Chip test jig

Abstract

The utility model relates to the technical field of chip testing jigs, and discloses a chip testing jig which comprises a first testing assembly and a second testing assembly, the first testing assembly comprises a first fixing piece and a testing part used for testing a chip, the first fixing piece is provided with an air channel, and the testing part is connected with the first fixing piece; the second test assembly comprises a second fixing piece and an electrode, the second fixing piece is detachably connected with the first fixing piece, the electrode is connected with the second fixing piece and is provided with an adsorption surface and a flow channel penetrating through the adsorption surface, the adsorption surface, the second fixing piece and the first fixing piece are encircled to form a test cavity for accommodating the chip, and the test cavity is communicated with the air channel and the flow channel. When the chip testing jig is used for testing a chip, the problem of high-voltage breakdown electric leakage during chip testing can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing jigs, in particular to a chip testing jig. Background Art

[0002] A chip test fixture is a device used to test semiconductor chips, generally including a test fixture and test equipment: the test fixture is used to fix the chip on the fixture for testing, and the test equipment is used to test the electrical characteristics of the chip.

[0003] Publication No. CN117471134A discloses a chip testing fixture, including a stage and an air compressor; a groove is provided on the loading surface of the stage; a rectangular pore array is provided in the groove, and the pore objects in the pore array correspond one-to-one to the chips to be tested; the air compressor is arranged inside the stage, facing the loading surface, and provides suction pressure to the loading surface. During implementation, a plurality of chips to be tested are arranged in an array, and are placed one-to-one corresponding to the pore objects in the pore array of the groove, and suction pressure is provided by the air compressor so that the chips to be tested are adsorbed in the groove. The test system can perform a unified test on all the chips to be tested in the groove at the same time. After the test is completed, the air compressor is stopped, and the chips to be tested in this batch are taken out, and then replaced with the chips to be tested in the next batch, and the above steps can be repeated.

[0004] In the above chip test fixture, during testing, the chip is adsorbed in the groove, but the side of the chip away from the test fixture is exposed, which may cause high voltage breakdown and leakage between the chip, the stage and the test equipment. Utility Model Content

[0005] The utility model aims to overcome the above technical deficiencies and propose a chip testing jig to solve the technical problem of high voltage breakdown and leakage when the chip is exposed in the prior art test fixture when testing the chip.

[0006] In order to achieve the above technical purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a chip testing jig, comprising:

[0008] A first testing assembly includes a first fixing member and a testing portion for testing a chip, wherein the first fixing member is provided with an air passage, and the testing portion is connected to the first fixing member; and

[0009] The second test component includes a second fixing part and an electrode, wherein the second fixing part is detachably connected to the first fixing part, the electrode is connected to the second fixing part, and an adsorption surface and a flow channel passing through the adsorption surface are provided, the adsorption surface, the second fixing part and the first fixing part together form a test cavity for accommodating the chip, and the test cavity is connected to the air channel and the flow channel.

[0010] In some embodiments, the contact surfaces of the first fixing member and the second fixing member are hermetically connected.

[0011] In some embodiments, the first fixing member includes a first fixing base and a first insulating block. The first insulating block is connected to the first fixing base, and the testing portion is connected to the first fixing base.

[0012] The second fixing member includes a second fixing base and a second insulating block. The second fixing base and the second insulating block are sleeved on the electrode. A through hole is formed in the adsorption surface of the second insulating block relative to the electrode. The adsorption surface, the second insulating block, and the first insulating block enclose to form the testing cavity.

[0013] In some embodiments, two positioning holes are formed in the first insulating block and the first fixing base.

[0014] The second testing component further includes two positioning portions. The two positioning portions are connected to the second fixing base and are respectively arranged opposite to the two positioning holes. The positioning portions can be inserted into the opposite positioning holes.

[0015] In some embodiments, the second fixing member further includes an insulating ring. The insulating ring is arranged on one side of the second fixing base facing the first insulating block. The insulating ring is sleeved on the two positioning portions.

[0016] In some embodiments, an annular sealing groove is formed between the insulating ring and the second insulating block. The sealing groove is arranged around the testing cavity.

[0017] The second fixing member further includes a sealing ring. The sealing ring is embedded in the sealing groove, and when the second insulating block abuts against the first insulating block, the sealing ring fits against the first insulating block.

[0018] In some embodiments, the cross section of the sealing ring is in a herringbone shape.

[0019] In some embodiments, the air duct includes an air inlet channel and an air exhaust channel formed in the first fixing base and the first insulating block. The air inlet channel and the air exhaust channel are communicated through the testing cavity.

