Vertical furnace heat dissipation structure for electromagnetic oven main board processing

Abstract

The utility model relates to the technical field of electromagnetic oven mainboard production, and particularly discloses a vertical furnace heat dissipation structure for electromagnetic oven mainboard processing, which utilizes a temperature sensitive element of a temperature relay to detect the change of the temperature in a furnace, and controls the on-off of the temperature relay through a control circuit on a mainboard. Therefore, the functions of controlling and protecting the temperature in the furnace are realized; a protective cover used for covering the temperature relay is fixed to the front end of the mainboard, an air channel is formed in the side, away from the protective cover, of the temperature relay, the air channel is communicated with an inner cavity of the electric box shell, and it is ensured that the temperature relay can accurately detect the temperature of the inner cavity of the electric box shell by arranging the air channel; the temperature relay is isolated from the inner cavity of the inner shell through the protective cover, and temperature detection of the temperature relay is prevented from being affected when the heat dissipation device dissipates heat of the mainboard.

Description

Technical Field

[0001] The utility model relates to the technical field of the production of induction cooker mainboards, and particularly relates to a vertical furnace heat dissipation structure for processing induction cooker mainboards. Background Art

[0002] The vertical curing furnace is a common heat treatment device in the electronics industry. In the production of induction cookers, it is often used in the production of induction cooker mainboards. The vertical curing furnace has the characteristics of high efficiency. It adopts advanced heating technology, can quickly heat the material to the set temperature, and can improve production efficiency. Moreover, compared with the traditional heating method, the heating effect of the vertical furnace is more uniform, which can effectively avoid the uneven problem generated during the heating process of the material.

[0003] The control electric box of the vertical curing furnace is usually installed on the edge of its chassis. Since the temperature inside the furnace of the vertical curing furnace is generally controlled above 100°C, for the mainboard of the control electric box, the conductivity of electronic devices will be significantly reduced when they are in a high temperature environment for a long time, causing current transmission problems. The electronic components in the mainboard may work unstably, the current transmission is not smooth, and even it cannot work normally. In addition, the high temperature will also cause the resistance value of the mainboard to change, affecting the overall performance of the circuit.

[0004] Therefore, the usual method is to install a fan to cool the mainboard by air cooling. Although the temperature of the mainboard can be reduced, since some temperature relays are set in the control electric box of the vertical curing furnace, the temperature-sensitive elements (such as thermistors or bimetallic sheets) of the temperature relays are used to detect the change of the temperature inside the furnace, and the on-off of the relay is controlled through the control circuit, so as to realize the control and protection functions of the temperature inside the furnace. The fan cooling may affect the detection accuracy of the temperature relay.

[0005] Therefore, the existing technology still needs to be improved and developed. Content of the Utility Model

[0006] In view of the deficiencies of the above-mentioned existing technology, the purpose of the utility model is to provide a vertical furnace heat dissipation structure for processing induction cooker mainboards, so as to solve the problem that the detection accuracy of the temperature relay of the control electric box of the existing vertical curing furnace is affected due to fan cooling.

[0007] A vertical furnace heat dissipation structure for the processing of an electromagnetic furnace main board, including an electric box housing, an inner shell fixed to the rear side of the electric box housing, and a protective cover fixed to the front side of the electric box housing. The electric box housing is provided with an opening communicating the inner shell and the protective cover. A main board is fixed inside the inner shell, and a heat dissipation device for dissipating heat from the main board is provided on the protective cover. A temperature relay is provided on the main board, and a protective cover for covering the temperature relay is fixed to the front end of the main board. An air channel is provided on the side of the temperature relay away from the protective cover, and the air channel communicates with the inner cavity of the electric box housing.

[0008] Specifically, a first heat insulation layer is covered on the rear side of the electric box housing, and a second heat insulation layer is covered on the outer surface of the inner shell away from the electric box housing.

[0009] Specifically, air outlets communicating with the inner cavity of the inner shell are provided at both the upper and lower ends of the protective cover.

[0010] Specifically, the main board is connected with a wire. Threading holes for the wire to pass through are provided at both the left and right ends of the protective cover, and a wire management device is provided on the back of the protective cover. The wire management device includes a plurality of wire clips for fixing the wire.

[0011] Specifically, the open end of the wire clip is in a horn-shaped structure.

[0012] Specifically, two integrated circuit areas are provided on the main board, and there are two heat dissipation devices which are respectively arranged corresponding to the two integrated circuit areas.

[0013] Specifically, the heat dissipation device is a fan.

