Silicon wafer flower basket capable of preventing surface mounting
By setting different angles on the upper and lower teeth rods of the silicon wafer basket, the problem of silicon wafer patch phenomenon and production capacity reduction in the silicon wafer basket is solved, and more efficient silicon wafer bearing and production capacity improvement is achieved.
Patent Information
- Application Number
- CN202421737107.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-22
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-07-22
AI Technical Summary
The silicon wafers in the silicon wafer basket are prone to patching, which affects the cleaning and velvet making effect. In order to prevent patching, the gap between the silicon wafers is increased, resulting in a decrease in the number of silicon wafers carried by the silicon wafer basket and a decrease in production capacity.
A silicon wafer flower basket with anti-spatch is designed. By providing upper and lower grooves with angles at different angles on the upper and lower grooves on the upper and lower grooves, each silicon wafer is placed between an upper and lower grooves and a matching lower groove, preventing patch phenomena, while reducing the gap between the silicon wafers and increasing the load-bearing number.
It effectively prevents the silicon wafer patching phenomenon in the silicon wafer basket, increases the number of silicon wafers carried by the silicon wafer basket, and increases the production capacity.
Smart Images
Figure CN222995360U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of photovoltaic manufacturing, in particular to a wafer carrier for preventing sticking of wafers. Background Art
[0002] With the continuous increase in the global demand for renewable energy, the solar photovoltaic industry has developed rapidly. During the cleaning and texturing process of wafers (also known as solar cells), reactions need to be carried out through various chemical solution tanks. In this process, wafer carriers (also known as loading devices) are usually used to carry wafers, and a manipulator is used to pick up and drive the wafer carrier, so as to realize the transfer of wafers in the chemical solution tank and complete the cleaning and texturing process. Among them, the wafer carrier is composed of a base, an upper tooth bar, a lower tooth bar and side tooth bars.
[0003] However, during the process of the wafer carrier carrying wafers and transferring them in the chemical solution tank, the wafers placed in the wafer carrier will more or less stick together, affecting the cleaning and texturing of the wafers. In order to solve this problem, some manufacturers will increase the placement gap of the wafers in the wafer carrier, that is, the tooth grooves of the upper tooth bar and the tooth grooves of the matching lower tooth bar are arranged in a staggered manner. However, this will reduce the number of wafers carried by the wafer carrier and reduce the production capacity.
[0004] Therefore, in order to prevent the wafers in the wafer carrier from sticking together and ensure that the wafers do not fall while placing more wafers, different manufacturers have proposed different design schemes, and the design concepts of different design schemes are different, and the effects produced are also different. Summary of the Utility Model
[0005] In view of this, the utility model provides a wafer carrier for preventing sticking of wafers, which is used to solve the problems that the wafers in the wafer carrier stick together in the prior art, and the number of wafers carried by the wafer carrier is reduced, resulting in a reduction in production capacity.
[0006] The technical solution of the utility model is a wafer carrier for preventing sticking of wafers, including two bases, a plurality of upper tooth bars connected to the upper parts of the two bases, a plurality of lower tooth bars connected to the lower parts of the two bases, each upper tooth bar is provided with a plurality of upper teeth at intervals along its extending direction, and an upper tooth groove is formed between any two adjacent upper teeth;
[0007] Each lower tooth bar is provided with a plurality of lower teeth at intervals along its extending direction, and a lower tooth groove is formed between any two adjacent lower teeth;
[0008] Each upper tooth groove is matched with a lower tooth groove, and different angles are provided in each upper tooth groove and its matched lower tooth groove.
[0009] Further, both the upper tooth groove and the lower tooth groove include a first head, a first tail, and a first middle part connecting the first head and the first tail;
[0010] And the included angle of the first head is 40° - 60°.
[0011] Further, the included angle of the first middle part is 5° - 10°.
[0012] Further, the first tails of any tooth grooves on the same tooth bar are parallel to each other and perpendicular to the tooth bar where they are located.
[0013] Further, the wafer carrier also includes at least one side tooth bar connected to one side of two bases. Each side tooth bar is provided with a plurality of side teeth at intervals along its extending direction. An side tooth groove is formed between any two adjacent side teeth. Each side tooth groove is correspondingly matched with an upper tooth groove and the lower tooth groove;
[0014] The side tooth groove is provided with included angles of different angles.
