Buffer base material of buffer device
By designing a buffer substrate with a first depression structure and a buffer member in the spacecraft, the impact of the explosion shock wave generated by the pyrotechnical separation device on the precision equipment is solved, the bearing capacity and service life of the buffer device are improved, and the effective reduction effect is achieved.
Patent Information
- Application Number
- CN202422190049.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-09-06
AI Technical Summary
The explosion shock wave generated by the fire separation device in existing spacecraft will affect the normal use of precision sensors and data acquisition instruments, and may even lead to failure. The commonly used honeycomb plate buffer device has poor load-bearing capacity and is prone to damage.
A buffer substrate of a buffer device is designed, including a substrate body, an input connection portion and an output connection portion. The substrate body is provided with a first recessed structure for surrounding the input connection portion and a buffer member is provided therein to weaken the transmission of impact force.
By setting the first recessed structure and buffer member on the force transmission path, the impact force is effectively reduced, the bearing capacity and strength of the buffer substrate are improved, the service life is extended, and good shock drop performance is shown in scenarios such as spacecraft with large impact loads.
Smart Images
Figure CN222992028U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of buffer devices, and particularly relates to a buffer substrate of a buffer device, and the buffer device can be particularly applied to a buffer device of an explosive separation device in a spacecraft. Background Art
[0002] A spacecraft, also known as a space vehicle, a space aircraft, etc., specifically refers to various aircrafts that can operate in space according to the laws of celestial mechanics and perform specific tasks such as exploring, developing, and utilizing space and celestial bodies.
[0003] Generally speaking, a relatively large number of precision sensors or data acquisition instruments, etc. are fixedly installed on a spacecraft to facilitate the normal operation of the spacecraft and perform relevant data acquisition; and, in order to meet the deployment requirements of relevant components in the spacecraft, a pyrotechnic separation device is usually configured on the installation structure of the precision sensors or data acquisition instruments installed on the spacecraft. When the pyrotechnic separation device works, a relatively large explosion shock wave will be generated, and this explosion shock wave will affect the normal use of nearby precision sensors or data acquisition instruments, etc. Seriously, it may even cause the failure of precision sensors or data acquisition instruments, etc.
[0004] In the related art, a common solution is to use a honeycomb panel for shock reduction, but the load-bearing capacity of the honeycomb panel is relatively poor. Once the impact load received is relatively large, it is easy to be damaged, thereby affecting the service life of the entire buffer device.
[0005] Therefore, how to provide a solution to overcome or alleviate the above defects is still a technical problem that those skilled in the art need to solve urgently. Summary of the Utility Model
[0006] The purpose of the utility model is to provide a buffer substrate of a buffer device, which can have better load-bearing capacity and strength performance, can be better applied to scenarios with relatively large impact loads, and can have a relatively long service life.
[0007] To solve the above technical problems, the utility model provides a buffer substrate of a buffer device, including a substrate body, an input connection part, and an output connection part. The substrate body is provided with a first concave structure, the first concave structure is located between the input connection part and the output connection part, the first concave structure is configured to be able to surround the input connection part, and a buffer member is arranged in the first concave structure; the input connection part is installed on the substrate body, or the input connection part and the substrate body are integrally formed; the output connection part is installed on the substrate body, or the output connection part and the substrate body are integrally formed.
[0008] In the buffer substrate provided by the embodiment of the present utility model, a first concave structure is provided between the input connection part and the output connection part, which can effectively cut off the force transmission path between the two. Thus, when a buffer member is arranged in the first concave structure in this form, the buffer member can better play its role of weakening and buffering the impact force between the input connection part and the output connection part, so that the reduction of the impact force can be more effectively realized. Moreover, the above-mentioned first concave structure can surround the input connection part, so that the situation that the impact force input from the input connection part directly bypasses the first concave structure when being transmitted to the output connection part can be greatly reduced. That is to say, the buffering effect of the first concave structure and the buffer member arranged in the first concave structure on the impact force can be exerted to a greater extent.