[0014] Advantages of the present utility model:

[0015] In the vertical furnace heat dissipation structure of the present utility model, a temperature relay is provided on the main board. The temperature-sensitive element of the temperature relay is used to detect the change of the temperature inside the furnace, and the on-off of the temperature relay is controlled through the control circuit on the main board, so as to realize the control and protection functions of the temperature inside the furnace. A protective cover for covering the temperature relay is fixed to the front end of the main board. An air channel is provided on the side of the temperature relay away from the protective cover, and the air channel communicates with the inner cavity of the electric box housing. By setting the air channel, it is ensured that the temperature relay can accurately detect the temperature of the inner cavity of the electric box housing. The temperature relay is isolated from the inner cavity of the inner shell by the protective cover, avoiding the influence of the heat dissipation device on the temperature detection of the temperature relay when dissipating heat from the main board. Description of the drawings

[0016] Figure 1 It is a three-dimensional view of the vertical curing furnace control electric box of the present utility model;

[0017] Figure 2Explosion diagram of the control electric box of the vertical curing furnace of the present utility model;

[0018] Figure 3 Front view of the control electric box of the vertical curing furnace of the present utility model;

[0019] Figure 4 is Figure 3 Cross-sectional view of the A-A plane in

[0020] Figure 5 Structural schematic diagram of the wire buckle of the present utility model;

[0021] Figure 6 Stereogram of the electric box housing, wire, wire management device and main board of the present utility model;

[0022] Figure 7 Stereogram of the wire, wire management device, main board and protective cover of the present utility model.

[0023] Reference numerals are: electric box housing 10, inner housing 20, protective cover 30, opening 11, main board 40, heat dissipation device 50, temperature relay 41, protective cover 60, air channel 42, first heat insulation layer 70, second heat insulation layer 80, air outlet 31, wire 43, wire passing hole 32, wire buckle 90, integrated circuit area 44. Detailed implementation manners

[0024] The present utility model provides a vertical furnace heat dissipation structure for processing an induction cooker main board. To make the purpose, technical solution and effects of the present utility model clearer and more definite, the following takes examples with reference to the drawings to further elaborate on the present utility model in detail. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0025] In the description of the present utility model, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present utility model.

[0026] Such as Figures 1 to 7, this embodiment discloses a vertical furnace heat dissipation structure for the processing of an induction cooker main board, including an electric box housing 10, an inner housing 20 fixed to the rear side of the electric box housing 10, and a protective cover 30 fixed to the front side of the electric box housing 10. The electric box housing 10 is provided with an opening 11 communicating the inner housing 20 and the protective cover 30. A main board 40 is fixed inside the inner housing 20. A heat dissipation device 50 for dissipating heat from the main board 40 is provided on the protective cover 30. A temperature relay 41 is provided on the main board 40. A protective cover 60 for covering the temperature relay 41 is fixed to the front end of the main board 40. An air channel 42 is provided on the side of the temperature relay 41 away from the protective cover 60, and the air channel 42 communicates with the inner cavity of the electric box housing 10.

[0027] In the vertical curing furnace control electric box of this embodiment, a heat dissipation device 50 is provided on the protective cover 30. By dissipating heat from the main board 40 through the heat dissipation device 50, the working temperature of the main board 40 can be reduced, ensuring the conductive stability of the electronic devices on the main board 40.

[0028] A temperature relay 41 is provided on the main board 40. The temperature-sensitive element of the temperature relay 41 is used to detect the change of the temperature in the furnace, and the switch of the temperature relay 41 is controlled through the control circuit on the main board 40, so as to realize the control and protection functions of the temperature in the furnace. Moreover, a protective cover 60 for covering the temperature relay 41 is fixed to the front end of the main board 40. An air channel 42 is provided on the side of the temperature relay 41 away from the protective cover 60, and the air channel 42 communicates with the inner cavity of the electric box housing 10. By setting the air channel 42, it is ensured that the temperature relay 41 can accurately detect the temperature of the inner cavity of the electric box housing 10. The temperature relay 41 is isolated from the inner cavity of the inner housing 20 through the protective cover 60, avoiding the influence of the heat dissipation device 50 on the temperature detection of the temperature relay 41 when dissipating heat from the main board 40.

[0029] Please refer to Figure 1 , Figure 2 and Figure 4 , in order to prevent the temperature in the furnace from dissipating from the electric box housing 10 and the inner housing 20 to the outside, a first heat insulation layer 70 is covered on the rear side of the electric box housing 10 in this embodiment, and a second heat insulation layer 80 is covered on the outer surface of the side of the inner housing 20 away from the electric box housing 10, which has a good heat insulation effect and reduces the energy consumption required for heating the vertical curing furnace.

