Organic light-emitting display device

Abstract

The utility model discloses an organic light-emitting display device which comprises a substrate, a pixel unit and a partition unit, a packaging structure covers the pixel unit and the partition unit, and a cover plate is located on one side of the packaging structure. The distance between the upper surface of the pixel unit and the cover plate is larger than the distance between the upper surface of the partition unit and the cover plate. The packaging structure comprises a first packaging unit and a second packaging unit, the first packaging unit is located above the pixel unit, and the second packaging unit is located above the partition unit; in the thickness direction of the substrate, the distance between the upper surface of the first packaging unit and the substrate is h1, and the distance between the upper surface of the second packaging unit and the substrate is h2; wherein h1-h2 / h2 is less than 10%. According to the technical scheme provided by the embodiment of the utility model, the light emitting effect is ensured by adjusting the emitting direction of the light on the upper surface of the packaging structure.

Description

Technical Field

[0001] The utility model relates to the technical field of displays, and particularly to an organic light-emitting display device. Background Art

[0002] An organic light-emitting diode (OLED) display device is a display device that uses OLEDs as display pixels. Compared with traditional liquid crystal display devices, OLED display devices are more and more popular in the market because of their advantages such as self-luminescence, low power consumption, good color effect, and flexibility for flexible displays.

[0003] Figure 1 FIG. shows a partial cross-sectional structure schematic diagram of an organic light-emitting display device in the related art. As Figure 1 shown, pixel units 200' are arranged in an array on one side of a substrate 100'. The pixel units 200' can display light, that is, the area where the pixel units 200' are arranged is the light-emitting area AA' in the organic light-emitting display device. Further, there are barrier units 300' between adjacent pixel units 200'. The area where the barrier units 300' are arranged does not display light, that is, the area where the barrier units 300' are arranged is the non-light-emitting area NA' in the organic light-emitting display device.

[0004] As Figure 1 shown, an encapsulation layer 400' is provided on the pixel units 200' and the barrier units 300' of the organic light-emitting display device to protect the pixel units 200'. Other film layers 500' such as optical glue are also filled on the encapsulation layer 400'. There is a large height difference between the pixel units 200' and the barrier units 300'. This will cause a height difference on the upper surface of the encapsulation layer 400' provided in the light-emitting area AA and the non-light-emitting area NA. The refractive index of the other film layers 500' provided on the encapsulation layer 400' is different from that of the encapsulation layer 400'. There is an inclined interface between the encapsulation layer 400' and the other film layers 500' on the light-emitting path of the pixel units 200', and this inclined interface is relatively long. Therefore, the light rays emitted from the pixel units 200' to the encapsulation layer 400' have different transmission paths at different positions. As Figure 1 shown by the arrows a and b in, the transmission path of the light ray b emitted from the inclined interface deviates from the light-emitting direction of the positive viewing angle, resulting in different transmission paths for the light ray a and the light ray b. Therefore, the light-emitting effect of the pixel units 200' at the positive viewing angle is affected, and further the overall light-emitting effect of the organic light-emitting display device is affected. Summary of the Utility Model

[0005] The utility model provides an organic light-emitting display device, so as to improve the light-emitting effect of the organic light-emitting display device.

[0006] An embodiment of the present utility model provides an organic light-emitting display device, including:

[0007] A substrate;

[0008] A pixel unit and a partition unit, the pixel unit and the partition unit are located on the substrate, and the partition unit is disposed between two adjacent pixel units;

[0009] An encapsulation structure that covers the pixel unit and the partition unit;

[0010] A cover plate located on the encapsulation structure;

[0011] The distance from the upper surface of the pixel unit to the cover plate is greater than the distance from the upper surface of the partition unit to the cover plate;

[0012] The encapsulation structure includes a first encapsulation unit and a second encapsulation unit. The first encapsulation unit is located above the pixel unit, and the second encapsulation unit is located above the partition unit;

[0013] Wherein, along the thickness direction of the substrate, the distance between the upper surface of the first encapsulation unit and the substrate is h1, and the distance between the upper surface of the second encapsulation unit and the substrate is h2;

[0014] Wherein, |h1 - h2| / h2 < 10%.

[0015] Optionally, the encapsulation structure includes a first encapsulation layer;

[0016] The first encapsulation unit includes a first encapsulation part in the first encapsulation layer, and the second encapsulation unit includes a second encapsulation part in the first encapsulation layer;

[0017] Along the thickness direction of the substrate, the distance between the upper surface of the first encapsulation part and the substrate is the h1, and the distance between the upper surface of the second encapsulation part and the substrate is the h2;

[0018] Along the thickness direction of the substrate, the distance from the upper surface of the first encapsulation part to the upper surface of the pixel unit is greater than the distance from the upper surface of the second encapsulation part to the upper surface of the partition unit.

[0019] Optionally, the encapsulation structure includes a second encapsulation layer and a filling layer, and the filling layer is located on the side of the second encapsulation layer away from the substrate;

[0020] The first encapsulation unit includes a third encapsulation part in the second encapsulation layer and a first filling part in the filling layer; the second encapsulation unit includes a fourth encapsulation part in the second encapsulation layer and a second filling part in the filling layer;

[0021] In the thickness direction of the substrate, the distance between the upper surface of the first filling part and the substrate is h1, and the distance between the upper surface of the second filling part and the substrate is h2;

[0022] In the thickness direction of the substrate, the distance from the upper surface of the third encapsulation part to the upper surface of the pixel unit is h3, and the distance from the upper surface of the fourth encapsulation part to the upper surface of the partition unit is h4, where |h3 - h4| / h4 < 10%;

[0023] The distance between the upper surface of the first filling part and the upper surface of the third encapsulation part is greater than the distance between the upper surface of the second filling part and the upper surface of the fourth encapsulation part.

[0024] Optionally, the refractive index of the second encapsulation layer is n1, and the refractive index of the filling layer is n2;

[0025] Wherein, |n1 - n2| ≤ 0.1.

[0026] Optionally, the filling layer includes a planarization layer.

[0027] Optionally, the filling layer includes a first optical adhesive layer.

[0028] Optionally, the organic light-emitting display device further includes a second optical adhesive layer;

[0029] The second optical adhesive layer is located on the side of the encapsulation structure away from the substrate, and the refractive index of the second optical adhesive layer is less than the refractive index of the encapsulation structure.