[0009] In addition, in the substrate body of the buffer substrate in the embodiment of the present utility model, the first concave structure is only arranged in a local area, and the areas such as the bottom wall part and the peripheral wall part used to enclose and form the first concave structure in the substrate body are all solid structures, so that the strength and load-bearing capacity of the substrate body and the buffer substrate can be greatly improved. When applied to scenarios with large impact loads, such as the scenario of spacecraft, the buffer substrate is not easily directly damaged due to large impacts, and its own service life can be relatively long, and it can ensure its good impact reduction performance for a relatively long time.
[0010] Optionally, the number of the input connection parts is different from the number of the output connection parts.
[0011] Optionally, the substrate body is further provided with weight-reducing holes.
[0012] Optionally, a plurality of the input connection parts are arranged on the substrate body at intervals, and one first concave structure is configured to be able to surround the plurality of input connection parts; or, the number of the input connection parts is the same as the number of the first concave structures, and the first concave structures and the input connection parts are arranged in correspondence.
[0013] Optionally, the wall part of the substrate body used to enclose and form the first concave structure includes a bottom wall part, and the ratio of the wall thickness of the bottom wall part to the groove depth of the first concave structure is less than or equal to 0.25.
[0014] Optionally, on the normal direction of the substrate body, the first concave structures are arranged on both sides of the substrate body.
[0015] Optionally, the first concave structure on one normal side of the substrate body is a first type of groove body, and the first concave structure on the other normal side of the substrate body is a second type of groove body. There is at least one first type of groove body and one second type of groove body between one input connection part and one output connection part. In the normal direction of the substrate body, there is an overlapping area between the first type of groove body and the second type of groove body, and the substrate body has a turning transition wall part between the first type of groove body and the second type of groove body.
[0016] Optionally, the substrate body is further provided with a second concave structure. The side where the first concave structure is located is consistent with the side where the input connection part is located. The second concave structure and the first concave structure are respectively located on both sides in the normal direction of the substrate body. The second concave structure and the input connection part are oppositely arranged in the normal direction of the substrate body, and a buffer member is also arranged in the second concave structure.
[0017] Optionally, a core plate is further included. The core plate is arranged in at least one of the first concave structure and the second concave structure, and the core plate is in a honeycomb shape.
[0018] Optionally, the core plate and the substrate body are of an integrally formed one-piece structure. Description of the Drawings
[0019] Figure 1 It is a schematic structural diagram of an implementation manner of the substrate body of the buffer device provided by the present utility model;
[0020] Figure 2 It is a schematic structural diagram of an implementation manner of the substrate body of the buffer device provided by the present utility model;
[0021] Figure 3 It is a partial cross-sectional view of a buffer substrate with the first concave structure arranged on only one side;
[0022] Figure 4 It is a partial cross-sectional view of a buffer substrate with the first concave structure arranged on both sides;
[0023] Figure 5 It is a partial cross-sectional view of a buffer substrate with the first concave structure arranged on both sides and an overlapping area between the first concave structures on both sides;
[0024] Figure 6 It is a partial cross-sectional view of a buffer substrate with the first concave structure and the second concave structure;
[0025] Figure 7 It is a schematic structural diagram of a buffer device.
[0026] Explanation of the reference numerals is as follows:
[0027] 100 Buffer substrate, 110 Substrate body, 111 First recessed structure, 111a Type I groove, 111b Type II groove, 112 Bottom wall portion, 113 Steering transition wall portion, 114 Second recessed structure, 115 Weight reduction hole, 120 Input connection portion, 130 Output connection portion, 140 Shielding cover. Detailed implementation manners
[0028] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0029] In the embodiments of the present invention, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.
[0030] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly defined and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connected" may be a detachable connection or a non-detachable connection; it may be a direct connection or an indirect connection through an intermediate medium.
[0031] In the description of the embodiments of the present invention, the term "a plurality of" means two or more. And when using "a plurality of" to represent the quantity of different components, it does not represent the mutual relationship of these components in terms of quantity.
[0032] In the description of the embodiments of the present invention, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, the element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.
