Explosion-proof hybrid crimping structure of IGBT (Insulated Gate Bipolar Translator) and diode

Abstract

The utility model discloses an explosion-proof hybrid crimping structure for IGBTs and diodes, which comprises a plurality of power devices, water-cooled radiators are connected among the plurality of power devices, each power device comprises a diode and an IGBT, one surface of the water-cooled radiator connected between the diode and the IGBT is provided with a boss, and the other surface of the water-cooled radiator connected between the diode and the IGBT is provided with a boss. The boss is arranged on the face close to the diode, one side of the water-cooled radiator connected between the diode and the IGBT is connected with the laminated busbar to serve as a positive electrode interface, one side of the water-cooled radiator connected between the IGBT is a negative electrode interface, pressing plates are installed at the two ends of the power device, and a guide rod is installed between the pressing plates at the two ends. Through the bosses, the rigidity of the water-cooling radiator is improved under the condition that the weight of the crimping structure is increased to the minimum, so that the stress condition of the power device in the crimping structure is improved under the condition that the size and the weight of the crimping structure are changed to the minimum.

Description

Technical Field

[0001] The utility model belongs to the technical field of power devices, and in particular relates to an explosion-proof mixed crimping structure of an IGBT and a diode. Background Art

[0002] When discussing the application of 4.5kV, 5kA-level high-power devices, especially when IGBTs (insulated gate bipolar transistors) and diodes are integrated into full-bridge power modules as discrete components, the design and assembly process is particularly important. This high-voltage, high-current application scenario places stringent requirements on device reliability, thermal management, and mechanical stress distribution.

[0003] As the core switching element, the IGBT has a crimping table diameter of 155mm, and the recommended disc spring diameter is 160mm to ensure good electrical connection and heat conduction while dispersing mechanical pressure. However, due to the different functional characteristics and structural design of the matching diode, its crimping table is smaller, only 119mm, and the recommended disc spring diameter is also reduced to 125mm. This size difference significantly exacerbates the problem of uneven force when crimping 8 devices (4 IGBTs and 4 diodes) into a series structure in a full-bridge power module.

[0004] Specifically, the IGBT located in the center of the module will be subjected to higher pressure due to the larger crimping surface and wider disc spring diameter, which may not only cause micro cracks inside the IGBT chip, affecting the reliability of long-term operation, but also damage the packaging material due to excessive extrusion, shortening the life of the device. On the contrary, the diode located at the edge of the module may not receive enough pressure to ensure good electrical contact due to the small crimping surface and narrow disc spring diameter, thus affecting the current transmission efficiency and heat dissipation capacity, and also increasing the risk of failure.

[0005] The 4.5kV, 5kA power device, IGBT, and diode are two devices respectively. When forming a full-bridge circuit, 8 devices need to be connected in series. During the double pulse test and explosion-proof test, the device is damaged due to uneven force and the explosion-proof capability is insufficient. Therefore, it is necessary to solve the problem of uneven force on the devices of the power module crimping assembly and the more severe problem of explosion-proof capability requirements. Utility Model Content

[0006] The utility model aims to overcome the problems of uneven force on components and explosion-proof capability requirements of existing power module crimping assemblies, and provides an explosion-proof hybrid crimping structure of IGBTs and diodes.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] An explosion-proof hybrid press-fitting structure for IGBTs and diodes, comprising a number of power devices. A water-cooled radiator is connected between the number of power devices. The power devices include diodes and IGBTs. A boss is provided on one side of the water-cooled radiator connected between the diode and the IGBT. The boss is provided on the side close to the diode. One side of the water-cooled radiator connected between the diode and the IGBT is connected to a laminated busbar as the positive interface. One side of the water-cooled radiator connected to the middle of the IGBT is the negative interface. Pressure plates are installed at both ends of the power device, and a guide rod is installed between the pressure plates at both ends.

[0009] Further, the water-cooled radiator connected between the diode and the IGBT adopts a six-channel water-cooled radiator. Two channels are provided on the side of the six-channel water-cooled radiator close to the diode, and four channels are provided on the side of the six-channel water-cooled radiator close to the IGBT. The channels are coolant channels.