[0030] Optionally, the pixel unit includes an anode layer, an organic light-emitting layer, and a cathode layer; the anode layer is located on the side of the organic light-emitting layer close to the substrate, and the cathode is located on the side of the organic light-emitting layer away from the substrate;

[0031] The organic light-emitting layer includes an organic light-emitting material layer that emits multiple colors of light. In the first direction and / or the second direction, the emission colors of the organic light-emitting layers in adjacent pixel units are different; the first direction and the second direction intersect and are both parallel to the plane of the substrate.

[0032] Optionally, the partition unit includes a pixel definition layer, a cathode connection layer, and a partition layer; the pixel definition layer is located on the side of the cathode connection layer close to the substrate, and the partition layer is located on the side of the cathode connection layer away from the substrate;

[0033] The cathode connection layer and the cathode layer are electrically connected.

[0034] Optionally, the partition layer includes one or more of a trapezoid, a frustum of a cone, or a rectangle.

[0035] Optionally, the material of the cathode connection layer includes one or more of Mo, Au, TiN, and ITO.

[0036] Optionally, the organic light-emitting display device is a silicon-based micro organic light-emitting display device.

[0037] In the organic light-emitting display device provided by the embodiment of the present invention, the encapsulation structure in the organic light-emitting display device includes a first encapsulation structure and a second encapsulation structure. The first encapsulation structure is located above the pixel unit, and the second encapsulation structure is located above the partition unit. Moreover, the distance between the upper surface of the first encapsulation structure unit and the substrate is the same as or close to the distance between the upper surface of the second encapsulation structure unit and the substrate, that is, the distance between the overall encapsulation structure and the substrate is adjusted to be the same as or close to each other. In this way, the inclined interface between the encapsulation structure and the film layer above it can be reduced or eliminated, avoiding the problem of abnormal light output direction caused by the interface extension direction and the refractive index difference between different film layers at the interface, reducing the large-angle light output of the organic light-emitting display device, ensuring the light output efficiency in the front view angle, and ensuring the light output effect of the organic light-emitting display device.

[0038] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present invention, nor is it used to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0040] Figure 1 It is a schematic partial cross-sectional structure diagram of an organic light-emitting display device in the related art;

[0041] Figure 2 It is a schematic structural diagram of an organic light-emitting display device provided by an embodiment of the present invention;

[0042] Figure 3 For Figure 2 It is a schematic cross-sectional structure diagram along the A-A' direction;

[0043] Figure 4 Another schematic cross-sectional structure diagram along the A-A' direction; Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction;

[0044] Figure 5 Another schematic cross-sectional structure diagram along the A-A' direction; Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction

[0045] Figure 6 Another schematic cross-sectional structure diagram along the A-A' direction; Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction;

[0046] Figure 7 Another schematic cross-sectional structure diagram along the A-A' direction; Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction;

[0047] Figure 8 Schematic diagram of the film layer structure of a pixel unit provided by an embodiment of the present invention;

[0048] Figure 9 Another schematic cross-sectional structure diagram along the A-A' direction. Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction. Detailed implementation manners

[0049] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0051] Figure 2 Schematic diagram of the structure of an organic light-emitting display device provided by an embodiment of the present invention, Figure 3 Another schematic cross-sectional structure diagram along the A-A' direction; Figure 2A schematic cross-sectional structure diagram along the A-A' direction Figure 4 is Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction Figure 5 is Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction Figure 6 is Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction Figure 7 is Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction Figure 8 is a schematic diagram of the film layer structure of a pixel unit provided by an embodiment of the present invention

[0052] Referring to Figures 2 to 4 as shown, an embodiment of the present invention provides an organic light-emitting display device 10, which includes: a substrate 100; a pixel unit 200 and a partition unit 300. The pixel unit 200 and the partition unit 300 are located on the substrate 100, and the partition unit 300 is disposed between two adjacent pixel units 200; a packaging structure 400 that covers the pixel unit 200 and the partition unit 300; a cover plate 500 located on the packaging structure 400; the distance s1 from the upper surface of the pixel unit 200 to the cover plate 500 is greater than the distance s2 from the upper surface of the partition unit 300 to the cover plate 500; the packaging structure 400 includes a first packaging unit 410 and a second packaging unit 420. The first packaging unit 410 is located above the pixel unit 200, and the second packaging unit 420 is located above the partition unit 300; wherein, along the thickness direction of the substrate 100, the distance between the upper surface of the first packaging unit 410 and the substrate 100 is h1, and the distance between the upper surface of the second packaging unit 420 and the substrate 100 is h2; wherein, |h1 - h2| / h2 < 10%.

[0053] Among them, the organic light-emitting display device 10 includes a substrate 100 and a pixel unit 200 located on one side of the substrate 100. Specifically, the substrate 100 may be a driving substrate, and a plurality of pixel units 200 arranged in an array are defined on the substrate 100. The setting quantity and arrangement mode of the pixel units 200 have diversity, and the embodiments of the present invention are not shown one by one. Exemplarily, referring to Figure 2 and Figure 3 as shown, the substrate 100 includes a substrate 101, and a driving transistor T corresponding to the pixel unit 200 is disposed on the substrate 101. The driving transistor T is connected to the pixel unit 200, and the driving transistor T can provide a working signal corresponding to the light-emitting brightness for the pixel unit 200 to drive the pixel unit 200 to emit light, thereby realizing the display effect of the organic light-emitting display device 10

[0054] Specifically, referring to Figure 8As shown, the pixel unit 200 may include an anode layer 200a, an organic light-emitting layer 200b, and a cathode layer 200c; the anode layer 200a is located on the side of the organic light-emitting layer 200b close to the substrate 100, and the cathode layer 200c is located on the side of the organic light-emitting layer 200b away from the substrate 100. Among them, the anode layer 200a serves as one electrode of the pixel and can inject carriers (such as holes) into the pixel under the drive of the positive voltage of an external power supply. The cathode layer 200c is used to supply electrons to the organic light-emitting layer 200b. When electrons and holes are respectively injected into the organic light-emitting layer 200b from the cathode layer 200c and the anode layer 200a, the electrons and holes recombine in the organic light-emitting layer 200b to release energy and emit light. The material of the light-emitting material layer 200d in the organic light-emitting layer 200b can determine the emission color of the organic light-emitting layer 200b.