[0033] Please refer to Figures 1 - 6 , Figure 1 which is a schematic structural diagram of an implementation manner of the substrate body of the buffer device provided by the present invention; Figure 2 which is a schematic structural diagram of an implementation manner of the substrate body of the buffer device provided by the present invention; Figure 3 which is a partial cross-sectional view of a buffer substrate with the first recessed structure arranged on only one side; Figure 4 which is a partial cross-sectional view of a buffer substrate with the first recessed structure arranged on both sides; Figure 5A partial cross-sectional view of a buffer substrate with first recessed structures arranged on both sides and with overlapping areas of the first recessed structures on both sides; Figure 6 It is a partial cross-sectional view of a buffer substrate having a first recessed structure and a second recessed structure.
[0034] like Figures 1 - 6 As shown, an embodiment of the present invention provides a buffer substrate that can be applied to a buffer device. The buffer substrate 100 includes a substrate body 110 , an input connection portion 120 , an output connection portion 130 and a shielding cover 140 .
[0035] The input connection part 120 and the output connection part 130 are both located in the substrate body 110. Specifically, the input connection part 120, the output connection part 130 and the substrate body 110 can be an integral structure formed in one piece, so that the buffer substrate 100 has fewer molding steps and the molding process can be relatively simple. In addition, at least one of the input connection part 120 and the output connection part 130 and the substrate body 110 can be configured to be manufactured separately and then assembled. The specific assembly process includes but is not limited to welding, riveting, bolt connection, clamping, etc. In short, the reliability requirements of the connection must be guaranteed; under this implementation method, the structural form of the substrate body 110 can be simpler, and the preparation of the substrate body 110 can also be simplified. At the same time, since at least one of the input connection part 120 and the output connection part 130 is manufactured separately, its structural form can also have more diverse choices, and the structural design can be more flexible.
[0036] The substrate body 110 is provided with a first recessed structure 111. The first recessed structure 111 is located in the force transmission path (eg, Figure 1 and Figure 2 The first recessed structure 111 is provided with a buffer member. The shielding cover 140 is installed on the substrate body 110 and can block the notch of the first recessed structure 111, thereby reducing the possibility that the buffer member in the first recessed structure 111 is damaged or falls out of the first recessed structure 111.
[0037] In the above scheme, the embodiment of the utility model sets a first recessed structure 111 on the force transmission path of the input connection part 120 and the output connection part 130 to isolate the force transmission path between the two, and sets a buffering member in the first recessed structure 111, which can weaken and buffer the impact force between the input connection part 120 and the output connection part 130, thereby effectively achieving the technical purpose of reducing the impact force.
[0038] Moreover, the above-mentioned first concave structure 111 can surround the input connection part 120, so that the situation where the impact force input from the input connection part 120 directly bypasses the first concave structure 111 when being transmitted to the output connection part 130 can be greatly reduced. That is to say, the buffering effect of the first concave structure 111 and the buffer member arranged in the first concave structure 111 on the impact force can be exerted to a greater extent.
[0039] In some implementation manners, the first concave structure 111 forms a closed ring. In this way, on the substrate body 110, the first concave structure 111 can achieve complete isolation between the input connection part 120 and the output connection part 130, and can maximize the functions of the first concave structure 111 and the buffer member located in the first concave structure 111.
[0040] In other implementation manners, as Figure 1 and Figure 2 shown, the first concave structure 111 can be an open ring. At this time, the first concave groove 111 cannot achieve a full surround in the circumferential direction. In this case, through research, the embodiments of the present invention find that setting the first concave structure 111 in the form of an open ring to surround the input connection part 120 can better reduce the situation where the impact force bypasses the first concave structure 111, that is, can better buffer the impact force, so as to achieve a better impact reduction effect.
[0041] The number of the input connection parts 120 and the output connection parts 130 can both be multiple. In this way, the input impact force and the output impact force can be shunted, so that the impact force to be transmitted by each input connection part 120 and each output connection part 130 can be relatively small, and the situation where the input connection part 120 and the output connection part 130 are damaged in actual applications can be greatly avoided.