[0015] Further, the side tooth groove includes a second head, a second tail, and a second middle part connecting the second head and the second tail;
[0016] And the included angle of the second head is 40° - 60°.
[0017] Further, the included angle of the second middle part is 5° - 10°.
[0018] Further, the second tails of any side tooth grooves are parallel to each other and perpendicular to the side tooth bar where they are located.
[0019] Further, the bases, the upper tooth bar, the lower tooth bar, and the side tooth bar enclose a loading space for wafers, and the loading space is provided with an opening on the other side corresponding to the side where the two bases are provided with side tooth bars.
[0020] Further, the upper teeth, the lower teeth, and the side teeth are all type A teeth.
[0021] Compared with the prior art, the utility model has at least the following beneficial effects:
[0022] In the utility model, each upper tooth groove is correspondingly aligned with a lower tooth groove, and different included angles are provided in each upper tooth groove and each lower tooth groove. In this way, not only can the phenomenon of wafer sticking between adjacent wafers be prevented, but also the wafers are convenient to pick up and place, the gap between adjacent wafers is reduced, the number of wafers carried by the wafer carrier is increased, and the production capacity is improved. Description of the Drawings
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model belongs; the terms used in the description of the present application are only for the purpose of describing specific embodiments and are not intended to limit this utility model; the terms "comprising" and "having" and any variations thereof in the description and claims of this utility model and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the description and claims of this utility model or the above drawings are used to distinguish different objects and not to describe a specific order.
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of this utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0025] Figure 1 Front view of the silicon wafer carrier of this utility model;
[0026] Figure 2 For Figure 1 Enlarged schematic view of reference numeral A in
[0027] Figure 3 For Figure 1 Enlarged schematic view of reference numeral B in
[0028] Figure 4 Partial enlarged schematic view of the side tooth bar of the silicon wafer carrier of this utility model;
[0029] Figure 5 Cross-sectional view of the silicon wafer carrier of this utility model.
[0030] Reference numerals:
[0031] 10, base;
[0032] 20, upper tooth bar;
[0033] 201, upper teeth; 202, upper tooth grooves;
[0034] 30, lower tooth bar;
[0035] 301, lower teeth; 302, lower tooth grooves;
[0036] 40, side tooth bar;
[0037] 401, side teeth; 402, side tooth grooves;
[0038] 50, loading space;
[0039] 100, the first head; 200, the first tail; 300, the first middle part;
[0040] 400, the second head; 500, the second tail; 600, the second middle part. Detailed implementation mode
[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model. Thus, a feature pointed out in this specification will be used to illustrate one of the features of one embodiment of the present utility model, rather than implying that each embodiment of the present utility model must have the described feature. In addition, it should be noted that this specification describes many features. Although some features may be combined together to show possible system designs, these features may also be used in other combinations not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.
[0042] The principle and structure of the present utility model will be described in detail below with reference to the accompanying drawings and embodiments.
[0043] In one embodiment, in order to prevent the silicon wafers carried in the silicon wafer carrier from being pasted, and ensure that the silicon wafers do not fall off while carrying more silicon wafers, referring to the attached Figures 1-3 , the present utility model provides a silicon wafer carrier for preventing pasting, which includes two bases 10, a plurality of upper tooth bars 20 connected to the upper parts of the two bases 10, a plurality of lower tooth bars 30 connected to the lower parts of the two bases 10, each upper tooth bar 20 is provided with a plurality of upper teeth 201 at intervals along its extending direction, and an upper tooth groove 202 is formed between any two adjacent upper teeth 201;
[0044] Each lower tooth bar 30 is provided with a plurality of lower teeth 301 at intervals along its extending direction, and a lower tooth groove 302 is formed between any two adjacent lower teeth 301;
[0045] Each upper tooth groove 202 is matched with a lower tooth groove 302, and different angles are provided in each upper tooth groove 202 and its matched lower tooth groove 302. And the midlines of each upper tooth groove 202 and its matched lower tooth groove 302 are located on the same center line to form a counterpoint setting.