[0055] Further, the organic light-emitting display device 10 further includes a partition unit 300 located on one side of the substrate 100, and the partition unit 300 is disposed between two adjacent pixel units 200. The area where the pixel unit 200 is located can be understood as the light-emitting area of the organic light-emitting display device 10, and the partition unit 300 can be understood as the non-light-emitting area of the organic light-emitting display device 10. Along the thickness direction of the substrate 100, the distance s1 from the upper surface of the pixel unit 200 to the cover plate 500 is greater than the distance s2 from the upper surface of the partition unit 300 to the cover plate 500, that is, the heights of the pixel unit 200 and the partition unit 300 are different, and there is a large height difference between the partition unit 300 and the pixel unit 200. In this way, the partition unit 300 can more clearly define the boundary of each pixel unit 200 and is beneficial to reducing the optical crosstalk and electrical crosstalk between adjacent pixel units 200. Exemplarily, the pixel units 200 on both sides of the partition unit 300 can be a red pixel unit and a blue pixel unit respectively, which can reduce the optical crosstalk and electrical crosstalk between the red pixel unit and the blue pixel unit, ensure the effective output of red light and blue light, and thus achieve the color display effect of the organic light-emitting display device 10. Further, the overall morphology of the partition unit 300 can be adjusted. For example, the partition unit 300 is adjusted to an inverted trapezoid or an eave structure. Then, when preparing the organic light-emitting layer 200b or the cathode layer 200c in the pixel unit 200 subsequently, the partition unit 300 can disconnect at least part of the organic light-emitting layer 200b or the cathode layer 200c laid on the whole surface, which can prevent leakage current from being transmitted to adjacent pixel units and is beneficial to improving the accuracy of pixel brightness control. Further, through the preparation of the partition unit 300, the organic light-emitting layer 200b prepared on the whole surface can be segmented, and the corresponding organic light-emitting layer 200d can be formed in each pixel unit 200 without using a traditional fine metal mask (FMM), and the organic light-emitting layer 200b is separated between each pixel unit 200, thereby being able to reduce the manufacturing cost.

[0056] Further, the organic light emitting display device 10 further includes a packaging structure 400 and a cover plate 500. The packaging structure 400 covers the pixel unit 200 and the partition unit 300 to ensure the structural stability of the pixel unit 200 and the partition unit 300. The cover plate 500 is located on the packaging structure 400 to support and protect the packaging structure 400.

[0057] Further, the packaging structure 400 includes a first packaging unit 410 located above the pixel unit 200 and a second packaging unit 420 located above the partition unit 300. The distance h1 between the upper surface of the first packaging unit 410 and the substrate 100 and the distance h2 between the upper surface of the second packaging unit 420 and the substrate 100 satisfy |h1 - h2| / h2 < 10%, that is, the distance between the upper surface of the first packaging unit 410 and the substrate 100 is the same as or close to the distance between the upper surface of the second packaging unit 420 and the substrate 100. For the formula |h1 - h2| / h2 < 10%, it can be understood that |h1 - h2| / h2 can be equal to 0, 5%, 7%, or 9%, etc., thus reflecting that the values of h1 and h2 are close, that is, the upper surface of the packaging structure 400 has a relatively flat packaging surface, so that the inclined interface between the packaging structure 400 and the film layer above it can be reduced or eliminated. Comparing Figure 3 region c2 in Figure 1 region c1, when the height of the upper surface of the packaging structure 400 in the region where the pixel unit 200 is located and the height in the region where the partition unit 300 is located are close, the length of this inclined interface is effectively shortened. Therefore, the light transmitted to this inclined interface is reduced, and the light with light deflection is reduced, which can ensure that more light emitted by the pixel unit 200 is emitted at a positive viewing angle. Comparing Figure 4 region c2 in Figure 1 region c1, when the height of the upper surface of the packaging structure 400 in the region where the pixel unit 200 is located is the same as the height in the region where the partition unit 300 is located, this inclined interface can be completely eliminated, and the light deflection caused by the inclined interface can be eliminated, which can further reduce the deflection of the light emitted by the pixel unit 200. That is, by shortening or eliminating the inclined interface, it can ensure that the pixel unit 200 has a good positive viewing angle light emission effect.

[0058] Specifically, refer to Figures 3 to 7As shown in the figure, in order to make the distance between the upper surface of the first encapsulation unit 410 and the substrate 100 the same as or close to the distance between the upper surface of the second encapsulation unit 420 and the substrate 100, the thickness of the first encapsulation unit 410 itself can be adjusted to be greater than the thickness of the second encapsulation unit 420 itself. Specifically, the height of the upper surface of the first encapsulation unit 410 can be understood as the sum of the heights of the pixel unit 200 and the substrate 100 plus the height of the first encapsulation unit 410 itself, and the height of the upper surface of the second encapsulation unit 420 can be understood as the sum of the heights of the partition unit 300 and the substrate 100 plus the height of the second encapsulation unit 420 itself. Therefore, when the distance between the pixel unit 200 and the substrate 100 is less than the distance between the partition unit 300 and the substrate 100, by adjusting the thickness of the first encapsulation unit 410 to be greater than the thickness of the second encapsulation unit 420, the surface height of the encapsulation structure 400 on the side away from the substrate 100 in each area can be leveled or the difference can be reduced. In other words, by adjusting the difference between the height of the first encapsulation unit 410 itself and the height of the second encapsulation unit 420 itself, the large height difference between the partition unit 300 and the pixel unit 200 can be balanced, so as to effectively make the height of the surface of the encapsulation structure 400 on the side away from the substrate 100 in the light-emitting area close to or the same as the height in the non-light-emitting area.

[0059] In summary, the organic light-emitting display device provided by the embodiment of the present invention adjusts the encapsulation structure to ensure that the distance between the upper surface of the first encapsulation structure unit and the substrate is the same as or close to the distance between the upper surface of the second encapsulation structure unit and the substrate, that is, adjusts the distance between the whole encapsulation structure and the substrate to be the same as or close to each other. In this way, the inclined interface between the encapsulation structure and the film layer above it can be reduced or eliminated, avoiding the problem that the light-emitting direction is abnormal due to the interface extension direction and the refractive index difference between different film layers at the interface, reducing the large-angle light emission of the organic light-emitting display device, ensuring the light-emitting efficiency at the front view angle, and ensuring the light-emitting effect of the organic light-emitting display device.

