Heat dissipation equipment for technology development hardware

Abstract

The utility model discloses heat dissipation equipment for technology development hardware, and relates to the technical field of hard disk heat dissipation equipment. The heat dissipation device comprises a heat dissipation box, a containing groove is formed in the front face of the heat dissipation box, a temperature sensor is installed on the side wall of the containing groove, an air extracting pump is installed in the middle of the upper surface of the outer portion of the heat dissipation box, and the air extracting end of the air extracting pump is connected with an air extracting pipe. The end, away from the air extracting pump, of the air extracting pipe penetrates into the heat dissipation box, and the air outlet end of the air extracting pump is connected with an air outlet pipe. Hot air at the top is absorbed, cooled and then discharged from the bottom of the containing groove, the hot air at the top is fully extruded out, cold and hot air exchange in the containing groove is completed, the temperature in the containing groove is rapidly reduced, and the temperature in the containing groove is further reduced in cooperation with cooling water in the cooling groove; the temperature of the hardware on the partition plate of the placing groove is reduced to achieve the purpose of heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of hard disk heat dissipation devices, and particularly relates to a heat dissipation device for hardware in technology development. Background Technique

[0002] Computer hardware: refers to the general term for various physical devices composed of electronic, mechanical, optoelectronic components, etc. in a computer system. In computer technology development, the situation of hardware heating often occurs. If heat dissipation is not carried out in time, it is easy to reduce the service life of the hardware and lower the working efficiency. Most of the current heat dissipation devices for computer hardware still use a single fan for heat dissipation, with poor overall effect and slow efficiency. Content of the Utility Model

[0003] In order to solve the above problems, the purpose of the utility model is to provide a heat dissipation device for hardware in technology development.

[0004] To solve the above technical problems, the utility model adopts the following technical scheme: A heat dissipation device for hardware in technology development, including a heat dissipation box. A placement groove is opened on the front surface of the heat dissipation box, and a temperature sensor is installed on the side wall of the placement groove. A suction pump is installed at the middle position of the upper surface of the outside of the heat dissipation box. The suction end of the suction pump is connected with a suction pipe, and one end of the suction pipe away from the suction pump penetrates into the interior of the heat dissipation box. The air outlet end of the suction pump is connected with an air outlet pipe. A cooling box is installed on the back surface of the heat dissipation box. One end of the air outlet pipe close to the cooling box is connected with a cooling pipe and the cooling pipe is inside the cooling box. The bottom of the cooling pipe is connected with a bifurcated pipe, and one end of the bifurcated pipe away from the cooling pipe is fixedly provided with an exhaust pipe and the exhaust pipe is arranged at the bottom of the placement groove. Cooling water is contained in the cooling box. A water storage tank is fixedly installed below the cooling box on the side wall of the heat dissipation box. Cooling grooves are opened on both sides of the interior of the heat dissipation box where the placement groove is located. Both ends of the water storage tank are respectively connected to the cooling grooves through a water inlet pipe and a water outlet pipe.

[0005] Preferably, a partition board is fixedly provided above the exhaust pipe in the placement groove, and rectangularly distributed ventilation holes are opened at the middle end of the partition board.

[0006] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0007] 1. In the utility model, the hot air at the top is absorbed, cooled and discharged from the bottom of the placement groove, so that the hot air at the top will also be fully squeezed out, completing the cold and hot air exchange in the placement groove, quickly reducing the temperature in the placement groove. Combined with the cooling water in the cooling groove, the temperature inside the placement groove is further reduced, so that the temperature of the hardware itself on the partition board of the placement groove is reduced to achieve the purpose of heat dissipation;

[0008] 2. In the present utility model, the cooling water can circulate completely during use, thereby ensuring the cooling effect inside the subsequent treatment tank and further improving the effectiveness of cooling and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0010] Figure 1 It is a front structure schematic diagram of the heat dissipation box of the present utility model.

[0011] Figure 2 It is a back structure schematic diagram of the heat dissipation box of the present utility model.

[0012] Figure 3 It is a structure schematic diagram of the bifurcated pipe of the present utility model.

[0013] Figure 4 It is a structure schematic diagram of the cooling tank of the present utility model.

