are detachably connected to the bottom plate (1) via bolts.

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