[0042] In the above implementation manners, each input connection part 120 and each output connection part 130 can be arranged at intervals on the substrate body 110 to make full use of the space on the substrate body 110. At the same time, the distance between each input connection part 120 and the output connection part 130 can also be increased, thereby increasing the force transmission path between the input connection part 120 and the output connection part 130, and facilitating the arrangement of the first concave structure 111.
[0043] In fact, the number of input connection portions 120 is not limited to the multiple ones described above, and it can also be one, which can be specifically determined in combination with actual usage requirements, etc. For example, in actual applications, there may be a buffer substrate 100 directly connected to a vibration source. Thus, the number of input connection portions 120 is actually related to the structural form of the vibration source. In this case, it is also possible that there is only one input connection portion 120.
[0044] There may be a one-to-one correspondence between the input connection portion 120 and the first recessed structure 111; for example Figure 1 and Figure 2 In the implementation manner of, the number of the input connection portions 120 and the first recessed structures 111 can be the same, and the input connection portions 120 can be arranged corresponding to the first recessed structures 111, so that each input connection portion 120 has a corresponding first recessed structure 111 surrounding it. Or, the number of the input connection portions 120 can also be more than that of the first recessed structures 111. In this way, at least two input connection portions 120 can be surrounded by one first recessed structure 111. Or, alternatively, the number of the input connection portions 120 can be less than that of the first recessed structures 111. In this way, at least one input connection portion 120 can be surrounded by multiple first recessed structures 111.
[0045] When the number of the first recessed structures 111 is multiple, the first recessed structures 111 can share the same shielding cover 140 to reduce the number of shielding covers 140 used. Or, a shielding cover 140 can also be configured for each first recessed structure 111.
[0046] In actual applications, in addition to being able to undertake the function of force transmission, the output connection portion 130 and the input connection portion 120 can also play a connecting function. For example, for the implementation manner in which the buffer device includes multiple buffer substrates 100, in two adjacent buffer substrates 100, the output connection portion 130 of one can be connected to the input connection portion 120 of the other, so as to directly transmit the impact force from the output connection portion 130 of one buffer substrate 100 to the input connection portion 120 of the other buffer substrate 100. Also for example, for the implementation manner in which the buffer device has only one buffer substrate 100, its input connection portion 120 can be directly connected to the vibration source, while the output connection portion 130 can be directly connected to the component to be protected.
[0047] The substrate body 110 can also be provided with weight-reducing holes 115 for reducing the weight of the buffer substrate 100, so as to achieve lightweight.
[0048] In some implementation manners, the buffer member can be damping particles, and the damping particles can be filled in the first recessed structure 111.
[0049] In this implementation manner, when the impact force is transmitted from the input connection portion 120 to the first recessed structure 111, it can drive the damping particles in the first recessed structure 111 to move. Since the damping particles are independent of each other, when they are forced to move, the movement directions and trajectories of the damping particles are not completely the same, and the damping particles can collide with each other to dissipate the impact force, so that the impact force transmitted to the output connection portion 130 can be significantly weakened, thus achieving a better impact reduction effect.
[0050] The material of the damping particles can be diverse and is not specifically limited in the embodiments of the present utility model. Specifically, it can be determined in combination with the actual application scenario, etc. For example, the damping particles can be made of a metal material, such as iron-based particles, etc., so as to have relatively high strength, thereby being able to greatly reduce the possibility of damage during the collision of the damping particles with each other.
[0051] Based on the principle that the damping particles collide with each other to dissipate the impact force, the first recessed structure 111 should have a relatively large space inside, so that the damping particles can move well, thereby fully exerting their impact reduction performance. In specific practice, there may be a correlation between the size design of the first recessed structure 111 and the size of the damping particles. Taking iron-based particles with a diameter between 1.95 mm and 2.05 mm as an example of the damping particles, the distance L1 of the first recessed structure 111 on the connection line between the centers of the input connection portion 120 and the output connection portion 130 can be greater than or equal to 8 mm. In this way, the role of the damping particles in the first recessed structure 111 can be better exerted.