[0046] In this way, each silicon wafer can be placed between an upper tooth groove 202 and its matching lower tooth groove 302 to prevent the silicon wafer from falling off. Compared with the misalignment of the upper tooth groove 202 and its matching lower tooth groove 302, in the present utility model, each upper tooth groove 202 is aligned with a lower tooth groove 302, that is, the midlines of each upper tooth groove 202 and its matching lower tooth groove 302 are located on the same central line to form an alignment setting, and different angles are provided in each upper tooth groove 202 and each lower tooth groove 301. This can not only prevent the phenomenon of patch bonding between adjacent silicon wafers, but also facilitate the picking and placing of silicon wafers, reduce the gap between adjacent silicon wafers, increase the number of silicon wafers carried by the silicon wafer cassette, and improve the production capacity.
[0047] It should be noted that when the silicon wafers can be placed between an upper tooth groove 202 and its matching lower tooth groove 302, the lower end of the silicon wafer will directly contact the lower tooth rod 30 after entering the lower tooth groove 302, while the upper end of the silicon wafer will not contact the upper tooth rod 20 after entering the upper tooth groove 202.
[0048] Moreover, the silicon wafer cassette is also provided with a manipulator (not shown, the same throughout the text), and the manipulator will lift the silicon wafer cassette to transfer the silicon wafer cassette and the silicon wafers carried thereon in each liquid medicine tank.
[0049] Specifically, to limit the position of the silicon wafer between the upper tooth groove 202 and the lower tooth groove 302, facilitate the picking and placing of the silicon wafer, and prevent the phenomenon of patch bonding between adjacent silicon wafers, referring to the attached Figures 2-3 , both the upper tooth groove 202 and the lower tooth groove 302 include a first head 100, a first tail 200, and a first middle part 300 connecting the first head 100 and the first tail 200;
[0050] Moreover, the included angle α of the first head 100, the included angle β of the first middle part 300, and the included angle of the first tail 200 are all different, and the included angle α of the first head 100 is greater than the included angle β of the first middle part 300.
[0051] In this way, the included angles of the first head 100, the first tail 200, and the first middle part 300 are all different, and both the upper tooth 201 and the lower tooth 301 are A-shaped teeth, which can ensure that adjacent silicon wafers will not have the phenomenon of patch bonding. Specifically:
[0052] The included angle α of the first head 100 is 40° - 60°, and in this embodiment, the included angle α of the first head 100 is preferably 60° because a larger included angle α of the first head 100 makes it easier to place the silicon wafer.
[0053] The included angle β of the first middle part 300 is 5°-10°, and the included angle β of the first middle part 300 in this embodiment is preferably 10°. Because the included angle β of the first middle part 300 is small, it can better limit the position of the silicon wafer between the upper tooth groove 202 and the lower tooth groove 302, and at the same time ensure that the silicon wafer can contact the liquid medicine with the largest area in the liquid medicine tank.
[0054] The first tails 200 of any tooth grooves on the same tooth bar are parallel to each other and perpendicular to the tooth bar where they are located, so that the position of the silicon wafer between the upper tooth groove 202 and the lower tooth groove 302 can be further limited to ensure that adjacent silicon wafers do not stick together.
[0055] It should be noted that when the silicon wafers can all be placed between an upper tooth groove 202 and its matching lower tooth groove 302, the lower end of the silicon wafer will directly contact the lower tooth bar 30 after entering the lower tooth groove 302, and the upper end of the silicon wafer enters the upper tooth groove 202, that is, it exceeds the first middle part 300 of the upper tooth groove 202 and enters the first tail 200, but the upper end of the silicon wafer does not contact the upper tooth bar 20.
[0056] Among them, to further ensure the stability of the silicon wafer carried in the silicon wafer carrier and prevent the silicon wafer from falling from the corresponding upper tooth groove 202 and lower tooth groove 302, refer to the attached Figure 1 and 4 , the silicon wafer carrier further includes at least one side tooth bar 40 connected to one side of the two bases 10. Each side tooth bar 40 is provided with a plurality of side teeth 401 at intervals along its extending direction. An side tooth groove 402 is formed between any two adjacent side teeth 401. Each side tooth groove 402 is correspondingly matched with an upper tooth groove 202 and a lower tooth groove 302;
[0057] The side tooth groove 402 is provided with included angles of different angles.
