Connector

Abstract

The utility model relates to the technical field of conductive connecting devices, in particular to a connector, which is provided with a crimping end and comprises a transmission wafer and a shielding wafer, the transmission wafer and the shielding wafer are respectively provided with a grounding crimping part arranged at the crimping end, the transmission wafer is provided with a signal crimping part arranged at the crimping end, and the signal crimping part is provided with a signal connecting part arranged at the signal crimping part. The connector comprises a shielding conduction piece arranged at the crimping end, and the shielding conduction piece is provided with contact through holes corresponding to the grounding crimping parts and avoiding through holes used for avoiding the signal crimping parts. And the grounding crimping parts are provided with contact parts which are in interference fit with the contact through holes, so that the grounding crimping parts of the transmission wafer and the grounding crimping parts of the shielding wafer are conducted, and the structure for realizing shielding conduction is relatively stable, and is beneficial to contact reliability.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive connection devices, and particularly relates to a connector. Background Art

[0002] With the improvement of signal transmission rate, high-speed connectors have higher and higher requirements for signal crosstalk resistance. The shielding structure of high-speed connectors is used to reduce crosstalk between different signal lines and achieve high-speed signal transmission. For example, a high-speed backplane connector socket disclosed in a Chinese invention patent with the authorization announcement number of CN116073172B, the socket board body thereof includes a base and a fixing clip. Between the base and the fixing clip, there are multiple alternately distributed wafers A, wafers B and wafer C. Shielding terminals are arranged on both sides of wafers A and wafers B, and a shielding sheet is arranged inside wafer C. A plurality of elastic pieces are arranged on the shielding sheet and are bent towards both sides respectively. The elastic pieces on both sides of the shielding sheet can be in contact with the adjacent shielding terminals on the left and right sides, and the shielding effect is better, reducing signal transmission loss. Among them, signal terminals are arranged on wafers A and wafers B. Wafers A, wafers B and the shielding terminals on both sides are combined to form a transmission wafer capable of transmitting signals. The shielding terminal is a shielding sheet arranged on both sides of the transmission wafer. Through the shielding sheet on the side of the transmission wafer, crosstalk between the two adjacent transmission wafers on the left and right can be reduced; wafer C does not contain signal terminals, and only a shielding sheet is arranged inside its insulator, which is used to be arranged between two adjacent transmission wafers on the left and right and is interconnected with the shielding sheet of the transmission wafer to enhance the shielding effect, and wafer C forms a shielding wafer. One end of the connector for crimping with a printed circuit board is a crimping end. The signal terminals of the transmission wafer have signal crimping parts arranged at the crimping end. The shielding sheets of the transmission wafer and the shielding wafer both have grounding crimping parts arranged at the crimping end. The crimping part is provided with a fish-eye structure. The shielding sheet of the shielding wafer is provided with elastic pieces for interconnecting with the shielding sheet of the transmission wafer at the crimping end to realize shielding conduction between the transmission wafer and the shielding wafer.

[0003] However, for the shielding conduction structure of the transmission wafer and the shielding wafer of the above-mentioned connector, conduction is achieved through the elastic piece pressing and contacting, and the elastic piece needs to be bent and formed on the shielding sheet of the shielding wafer. The processing and manufacturing are relatively complex, and usually, the bending amount is relatively difficult to control, and it is easy to cause unreliable contact during actual assembly due to the elastic piece rebounding. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a connector to solve the problem that the shielding conduction structure of the transmission wafer and the shielding wafer of the current connector, which realizes shielding conduction through the elastic piece pressing and contacting, is easy to affect the contact reliability due to the elastic piece rebounding.

[0005] The technical solution of the connector of the utility model is as follows:

[0006] A connector has a crimping end. The connector includes a transmission wafer and a shielding wafer. The transmission wafer and the shielding wafer respectively have grounding crimping parts provided at the crimping end. The transmission wafer has signal crimping parts provided at the crimping end. The connector includes a shielding conduction member provided at the crimping end. The shielding conduction member is provided with respective contact through-holes corresponding to the respective grounding crimping parts and a relief through-hole for avoiding the signal crimping parts. The contact through-holes are for the corresponding grounding crimping parts to pass through, and the grounding crimping parts are provided with contact portions that are in interference fit with the contact through-holes so that the grounding crimping parts of the transmission wafer and the grounding crimping parts of the shielding wafer are electrically connected.