[0052] In some other implementation manners, the impact reduction structure 150 may further include damping particles and a core plate. The core plate can be located in the first recessed structure 111. Specifically, the core plate can be a honeycomb plate, which is in a honeycomb shape and includes a plurality of honeycomb cavities. The cavity walls of each honeycomb cavity can all be load-bearing members, which can greatly increase the load-bearing path inside the first recessed structure 111, and further increase the loss of the impact force during the transmission process, so as to better achieve the technical purpose of impact reduction.
[0053] The core plate and the base material body 110 can be a split structure, that is, the core plate and the base material body 110 can be manufactured separately and then assembled. In this way, the processing and preparation difficulty of the base material body 110 can be reduced. Specifically, the base material body 110 can be prepared first, and a core plate with a suitable size can be prepared according to the size of the first recessed structure 111, and then the core plate can be fixed in the first recessed structure 111 by means of gluing and pressing.
[0054] Alternatively, the core plate and the substrate body 110 may also be an integrally formed one-piece structure, that is, the core plate may be integrally formed in the first recessed structure 111. In this way, the preparation steps of the buffer substrate 100 may be relatively fewer, and the preparation process may be relatively simplified.
[0055] The damping particles can be specifically filled in the honeycomb cavity of the core plate, so that the damping particles and the core plate can work together to achieve impact reduction, thereby achieving a better impact reduction effect. It should be noted that since the damping particles require a certain installation space, when the damping particles and the core plate are combined, the size of the honeycomb cavity of the core plate needs to be controlled so that the damping particles in the honeycomb cavity can also collide freely.
[0056] like Figure 1 and Figure 2 As shown, the number of input connection parts 120 and the number of output connection parts 130 may be consistent. Alternatively, the number of input connection parts 120 and the number of output connection parts 130 may also be different.
[0057] like Figure 3 As shown, the substrate body 110 may further include a bottom wall portion 112, and the bottom wall portion 112 may be located on the side of the first recessed structure 111 away from its notch, that is, the bottom wall portion 112 may block the side of the first recessed structure 111 away from its notch. The bottom wall portion 112 may have a wall thickness L2, and the first recessed structure 111 may have a groove depth L3. It should be understood that the groove depth L3 and the wall thickness L2 here both refer to the dimensions in the normal direction of the substrate body 110.
[0058] The greater the wall thickness L2 of the bottom wall portion 112, the higher the structural strength of the substrate body 110, and in practical applications, the lower the possibility of damage to the buffer substrate 100. The greater the groove depth L3 of the first recessed structure 111, the lower the possibility of the impact force bypassing the first recessed structure 111 in the normal direction of the substrate body 110, that is, the buffering performance of the first recessed structure 111 and its internal buffering component can be better exerted, and the impact reduction effect can be better.
[0059] Based on this, the following embodiments of the present invention will conduct hammer tests in combination with five different embodiments and comparative examples to explore the influence of the proportional relationship between the wall thickness L2 of the bottom wall portion 112 and the groove depth L3 of the first recessed structure 111 on the impact reduction effect of the buffer substrate 100 .
[0060] Table 1 Comparison table of hammer test results of different embodiments
[0061] Comparative Example Example 1 Example 2 Example 3 Example 4 Example 5 L2 / L3 0.25 0.24 0.44 0.625 0.25 Maximum value of shock response spectrum 1798.47 1298.48 1190.59 1482.68 1600.43 1252.67 Effect of impact reduction ------ 27.8% 33.8% 17.6% 11.0% 30.3%
[0062] Example 1: The wall thickness L2 is 2 mm, the groove depth L3 is 8 mm, and the ratio of the wall thickness L2 to the groove depth L3 is 1:4. Example 2: The wall thickness L2 is 3 mm, the groove depth L3 is 12.5 mm, and the ratio of the wall thickness L2 to the groove depth L3 is 1:4.17. Example 3: The wall thickness L2 is 4 mm, the groove depth L3 is 9 mm, and the ratio of the wall thickness L2 to the groove depth L3 is 1:2.25. Example 4: The wall thickness L2 is 5 mm, the groove depth L3 is 8 mm, and the ratio of the wall thickness L2 to the groove depth L3 is 1:1.6. Example 5: The wall thickness L2 is 6.5 mm, the groove depth L3 is 26 mm, and the ratio of the wall thickness L2 to the groove depth L3 is 1:4. The structural form of the buffer substrate 100 used in the above five examples can be referred to the foregoing Figure 1 , the buffer member is a damping particle, and the comparative example does not provide the first recessed structure 111. After obtaining the test data of the five examples, the mean value of the input / output shock response data is taken, and by correcting the taken mean value, the maximum value of the shock response spectrum under each example can be obtained, and the shock reduction effect of each example can be calculated. Specifically, it can be referred to Table 1 above.