[0020] In some embodiments, the second fixing member further includes at least two claws. At least two claws are arranged on both sides of the second fixing base. One end of the claw is connected to the second fixing base, and the other end of the claw can be clamped with the first fixing base.

[0021] In some embodiments, the other ends of at least two of the claws can be opened in directions away from each other, and can be elastically reset and clamp the test part under the action of their own elastic force, so as to be clamped with the first fixing seat through the test part.

[0022] Compared with the prior art, the chip testing jig provided by the utility model sets the chip on the adsorption surface of the electrode when testing the chip, connects the flow channel through the negative pressure exhaust equipment, fixes the chip on the adsorption surface through the negative pressure suction of the negative pressure exhaust equipment, and then connects the second fixing part to the first fixing part. During the connection process, the testing part abuts against the side of the chip away from the adsorption surface to test the chip. During the test, protective gas is injected into the test chamber through the airway, and the chip is isolated from the air by the protective gas, so that the chip is in a relatively sealed and dry environment, which can prevent the chip from being exposed to the air and avoid the problem of high-voltage breakdown and leakage during the high-voltage test of the chip. After the test is completed, the second fixing part is separated from the first fixing part, the chip is taken out, and the next chip is tested according to the above steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of a chip testing jig provided by an embodiment of the utility model when in use;

[0024] Figure 2 This is a schematic diagram of the structure of a chip testing jig provided by an embodiment of the utility model when in use;

[0025] Figure 3 It is a structural schematic diagram of a chip testing jig provided by an embodiment of the utility model when in use.

[0026] Description of reference numerals:

[0027] First test component 1;

[0028] The first fixing member 11;

[0029] First fixing seat 111;

[0030] First insulating block 112;

[0031] Testing section 12;

[0032] PCB board 121;

[0033] Spring probe 122;

[0034] Second test component 2;

[0035] The second fixing member 21;

[0036] Adsorption surface 221;

[0037] The second fixing seat 211;

[0038] The second insulating block 212;

[0039] Insulating ring 213;

[0040] Sealing ring 214;

[0041] Claw 215;

[0042] Electrode 22;

[0043] Positioning part 23;

[0044] Air duct a;

[0045] Intake passage a1;

[0046] Exhaust passage a2;

[0047] Flow channel b;

[0048] Test chamber c. Detailed implementation manner

[0049] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0050] In order to solve the technical problem that the chip is exposed and there is high-voltage breakdown and leakage when the existing test fixture tests the chip, the present utility model provides a chip test fixture that can achieve high-voltage testing of the chip.

[0051] It should be noted that the chip test fixture described in the present utility model is used for but not limited to the testing of chips, etc. For the convenience of description, in the present utility model, only the case where the test fixture is applied to chip testing is taken as an example for description, and the principle of applying the test fixture to other types of devices is essentially the same as that of applying it to the chip test fixture, and will not be elaborated here one by one.

[0052] Please refer to Figure 1 , Figure 1It is a structural schematic diagram of a chip testing jig in an embodiment of the utility model. The chip testing jig includes a chip testing jig, including a first test component 1 and a second test component 2. The first test component 1 includes a first fixing member 11 and a test portion 12 for testing the chip. The first fixing member 11 is provided with an air channel a, and the test portion 12 is connected to the first fixing member 11; the second test component 2 includes a second fixing member 21 and an electrode 22. The second fixing member 21 is detachably connected to the first fixing member 11, the electrode 22 is connected to the second fixing member 21, and is provided with an adsorption surface 221 and a flow channel b passing through the adsorption surface 221. The adsorption surface 221, the second fixing member 21 and the first fixing member 11 are surrounded to form a test cavity c for accommodating the chip, and the test cavity c is connected to the air channel a and the flow channel b.

[0053] When the chip needs to be tested, the chip is set on the adsorption surface 221 of the electrode 22, and the flow channel b is connected through a negative pressure exhaust device. The chip is fixed on the adsorption surface 221 by the negative pressure suction force of the negative pressure exhaust device, and then the second fixing member 21 is connected to the first fixing member 11. During the connection process, the test part 12 abuts against the side of the chip away from the adsorption surface 221 to test the chip. During the test, protective gas is injected into the test chamber c through the airway a. The chip is isolated from the air by the protective gas, so that the chip is in a relatively sealed and dry environment, which can prevent the chip from being exposed to the air and avoid the problem of high-voltage breakdown and leakage during the high-voltage test of the chip. After the test is completed, the second fixing member 21 is separated from the first fixing member 11, the chip is taken out, and the next chip is tested according to the above steps.