[0058] In this way, when the silicon wafer carrier carries the silicon wafers and rotates in each liquid medicine tank, the side tooth bar 40 connected to one side of the two bases 10 can prevent the silicon wafers from falling from one side of the two bases 10 due to inertia.
[0059] And there is no side tooth bar 40 connected to the other side of the two bases 10, but the silicon wafers will not fall from the side without the side tooth bar 40, because when the silicon wafer carrier carries the silicon wafers and rotates in each liquid medicine tank, the manipulator will tilt slightly towards the side with the side tooth bar 40, or make the center of the silicon wafer shift to the side with the side tooth bar 40 by other means, so that the silicon wafers will not fall from the side without the side tooth bar 40 of the silicon wafer carrier due to inertia during the rotation process; and the side tooth groove 402 is provided with included angles of different angles, which can prevent adjacent silicon wafers from sticking together on the side tooth bar 40.
[0060] In other embodiments, a protective rod can also be detachably provided on the other side of the tooth bar 40 on the opposite side of the silicon wafer carrier, so as to prevent the silicon wafers from falling out of the silicon wafer carrier due to inertia during the transfer process.
[0061] It should be noted that the extension line of the center line of any side tooth groove 402 will be perpendicular to the center lines of the corresponding upper tooth groove 202 and lower tooth groove 302.
[0062] It should be noted that in this embodiment, two bases 10, three upper tooth bars 20, three lower tooth bars 30 and two side tooth bars 40 are combined to form a silicon wafer carrier, which can ensure the stability of the silicon wafers in the silicon wafer carrier and prevent the silicon wafers from easily falling out of the silicon wafer carrier.
[0063] Among them, referring to the attached Figure 1 and 5 , the bases 10, upper tooth bars 20, lower tooth bars 30 and side tooth bars 40 enclose a rectangular parallelepiped-shaped loading space 50 for loading silicon wafers, and the loading space 50 is provided with an opening on the other side corresponding to the two bases 10 where the side tooth bars 40 are provided opposite to each other.
[0064] In this way, it is convenient for equipment or manual operation to place the silicon wafers from the opening of the loading space 50 into the corresponding upper tooth grooves 202 and lower tooth grooves 302, or to take out the silicon wafers that have been cleaned and textured from the corresponding upper tooth grooves 202 and lower tooth grooves 302. In this way, it is easier to place or take out the silicon wafers located in the loading space 50, so as to improve production efficiency.
[0065] Among them, in order to further define the position of the silicon wafers on the side tooth grooves 402, facilitate the picking and placing of the silicon wafers, and prevent the adjacent silicon wafers from sticking together, referring to the attached Figure 4 , the side tooth groove 402 includes a second head 400, a second tail 500 and a second middle part 600 connecting the second head 400 and the second tail 500;
[0066] Moreover, the included angle α' of the second head 400, the included angle β' of the second middle part 600 and the included angle of the second tail 500 are all different, and the included angle α' of the second head 400 is greater than the included angle β' of the second middle part 600.
[0067] In this way, the included angles of the second head 400, the second tail 500 and the second middle part 600 are all different, and the side tooth 401 is a type-A tooth, which can ensure that the adjacent silicon wafers on the side tooth bar 40 will not stick together. Specifically:
[0068] The included angle α' of the second head 400 is 40° - 60°, and the included angle α' of the second head 400 in this embodiment is preferably 60°, because a larger included angle α' of the second head 400 makes it easier to place the silicon wafers.
[0069] The included angle β' of the second middle part 600 is 5°-10°, and the included angle β' of the second middle part 600 in this embodiment is preferably 10°. Since the included angle β' of the second middle part 600 is small, it can better limit the position of the silicon wafer on the side tooth groove 402, and at the same time ensure that the silicon wafer can contact the liquid medicine with the largest area in the liquid medicine tank.
[0070] The second tails 500 of any side tooth groove 402 are parallel to each other and perpendicular to the corresponding side tooth bar 40, which can further limit the position of the silicon wafer on the side tooth groove 402 to ensure that the adjacent two silicon wafers on the side tooth bar 40 do not have the phenomenon of patchwork.
[0071] In other embodiments, any upper tooth bar 20, any lower tooth bar 30 and any side tooth bar 40 are detachably connected to the base 10. In this way, when the upper tooth bar 20, the lower tooth bar 30 and the side tooth bar 40 need to be repaired or replaced, the upper tooth bar 20, the lower tooth bar 30 and the side tooth bar 40 are detachably connected to the two bases 10 to improve the maintenance efficiency.