[0063] As shown in Table 1 above, the shock reduction effects of Example 1, Example 2, and Example 5 are all above 25%, and the shock reduction of the impact force can be better achieved. Based on this, in some alternative implementation manners of the embodiments of the present invention, the ratio between the wall thickness L2 of the bottom wall portion 112 and the groove depth L3 of the first recessed structure 111 can be set to be less than or equal to 0.25. In this way, the shock reduction performance of the buffer substrate 100 in the embodiments of the present invention can be better.
[0064] In the above Figure 3 implementation manner, the first recessed structure 111 is only distributed on one side of the substrate body 110. Specifically, the first recessed structure 111 and the input connection portion 120 are distributed on the same side of the normal direction of the substrate body 110. Of course, the first recessed structure 111 and the input connection portion 120 can also be respectively arranged on different sides of the normal direction of the substrate body 110.
[0065] In Figure 4 implementation manner, the first recessed structure 111 can also be arranged on both sides of the normal direction of the substrate body 110. In this way, the space of the substrate body 110 in its normal direction can be more fully utilized to arrange the first recessed structure 111, so as to increase the opening area of the first recessed structure 111 as much as possible, thereby increasing the setting amount of the buffer member as much as possible, which is beneficial to improving the shock reduction performance of the buffer substrate 100 in the embodiments of the present invention.
[0066] For the convenience of description, the first recessed structures 111 on both sides of the normal direction of the substrate body 110 can be respectively called a first type of groove body 111a and a second type of groove body 111b. In Figure 4 and Figure 5In the implementation method, the first recessed structure 111 on the same side as the input connection part 120 is called a first type of groove body 111a, and then the first recessed structure 111 on the side different from the input connection part 120 is called a second type of groove body 111b. In addition, it is also feasible to call the first recessed structure 111 on the side different from the input connection part 120 a first type of groove body 111a, and call the first recessed structure 111 on the same side as the input connection part 120 a second type of groove body 111b.
[0067] In the specific arrangement, there can be at least one first type of groove body 111a and one second type of groove body 111b between one input connection part 120 and one output connection part 130. And, as Figure 5 shown, in the normal direction of the base material body 110, there can be an overlapping area between the first type of groove body 111a and the second type of groove body 111b.
[0068] With such a setting, the base material body 110 can have a turning transition wall part 113 between the first type of groove body 111a and the second type of groove body 111b. When the impact force is transmitted within the base material body 110, it needs to pass through the bottom wall part 112 corresponding to the first type of groove body 111a, the turning transition wall part 113, and the bottom wall part 112 corresponding to the second type of groove body 111b in sequence, with multiple turnings, which can effectively consume the impact force. And, because there is an overlap between the first type of groove body 111a and the second type of groove body 111b, the arrangement area of the first recessed structure 111 in the normal direction of the base material body 110 is greatly increased. As Figure 5 shown, the first recessed structure 111 can cover the entire area of the base material body 110 in its normal direction. In this way, the difficulty of the impact force bypassing the first recessed structure 111 and directly transmitting to the output connection part 130 will be greatly increased, and thus the buffering performance of the first recessed structure 111 and the buffer member located in the first recessed structure 111 can be exerted to a greater extent, so that the buffer base material 100 can have a better impact reduction effect.
