Heat conduction type multi-layer solid wood board
By introducing metal heat conduction strips and thermal conduction holes into the multi-layer solid wood boards, and using clamping connections between bumps and grooves, the existing solid wood boards have been solved, and the existing solid wood board products are achieved with high efficiency and environmentally friendly.
Patent Information
- Application Number
- CN202421930444.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-10
- Publication Date
- 2025-06-20
- Estimated Expiration
- 2034-08-10
AI Technical Summary
The existing solid wood boards have poor thermal conductivity, which affects the thermal conductivity of floor heating. In addition, the glue will emit odors and toxic substances when conducting heat, affecting the safety of use.
Design a thermally conductive multi-layer solid wood board, by setting metal heat conduction strips and thermal conduction holes on the base plate, and connecting the panel and the bottom plate by clamping the bumps and grooves, avoiding the use of glue.
It improves the thermal conductivity of solid wood boards, achieves the purpose of low-temperature heating and rapid indoor heating, and avoids the release of odors and toxic substances when the glue is heated, and improves environmental protection.
Smart Images

Figure CN222997589U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat-conducting multi-layer solid wood board, belonging to the technical field of solid wood boards. Background Technique
[0002] Natural materials, especially wood, have always been the main materials for furniture from ancient times to the present and have always been loved and cherished by people; today when people's aesthetic consciousness tends to be nostalgic, natural solid wood materials are even more favored by people; solid wood furniture made of solid wood occupies an important position in the high-end furniture field with high requirements for beauty.
[0003] The utility model with the patent number 202321867850.2 provides a multi-layer solid wood board that prevents cracking. This utility model pre-treats the edge sealing of the multi-layer solid wood board before painting the multi-layer solid wood board, forms a sealing strip on the side and cross-section of the multi-layer solid wood board, and paints the whole periphery of the sealing strip and the multi-layer solid wood board, thereby avoiding the cracking of the paint surface on the side and cross-section of the multi-layer solid wood board, simplifying the production process, saving manufacturing costs and improving production efficiency at the same time; however, the existing solid wood boards have poor heat conduction effect. When the solid wood board is used as the floor for floor heating, it will affect the heat conduction effect of the floor heating, and the existing solid wood boards are all bonded with glue. When conducting heat, the glue will also emit odors and toxic substances due to heat, affecting the use safety of the solid wood board. Content of the Utility Model
[0004] Aiming at the problems in the related technologies, the utility model proposes a heat-conducting multi-layer solid wood board to overcome the above-mentioned technical problems existing in the existing related technologies.
[0005] For this reason, the specific technical solution adopted by the utility model is as follows:
[0006] A heat-conducting multi-layer solid wood board includes a base board. A panel is fixedly arranged on the top of the base board, and a bottom board is fixedly arranged on the bottom of the base board. Protrusions are evenly and fixedly arranged on the upper and lower surfaces of the base board. Grooves are evenly formed at positions corresponding to the protrusions on the bottom of the panel, the top of the bottom board. The protrusions are all embedded in the grooves. Heat-conducting holes are evenly formed in the inner cavity of the base board. Metal heat-conducting strips are fixedly arranged in the inner cavities of the heat-conducting holes. A reinforcing rod is horizontally arranged in the inner cavity of the base board. Connecting convex plates and connecting concave plates are respectively arranged at the edges of the base board.
[0007] Preferably, an anti-slip layer is coated on the surface of the panel. Heat-conducting silica gels are arranged between the panel, the bottom board and the base board. Reinforcing ribs are arranged in both the panel and the bottom board. Through holes are evenly formed in the bottom board at positions opposite to the metal heat-conducting strips.
[0008] Preferably, the cross-sections of the bumps and grooves are both trapezoidal. Heat-conducting sheets are fixedly provided at both the upper and lower ends of the metal heat-conducting strip, and the heat-conducting sheets are fixedly arranged on the surface of the bumps.
[0009] Preferably, the heat-conducting sheets at the bottom of the metal heat-conducting strip are symmetrically arranged. Positioning holes are evenly formed in the middle of the metal heat-conducting strip, and limiting holes are formed at positions corresponding to the positioning holes in the inner cavity of the base plate.
[0010] Preferably, the positioning holes and the limiting holes are both perpendicular to the metal heat-conducting strip and the heat-conducting holes, and the reinforcing rods are arranged in the positioning holes and the limiting holes.
[0011] Preferably, positioning grooves are formed at both ends of the base plate, the panel and the bottom plate, and the positions of the positioning grooves correspond to each other. Positioning blocks are embedded in the positioning grooves, and the cross-sections of the positioning grooves and the positioning blocks are both trapezoidal.