[0014] In the figure: 1. Heat dissipation box; 11. Placing groove; 12. Air extraction pump; 13. Air extraction pipe; 14. Suction hopper; 15. Air outlet pipe; 16. Cooling box; 17. Cooling pipe; 18. Bifurcated pipe; 19. Exhaust pipe; 2. Water storage tank; 21. First delivery pipe; 22. Second delivery pipe; 23. Water inlet pipe; 24. Water outlet pipe; 25. Water pump; 26. Cooling tank; 3. Partition board; 31. Ventilation holes; 4. Heat dissipation holes; 5. Temperature sensor. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0016] Embodiment: As Figures 1-4As shown in the figure, the utility model provides a heat dissipation device for technology development hardware, including a heat dissipation box 1. A placement groove 11 is opened on the front surface of the heat dissipation box 1. A temperature sensor 5 is installed on the side wall of the placement groove 11. An air extraction pump 12 is installed at the middle position of the upper surface of the exterior of the heat dissipation box 1. The air extraction end of the air extraction pump 12 is connected with an air extraction pipe 13. One end of the air extraction pipe 13 far away from the air extraction pump 12 penetrates into the interior of the heat dissipation box 1. The air outlet end of the air extraction pump 12 is connected with an air outlet pipe 15. A cooling box 16 is installed on the back surface of the heat dissipation box 1. One end of the air outlet pipe 15 close to the cooling box 16 is connected with a cooling pipe 17 and the cooling pipe 17 is inside the cooling box 16. A bifurcated pipe 18 is connected to the bottom of the cooling pipe 17. One end of the bifurcated pipe 18 far away from the cooling pipe 17 is fixedly provided with an exhaust pipe 19 and the exhaust pipe 19 is arranged at the bottom of the placement groove 11. Cooling water is contained in the cooling box 16. A water storage tank 2 is fixedly installed below the cooling box 16 on the side wall of the heat dissipation box 1. Cooling grooves 26 are opened on both sides of the interior of the heat dissipation box 1 where the placement groove 11 is located. Both ends of the water storage tank 2 are respectively connected to the cooling grooves 26 through a water inlet pipe 23 and a water outlet pipe 24.

[0017] An air suction hopper 14 is fixedly provided at the bottom of the air extraction pipe 13. The provided air suction hopper 14 can gather the hot air at the top in a large range, thereby increasing the efficiency of sucking the hot air and better and more quickly cooling the interior of the heat dissipation box 1.

[0018] A first delivery pipe 21 and a second delivery pipe 22 are respectively and jointly connected between the water storage tank 2 and the cooling box 16. The provided first delivery pipe 21 is used to deliver the cooling water in the water storage tank 2 into the cooling box 16. At the same time, the second delivery pipe 22 can regularly pump the cooling water in the cooling box 16 into the water storage tank 2, which is convenient for subsequent replacement of the cooling water and keeps the cooling effect; the first delivery pipe 21, the second delivery pipe 22, the water inlet pipe 23 and the water outlet pipe 24 are all installed and connected through a water pump 25 to ensure that there is enough power to pump the cooling water to flow.

[0019] The cooling pipe 17 is integrally arranged in an S shape. By arranging the cooling pipe 17 in an S shape, the residence time of the inhaled hot air in the cooling box 16 is increased, thereby improving the cooling effect on the hot air.

[0020] A partition plate 3 is fixedly provided above the exhaust pipe 19 in the placement groove 11. A rectangular-distributed ventilation hole 31 is opened at the middle end of the partition plate 3. The provided partition plate 3 is used to place the computer hardware to be heat-dissipated. At the same time, the ventilation openings can facilitate the flow of gas, so that the cooling gas enters the treatment groove and contacts the surface of the hardware through the ventilation openings, thereby dissipating heat from the heated hardware.

[0021] Rectangular-distributed heat dissipation holes 4 are opened at the top of the heat dissipation box 1. The provided heat dissipation holes 4 can facilitate the discharge of some of the hot air gathered at the top.