[0030] Please refer to Figure 1 , the heat dissipation device 50 is a fan, and the air outlet of the fan faces the main board 40. After the fan starts, it blows directly on the main board 40 to realize the cooling of the main board 40. In order to make the air flow better discharged, air outlets 31 communicating with the inner cavity of the inner housing 20 are provided at both the upper and lower ends of the protective cover 30. The air outlets 31 can adopt a full-opening structure or a porous structure. In order to exhaust air with the highest efficiency, the air outlets 31 in this embodiment adopt a full-opening structure.

[0031] Please refer to Figure 2, the main board 40 of this embodiment is connected with a wire 43. Threading holes 32 for the wire 43 to pass through are provided at both the left and right ends of the protective cover 30. The wire 43 passes through the threading holes 32 concentratedly from the left and right sides of the protective cover 30 and is then electrically connected to the main board 40, avoiding wire chaos.

[0032] Further, please refer to Figure 6 and Figure 7 , a wire management device is provided on the back of the protective cover 30. The wire management device includes a plurality of wire clips 90 for fixing the wire 43. The wire clips 90 can be fixed to the back of the protective cover 30 by means such as welding fixation, screw fixation, and snap fixation. The positions of the wire clips 90 can be arranged according to the number of wires 43, having a good wire management effect.

[0033] Please refer to Figure 5 , the open end of the wire clip 90 is a horn-shaped structure. When installing the wire 43, the wire 43 is directly pressed into the open end of the wire clip 90. Since the open end is a horn-shaped structure, it helps to guide the wire 43 to quickly snap into the card slot of the wire clip 90.

[0034] Please refer to Figure 7 , two integrated circuit areas 44 are provided on the main board 40. The integrated circuit areas 44 can be high-frequency and high-power circuit areas that need to dissipate heat. There are two heat dissipation devices 50 and they are respectively arranged corresponding to the two integrated circuit areas 44. The heat dissipation devices 50 directly dissipate heat from the integrated circuit areas 44, improving the heat dissipation efficiency of the integrated circuit areas 44.

[0035] The above has specifically described the preferred embodiments of the present utility model, but the present utility model is not limited to the described embodiments. Those skilled in the art can also make various equivalent variations or substitutions without departing from the spirit of the present utility model, and these equivalent variations or substitutions are all included within the scope defined by the claims of the present utility model.

Claims

1. A vertical furnace heat dissipation structure for processing an induction cooker mainboard, characterized in that: The invention comprises an electric box shell (10), an inner shell (20) fixed to the rear side of the electric box shell (10), and a protective cover (30) fixed to the front side of the electric box shell (10); the electric box shell (10) is provided with an opening (11) connecting the inner shell (20) and the protective cover (30); a main board (40) is fixed in the inner shell (20); the protective cover (30) is provided with a heat dissipation device (50) for dissipating heat from the main board (40); a temperature relay (41) is provided on the main board (40); a protective cover (60) for covering the temperature relay (41) is fixed to the front end of the main board (40); an air channel (42) is provided on the side of the temperature relay (41) away from the protective cover (60); the air channel (42) is communicated with the inner cavity of the electric box shell (10).

2. The vertical furnace heat dissipation structure for processing an induction cooker mainboard according to claim 1, characterized in that: The rear side of the electrical box outer shell (10) is covered with a first thermal insulation layer (70), and the outer surface of the inner shell (20) away from the electrical box outer shell (10) is covered with a second thermal insulation layer (80).

3. The vertical furnace heat dissipation structure for processing an induction cooker mainboard according to claim 1, characterized in that: The upper and lower ends of the protective cover (30) are both provided with air outlets (31) which are in communication with the inner cavity of the inner shell (20).

4. The vertical furnace heat dissipation structure for processing an induction cooker mainboard according to claim 3, characterized in that: The main board (40) is connected to a wire (43), and both left and right ends of the protective cover (30) are provided with threading holes (32) for the wire (43) to pass through. The back of the protective cover (30) is provided with a wire management device, and the wire management device includes a plurality of wire buckles (90) for fixing the wire (43).

5. The vertical furnace heat dissipation structure for processing an induction cooker mainboard according to claim 4, characterized in that: The open end of the wire buckle (90) is a trumpet-shaped structure.

6. The vertical furnace heat dissipation structure for processing an induction cooker mainboard according to claim 1, characterized in that: The mainboard (40) is provided with two integrated circuit areas (44), and the heat dissipation devices (50) have two and are respectively provided corresponding to the two integrated circuit areas (44).

7. The vertical furnace heat dissipation structure for processing an induction cooker mainboard according to claim 1, characterized in that: The heat dissipation device (50) is a fan.

Images