[0012] Preferably, the connecting convex plates are fixedly arranged on the right side and the bottom of the base plate, the connecting concave plates are arranged on the left side and the top of the base plate, and the connecting convex plates are located above the connecting concave plates.
[0013] Preferably, connecting holes are evenly formed at the top of the connecting concave plates. Connecting convex rods are fixedly provided at positions corresponding to the bottom of the connecting convex plates, and the connecting convex rods are inserted into the connecting holes, and rubber sealing strips are arranged at the joints.
[0014] The beneficial effects of the present utility model are as follows:
[0015] 1. By arranging the bumps, when in use, the panel and the bottom plate of the solid wood board are connected by the clamping method of the grooves and the bumps. The whole solid wood board does not need to be bonded with glue. When the solid wood board conducts heat, it can effectively avoid the emission of peculiar smell and toxic substances due to the heating of the glue, and improve the environmental protection of the solid wood board.
[0016] 2. By arranging the metal heat-conducting strip, during the use process, the heat at the bottom of the solid wood board can be transferred to the panel through the metal heat-conducting strip, effectively improving the heat-conducting efficiency of the solid wood board, and achieving the purpose of low-temperature heating and rapid indoor temperature rise, and improving its practicability.
[0017] 3. By arranging the connecting convex plates, when assembling the solid wood boards, the connecting convex plates on the adjacent solid wood boards can be buckled on the connecting concave plates, which is more convenient for the splicing and installation of the solid wood boards, avoiding the sliding of the solid wood boards during use, and ensuring the overall stability of the solid wood boards. Description of the Drawings
[0018] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the specific embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model.
[0019] Figure 1 It is a schematic diagram of the overall structure of a heat-conducting multi-layer solid wood board of the present utility model;
[0020] Figure 2 It is a schematic diagram of the split structure of the board of a heat-conducting multi-layer solid wood board of the present utility model;
[0021] Figure 3 It is a schematic diagram of the structure at the heat-conducting holes of a heat-conducting multi-layer solid wood board of the present utility model;
[0022] Figure 4 It is a schematic diagram of the connecting convex plate structure of a heat-conducting multi-layer solid wood board of the present utility model;
[0023] Reference numerals in the figure: 1, base board; 2, face board; 3, bottom board; 4, convex block; 5, groove; 6, heat-conducting hole; 7, metal heat-conducting strip; 8, reinforcing rod; 9, connecting convex plate; 10, connecting concave plate; 11, heat-conducting sheet; 12, positioning hole; 13, limiting hole; 14, positioning groove; 15, positioning block; 16, connecting hole; 17, connecting convex rod; 18, through hole. Specific embodiments
[0024] To further illustrate the embodiments, the present utility model provides accompanying drawings. These accompanying drawings are a part of the disclosure of the present utility model. They are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those of ordinary skill in the art should be able to understand other possible implementation manners and the advantages of the present utility model. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.
[0025] According to an embodiment of the present utility model, a heat-conducting multi-layer solid wood board is provided.
[0026] Embodiment 1
[0027] Such as Figures 1-4As shown in the figure, a heat-conducting multi-layer solid wood board according to an embodiment of the present utility model includes a base board 1. A panel 2 is fixedly arranged on the top of the base board 1, and a bottom board 3 is fixedly arranged on the bottom of the base board 1. Protrusions 4 are uniformly and fixedly arranged on the upper and lower surfaces of the base board 1. Grooves 5 are uniformly formed at positions corresponding to the protrusions 4 on the bottom of the panel 2 and the top of the bottom board 3. The protrusions 4 are all embedded in the grooves 5. Heat-conducting holes 6 are uniformly formed in the inner cavity of the base board 1. A metal heat-conducting strip 7 is fixedly arranged in the inner cavity of the heat-conducting hole 6. A reinforcing rod 8 is transversely arranged in the inner cavity of the base board 1. Connecting convex plates 9 and connecting concave plates 10 are respectively arranged at the edges of the base board 1. An anti-slip layer is coated on the surface of the panel 2. Heat-conducting silica gels are arranged between the panel 2, the bottom board 3 and the base board 1. Reinforcing ribs are arranged in both the panel 2 and the bottom board 3. Through holes 18 are uniformly formed in the bottom board 3 at positions corresponding to the metal heat-conducting strips 7. The heat-conducting silica gel ensures that heat can be transferred between the layers of the board, and the through holes 18 contribute to the diffusion of heat from the bottom to the inside of the solid wood board. Positioning grooves 14 are formed at both ends of the base board 1, the panel 2 and the bottom board 3, and the positions of the positioning grooves 14 correspond to each other. Positioning blocks 15 are embedded in the positioning grooves 14. The cross-sections of the positioning grooves 14 and the positioning blocks 15 are both trapezoidal. After the panel 2, the bottom board 3 and the base board 1 are connected together, the positioning blocks 15 can be embedded in the positioning grooves 14 to further ensure the firmness of the overall solid wood board and prevent dislocation between the layers.