[0060] The specific setting method of the encapsulation structure will be described in the following embodiments.

[0061] Continue to refer to Figures 2 to 4As shown, the encapsulation structure 400 includes a first encapsulation layer 400a; the first encapsulation unit 410 includes a first encapsulation section 411 in the first encapsulation layer 400a, and the second encapsulation unit 420 includes a second encapsulation section 421 in the first encapsulation layer 400a; along the thickness direction of the substrate 100, the distance between the upper surface of the first encapsulation section 411 and the substrate 100 is h1, and the distance between the upper surface of the second encapsulation section 421 and the substrate 100 is h2; along the thickness direction of the substrate 100, the distance s3 from the upper surface of the first encapsulation section 411 to the upper surface of the pixel unit 200 is greater than the distance s4 from the upper surface of the second encapsulation section 421 to the upper surface of the partition unit 300.

[0062] Among them, referring to Figure 3 and Figure 4 As shown, the first encapsulation unit 410 includes a first encapsulation section 411, the second encapsulation unit 420 includes a second encapsulation section 421, and both the first encapsulation section 411 and the second encapsulation section 421 are the first encapsulation layer 400a. It can be understood that the first encapsulation section 411 and the second encapsulation section 421 are of the same material and are prepared integrally. Exemplarily, the first encapsulation section 411 and the second encapsulation section 421 are a whole-layer thin film encapsulation layer (TFE). The first encapsulation section 411 can protect the structure of the pixel unit 200, and the second encapsulation section 421 can protect the partition unit 300.

[0063] Specifically, referring to Figure 3 and Figure 4 As shown, along the thickness direction of the substrate 100, the distance s3 from the upper surface of the first encapsulation section 411 to the upper surface of the pixel unit 200 is greater than the distance s4 from the upper surface of the second encapsulation section 421 to the upper surface of the partition unit 300. It can be understood that the self-thickness of the first encapsulation section 411 is greater than the self-thickness of the second encapsulation section 421. By adjusting the thickness difference between the first encapsulation section 411 in the light-emitting area and the second encapsulation section 421 in the non-light-emitting area, and combining the large height difference between the pixel unit 200 and the partition unit 300, it can be ensured that the distance between the surface of the first encapsulation section 411 far from the substrate 100 and the substrate 100 is the same or similar to the distance between the surface of the second encapsulation section 421 far from the substrate 100 and the substrate 100, that is, the distance between the upper surface of the first encapsulation unit 410 and the substrate 100 is the same or similar to the distance between the upper surface of the second encapsulation unit 420 and the substrate 100, and the upper surface of the encapsulation structure 400 is an approximately flat surface. Thus, the inclined interface can be effectively shortened or eliminated, and the light emitted from the pixel unit 200 at the inclined interface can be reduced or eliminated, so as to ensure the forward-view light emission of the pixel unit 200.

[0064] Furthermore, referring toFigure 3 As shown, the distance between the upper surface of the first encapsulation unit 410 and the substrate 100 is h1, and the distance between the upper surface of the second encapsulation unit 420 and the substrate 100 is h2, satisfying |h1 - h2| / h2 < 10%, that is, there is a small thickness difference between the two. Exemplarily, the difference between h2 and h1 can be less than 0.1 micrometer. Refer to Figure 3 As shown in region c2 in [reference], with a small thickness difference, it can be ensured that the length of the inclined interface is short, which can effectively reduce the light emitted from the pixel unit 200 from exiting at the inclined interface. That is, it can avoid the problem that the light emission direction is abnormal at the inclined interface due to the refractive index difference between different film layers at the interface extension direction and the interface, avoid reducing the large-angle light emission of the organic light-emitting display device, and ensure the light emission efficiency in the front view angle, thereby improving the light emission effect of the organic light-emitting display device 10. Optionally, during the preparation of the organic light-emitting display device 10, the first encapsulation part 411 and the second encapsulation part 421 are prepared as a whole surface, and the thickness of the first encapsulation part 411 and the second encapsulation part 421 can be further adjusted by the process of back etching.

[0065] Furthermore, the distance between the upper surface of the first encapsulation unit 410 and the substrate 100 is h1, and the distance between the upper surface of the second encapsulation unit 420 and the substrate 100 is h2, and it can also satisfy h1 = h2, that is, there is no thickness difference between the two. Refer to Figure 4 As shown, in the case of no thickness difference, it can be ensured that there is no inclined interface, thereby further improving the light emission effect of the organic light-emitting display device 10.

[0066] In summary, the above embodiments are described by taking the encapsulation structure as a single structure as an example. By setting the encapsulation structure as a single structure and adjusting the thickness of the encapsulation structures at different positions, it is ensured that the flatness of the upper surfaces of the encapsulation structures at different positions is good, the area of the inclined interface in the upper surface of the encapsulation structure is small or there is no inclined interface, and the large-angle light deflection of the light emitted from the pixel unit at the inclined interface is reduced or eliminated, thereby ensuring the light emission efficiency in the front view angle of the pixel unit.

[0067] It should be noted that the encapsulation structure being a single structure can be understood as that the encapsulation structure only includes the first encapsulation layer, and it is not limited to the encapsulation structure being a single film layer. The first encapsulation layer can include multiple film layers, such as multiple film layers including an inorganic layer - an organic layer - an inorganic layer, etc. The following embodiments describe the encapsulation structure as a multi-structure.

[0068] Continue to refer to Figure 2 、 Figures 5 to 7As shown, the encapsulation structure 400 includes a second encapsulation layer 400b and a filling layer 400c, and the filling layer 400c is located on the side of the second encapsulation layer 400b away from the substrate 100; the first encapsulation unit 410 includes a third encapsulation part 412 in the second encapsulation layer 400b and a first filling part 413 in the filling layer 400c; the second encapsulation unit 420 includes a fourth encapsulation part 422 in the second encapsulation layer 400b and a second filling part 423 in the filling layer 400c; along the thickness direction of the substrate 100, the distance between the upper surface of the first filling part 413 and the substrate 100 is h1, and the distance between the upper surface of the second filling part 423 and the substrate 100 is h2; along the thickness direction of the substrate 100, the distance from the upper surface of the third encapsulation part 412 to the upper surface of the pixel unit 200 is h3, and the distance from the upper surface of the fourth encapsulation part 422 to the upper surface of the partition unit 300 is h4, where |h3 - h4| / h4 < 10%; the distance s5 between the upper surface of the first filling part 413 and the upper surface of the third encapsulation part 412 is greater than the distance s6 between the upper surface of the second filling part 423 and the upper surface of the fourth encapsulation part 422.