[0007] Further, the surface of the contact portion is provided with forced-fit protrusions, and the forced-fit protrusions are in interference fit with the hole walls of the contact through-holes.

[0008] Further, the grounding crimping part includes a fish-eye structure for passing through the contact through-hole, and the grounding crimping part is provided with a guiding inclined surface on the side close to the fish-eye structure of the forced-fit protrusion.

[0009] Further, the forced-fit protrusion is provided with a contact inclined surface that is in interference fit with the hole wall of the contact through-hole, and the contact inclined surface is coplanar with the guiding inclined surface.

[0010] Further, the grounding crimping part is a cantilever structure, and the grounding crimping part is provided with at least two forced-fit protrusions in its cantilever direction.

[0011] Further, for two adjacent forced-fit protrusions in the cantilever direction of the grounding crimping part, the protrusion height of the forced-fit protrusion closer to the root of the cantilever structure is greater than the protrusion height of the forced-fit protrusion farther from the root of the cantilever structure.

[0012] Further, the shielding wafer includes an inner shielding sheet, the grounding crimping part of the shielding wafer is provided on the inner shielding sheet, and the inner shielding sheet is provided with a hollow structure for weight reduction.

[0013] Further, the connector includes a connector housing, each transmission wafer is mounted on the connector housing, and the connector housing is provided with a mounting structure for mounting the shielding wafer.

[0014] Further, the mounting structure is a plug post, the shielding wafer includes an insulator, and the insulator of the shielding wafer is provided with a slot for inserting the plug post.

[0015] Further, the transmission wafer includes signal terminals and side shielding sheets provided on its sides, the signal crimping parts are provided on the signal terminals, and the grounding crimping parts of the transmission wafer are provided on the side shielding sheets.

[0016] Beneficial effects: The utility model is improved on the basis of the connector in the prior art. A shielding conduction member is arranged at the crimping end of the connector. An avoidance through hole and a contact through hole are arranged on the shielding conduction member. By avoiding the signal crimping part of the transmission wafer through the avoidance through hole and allowing the grounding crimping part to pass through the contact through hole, the signal crimping part and the grounding crimping part can be crimped onto the corresponding printed circuit board. The contact part of the grounding crimping part is in interference fit with the contact through hole of the shielding conduction member to achieve a fixed connection while enabling the grounding crimping part to form an electrical contact with the shielding conduction member. Furthermore, the shielding conduction member conducts the grounding crimping part of the transmission wafer and the grounding crimping part of the shielding wafer. The grounding crimping part of the transmission wafer and the grounding crimping part of the shielding wafer are press-fitted into the corresponding contact through holes of the shielding conduction member to achieve the structure of shielding conduction. The structure is relatively stable, which is beneficial to the contact reliability. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of an embodiment of the connector of the utility model;

[0018] Figure 2 is Figure 1 a schematic diagram of the transmission wafer in

[0019] Figure 3 is Figure 1 a schematic diagram of the shielding wafer in

[0020] Figure 4 is Figure 1 a schematic structural diagram of the shielding conduction member in

[0021] Figure 5 is Figure 1 a schematic structural diagram of the connector housing in

[0022] Figure 6 is Figure 1 a cross-sectional view of the connector at the interference fit between the grounding crimping part of the transmission wafer and the shielding conduction member in

[0023] Figure 7 is Figure 6 a partial enlarged view of A in

[0024] Figure 8 is Figure 1 a cross-sectional view of the connector at the interference fit between the grounding crimping part of the shielding wafer and the shielding conduction member in

[0025] Figure 9 is Figure 8 a partial enlarged view of B in

[0026] In the figure:

[0027] 1. Connector housing; 11. Accommodation cavity; 12. Plug post;

[0028] 2. Transmission wafer; 21. First insulator; 22. First shielding sheet; 23. First ground crimping portion; 231. First protrusion; 232. Second protrusion; 233. First guiding inclined surface; 24. Signal crimping portion;

[0029] 3. Shielding wafer; 31. Second insulator; 32. Second shielding sheet; 33. Second ground crimping portion; 331. Third protrusion; 332. Second guiding inclined surface; 34. Slot;