[0028] Embodiment 2
[0029] As Figures 1-4As shown in the figure, a heat-conducting multi-layer solid wood board according to an embodiment of the present invention includes a base board 1. A panel 2 is fixedly provided on the top of the base board 1, and a bottom board 3 is fixedly provided on the bottom of the base board 1. Convex blocks 4 are evenly and fixedly provided on the upper and lower surfaces of the base board 1. Grooves 5 are evenly opened at positions corresponding to the bottom of the panel 2, the top of the bottom board 3 and the convex blocks 4. The convex blocks 4 are all embedded in the grooves 5. Heat-conducting holes 6 are evenly opened in the inner cavity of the base board 1. A metal heat-conducting strip 7 is fixedly provided in the inner cavity of the heat-conducting hole 6. A reinforcing rod 8 is horizontally arranged in the inner cavity of the base board 1. Connecting convex plates 9 and connecting concave plates 10 are respectively provided at the edges of the base board 1. The cross-sections of the convex blocks 4 and the grooves 5 are both trapezoidal. Heat-conducting sheets 11 are fixedly provided at both the upper and lower ends of the metal heat-conducting strip 7, and the heat-conducting sheets 11 are fixedly arranged on the surfaces of the convex blocks 4, so that the heat-conducting sheets 11 are in contact with the panel 2 and the bottom board 3 respectively, effectively improving the heat-conducting efficiency of the solid wood board. The heat-conducting sheets 11 at the bottom of the metal heat-conducting strip 7 are symmetrically arranged. Positioning holes 12 are evenly opened in the middle of the metal heat-conducting strip 7. Positioning holes 13 are opened at positions corresponding to the positioning holes 12 in the inner cavity of the base board 1, which is convenient for inserting the metal heat-conducting strip 7 into the heat-conducting holes 6 and separating the heat-conducting sheets 11 at the bottom, so that the metal heat-conducting strip 7 can be installed and fixed. The positioning holes 12 and the positioning holes 13 are both perpendicular to the metal heat-conducting strip 7 and the heat-conducting holes 6. The reinforcing rod 8 is arranged in the positioning holes 12 and the positioning holes 13. The reinforcing rod 8 can be inserted into the positioning holes 12 and the positioning holes 13, which can ensure the fixation of the metal heat-conducting strip 7 and also improve the strength of the base board 1, avoiding the deformation of the base board 1 when heated.
[0030] Embodiment III
[0031] As Figures 1-4As shown in the figure, a heat-conducting multi-layer solid wood board according to an embodiment of the present invention includes a base board 1. A panel 2 is fixedly provided on the top of the base board 1, and a bottom board 3 is fixedly provided on the bottom of the base board 1. Convex blocks 4 are evenly and fixedly provided on the upper and lower surfaces of the base board 1. Grooves 5 are evenly formed at positions corresponding to the bottom of the panel 2, the top of the bottom board 3 and the convex blocks 4. The convex blocks 4 are all embedded in the grooves 5. Heat-conducting holes 6 are evenly formed in the inner cavity of the base board 1. A metal heat-conducting strip 7 is fixedly provided in the inner cavity of the heat-conducting hole 6. A reinforcing rod 8 is horizontally arranged in the inner cavity of the base board 1. Connecting convex plates 9 and connecting concave plates 10 are respectively arranged at the edges of the base board 1. The connecting convex plate 9 is fixedly arranged on the right side and the bottom of the base board 1, and the connecting concave plate 10 is arranged on the left side and the top of the base board 1. The connecting convex plate 9 is located above the connecting concave plate 10. Connecting holes 16 are evenly formed at the top of the connecting concave plate 10. Connecting convex rods 17 are fixedly provided at positions corresponding to the bottom of the connecting convex plate 9 and the connecting holes 16, and the connecting convex rods 17 are inserted into the connecting holes 16. And a rubber sealing strip is provided at the connection part. Placing the connecting convex plate 9 on the other connecting concave plate 10 on the adjacent solid wood board and inserting the connecting convex rod 17 into the connecting hole 16 can realize the splicing of the solid wood boards. Moreover, the rubber sealing strip can make the solid wood boards have a certain buffering effect, avoiding the arching caused by the thermal expansion of the solid wood boards.