[0069] Among them, referring to Figures 5 to 7 As shown, the encapsulation structure 400 includes a second encapsulation layer 400b and a filling layer 400c, and the filling layer 400c is located on the side of the second encapsulation layer 400b away from the substrate 100. The first encapsulation unit 410 includes a third encapsulation part 412 and a first filling part 413, and the second encapsulation unit 420 includes a fourth encapsulation part 422 and a second filling part 423. Among them, the third encapsulation part 412 and the fourth encapsulation part 422 are both the second encapsulation layer 400b, and the first filling part 413 and the second filling part 423 are both the filling layer 400c. It can be understood that the third encapsulation part 412 and the fourth encapsulation part 422 are of the same material and are prepared integrally; the first filling part 413 and the second filling part 423 are of the same material and are prepared integrally. The third encapsulation part 412, the first filling part 413, the fourth encapsulation part 422, and the second filling part 423 are all made of transparent materials and will not affect the transmission of light. Among them, the third encapsulation part 412 can protect the structure of the pixel unit 200, and the fourth encapsulation part 422 can protect the partition unit 300; the first filling part 413 and the second filling part 423 are used to flatten the upper surface of the encapsulation structure 400, thereby shortening or eliminating the inclined interface that the encapsulation structure 400 may generate. Therefore, the light transmitted to this inclined interface is reduced, and the light that undergoes large-angle light emission deflection is reduced, so that it can be ensured that more light emitted by the pixel unit 200 is emitted at a positive angle, thereby ensuring the overall light emission effect of the organic light-emitting display device 10.

[0070] Among them, referring to Figures 5 to 7As shown, along the thickness direction of the substrate 100, the distance from the upper surface of the third encapsulation section 412 to the upper surface of the pixel unit 200 is h3, and the distance from the upper surface of the fourth encapsulation section 422 to the upper surface of the partition unit 300 is h4, where |h3 - h4| / h4 < 10%. The formula |h3 - h4| / h4 < 10% can be understood as: |h3 - h4| / h4 can be equal to 0, 5%, 7%, or 9%, etc., thereby reflecting that the values of h3 and h4 are close, that is, the thicknesses of the third encapsulation section 412 and the fourth encapsulation section 422 are close or the same, ensuring that the second encapsulation layer 400b has a similar protection degree for the pixel unit 200 and the partition unit 300.

[0071] Furthermore, since the distance between the upper surface of the pixel unit 200 and the substrate is less than the distance between the upper surface of the partition unit 300 and the substrate 100, and the thicknesses of the third encapsulation section 412 and the fourth encapsulation section 422 are close or the same, the distance between the surface of the third encapsulation section 412 away from the substrate 100 and the substrate 100 is less than the distance between the surface of the fourth encapsulation section 422 away from the substrate 100 and the substrate 100. By adjusting the distance s5 from the upper surface of the first filling section 413 to the upper surface of the third encapsulation section 412 to be greater than the distance s6 from the upper surface of the second filling section 423 to the upper surface of the fourth encapsulation section 422, that is, by adjusting the difference between the height of the first filling section 413 itself and the height of the second filling section 423 itself, the originally existing large height difference can be balanced, so as to effectively make the surface of the encapsulation structure 400 away from the substrate 100 have a similar or the same height in the light-emitting area and the non-light-emitting area, thereby shortening or eliminating the inclined interface existing between the encapsulation structure 400 and the film layer above it, reducing or eliminating the outgoing light of the pixel unit 200 from emitting at the inclined interface, and thus ensuring the forward-view light emission of the pixel unit 200. In the embodiment of the present invention, on the basis of the second encapsulation layer 400b, a filling layer 400c is added to ensure that the distance between the upper surface of the encapsulation structure 400 and the substrate 100 in the light-emitting area is the same or similar to the distance between the upper surface of the encapsulation structure 400 and the substrate 100 in the non-light-emitting area, thereby ensuring the light-emitting effect of the organic light-emitting display device 10.

[0072] Continue to refer to Figure 2 、 Figures 5 to 7 As shown, the refractive index of the second encapsulation layer 400b is n1; the refractive index of the filling layer 400c is n2; where |n1 - n2| ≤ 0.1.

[0073] Among them, the second encapsulation layer 400b and the filling layer 400c are adjusted to have the same or similar refractive indices. That is, the first filling part 413 is prepared with a material having the same or similar refractive index as that of the third encapsulation part 412, and the second filling part 423 is prepared with a material having the same or similar refractive index as that of the fourth encapsulation part 422. Thus, the refractive indices of the third encapsulation part 412, the fourth encapsulation part 422, the first filling part 413, and the second filling part 423 are all the same or similar.

[0074] Furthermore, the thicknesses of the third encapsulation part 412 and the fourth encapsulation part 422 are similar or the same. Thus, as shown in Figures 5 to 7 Due to the height difference between the pixel unit 200 and the partition unit 300 at the adjacent position of the third encapsulation part 412 and the fourth encapsulation part 422, there will be an inclined interface between the upper and lower film layers, namely the second encapsulation layer 400b and the filling layer 400c, in the light-emitting area and the non-light-emitting area. When the refractive indices of the film layer structures on both sides of the inclined interface are the same or similar, that is, when the refractive indices of the second encapsulation layer 400b and the filling layer 400c are the same or similar, the light emitted from the pixel unit 200 will not be greatly deflected from the original light-emitting direction when transmitted to the inclined interface due to a large refractive index difference. That is, when the refractive indices of the second encapsulation layer 400b and the filling layer 400c are the same or similar, the inclined interface will not have a great influence on the transmission direction of the incident light thereon, and the light of the pixel unit 200 can still ensure the light-emitting effect at the front viewing angle, thereby ensuring the overall light-emitting effect of the organic light-emitting display device 10.

[0075] Optionally, continuing to refer to Figure 2 、 Figure 5 and Figure 6 As shown, the filling layer 400c includes a planarization layer.