[0010] Further, the power devices are connected in sequence according to the order of the first diode, the second diode, the first IGBT, the second IGBT, the third IGBT, the fourth IGBT, the third diode, and the fourth diode. The first diode is connected to the inner side of the first pressure plate, the fourth diode is connected to the inner side of the second pressure plate, and the first pressure plate and the second pressure plate are of the same size.

[0011] Further, a first insulating block is installed between the inner side of the first pressure plate and the first diode. A disc spring is provided between the inner side of the first pressure plate and the first insulating block. A ball head guide rod is provided between the first insulating block and the disc spring.

[0012] Further, the guide rod is connected between the inner sides of the first pressure plate and the second pressure plate. Four guide rods are provided. One ends of the four guide rods are respectively connected to the four corners of the first pressure plate, and the other ends of the four guide rods are respectively connected to the four corners of the second pressure plate.

[0013] Further, a third water-cooled radiator is connected between the second diode and the first IGBT. A seventh water-cooled radiator is connected between the fourth IGBT and the third diode. One side of the third water-cooled radiator and one side of the seventh water-cooled radiator are connected in series. The third water-cooled radiator and the seventh water-cooled radiator are provided with bosses. The boss of the third water-cooled radiator is provided close to the second diode, the boss of the seventh water-cooled radiator is provided close to the third diode, and a fifth radiator is connected between the second IGBT and the third IGBT.

[0014] Further, a second insulating block is installed between the second pressure plate and the fourth diode. A first radiator is installed between the first insulating block and the first diode. A second radiator is installed between the first diode and the second diode. A fourth radiator is installed between the first IGBT and the second IGBT. A sixth radiator is installed between the third IGBT and the fourth IGBT. An eighth radiator is installed between the third diode and the fourth diode. A ninth radiator is installed between the fourth diode and the second insulating block.

[0015] Further, it includes a first copper bar. There are two first copper bars. The second radiator and the fourth radiator are connected in series through one first copper bar, and the sixth radiator and the eighth radiator are connected in series through the other first copper bar.

[0016] Further, it includes a second copper bar. There are two second copper bars. The first radiator, the fifth radiator and the ninth radiator are connected in parallel through the two second copper bars.

[0017] Further, an insulating plate is connected to the outside of the water-cooled radiator.

[0018] Compared with the prior art, the utility model has the following beneficial technical effects:

[0019] In an explosion-proof hybrid pressing structure of an IGBT and a diode of the utility model, a water-cooled radiator connected between the diode and the IGBT is provided with a boss. The boss is arranged on the side close to the diode. The water-cooled radiator with the boss is used for the connection between the diode and the IGBT. By means of the boss, the stiffness of the water-cooled radiator is improved with the minimum increase in the weight of the pressing structure, so that the force-bearing condition of the power devices in the pressing structure is improved with the minimum changes in volume and weight of the pressing structure.

[0020] The water-cooled radiator connected between the diode and the IGBT adopts a six-channel water-cooled radiator. Two channels are arranged on the side of the six-channel water-cooled radiator close to the diode, and four channels are arranged on the side of the six-channel water-cooled radiator close to the IGBT. The six-channel water-cooled radiator ensures good equalization of the coolant while meeting the heat dissipation performance requirements.

[0021] Further, the disc spring is fixed by a guide rod with a ball head, so that when the first pressing plate is extruded to transfer pressure to the pressing structure, the force is evenly distributed in all directions of the pressing structure.

[0022] An explosion-proof hybrid pressing structure of an IGBT and a diode of the utility model optimizes the force-bearing condition of the pressing structure and improves the reliability of the pressing structure by designing a water-cooled radiator with an equalizing, lightweight and high-stiffness structure. By reasonably arranging the full-bridge circuit and designing the insulating baffle, the explosion-proof ability of the pressing structure is improved.

[0023] Further, the pressing structure is reinforced by the connecting copper bar, insulating plate and laminated busbar of the circuit, making full use of each component and providing explosion-proof protection around the pressing structure to improve the explosion-proof protection of the pressing structure. Description of the Drawings

[0024] The accompanying drawings of the specification are used to provide a further understanding of the present utility model and form a part of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and shall not unduly limit the present utility model.

