3D printing heat conduction composite substrate

Abstract

The utility model relates to a 3D printing heat conduction composite substrate which comprises a support. A plurality of sets of heat exchange insertion holes are formed in the top of the support, heat conduction insertion blocks are inserted into the heat exchange insertion holes, the tops of the heat conduction insertion blocks and the lower base plate platform are of an integrated connection structure, and the upper base plate platform is laid on the top of the lower base plate platform; a pipeline base plate is placed at the bottom of the support, and a heat exchange pipeline assembly of the pipeline base plate is connected with the heat conduction inserting block in a heat exchange mode. According to the 3D printing heat conduction composite substrate, an upper-lower double-loading-assembly structure is adopted, the bearing printing capital construction and heat conduction working procedures are completed in a distributed mode, and the technical problem that the heat dissipation efficiency of a single-set substrate structure is low is solved. The grouped loading structure can effectively disperse the load of the substrate, the structural strength of the substrate is improved, and meanwhile convenience is provided for subsequent replacement of the substrate and the heat dissipation assembly.

Description

Technical Field

[0001] The utility model belongs to the technical field, and particularly relates to a 3D printing heat conduction composite substrate. Background Art

[0002] The heat conduction substrate is an indispensable key component in the field of electronic packaging, mainly used for supporting, fixing and protecting electronic components, and effectively managing the heat generated during the operation of electronic components. With the development of electronic products towards miniaturization, integration and high performance, the requirements for heat conduction substrates are also increasing day by day. It is not only required to have excellent thermal conductivity, but also good machinability, electrical insulation and chemical stability. The introduction of 3D printing technology has brought a revolutionary change to the manufacturing of heat conduction substrates, making complex internal structures, high-precision positioning and personalized customization possible.

[0003] Therefore, this application provides a 3D printing heat conduction composite substrate. This application adopts an upper and lower double loading component structure to complete the loading of the printing infrastructure and the heat conduction process respectively, solving the technical problem of low heat dissipation efficiency of a single substrate structure. The structure of grouped loading can effectively disperse the load of the substrate, improve the structural strength of the substrate, and also provide convenience for subsequent replacement of the substrate and heat dissipation components. Summary of the Invention

[0004] To achieve the above object, the technical solution of the utility model is as follows:

[0005] A 3D printing heat conduction composite substrate includes a support; a plurality of heat exchange insertion holes are opened at the top of the support, heat conduction insertion blocks are inserted in the heat exchange insertion holes, the top of the heat conduction insertion blocks is integrally connected with the lower platform of the substrate, and the upper platform of the substrate is laid on the top of the lower platform of the substrate;

[0006] A pipeline substrate is placed at the bottom of the support, and the heat exchange pipeline assembly of the pipeline substrate is in heat exchange connection with the heat conduction insertion blocks.

[0007] Further, six buckle holes are opened on both sides of the plane along the heat exchange insertion holes of the support, and the buckle holes are in buckle limit butt joint with both sides of the bottom end face of the lower platform of the substrate.

[0008] Furthermore, the heat exchange pipeline assembly includes a heat exchange pipeline and a circulation valve port;

[0009] The circulation valve port is horizontally installed at the opening on the side of the pipeline substrate, and the circulation valve port is communicated with the heat exchange pipeline through the built-in heat exchange channel of the pipeline substrate.

[0010] Furthermore, the heat exchange pipeline is inserted into the heat conduction insertion block along the insertion hole, and the heat conduction insertion block is in thermal contact with the outer wall of the heat exchange pipeline.

[0011] Furthermore, retaining edges are provided at the front and rear end faces of the support, and feet extend integrally from the bottom of the corners of the support, and a supporting foot horizontally extends from the bottom of the feet.

[0012] The beneficial effects of the present utility model are as follows:

[0013] Compared with the prior art, the present application provides a 3D printing heat conduction composite substrate. The present application adopts an upper and lower dual loading component structure to separately complete the processes of carrying the printing infrastructure and heat conduction, solving the technical problem of low heat dissipation efficiency of a single substrate structure. The structure of grouped loading can effectively disperse the load of the substrate, improve the structural strength of the substrate, and also facilitate the subsequent replacement of the substrate and the heat dissipation component. Description of the Drawings

[0014] Figure 1 It is a schematic top view of the installation structure of a 3D printing heat conduction composite substrate of the present utility model.

[0015] Figure 2 It is a top view of a 3D printing heat conduction composite substrate of the present utility model.

[0016] Figure 3 It is a front view of the bottom installation structure of a 3D printing heat conduction composite substrate of the present utility model.

[0017] List of Drawing Reference Signs:

[0018] 1 is the upper platform of the substrate, 2 is the lower platform of the substrate, 3 is the snap hole, 4 is the heat exchange insertion hole, 5 is the foot, 6 is the supporting foot, 7 is the support, 7-1 is the retaining edge, 8 is the heat conduction insert block, 9 is the insertion hole, 10 is the snap, 11 is the heat exchange pipeline, 12 is the circulation valve port, 13 is the pipeline substrate. Detailed Embodiment

[0019] The following further clarifies the present utility model in conjunction with the drawings and the detailed embodiment. It should be understood that the following detailed embodiment is only used to illustrate the present utility model and not to limit the scope of the present utility model.