[0076] Specifically, referring to Figure 2 、 Figure 5 and Figure 6 As shown, the film layer structure for leveling the thickness of the third encapsulation part 412 and the fourth encapsulation part 422 can be a planarization layer, that is, the filling layer 400c is a planarization layer. Specifically, the first filling part 413 includes a first planarization part 413a, that is, the first planarization part 413a is located on the side of the third encapsulation part 412 away from the substrate 100; the second filling part 423 includes a second planarization part 423a, that is, the second planarization part 423a is located on the side of the third encapsulation part 422 away from the substrate 100.

[0077] Further, by using the planarization layer as the filling layer, while ensuring that its refractive index is the same as or close to that of the second encapsulation layer, the planarization layer can ensure the overall flatness of the encapsulation structure based on its good leveling effect, and at the same time ensure that the light does not deviate from the normal viewing angle light-emitting direction, so as to ensure the light-emitting effect of the organic light-emitting display device 10.

[0078] Optionally, continue to refer to Figure 2 、 Figure 5 and Figure 6 As shown, the filling layer 400c includes a first optical adhesive layer.

[0079] Specifically, referring to Figure 2 、 Figure 5 and Figure 6 As shown, the film layer structure for leveling the third encapsulation part 412 and the fourth encapsulation part 422 in thickness can be the first optical adhesive layer. Specifically, the first filling part 413 includes a first optical adhesive sub-part 413b, that is, the first optical adhesive sub-part 413b is located on the side of the third encapsulation part 412 away from the substrate 100; the second filling part 423 includes a second optical adhesive sub-part 423b, that is, the second optical adhesive sub-part 423b is located on the side of the third encapsulation part 422 away from the substrate 100. In the organic light-emitting display device 10, an optical adhesive layer is originally provided to ensure the tight fitting of the cover plate 500. In this embodiment, the originally provided optical adhesive layer is provided in the encapsulation structure 400, while ensuring the flatness of the upper surface of the encapsulation structure 400, it can also reduce the preparation cost of the film layer. Further, adjust the refractive index of the first optical adhesive sub-part 413b to be the same as or close to that of the third encapsulation part 412, and at the same time adjust the refractive index of the second optical adhesive sub-part 423b to be the same as or close to that of the fourth encapsulation part 422. In this way, the inclined interface formed between the first optical adhesive layer and the second encapsulation layer 400b will not affect the transmission of light, that is, when the refractive index of the second encapsulation layer 400b and the first optical adhesive layer is similar, the light emitted from the pixel unit 200 will not be greatly deflected from the original light-emitting direction due to a large refractive index difference when transmitted to this inclined interface, and this inclined interface will not have a great influence on the transmission direction of the incident light thereon. The light of the pixel unit 200 can still ensure the light-emitting effect at the normal viewing angle, thus ensuring the overall light-emitting effect of the organic light-emitting display device 10. In this way, when the light is transmitted between the second encapsulation layer 400b and the first optical adhesive layer, the transmission direction will not be greatly deflected due to the refractive index difference, ensuring that the light can be emitted at the normal viewing angle to ensure the light-emitting brightness at the normal viewing angle.

[0080] Continue to refer to Figures 2 to 6As shown, the organic light-emitting display device 10 further includes a second optical adhesive layer 600; the second optical adhesive layer 600 is located on the side of the encapsulation structure 400 away from the substrate 100, and the refractive index of the second optical adhesive layer 600 is less than that of the encapsulation structure 400.

[0081] Among them, the organic light-emitting display device 10 further includes a second optical adhesive layer 600. Through the second optical adhesive layer 600, the stable existence relationship between the cover plate 500 and the encapsulation structure 400 can be ensured, thereby ensuring the structural stability of the organic light-emitting display device 10. At the same time, the second optical adhesive layer 600 is generally made of a transparent material and will not interfere with the light emitted by the pixel unit 200.

[0082] Figure 9 For Figure 2 Another schematic cross-sectional structure diagram along the A-A' direction, continue to refer to Figure 2 、 Figure 8 and Figure 9 As shown, the pixel unit 200 includes an anode layer 200a, an organic light-emitting layer 200b, and a cathode layer 200c; the anode layer 200a is located on the side of the organic light-emitting layer 200b close to the substrate 100, and the cathode layer 200c is located on the side of the organic light-emitting layer 200b away from the substrate 100; the organic light-emitting layer 200b includes a light-emitting material layer 200d that emits multiple colors of light. In the first direction X and / or the second direction Y, the light-emitting colors of the organic light-emitting layers 200b in adjacent pixel units 200 are different; the first direction X and the second direction Y intersect and are both parallel to the plane where the substrate 100 is located.

[0083] Specifically, referring to Figure 8 As shown, the pixel unit 200 may include an anode layer 200a, an organic light-emitting layer 200b, and a cathode layer 200c; the positional relationship of the anode layer 200a, the organic light-emitting layer 200b, and the cathode layer 200c is as follows: the anode layer 200a is located on the side of the organic light-emitting layer 200b close to the substrate 100, and the cathode layer 200c is located on the side of the organic light-emitting layer 200b away from the substrate 100; it can also be understood that the organic light-emitting layer 200b is located between the anode layer 200a and the cathode layer 200c, and the anode layer 200a is located on the side of the organic light-emitting layer 200b close to the substrate 100. Among them, the anode layer 200a serves as an electrode of the pixel and can inject carriers (such as holes) into the pixel under the drive of the positive voltage of the external power supply. The cathode layer 200c is used to provide electrons to the organic light-emitting layer 200b. When electrons and holes are respectively injected into the organic light-emitting layer 200b from the cathode layer 200c and the anode layer 200a, the electrons and holes recombine in the organic light-emitting layer 200b to release energy and emit light. The material of the light-emitting material layer 200d in the organic light-emitting layer 200b can determine the light-emitting color of the organic light-emitting layer 200b.