[0030] 4. Shielding conduction member; 41. First contact through-hole; 42. Second contact through-hole; 43. Avoidance through-hole;

[0031] 5. Fixing piece. Specific implementation manner

[0032] A shielding conduction member is arranged at the crimping end of the connector of the present utility model. An avoidance through-hole and contact through-holes are arranged on the shielding conduction member. By avoiding the signal crimping portion of the transmission wafer through the avoidance through-hole and allowing the ground crimping portion to pass through the contact through-holes, the signal crimping portion and the ground crimping portion can be crimped to the corresponding printed circuit board. The contact portion of the ground crimping portion and the contact through-holes of the shielding conduction member are in interference fit to achieve fixed connection while enabling the ground crimping portion and the shielding conduction member to form electrical contact. Furthermore, the shielding conduction member is used to conduct the ground crimping portion of the transmission wafer and the ground crimping portion of the shielding wafer. The ground crimping portion of the transmission wafer and the ground crimping portion of the shielding wafer are press-fitted into the corresponding contact through-holes of the shielding conduction member to achieve the structure of shielding conduction, which has a relatively stable structure and is beneficial to contact reliability.

[0033] An embodiment of the connector of the present utility model:

[0034] As Figure 1 shown, the connector includes a connector housing 1, a transmission wafer 2, a shielding wafer 3, a shielding conduction member 4, and a fixing piece 5. A plurality of transmission wafers 2 are arranged side by side, and a shielding wafer 3 is sandwiched between every two transmission wafers 2. Each transmission wafer 2 and each shielding wafer 3 are installed on the connector housing 1 and are connected together by being clamped with the same fixing piece 5. The connector has a crimping end and a mating end. The crimping end is used to be crimped to the corresponding printed circuit board, and the mating end is used to be plugged with a mating connector. The transmission wafer 2 can transmit high-speed signals, and the shielding wafer 3 is used to enhance the shielding effect between two adjacent transmission wafers 2 and is suitable for electrical connectors with higher signal transmission rates. The shielding conduction member 4 is arranged at the crimping end of the connector. The shielding conduction member 4 can conduct the shielding structures of each transmission wafer 2 and shielding wafer 3 to achieve common grounding, and has a good shielding effect.

[0035] As Figure 1 、 Figure 2 、 Figure 4 、 Figure 5, Figure 6 , Figure 7 As shown in Figure 6 and Figure 7 , the transmission wafer 2 includes a first insulator 21, a first shielding sheet 22, and signal terminals. The signal terminals are trace terminals, and the signal terminals are arranged in pairs to form a differential pair. One end of the signal terminal is provided with a signal plugging structure, and the other end is provided with a signal crimping portion 24. The signal terminals are fixed on the first insulator 21. The first insulator 21 constitutes the insulator of the transmission wafer 2. On both sides in the thickness direction of the first insulator 21, first shielding sheets 22 are fixed. The first shielding sheet 22 is the shielding structure of the transmission wafer 2. The first shielding sheet 22 constitutes a side shielding sheet provided on the side of the transmission wafer 2. The first shielding sheet 22 is provided with a ground plugging structure and a first ground crimping portion 23. The first ground crimping portion 23 constitutes the ground crimping portion of the shielding wafer 3. The signal crimping portion 24 of the signal terminal and the first ground crimping portion 23 of the first shielding sheet 22 are arranged at the crimping end of the connector for crimping with a printed circuit board. The connector housing 1 is provided with a receiving cavity 11. After each transmission wafer 2 is mounted on the connector housing 1, the first insulator 21 is snap-fitted with the connector housing 1. The signal plugging structure of the signal terminal and the ground plugging structure of the first shielding sheet 22 extend into the corresponding receiving cavity 11. The receiving cavity 11 penetrates along the plugging direction of the connector for the insertion of the pins of the mating connector.

[0036] The shielding conduction member 4 is a plate body and can conduct electricity. The shielding conduction member 4 can be made of conductive plastic. At the position corresponding to the transmission wafer 2 on the shielding conduction member 4, an avoidance through hole 43 and a first contact through hole 41 are provided. The avoidance through holes 43 correspond to the signal terminals one by one. The avoidance through holes 43 allow the signal crimping portions 24 of the signal terminals of the transmission wafer 2 to pass through and avoid the signal crimping portions 24 so that the signal terminals do not contact the shielding conduction member 4. The avoidance through holes 43 allow the fish-eye structures of the signal crimping portions 24 to pass through for crimping with the printed circuit board.