[0025] Figure 1 It is a schematic structural diagram of an explosion-proof hybrid press-fitting structure of an IGBT and a diode according to the present utility model.

[0026] Figure 2 It is a schematic diagram of a spherical guide rod and a disc spring of an explosion-proof hybrid press-fitting structure of an IGBT and a diode according to the present utility model.

[0027] Figure 3 It is a schematic diagram of the flow channel of the third water-cooled radiator of an explosion-proof hybrid press-fitting structure of an IGBT and a diode according to the present utility model.

[0028] Figure 4 It is a schematic diagram of explosion-proof protection of an explosion-proof hybrid press-fitting structure of an IGBT and a diode according to the present utility model.

[0029] Among them, there are a first pressing plate 1, a disc spring 2, a ball head guide rod 3, a first insulating block 4, a first radiator 5, a second radiator 6, a third water-cooled radiator 7, a fourth radiator 8, a fifth radiator 9, a sixth radiator 10, a seventh water-cooled radiator 11, an eighth radiator 12, a ninth radiator 13, a second insulating block 14, a second pressing plate 15, a guide rod 16, a diode 17, an IGBT 18, a first copper row 19, a second copper row 20, a laminated busbar 21, and an insulating plate 22. Detailed implementation manners

[0030] In order to enable those skilled in the art of the present technology to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0031] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present utility model are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0032] Embodiment 1

[0033] See Figure 1 , an explosion-proof hybrid press-fitting structure of an IGBT and a diode, comprising a first pressing plate 1, a disc spring 2, a ball head guide rod 3, a first insulating block 4, a first heat sink 5, a second heat sink 6, a third water-cooled heat sink 7, a fourth heat sink 8, a fifth heat sink 9, a sixth heat sink 10, a seventh water-cooled heat sink 11, an eighth heat sink 12, a ninth heat sink 13, a second insulating block 14, a second pressing plate 15, a guide rod 16, a diode 17, an IGBT 18, a first copper bar 19, a second copper bar 20, a laminated busbar 21, and an insulating plate 22.

[0034] Eight power devices are distributed from top to bottom in the order of diode - diode - IGBT - IGBT - IGBT - IGBT - diode - diode, and are connected by water-cooled heat sinks in the middle.

[0035] Through two first copper bars 19, the second heat sink, the fourth heat sink, the sixth heat sink and the eighth heat sink are respectively connected in series. Through two second copper bars 20, with one of the copper bars on the back, the first, fifth and ninth heat sinks are connected in parallel. The third and seventh water-cooled plates are connected in series through the laminated busbar 21 as the positive interface, and the fifth heat sink is connected as the negative interface, thus forming a full-bridge circuit and minimizing the transfer surface between the IGBT and the diode.

[0036] The first pressing plate 1 and the second pressing plate 15 with the same outer contour size are connected by four metal guide rods 16, so that the pressure of the first pressing plate 1 on the component is vertically downward. The upper and lower parts are separated from the string by the first insulating block 4 and the second insulating block 14 respectively.

[0037] As Figure 2 shown, the disc spring 2 is fixed by a guide rod 3 with a ball head to ensure uniform force in all directions when transmitting pressure downward.

[0038] As Figure 3As shown, the third water-cooled radiator 7 and the seventh water-cooled radiator 11 between the diode and the IGBT are connected by a water-cooled radiator with a boss. By improving the stiffness of the water-cooled radiator, when the pressing force is transmitted from top to bottom, the force on the device table is uniform.

[0039] As Figure 3 shown, for the six-channel water-cooled radiator, the third water-cooled radiator 7 with a boss and the seventh water-cooled radiator 11, due to the small area of the boss, two channels are designed on the diode side and four channels are designed on the IGBT side for the coolant channels. While ensuring sufficient water-cooling performance, the overall coolant pressure equalization of the pressing assembly is ensured.

[0040] The first copper bar 19, the second copper bar 20, the insulating plate 22, and the laminated busbar 21 of the loop are used to fix the four sides of the assembly, providing explosion protection to ensure that there is no displacement during the explosion of the water-cooled radiator and no damage to the water pipes during the explosion.