[0032] In summary, by means of the above technical solutions of the present invention, when assembling the solid wood boards, the connecting convex plate 9 on the adjacent solid wood boards can be buckled on the connecting concave plate 10, which is more convenient for the splicing and installation of the solid wood boards, avoiding the sliding of the solid wood boards during use and ensuring the overall stability of the solid wood boards. During use, the heat at the bottom of the solid wood board can be transferred to the panel 2 through the metal heat-conducting strip 7, effectively improving the heat-conducting efficiency of the solid wood board, achieving the purpose of low-temperature heating and rapid indoor temperature rise, and improving its practicability. At the same time, the panel 2 and the bottom board 3 of the solid wood board are connected by the clamping method of the groove 5 and the convex block 4. The whole solid wood board does not need to be bonded with glue. When the solid wood board conducts heat, it can effectively avoid the emission of odors and toxic substances due to the heating of the glue, improving the environmental protection of the solid wood board.
[0033] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A heat-conductive multi-layer solid wood board, comprising a base board (1), characterized in that: A panel (2) is fixedly provided on the top of the base plate (1), a bottom plate (3) is fixedly provided on the bottom of the base plate (1), protrusions (4) are evenly fixedly provided on the upper and lower surfaces of the base plate (1), grooves (5) are evenly provided at the bottom of the panel (2) and the top of the bottom plate (3) at positions corresponding to the protrusions (4), and the protrusions (4) are all embedded in the grooves (5), and the inner cavity of the base plate (1) is evenly provided with heat conduction holes (6), and the inner cavity of the heat conduction holes (6) is fixedly provided with metal heat conduction strips (7), and the inner cavity of the base plate (1) is transversely provided with reinforcing rods (8), and the edges of the base plate (1) are respectively provided with connecting protrusions (9) and connecting concave plates (10).
2. The heat-conductive multi-layer solid wood board according to claim 1, characterized in that: The surface of the panel (2) is coated with an anti-slip layer, thermal conductive silica gel is provided between the panel (2), the bottom plate (3) and the base plate (1), reinforcing ribs are provided inside the panel (2) and the bottom plate (3), and through holes (18) are evenly opened on the bottom plate (3) at positions opposite to the metal thermal conductive strip (7).
3. The heat-conductive multi-layer solid wood board according to claim 2, characterized in that: The cross-sections of the protrusion (4) and the groove (5) are both trapezoidal, and the upper and lower ends of the metal heat-conducting strip (7) are fixedly provided with heat-conducting sheets (11), and the heat-conducting sheets (11) are fixedly arranged on the surface of the protrusion (4).
4. The heat-conductive multi-layer solid wood board according to claim 3, characterized in that: The heat conducting plates (11) at the bottom of the metal heat conducting strip (7) are symmetrically arranged, positioning holes (12) are evenly arranged in the middle of the metal heat conducting strip (7), and limiting holes (13) are arranged at positions corresponding to the positioning holes (12) in the inner cavity of the base plate (1).
5. The heat-conductive multi-layer solid wood board according to claim 4, characterized in that: The positioning hole (12) and the limiting hole (13) are both arranged perpendicularly to the metal heat conducting strip (7) and the heat conducting hole (6), and the reinforcing rod (8) is arranged in the positioning hole (12) and the limiting hole (13).
6. The heat-conductive multi-layer solid wood board according to claim 5, characterized in that: Both ends of the base plate (1), the panel (2) and the bottom plate (3) are provided with positioning grooves (14), and the positions of the positioning grooves (14) are corresponding. Positioning blocks (15) are embedded in the positioning grooves (14), and the cross-sections of the positioning grooves (14) and the positioning blocks (15) are both trapezoidal.
7. The heat-conductive multi-layer solid wood board according to claim 6, characterized in that: The connecting convex plate (9) is fixedly arranged on the right side and bottom of the base plate (1), the connecting concave plate (10) is arranged on the left side and top of the base plate (1), and the connecting convex plate (9) is located above the connecting concave plate (10).
8. The heat-conductive multi-layer solid wood board according to claim 7, characterized in that: The top of the connecting concave plate (10) is evenly provided with connecting holes (16), the bottom of the connecting convex plate (9) corresponding to the connecting holes (16) is fixed with connecting convex rods (17), the connecting convex rods (17) are inserted into the connecting holes (16), and a rubber sealing strip is provided at the connection.
Citation Information
Patent Citations
Anti-cracking multi-layer solid wood board
CN220734868U