[0037] The first contact through hole 41 constitutes the contact through hole on the shielding conduction member 4 corresponding to the first ground crimping portion 23. The first ground crimping portion 23 is a cantilever structure and extends based on the main body of the first shielding sheet 22 in the direction of crimping to the printed circuit board at the crimping end of the connector. The root of the first ground crimping portion 23 is connected to the main body of the first shielding sheet 22. The extending direction of the ground crimping portion is its length direction. The thickness direction of the ground crimping portion is the thickness direction of the first shielding sheet 22. The width direction of the ground crimping portion is perpendicular to the length direction and the thickness direction. The first contact through hole 41 allows the first ground crimping portion 23 to pass through. The first ground crimping portion 23 is provided with a contact portion that is in interference fit with the first contact through hole 41 so that the first ground crimping portions 23 of the respective transmission wafers 2 form a reliable conductive contact with the shielding conduction member 4.

[0038] There are multiple first grounding crimping portions 23 on the first shielding sheet 22, and the first grounding crimping portions 23 are arranged at intervals along the arrangement direction of each differential pair of the transmission wafer 2. The contact portion of the first grounding crimping portion 23 is provided with a first protrusion 231 and a second protrusion 232 for interference fit with the inner wall of the first contact through hole 41. The first grounding crimping portion 23 includes a fish-eye structure provided on one side of its contact portion away from its root. The fish-eye structure of the first grounding crimping portion 23 passes through the first contact through hole 41 to crimp the printed circuit board.

[0039] The first contact through hole 41 is adapted to the first grounding crimping portion 23. The width of the portion of the first grounding crimping portion 23 provided with the first protrusion 231 is greater than the width of the portion provided with the second protrusion 232. Correspondingly, the first contact through hole 41 is a stepped hole structure. The first contact through hole 41 has a large hole section with a larger size in the width direction of the first grounding crimping portion 23 and a small hole section with a smaller size in the width direction of the first grounding crimping portion 23. The small hole section is arranged on the outside. The first protrusion 231 is in interference fit with the inner wall of the small hole section of the first contact through hole 41, and the second protrusion 232 is in interference fit with the inner wall of the large hole section of the first contact through hole 41. Both the first protrusion 231 and the second protrusion 232 are forced-fit protrusions protruding from the side surfaces in the width direction of the contact portion of the first grounding crimping portion 23. By using the forced-fit protrusions to be in interference fit with the inner wall of the first contact through hole 41, the fit is reliable, and it is beneficial to reduce the scraping of the shielding conduction member 4 during forced fitting and reduce the generation of conductive plastic chips.

[0040] The first grounding crimping portion 23 is provided with a first guiding inclined surface 233 on the side of the first protrusion 231 close to the fish-eye structure. The first guiding inclined surface 233 can play a guiding role when the first grounding crimping portion 23 is inserted into the first contact through hole 41, and the existence of the inclined surface can also prevent this part from squeezing the inner wall of the first contact through hole 41 to generate conductive plastic chips. The first protrusion 231 is provided with a contact inclined surface that is in interference fit with the inner wall of the first contact through hole 41. The contact inclined surface is coplanar with the first guiding inclined surface 233, which is convenient for the first protrusion 231 to be pressed into the shielding conduction member 4, and the pressing process is smooth, which is beneficial to reducing the generation of conductive plastic chips.

[0041] The first protrusion 231 and the second protrusion 232 are spaced apart along the extending direction of the first ground crimping portion 23. The spaced-apart first protrusion 231 and second protrusion 232 are beneficial to enhancing the reliability of the interference fit between the first shielding sheet 22 and the shielding conduction member 4. One first protrusion 231 and an adjacent second protrusion 232 constitute two adjacent strong-fitting protrusions in the extending direction of the first ground crimping portion 23. The second protrusion 232 is close to the root of the cantilever structure, the first protrusion 231 is far from the root of the cantilever structure and close to the fish-eye structure, and the protrusion height of the second protrusion 232 is greater than that of the first protrusion 231. The second protrusion 232 with a greater protrusion height can achieve a more stable interference fit and make the height of the first protrusion 231 relatively low, which is beneficial to the gentle application of force during the interference assembly operation.