[0041] Embodiment 2

[0042] See Figure 1 、 Figure 2 、 Figure 3 and Figure 4 A kind of explosion-proof hybrid pressing structure for IGBT and diode, including several power devices. The water-cooled radiators are connected between several power devices. The power devices include diodes and IGBTs. A boss is arranged on one side of the water-cooled radiator connected between the diode and the IGBT, and the boss is arranged on the side close to the diode. One side of the water-cooled radiator connected between the diode and the IGBT is connected to the laminated busbar as the positive interface, and one side of the water-cooled radiator connected in the middle of the IGBT is the negative interface. Pressing plates are installed at both ends of the power device, and a guide rod 16 is installed between the two pressing plates at both ends.

[0043] Preferably, the water-cooled radiator connected between the diode and the IGBT adopts a six-channel water-cooled radiator. Two channels are arranged on the side of the six-channel water-cooled radiator close to the diode, and four channels are arranged on the side close to the IGBT. The channels are coolant channels.

[0044] Preferably, the power devices are connected in sequence according to the order of the first diode, the second diode, the first IGBT, the second IGBT, the third IGBT, the fourth IGBT, the third diode, and the fourth diode. The inner side of the first diode is connected to the first pressing plate 1, and the inner side of the fourth diode is connected to the second pressing plate 15. The first pressing plate 1 and the second pressing plate 15 are of the same size.

[0045] Preferably, a first insulating block 4 is installed between the inner side of the first pressing plate 1 and the first diode. A disc spring 2 is arranged between the inner side of the first pressing plate 1 and the first insulating block 4. A ball head guide rod 3 is arranged between the first insulating block 4 and the disc spring 2.

[0046] Preferably, the guide rod is connected between the inner sides of the first pressing plate 1 and the second pressing plate 15. Four guide rods 16 are provided. One ends of the four guide rods are respectively connected to the four corners of the first pressing plate 1, and the other ends of the four guide rods are respectively connected to the four corners of the second pressing plate 15.

[0047] Preferably, a third water-cooled radiator 7 is connected between the second diode and the first IGBT, a seventh water-cooled radiator 11 is connected between the fourth IGBT and the third diode. One side of the third water-cooled radiator 7 and one side of the seventh water-cooled radiator 11 are connected in series. The third water-cooled radiator 7 and the seventh water-cooled radiator 11 are provided with bosses. The boss of the third water-cooled radiator 7 is arranged close to the second diode, and the boss of the seventh water-cooled radiator 11 is arranged close to the third diode. A fifth radiator 9 is connected between the second IGBT and the third IGBT.

[0048] Preferably, a second insulating block 14 is installed between the second pressing plate 15 and the fourth diode, a first radiator 5 is installed between the first insulating block 4 and the first diode, a second radiator 6 is installed between the first diode and the second diode, a fourth radiator 8 is installed between the first IGBT and the second IGBT, a sixth radiator 10 is installed between the third IGBT and the fourth IGBT, an eighth radiator 12 is installed between the third diode and the fourth diode, and a ninth radiator 13 is installed between the fourth diode and the second insulating block 14.

[0049] Preferably, it includes two first copper bars 19. The second radiator 6 and the fourth radiator 8 are connected in series through one first copper bar 19, and the sixth radiator 10 and the eighth radiator 12 are connected in series through the other first copper bar 19.

[0050] Preferably, it includes two second copper bars 20. The first radiator 5, the fifth radiator 9 and the ninth radiator 13 are connected in parallel through the two second copper bars 20.

[0051] Preferably, an insulating plate 22 is connected to the outer side of the water-cooled radiator.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit the scope of its protection. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that after reading the present invention, various changes, modifications or equivalent replacements can still be made to the specific implementation manners of the present invention, but these changes, modifications or equivalent replacements are all within the scope of the claims of the present invention pending approval.