[0084] Further, referring to Figure 8 As shown in Figure 8 , the organic light-emitting layer 200b includes a first charge carrier adjustment layer 200b1, a light-emitting material layer 200d, and a second charge carrier adjustment layer 200b2 that are sequentially stacked. Among them, the first charge carrier adjustment layer 200b1 is located between the anode layer 200a and the light-emitting material layer 200d, and the first charge carrier adjustment layer 200b1 may include at least one of a hole injection layer HIL, a hole transport layer HTL, and an electron blocking layer EBL. As Figure 8 shown in Figure 8 , the hole injection layer HIL is located on the anode layer 200a, and is used to reduce the energy barrier for injecting holes from the anode layer 200a into the organic light-emitting layer 200b, so that holes can be more effectively transferred from the anode layer 200a to the hole transport layer HTL, improving the hole injection efficiency, and thus improving the light-emitting efficiency and brightness of the pixel. The hole transport layer HTL is located on the hole injection layer HIL, and is used to effectively transport the holes injected from the anode layer 200a to the light-emitting material layer 200d, ensuring the effective recombination of holes and electrons in the light-emitting material layer 200d to generate photons. The electron blocking layer EBL is located on the hole transport layer HTL, and is used to prevent electrons from diffusing disorderly from the electron transport layer ETL to the light-emitting material layer 200d, thereby ensuring the recombination of electrons and holes in the light-emitting material layer 200d, reducing the recombination of electrons and holes in the non-light-emitting region, and further improving the overall efficiency and lifespan of the device. Continuing to refer to Figure 8 , the second charge carrier adjustment layer 200b2 is located between the cathode layer 200c and the light-emitting material layer 200d, and the second charge carrier adjustment layer 200b2 may include at least one of a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL. Among them, as Figure 8 shown in Figure 8 , the hole blocking layer HBL is located on the light-emitting material layer 200d, and is used to prevent holes from entering the electron transport layer ETL from the anode layer 200a side, thereby reducing the ineffective recombination of holes and electrons in the non-light-emitting region and improving the overall light-emitting efficiency of the pixel. The electron transport layer ETL is located on the hole blocking layer HBL, and is used to effectively transport electrons from the cathode layer 200c to the light-emitting material layer 200d, so as to ensure that electrons can be quickly and effectively transported to the light-emitting material layer 200d and recombine with holes to emit photons. The electron injection layer EIL is located on the electron transport layer ETL, and is used to reduce the energy barrier for injecting electrons from the cathode layer 200c into the light-emitting material layer 200d, improving the electron injection efficiency. The electron injection layer EIL can take into account the good interface contact and energy level matching with the cathode layer 200c and the electron transport layer ETL, ensuring that electrons can be easily injected into the light-emitting material layer 200d to participate in the light-emitting process. In other embodiments, the first charge carrier adjustment layer 200b1 and the second charge carrier adjustment layer 200b2 are not limited to the above structures, and the embodiments of the present utility model do not make specific limitations thereon.

[0085] Further, the organic light-emitting material layers 200d in the pixel units 200 that display different colors have different colors. Refer to Figure 2 As shown, in the first direction X and / or the second direction Y, that is, in the row or column direction, the emission colors of the organic light-emitting layers 200b in adjacent pixel units 200 are different, thereby achieving the color display effect of the organic light-emitting display device 10. Specifically, refer to Figure 8 As shown, in two adjacent pixel units 200, which are shown as pixel unit 210 and pixel unit 220 in the figure, the colors of the organic light-emitting material layers 200d are different. The specific colors of the organic light-emitting material layers 200d can be red, blue, green, etc., and the embodiments of the present invention do not specifically limit this.

[0086] Continue to refer to Figure 3 As shown, the partition unit 300 includes a pixel definition layer 310, a cathode connection layer 320, and a partition layer 330; the pixel definition layer 310 is located on the side of the cathode connection layer 320 close to the substrate 100, and the partition layer 330 is located on the side of the cathode connection layer 320 far from the substrate 100; the cathode connection layer 320 is electrically connected to the cathode layer 200c.

[0087] Specifically, refer to Figure 3 As shown, the partition unit 300 includes a pixel definition layer 310, and the pixel definition layer 310 has a relatively high resistivity, so as to ensure insulation between adjacent anode layers 200a, thereby ensuring the normal display effect of the pixel unit 200.

[0088] Further, the partition unit 300 further includes a partition layer 330. Through the partition layer 330, the height of the entire partition unit 300 can be increased, which is beneficial to disconnect the cathode layer 200c and the organic light-emitting layer 200b prepared on the whole surface, thereby ensuring the light-emitting effect of the pixel unit 200.

[0089] Optionally, the partition layer 330 includes one or more of a trapezoid, a frustum of a cone, or a rectangle.

[0090] Further, the cross-sectional shape of the partition layer 330 can be a trapezoid as shown in Figures 3 to 7 As shown, and the overall shape of the partition layer 330 can be one or more of a trapezoid, a frustum of a cone, or a rectangle, reflecting the diversity of the setting of the partition layer 330.

[0091] Further, the partition unit 300 further includes a cathode connection layer 320. Since the cathode layer 200c prepared as a whole is disconnected at the partition unit 300, the cathode layers 200c in adjacent pixel units 200 can be electrically connected through the cathode connection layer 320. The relative positional relationship among the pixel definition layer 310, the cathode connection layer 320, and the partition layer 330 is as follows: the pixel definition layer 310 is located on the side of the cathode connection layer 320 close to the substrate 100, and the partition layer 330 is located on the side of the cathode connection layer 320 away from the substrate 100. Specifically, the cathode connection layer 320 is a conductor, and the cathode layers 200c in each pixel unit 200 can be electrically connected via the cathode connection layer 320, so that the cathode layer 200c can be connected to the power supply line of the cathode outside the display area, realizing the power supply of the cathode layer 200c in all pixel units 200, which helps to simplify the wiring structure and reduce costs.

[0092] Optionally, an organic light-emitting layer 200b and a cathode layer 200c are further included on the side of the partition unit 300 away from the substrate 100.

[0093] Specifically, referring to Figure 3 As shown, an organic light-emitting layer 200b and a cathode layer 200c are further included on the side of the partition unit 300 away from the substrate 100.

[0094] Referring to Figure 9 , it further includes a cathode connection layer, and the cathode connection layer is used to electrically connect adjacent cathode layers to each other. The material of the cathode connection layer 320 includes one or more of Mo, Au, TiN, and ITO.

[0095] Optionally, the material of the cathode connection layer 320 includes one or more of molybdenum (Mo), gold (Au), titanium nitride (TiN), and indium tin oxide (ITO).

[0096] Among them, Mo and Au have good electrical conductivity. Using Mo and Au for the cathode connection layer 320 helps to reduce ohmic loss and suppress the reduction of the potential on the cathode layer. At the same time, Mo and Au have good stability. Using Mo and Au for the cathode connection layer 320 helps to ensure that the cathode connection layer 320 will not be damaged by subsequent wet etching processes, and can prevent the cathode connection layer 320 from being oxidized in subsequent processes, ensuring that the cathode connection layer 320 can still maintain good morphology and electrical properties in the subsequent process environment.