[0042] As Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 8 , Figure 9 As shown, the shielding wafer 3 includes a second insulator 31 and a second shielding sheet 32. The second shielding sheet 32 and the second insulator 31 are fixed together by integral injection molding. The second insulator 31 constitutes the insulator of the shielding wafer 3, and the second shielding sheet 32 constitutes the inner shielding sheet of the shielding wafer 3. The second shielding sheet 32 is provided with a second ground crimping portion 33 at the crimping end of the connector. There are multiple second ground crimping portions 33 on the second shielding sheet 32, and the second ground crimping portions 33 are spaced apart in the arrangement direction of each differential pair of the transmission wafer 2. The second ground crimping portion 33 is a cantilever structure and extends along the direction in which the main body of the second shielding sheet 32 is crimped to the printed circuit board at the crimping end of the connector. The root of the second ground crimping portion 33 is connected to the main body of the second shielding sheet 32. The shielding conduction member 4 is provided with a second contact through-hole 42 adapted to the second ground crimping portion 33. The second ground crimping portion 33 passes through the second contact through-hole 42, and the second ground crimping portion 33 is provided with a contact portion that has an interference fit with the second contact through-hole 42, so that the second ground crimping portions 33 of each shielding wafer 3 form a reliable electrical contact with the shielding conduction member 4. By using the shielding conduction member 4 to conduct the ground crimping portion of the transmission wafer 2 and the ground crimping portion of the shielding wafer 3, and the ground crimping portions of the transmission wafer 2 and the shielding wafer 3 are interference-fitted into the corresponding contact through-holes of the shielding conduction member 4 to achieve the shielding conduction structure, the structure is relatively stable and beneficial to the contact reliability.

[0043] The contact portion of the second ground crimping portion 33 is provided with a third protrusion 331 for interference-fitting with the hole wall of the second contact through-hole 42. The second ground crimping portion 33 includes a fish-eye structure provided on the side of its contact portion away from its root. Each second ground crimping portion 33 is provided with two fish-eye structures, and the fish-eye structures of the second ground crimping portion 33 pass through the second contact through-hole 42 to crimp the printed circuit board.

[0044] On both sides in the width direction of the contact portion of the second grounding crimping portion 33, third protrusions 331 are convexly provided. The third protrusions 331 constitute the forced-fitting protrusions on the second grounding crimping portion 33. On the side of the third protrusions 331 close to the fish-eye structure, the second grounding crimping portion 33 is provided with a second guiding inclined surface 332. The second guiding inclined surface 332 can play a guiding role when the second grounding crimping portion 33 is inserted into the second contact through-hole 42, and the existence of the inclined surface can also prevent the inner wall of the first contact through-hole 41 from being extruded to generate conductive plastic chips. On the third protrusions 331, contact inclined surfaces that are in interference fit with the hole wall of the second contact through-hole 42 are provided. The contact inclined surfaces and the corresponding second guiding inclined surfaces 332 are coplanar, which facilitates the pressing of the third protrusions 331 into the shielding conduction member 4, and the pressing process is smooth, which is beneficial to reducing the generation of conductive plastic chips.

[0045] The connector housing 1 is provided with an installation structure for installing the shielding wafer 3. The installation structure is a plug post 12. On the second insulator 31 of the shielding wafer 3, a slot 34 for inserting the plug post 12 is provided. The plug post 12 is in tight fit with the slot wall of the slot 34 to use the connector housing 1 to limit and fix the shielding wafer 3. The structure is simple and the operation is convenient. Moreover, both the transmission wafer 2 and the shielding wafer 3 are installed on the connector housing 1, which is beneficial to ensuring the installation position. The main body of the second shielding sheet 32 of the shielding wafer 3 is provided with a large-area hollow structure. The hollow structure includes vertically intersecting strip-shaped portions. The hollow structure is used for weight reduction and can save materials under the condition of meeting the shielding requirements.

[0046] In other embodiments, the grounding crimping portion can also make the width of its contact portion greater than the width of the contact through-hole, so that the side surfaces in the width direction of the contact portion are directly in interference fit with the hole wall of the contact through-hole. At this time, the forced-fitting protrusions are not separately provided.

[0047] In other embodiments, the inclination angles of the guiding inclined surface and the contact inclined surface on the forced-fitting protrusion can also be different.