Claims

1. An explosion-proof hybrid crimping structure of IGBT and diode, characterized in that: The invention comprises a plurality of power devices, wherein a water-cooled heat sink is connected between the plurality of power devices, wherein the power devices comprise a diode and an IGBT, wherein a boss is arranged on one side of the water-cooled heat sink connected between the diode and the IGBT, wherein the boss is arranged on a side close to the diode, wherein one side of the water-cooled heat sink connected between the diode and the IGBT is connected to a laminated bus bar as a positive electrode interface, and one side of the water-cooled heat sink connected in the middle of the IGBT is a negative electrode interface, and pressure plates are arranged at both ends of the power device, and a guide rod (16) is arranged between the pressure plates at both ends.

2. The explosion-proof hybrid crimping structure of an IGBT and a diode according to claim 1, characterized in that: The water-cooled radiator connected between the diode and the IGBT adopts a six-channel water-cooled radiator. Two channels are arranged on the side of the six-channel water-cooled radiator close to the diode, and four channels are arranged on the side of the six-channel water-cooled radiator close to the IGBT, and the channels are coolant channels.

3. The explosion-proof hybrid crimping structure of an IGBT and a diode according to claim 1, characterized in that: The power devices are connected in sequence in the order of a first diode, a second diode, a first IGBT, a second IGBT, a third IGBT, a fourth IGBT, a third diode, and a fourth diode. The first diode is connected to the inner side of the first pressure plate (1), and the fourth diode is connected to the inner side of the second pressure plate (15). The first pressure plate (1) and the second pressure plate (15) are of the same size.

4. The explosion-proof hybrid crimping structure of an IGBT and a diode according to claim 3, characterized in that: A first insulating block (4) is installed between the inner side of the first pressing plate (1) and the first diode, a disc spring (2) is arranged between the inner side of the first pressing plate (1) and the first insulating block (4), and a ball head guide rod (3) is arranged between the first insulating block (4) and the disc spring (2).

5. The explosion-proof hybrid crimping structure of an IGBT and a diode according to claim 3, characterized in that: The guide rods are connected between the inner side of the first pressing plate (1) and the inner side of the second pressing plate (15), and four guide rods (16) are provided, one end of the four guide rods is respectively connected to the four corners of the first pressing plate (1), and the other end of the four guide rods is respectively connected to the four corners of the second pressing plate (15).

6. The explosion-proof hybrid crimping structure of an IGBT and a diode according to claim 3, characterized in that: A third water-cooled radiator (7) is connected between the second diode and the first IGBT, a seventh water-cooled radiator (11) is connected between the fourth IGBT and the third diode, one side of the third water-cooled radiator (7) and one side of the seventh water-cooled radiator (11) are connected in series, the third water-cooled radiator (7) and the seventh water-cooled radiator (11) are provided with bosses, the boss of the third water-cooled radiator (7) is arranged close to the second diode, the boss of the seventh water-cooled radiator (11) is arranged close to the third diode, and a fifth radiator (9) is connected between the second IGBT and the third IGBT.

7. The explosion-proof hybrid crimping structure of IGBT and diode according to claim 6, characterized in that: A second insulating block (14) is installed between the second pressure plate (15) and the fourth diode, a first heat sink (5) is installed between the first insulating block (4) and the first diode, a second heat sink (6) is installed between the first diode and the second diode, a fourth heat sink (8) is installed between the first IGBT and the second IGBT, a sixth heat sink (10) is installed between the third IGBT and the fourth IGBT, an eighth heat sink (12) is installed between the third diode and the fourth diode, and a ninth heat sink (13) is installed between the fourth diode and the second insulating block (14).

8. The explosion-proof hybrid crimping structure of IGBT and diode according to claim 7, characterized in that: It comprises a first copper bar (19), two first copper bars (19) are provided, the second radiator (6) and the fourth radiator (8) are connected in series via one first copper bar (19), and the sixth radiator (10) and the eighth radiator (12) are connected in series via another first copper bar (19).

9. The explosion-proof hybrid crimping structure of IGBT and diode according to claim 7, characterized in that: It comprises a second copper bar (20), two second copper bars (20) are provided, and the first radiator (5), the fifth radiator (9) and the ninth radiator (13) are connected in parallel via the two second copper bars (20).

10. The explosion-proof hybrid crimping structure of IGBT and diode according to claim 1, characterized in that: The outer side of the water cooling radiator is connected to an insulating plate (22).

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