[0072] The using method of the silicon wafer flower basket for preventing patchwork proposed by the present utility model:
[0073] First, place the silicon wafers to be cleaned and textured one by one on the upper tooth grooves 202, their matching lower tooth grooves 302 and the corresponding side tooth grooves 402 through equipment or manually, and then lift the silicon wafer flower basket by a manipulator to transfer the silicon wafer flower basket and the silicon wafers carried by it in each liquid medicine tank.
[0074] Finally, remove the silicon wafers after cleaning and texturing one by one from the upper tooth grooves 202, their matching lower tooth grooves 302 and the corresponding side tooth grooves 402 through equipment or manually, and place the silicon wafers to be cleaned and textured again to form a cycle.
[0075] Obviously, the above-described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. The preferred embodiments of the present utility model are shown in the drawings, but do not limit the patent scope of the present utility model. The present utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structures made by using the specification and drawings of the present utility model and directly or indirectly applied to other related technical fields are equally within the scope of the patent protection of the present utility model.
Claims
1. An anti-patch silicon wafer basket, comprising two bases (10), a plurality of upper gear rods (20) connected to the upper parts of the two bases (10), and a plurality of lower gear rods (30) connected to the lower parts of the two bases (10), characterized in that: Each of the upper gear rods (20) is provided with a plurality of upper teeth (201) at intervals along its extension direction, and an upper tooth groove (202) is formed between any two adjacent upper teeth (201); Each of the lower gear rods (30) is provided with a plurality of lower teeth (301) at intervals along its extension direction, and a lower tooth groove (302) is formed between any two adjacent lower teeth (301); Each of the upper tooth grooves (202) is matched with a lower tooth groove (302), and each of the upper tooth grooves (202) and the matched lower tooth groove (302) are provided with included angles of different angles.
2. The anti-patch silicon chip basket according to claim 1, characterized in that: The upper tooth groove (202) and the lower tooth groove (302) both comprise a first head portion (100), a first tail portion (200), and a first middle portion (300) connecting the first head portion (100) and the first tail portion (200); Furthermore, the included angle of the first head (100) is 40°-60°.
3. The anti-patch silicon chip basket according to claim 2, characterized in that: The included angle of the first middle portion (300) is 5°-10°.
4. The anti-sticking silicon chip basket according to claim 2, characterized in that: The first tail portions (200) of any tooth grooves on the same tooth rod are parallel to and perpendicular to the tooth rod.
5. The anti-patch silicon chip basket according to claim 1, characterized in that: The silicon wafer flower basket further comprises at least one side tooth rod (40) connected to one side of the two bases (10), each of the side tooth rods (40) being provided with a plurality of side teeth (401) at intervals along its extension direction, a side tooth groove (402) being formed between any two adjacent side teeth (401), and each of the side tooth grooves (402) being matched with an upper tooth groove (202) and a lower tooth groove (302); The side tooth grooves (402) are provided with included angles of different angles.
6. The anti-sticking silicon chip basket according to claim 5, characterized in that: The side tooth groove (402) comprises a second head portion (400), a second tail portion (500), and a second middle portion (600) connecting the second head portion (400) and the second tail portion (500); Furthermore, the included angle of the second head (400) is 40°-60°.
7. The anti-sticking silicon chip basket according to claim 6, characterized in that: The included angle of the second middle portion (600) is 5°-10°.
8. The anti-sticking silicon chip basket according to claim 6, characterized in that: The second tail portion (500) of any of the side tooth grooves (402) is parallel to and perpendicular to the side tooth rod (40) on which it is located.
9. The anti-sticking silicon chip basket according to claim 5, characterized in that: The base (10), the upper gear rod (20), the lower gear rod (30) and the side gear rod (40) enclose a carrying space (50) for carrying silicon wafers, and the carrying space (50) forms an opening corresponding to the other side of the two bases (10) opposite to the side gear rod (40).
10. The anti-sticking silicon chip basket according to claim 5, characterized in that: The upper teeth (201), the lower teeth (301) and the side teeth (401) are all A-type teeth.