[0048] In other embodiments, only the first protrusions can be provided on the first grounding crimping portion, and the second protrusions are no longer provided.

[0049] In other embodiments, the protrusion height of the first protrusions can also be the same as the protrusion height of the second protrusions.

[0050] In other embodiments, the first grounding crimping portion and the second grounding crimping portion can also be set in the same structural form. Correspondingly, the first contact through-hole matches the first grounding crimping portion, and the second contact through-hole matches the second grounding crimping portion.

[0051] In other embodiments, the second grounding crimping portion can also be provided with more than two forced-fitting protrusions in its overhanging direction.

[0052] In other embodiments, a guiding inclined surface connected to its surface may also be provided on one side of the second protrusion close to the fish-eye structure.

[0053] In other embodiments, pins for inserting into the pin holes on the insulator of the transmission wafer may also be provided on the insulator of the shielding wafer to connect the shielding wafer to the transmission wafer. In this case, the mounting structure for mounting the shielding wafer may no longer be provided on the connector housing.

[0054] In other embodiments, a clamping groove may also be provided on the side wall of the connector housing. The clamping groove forms a mounting structure, and a clamping platform is provided on the insulator of the shielding wafer to be clamped into the clamping groove.

[0055] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still make modifications to the technical solutions recorded in the foregoing embodiments without creative efforts, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A connector having a crimping end, the connector comprising a transmission chip (2) and a shielding chip (3), the transmission chip (2) and the shielding chip (3) respectively having a ground crimping portion arranged at the crimping end, and the transmission chip (2) having a signal crimping portion (24) arranged at the crimping end, wherein: The connector comprises a shielding conductive member (4) arranged at a crimping end, the shielding conductive member (4) being provided with contact through-holes respectively corresponding to the grounding crimping parts and an avoidance through-hole (43) for avoiding the signal crimping part (24), the contact through-holes being provided for the corresponding grounding crimping parts to pass through, and the grounding crimping parts being provided with contact portions which are interference-fitted with the contact through-holes so that the grounding crimping parts of the transmission chip (2) and the grounding crimping parts of the shielding chip (3) are conductively connected.

2. The connector according to claim 1, characterized in that: A strong mounting protrusion is arranged on the surface of the contact part, and the strong mounting protrusion is interference fit with the hole wall of the contact through hole.

3. The connector according to claim 2, characterized in that: The grounding crimping part comprises a fisheye structure for penetrating the contact through hole, and a guiding inclined surface is arranged on one side of the strong mounting protrusion close to the fisheye structure.

4. The connector according to claim 3, characterized in that: The forced installation protrusion is provided with a contact inclined surface which is interference-fitted with the hole wall of the contact through hole, and the contact inclined surface is coplanar with the guiding inclined surface.

5. The connector according to claim 2, 3 or 4, characterized in that: The grounding crimping part is a cantilever structure, and is provided with at least two strong mounting protrusions in the cantilevering direction thereof.

6. The connector according to claim 5, characterized in that: Of the two adjacent forced mounting protrusions in the overhanging direction of the grounding crimping portion, the protrusion height of the forced mounting protrusion close to the root of the cantilever structure is greater than the protrusion height of the forced mounting protrusion far from the root of the cantilever structure.

7. The connector according to any one of claims 1 to 4, characterized in that: The shielding chip (3) comprises an inner shielding sheet, a grounding crimping portion of the shielding chip (3) is arranged on the inner shielding sheet, and a hollow structure for reducing weight is provided on the inner shielding sheet.

8. The connector according to any one of claims 1 to 4, characterized in that: The connector comprises a connector housing (1), each transmission chip (2) is mounted on the connector housing (1), and a mounting structure for mounting a shielding chip (3) is provided on the connector housing (1).

9. The connector according to claim 8, characterized in that: The mounting structure is a plug post (12), the shielding chip (3) comprises an insulator, and a slot (34) for inserting the plug post (12) is provided on the insulator of the shielding chip (3).

10. The connector according to any one of claims 1 to 4, characterized in that: The transmission chip (2) comprises a signal terminal and a side shielding sheet arranged on the side thereof, a signal crimping portion (24) is arranged on the signal terminal, and a grounding crimping portion of the transmission chip (2) is arranged on the side shielding sheet.

Images