[0069] In Figure 6 the implementation method, in addition to the aforementioned first recessed structure 111, the base material body 110 can also be provided with a second recessed structure 114. The first recessed structure 111 and the input connection part 120 can be located on the same side of the base material body 110, and the second recessed structure 114 and the first recessed structure 111 can be located on both sides of the normal direction of the base material body 110 respectively. And, the second recessed structure 114 and the input connection part 120 can be oppositely arranged in the normal direction of the base material body 110. A buffer member can also be provided in the second recessed structure 114, and the shielding cover 140 can also block the notch of the second recessed structure 114. To Figure 6With reference to the orientation relationship and position relationship, the above embodiments can utilize the space below the substrate body 110 of the input connection portion 120, and can also increase the arrangement area of the buffer member, thereby improving the impact reduction performance of the buffer substrate 100.
[0070] There may be an overlapping area between the first recessed structure 111 and the second recessed structure 114 in the normal direction of the substrate body 110. In this way, there may also be a turning transition wall portion 113 between the first recessed structure 111 and the second recessed structure 114 to increase the number of turns of the impact force during transmission, and thus more dissipation of the impact force can be achieved. Of course, there may also be no overlapping area between the first recessed structure 111 and the second recessed structure 114 in the normal direction of the substrate body 110, which can be determined specifically according to the actual situation.
[0071] In addition, it should be emphasized that in the embodiment of the present invention, except for the above-mentioned first recessed structure 111 and second recessed structure 114 of the buffer substrate 110, other parts are all solid structures, such as the aforementioned bottom wall portion 112, turning transition wall portion 113, etc. Compared with the full honeycomb plate structure in the conventional impact reduction structure, the strength and load-bearing capacity of the buffer substrate 110 in the embodiment of the present invention can be greatly improved. When applied to scenarios with large impact loads, such as the scenario of the spacecraft mentioned in the background art, the service life of the buffer substrate 110 itself can be longer, which is more conducive to maintaining its impact reduction performance under long-term use conditions.
[0072] Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of a buffer device.
[0073] For ease of understanding, the embodiment of the present invention also shows a schematic structure of a buffer device, specifically as Figure 7 shown. The buffer device includes two layers of buffer substrates 100, and each buffer substrate 100 can be stacked along its normal direction (i.e., the wall thickness direction). The two buffer substrates 100 can be fixedly connected, and the specific fixed connection methods include but are not limited to welding, riveting, bolt connection, snap connection, etc. In short, the two buffer substrates 100 should be able to be assembled together more reliably.
[0074] Among the two buffer substrates 100, one can be connected to the vibration source, and the other can be connected to the component to be protected. In a specific example, it can be Figure 7The uppermost buffer substrate 100 is connected to the vibration source, and the lowermost buffer substrate 100 is connected to the component to be protected. During actual operation, the vibration source generates vibration impact force, which can be buffered step by step through the two buffer substrates 100. In this way, when the vibration impact force is transmitted to the component to be protected, the vibration impact force can be significantly weakened or even dissipated, thereby effectively reducing the impact of the vibration impact force generated by the vibration source on the component to be protected.
[0075] In a specific scenario, for example, in the scenario of the spacecraft mentioned in the background art, the above vibration source can be an explosive separation device, and the above component to be protected can be a precision sensor or data acquisition instrument in the spacecraft, etc.; the spacecraft can also be configured with a mounting member, which can be, for example, a mounting plate or a mounting frame, etc., and is not limited herein. In specific applications, the buffer device provided by the embodiment of the present invention can be arranged between the mounting member and the explosive separation device to isolate the explosive separation device and the mounting member, thereby effectively reducing the impact of the explosion shock wave generated by the explosive separation device during operation on the precision sensors or data acquisition instruments in the spacecraft, etc., which is beneficial to ensuring the normal operation of the spacecraft.
[0076] It should be understood that the above description of the application of the buffer device provided by the embodiment of the present invention in the spacecraft is only an exemplary illustration of the embodiment of the present invention and cannot be used as a limitation on the implementation scope of the buffer device provided by the embodiment of the present invention. In fact, the buffer device provided by the embodiment of the present invention can be applied to any scenario where there is vibration impact and the vibration impact needs to be buffered. For example, for some mechanical equipment, the vibration impact generated during the production process can be eliminated by the above buffer device.