[0020] As Figure 1 、 Figure 2 and Figure 3 shown, a 3D printing heat conduction composite substrate includes a support; a plurality of heat exchange insertion holes 4 are provided at the top of the support 7, a heat conduction insert block 8 is inserted into the heat exchange insertion holes 4, the top of the heat conduction insert block 8 is integrally connected to the lower platform 2 of the substrate, and the upper platform 1 of the substrate is laid on the top of the lower platform 2 of the substrate; among them, the design of the upper and lower substrate platforms separates the 3D printing infrastructure from the bottom heat conduction structure, enabling the separation of the heat dissipation component and the support plane, making it more convenient to replace damaged structures in the future, and the division of labor is clear. The heat exchange insertion holes 4 are used as the limiting hole-shaped structures for the heat conduction insert blocks 8.

[0021] A pipeline substrate 13 is placed at the bottom of the support 7, and the heat exchange pipeline assembly of the pipeline substrate 13 is in heat exchange connection with the heat conduction insert block 8. The support 7 serves as the frame structure of the overall substrate. The pipeline substrate 13 installed at the bottom of the support 7 can cooperate with the heat exchange pipeline assembly and the heat conduction insert block 8 to complete the heat exchange process, achieving the heat dissipation effect of the substrate.

[0022] As Figure 1 , Figure 2 and Figure 3 shown, six groups of buckle holes 3 are provided on both side planes of the support 7 along the heat exchange insertion holes 4, and the buckle holes 3 are in limit butt joint with the buckles 10 on both sides of the bottom end face of the lower platform 2 of the substrate. The buckles 10 cooperate with the buckle holes 3 to fix the installation process. The design of the buckles can further stabilize the connection between the support and the upper and lower substrates.

[0023] As Figure 1 , Figure 2 and Figure 3 shown, the heat exchange pipeline assembly includes a heat exchange pipeline 11 and a circulation valve port 12;

[0024] The circulation valve port 12 is horizontally installed at the opening on the side of the pipeline substrate 13, and the circulation valve port 12 is communicated with the heat exchange pipeline 11 through the built-in heat exchange channel of the pipeline substrate 13. The circulation valve port 12 can achieve the heat exchange effect by supplying coolant for front and rear circulation.

[0025] As Figure 1 , Figure 2 and Figure 3 shown, the heat exchange pipeline 11 is inserted into the heat conduction insert block 8 along the insertion hole 9, and the heat conduction insert block 8 is in thermal contact with the outer wall of the heat exchange pipeline 11.

[0026] As Figure 1 , Figure 2 and Figure 3 shown, the front and rear end faces of the support 7 are reserved with edge guards 7-1, the support 7 integrally extends with support feet 5 along the bottom corners, and the bottom of the support feet 5 horizontally extends with support brackets 6. The integrated support feet 5 and support brackets 6 facilitate integrated processing in a row.

[0027] It should be noted that the above content only illustrates the technical idea of the present invention and cannot be used to limit the protection scope of the present invention. For those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements all fall within the protection scope of the claims of the present invention.

Claims

1. A 3D printed heat-conducting composite substrate, comprising a support; wherein: The support (7) has a plurality of heat exchange jacks (4) on its top, and heat conduction plugs (8) are inserted into the heat exchange jacks (4). The top of the heat conduction plugs (8) is connected to the lower substrate platform (2) in an integrated manner, and the top of the lower substrate platform (2) is paved with an upper substrate platform (1); A pipeline base plate (13) is placed at the bottom of the support (7), and a heat exchange pipeline assembly of the pipeline base plate (13) is connected to a heat conduction plug block (8) in a heat exchange manner.

2. A 3D printed heat-conducting composite substrate according to claim 1, characterized in that: The support (7) is provided with six groups of buckle holes (3) along the planes on both sides of the heat exchange socket (4), and the buckle holes (3) are limitedly connected with the buckles (10) on both sides of the bottom end surface of the lower platform (2) of the base plate.

3. The 3D printed heat-conducting composite substrate according to claim 1, characterized in that: The heat exchange pipeline assembly comprises a heat exchange pipeline (11) and a circulation valve port (12); The circulation valve port (12) is horizontally mounted at an opening on the side of the pipeline substrate (13), and the circulation valve port (12) is connected to the heat exchange pipeline (11) through a heat exchange channel in the pipeline substrate (13).

4. The 3D printed heat-conducting composite substrate according to claim 3, characterized in that: The heat exchange pipeline (11) is inserted into the heat conductive plug block (8) along the insertion hole (9), and the heat conductive plug block (8) is in heat conductive contact with the outer wall of the heat exchange pipeline (11).

5. The 3D printed heat-conducting composite substrate according to claim 1, characterized in that: The front and rear end surfaces of the support (7) retain ribs (7-1), the support (7) has support feet (5) extending integrally along the bottom of the corners, and the bottom of the support feet (5) has support feet (6) extending horizontally.

Images