[0022] Working principle: When in use, when the temperature sensor 5 detects that the temperature in the placement groove 11 is relatively high, the air extraction pump 12 at the top works at this time. The hot air located at the top of the placement groove 11 can be sucked through the air extraction pipe 13 and the suction hopper 14, and is input into the cooling pipe 17 through the air outlet pipe 15. Since the cooling pipe 17 is located in the cooling box 16 and the cooling water is injected into the cooling box 16, the hot air passing through the cooling pipe 17 will be absorbed by the cooling water in the cooling box 16, so that the absorbed hot air is cooled. Subsequently, it will be respectively branched into each exhaust pipe 19 through the branch pipe 18. At this time, the cold air discharged through the exhaust pipe 19 will float up from the bottom. As the cooling is continuously injected from the bottom, the hot air at the top will also be fully squeezed out, completing the cold and hot air exchange in the placement groove 11, rapidly reducing the temperature in the placement groove 11. At the same time, the cooling water is injected into the cooling grooves 26 opened on both sides of the placement groove 11 by the heat dissipation box 1, further reducing the temperature inside the placement groove 11, so that the temperature of the hardware on the partition plate 3 of the placement groove 11 is reduced to achieve the purpose of heat dissipation, enabling the hardware itself to be in a normal working temperature state and ensuring the stability of the hardware operation.

[0023] Obviously, those skilled in the art can make various modifications and variations to the present utility model without departing from the spirit and scope of the present utility model. Thus, if these modifications and variations of the present utility model fall within the scope of the claims of the present utility model and their equivalent technologies, the present utility model also intends to include these modifications and variations.

Claims

1. A heat dissipation device for technology development hardware, comprising a heat dissipation box (1), characterized in that: The front side of the heat sink (1) is provided with a placement groove (11), and a temperature sensor (5) is installed on the side wall of the placement groove (11). An air extraction pump (12) is installed at a middle position of the upper surface of the outside of the heat sink (1). An air extraction pipe (13) is connected to the air extraction end of the air extraction pump (12), and the end of the air extraction pipe (13) away from the air extraction pump (12) penetrates into the heat sink (1). An air outlet pipe (15) is connected to the air outlet end of the air extraction pump (12). A cooling box (16) is installed on the back side of the heat sink (1), and a cooling pipe (17) is connected to the end of the air outlet pipe (15) close to the cooling box (16). (17) In the cooling box (16), a bifurcated pipe (18) is connected to the bottom of the cooling pipe (17), an exhaust pipe (19) is fixedly provided at one end of the bifurcated pipe (18) away from the cooling pipe (17), and the exhaust pipe (19) is arranged at the bottom of the placement groove (11), the cooling box (16) is filled with cooling water, a water storage tank (2) is fixedly installed on the side wall of the heat dissipation box (1) below the cooling box (16), and cooling grooves (26) are opened on both sides of the placement groove (11) inside the heat dissipation box (1), and the two ends of the water storage tank (2) are respectively connected and arranged in the cooling groove (26) through a water inlet pipe (23) and a water outlet pipe (24).

2. A heat dissipation device for technology development hardware as claimed in claim 1, characterized in that: An air suction hopper (14) is fixedly provided at the bottom of the air extraction pipe (13).

3. A heat dissipation device for technology development hardware as claimed in claim 1, characterized in that: The water storage tank (2) and the cooling tank (16) are respectively connected to each other by a first delivery pipe (21) and a second delivery pipe (22).

4. A heat dissipation device for technology development hardware as claimed in claim 3, characterized in that: The first delivery pipe (21), the second delivery pipe (22), the water inlet pipe (23) and the water outlet pipe (24) are all installed and connected via a water pump (25).

5. The heat dissipation device for technology development hardware according to claim 1, characterized in that: The cooling pipe (17) is arranged in an S shape as a whole.

6. The heat dissipation device for technology development hardware according to claim 1, characterized in that: A partition plate (3) is fixedly arranged in the placement groove (11) above the exhaust pipe (19), and a middle end of the partition plate (3) is provided with air holes (31) distributed in a rectangular shape.

7. The heat dissipation device for technology development hardware according to claim 1, characterized in that: The top of the heat dissipation box (1) is provided with heat dissipation holes (4) distributed in a rectangular shape.

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