[0077] In addition, the above implementation manner including two buffer substrates 100 is also an exemplary illustration of the embodiment of the present invention. In actual applications, those skilled in the art can adjust the number of buffer substrates 100 according to various factors such as the magnitude of the vibration impact force and the size of the installation space in different application scenarios; for example, the buffer substrate 100 can be only one, or the buffer substrate 100 can also be set to three or more than three. It should be clear that under the condition that the structural dimensions of the buffer substrate 100 remain unchanged, the more the number of buffer substrates 100 used, the better the corresponding impact reduction effect.
[0078] When the number of the buffer substrates 100 is multiple, the materials of two adjacent buffer substrates 100 can be different. In this way, when the impact force is transmitted between different buffer substrates 100, it is equivalent to propagating in two different media, which itself can also cause a large loss of the impact force, thereby achieving a better impact reduction effect. For example, among two adjacent buffer substrates 100, one can be made of steel material, and the other can be made of aluminum alloy or titanium alloy, etc.
[0079] In the embodiment of the present utility model, the buffer substrate 100 can be a metal plate. In this way, it can have relatively better waterproof, fireproof, corrosion-resistant and other properties, and the service life can be longer, especially suitable for use in spacecraft. Of course, in some other application scenarios, the buffer substrate 100 can also adopt other materials, which is not limited herein.
[0080] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present utility model, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present utility model.
Claims
1. A buffer substrate of a buffer device, characterized in that: The invention comprises a substrate body, an input connection part and an output connection part, wherein the substrate body is provided with a first recessed structure, the first recessed structure is located between the input connection part and the output connection part, the first recessed structure is configured to surround the input connection part, and a buffer member is provided in the first recessed structure; the input connection part is mounted on the substrate body, or the input connection part and the substrate body are integrally formed; the output connection part is mounted on the substrate body, or the output connection part and the substrate body are integrally formed.
2. The buffer substrate of the buffer device according to claim 1, characterized in that: The number of the input connection parts is different from the number of the output connection parts.
3. The buffer substrate of the buffer device according to claim 1, characterized in that: The substrate body is also provided with weight-reducing holes.
4. The buffer substrate of the buffer device according to any one of claims 1 to 3, characterized in that: A plurality of the input connection parts are arranged at intervals on the substrate body, and one first recessed structure is configured to surround the plurality of the input connection parts; or, The number of the input connection parts is consistent with the number of the first recessed structures, and the first recessed structures and the input connection parts are arranged correspondingly.
5. The buffer substrate of the buffer device according to any one of claims 1 to 3, characterized in that: The wall portion in the substrate body for enclosing and forming the first recessed structure includes a bottom wall portion, and a ratio between a wall thickness of the bottom wall portion and a groove depth of the first recessed structure is less than or equal to 0.
25.
6. The buffer substrate of the buffer device according to any one of claims 1 to 3, characterized in that: In the normal direction of the substrate body, the first recessed structure is disposed on both sides of the substrate body.
7. The buffer substrate of the buffer device according to claim 6, characterized in that: The first recessed structure on one side of the normal direction of the substrate body is a type-one groove body, and the first recessed structure on the other side of the normal direction of the substrate body is a type-two groove body. There is at least one type-one groove body and one type-two groove body between one of the input connection parts and one of the output connection parts. In the normal direction of the substrate body, there is an overlapping area between the type-one groove body and the type-two groove body, and the substrate body has a turning transition wall portion between the type-one groove body and the type-two groove body.
8. The buffer substrate of the buffer device according to any one of claims 1 to 3, characterized in that: The substrate body is also provided with a second recessed structure, the side where the first recessed structure is located is consistent with the side where the input connection part is located, the second recessed structure and the first recessed structure are respectively located on both sides of the normal direction of the substrate body, the second recessed structure and the input connection part are arranged opposite to each other in the normal direction of the substrate body, and the second recessed structure is also used to arrange a buffer component.
9. The buffer substrate of the buffer device according to claim 8, characterized in that: It also includes a core plate, which is disposed in at least one of the first recessed structure and the second recessed structure, and has a honeycomb shape.
10. The buffer substrate of the buffer device according to claim 9, characterized in that: The core plate and the substrate body are an integrally formed one-piece structure.