[0097] In other embodiments, the cathode connection layer 320 can also use other single-element metal materials to achieve good electrical conductivity and stability, and the embodiments of the present invention do not make specific limitations on this.

[0098] In addition, the material of the cathode connection layer 320 may also include conductive materials such as ITO or TiN, but is not limited thereto. Among them, ITO has high transparency (especially in the visible light range) and good conductivity; TiN has good conductivity and good chemical stability, which can meet the requirements of high conductivity and corrosion resistance. The use of ITO or TiN for the cathode connection layer 320 helps to ensure that the cathode connection layer 320 will not be damaged by subsequent wet etching processes, and at the same time can prevent the cathode connection layer 320 from being oxidized in subsequent processes, ensuring that the cathode connection layer 320 can still maintain good morphology and electrical properties in the subsequent process environment.

[0099] The organic light-emitting display device 10 is a silicon-based micro-organic light-emitting display device.

[0100] Among them, the silicon-based micro-organic light-emitting display device (Silicon-based Micro-OLED Display) combines silicon-based integrated circuit (CMOS) technology and organic light-emitting diode (OLED) technology, directly integrating the OLED pixel array onto a silicon wafer to form a micro-display. The silicon-based micro-organic light-emitting display device has the characteristics of small size, light weight, low power consumption, high brightness, fast response speed, and wide viewing angle, and is suitable for applications in near-eye display devices, such as virtual reality (VR), augmented reality (AR) head-mounted devices, head-up display (HUD) systems, micro-projectors, and other portable electronic products with strict requirements for volume, weight, and energy consumption.

[0101] It should be understood that various forms of the processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in the present invention can be executed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved, and no limitations are imposed herein.

[0102] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims

1. An organic light emitting display device, characterized in that: include: substrate; A pixel unit and a partition unit, wherein the pixel unit and the partition unit are located on the substrate, and the partition unit is arranged between two adjacent pixel units; A packaging structure, wherein the packaging structure covers the pixel unit and the partition unit; A cover plate, the cover plate being located on the packaging structure; The distance between the upper surface of the pixel unit and the cover plate is greater than the distance between the upper surface of the partition unit and the cover plate; The packaging structure comprises a first packaging unit and a second packaging unit, wherein the first packaging unit is located above the pixel unit, and the second packaging unit is located above the partition unit; Wherein, along the thickness direction of the substrate, the distance between the upper surface of the first packaging unit and the substrate is h1, and the distance between the upper surface of the second packaging unit and the substrate is h2; Among them, |h1-h2| / h2<10%.

2. The organic light emitting display device according to claim 1, characterized in that: The packaging structure includes a first packaging layer; The first encapsulation unit includes a first encapsulation subsection in the first encapsulation layer, and the second encapsulation unit includes a second encapsulation subsection in the first encapsulation layer; Along the thickness direction of the substrate, the distance between the upper surface of the first packaging section and the substrate is h1, and the distance between the upper surface of the second packaging section and the substrate is h2; The distance from the upper surface of the first packaging section to the upper surface of the pixel unit is greater than the distance from the upper surface of the second packaging section to the upper surface of the partition unit.

3. The organic light emitting display device according to claim 1, wherein: The packaging structure comprises a second packaging layer and a filling layer, wherein the filling layer is located on a side of the second packaging layer away from the substrate; The first encapsulation unit includes a third encapsulation subsection in the second encapsulation layer and a first filling subsection in the filling layer; the second encapsulation unit includes a fourth encapsulation subsection in the second encapsulation layer and a second filling subsection in the filling layer; Along the thickness direction of the substrate, the distance between the upper surface of the first filling section and the substrate is h1, and the distance between the upper surface of the second filling section and the substrate is h2; Along the thickness direction of the substrate, the distance between the upper surface of the third packaging section and the upper surface of the pixel unit is h3, and the distance between the upper surface of the fourth packaging section and the upper surface of the partition unit is h4, wherein |h3-h4| / h4<10%; A distance from an upper surface of the first filling section to an upper surface of the third packaging section is greater than a distance from an upper surface of the second filling section to an upper surface of the fourth packaging section.

4. The organic light emitting display device according to claim 3, characterized in that: The refractive index of the second encapsulation layer is n1, and the refractive index of the filling layer is n2; Among them, |n1-n2|≤0.

1.

5. The organic light emitting display device according to claim 3, characterized in that: The filling layer includes a planarization layer.

6. The organic light emitting display device according to claim 3, characterized in that: The filling layer includes a first optical adhesive layer.

7. The organic light emitting display device according to claim 2 or 5, characterized in that: The organic light emitting display device further includes a second optical adhesive layer; The second optical adhesive layer is located at a side of the packaging structure away from the substrate, and the refractive index of the second optical adhesive layer is smaller than the refractive index of the packaging structure.

8. The organic light emitting display device according to claim 1, wherein: The pixel unit comprises an anode layer, an organic light-emitting layer and a cathode layer; the anode layer is located on a side of the organic light-emitting layer close to the substrate, and the cathode layer is located on a side of the organic light-emitting layer away from the substrate; The organic light-emitting layer includes an organic light-emitting material layer that emits light of multiple colors. In the first direction and / or the second direction, the light-emitting colors of the organic light-emitting layers in adjacent pixel units are different; the first direction and the second direction intersect and are both parallel to the plane where the substrate is located.

9. The organic light emitting display device according to claim 8, characterized in that: The partition unit comprises a pixel definition layer, a cathode connection layer and a partition layer; the pixel definition layer is located on a side of the cathode connection layer close to the substrate, and the partition layer is located on a side of the cathode connection layer away from the substrate; The cathode connecting layer is electrically connected to the cathode layer.

10. The organic light emitting display device according to claim 9, characterized in that: The partition layer includes one or more of a trapezoidal shape, a truncated cone shape or a rectangular shape.

11. The organic light emitting display device according to claim 9, characterized in that: The material of the cathode connection layer includes one or more of Mo, Au, TiN and ITO.

12. The organic light emitting display device according to claim 1, wherein: The organic light emitting display device is a silicon-based micro organic light emitting display device.

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