[0054] like Figure 2 and Figure 3 As shown, in one embodiment, the contact surfaces of the first fixing member 11 and the second fixing member 21 are sealed and connected.

[0055] By sealing the contact surface of the first fixing member 11 and the second fixing member 21, it is possible to prevent air from flowing through the gap between the first fixing member 11 and the second fixing member 21, so that when the protective gas enters the test chamber c, the air can be discharged through the fixed airway a and flow out from the fixed airway a, which is convenient for recycling the protective gas.

[0056] like Figure 2 As shown, in one of the embodiments, the first fixing member 11 includes a first fixing seat 111 and a first insulating block 112, the first insulating block 112 is connected to the first fixing seat 111, and the testing part 12 is connected to the first fixing seat 111; the second fixing member 21 includes a second fixing seat 211 and a second insulating block 212, the second fixing seat 211 and the second insulating block 212 are sleeved on the electrode 22, and the second insulating block 212 is provided with a through hole on the adsorption surface 221 relative to the electrode 22, and the adsorption surface 221, the second insulating block 212 and the first insulating block 112 are surrounded to form a test cavity c.

[0057] By providing the first fixing base 111, the first insulating block 112, the second fixing base 211 and the second insulating block 212, the above-mentioned test cavity c is formed by enclosing the adsorption surface 221 of the chip with the second insulating block 212 and the first insulating block 112. Moreover, when the chip is being tested in the test cavity c, it is wrapped by the first insulating block 112, the second insulating block 212 and the electrode 22, which can isolate breakdown leakage and avoid high-voltage breakdown leakage when the chip is subjected to high-voltage testing.

[0058] It should be understood that the flow channel b penetrates through the second fixing base 211, enabling a vacuum pumping device such as a vacuum pump to communicate with the flow channel b on the outer wall of the second fixing base 211 to evacuate the air passage, so that the chip is negatively pressure adsorbed on the adsorption surface 221.

[0059] It should be understood that the test cavity c can be formed by enclosing the inner wall of the groove formed by the depression of the first insulating block 112, the outer wall of the first insulating block 112, and the adsorption surface 221. Alternatively, the test cavity c can be formed by enclosing the inner wall of the groove formed by the depression of the second insulating block 212, the outer wall of the first insulating block 112, and the adsorption surface 221. Additionally, the test cavity c can also be formed by enclosing the inner wall of the groove formed on the opposite sides of the first insulating block 112 and the second insulating block 212, the outer wall of the first insulating block 112, and the adsorption surface 221.

[0060] In one embodiment, to further enhance the insulation effect of the chip testing jig, the first fixing base 111 and the second fixing base 211 are made of an insulating material, which can be ceramics, resin, rubber, etc.

[0061] As Figure 2 shown, in one embodiment, the first insulating block 112 and the first fixing base 111 are provided with two positioning holes; the second test assembly 2 further includes two positioning portions 23, which are connected to the second fixing base 211 and are respectively arranged opposite to the two positioning holes, and the positioning portions 23 can be inserted into the corresponding positioning holes.

[0062] By providing two positioning portions 23 and two positioning holes, the detachable connection between the first fixing member 11 and the second fixing member 21 can be positioned.

[0063] It should be understood that the two positioning portions 23 can be two positioning posts, positioning rods, etc. In one embodiment, the two positioning portions 23 are respectively a cylindrical pin and a diamond pin.

[0064] As Figure 2 and Figure 3As shown, in one embodiment, the second fixing member 21 further includes an insulating ring 213. The insulating ring 213 is disposed on the side of the second fixing base 211 facing the first insulating block 112, and the insulating ring 213 is sleeved on the two positioning portions 23.

[0065] By providing the insulating ring 213, the insulating ring 213 can insulate the space between the positioning portion 23 and the first insulating block 112.

[0066] It should be understood that the contact surfaces between the first fixing member 11 and the second fixing member 21 can be sealed by a sealing ring 214, or can be sealed by a plurality of cooperating sealing structures. In one embodiment, an annular sealing groove is formed between the insulating ring 213 and the second insulating block 212, and the sealing groove is arranged around the test chamber c; the second fixing member 21 further includes a sealing ring 214, and the sealing ring 214 is embedded in the sealing groove, and when the second insulating block 212 abuts against the first insulating block 112, the sealing ring 214 fits against the first insulating block 112.

[0067] When testing the chip, the first insulating block 112 and the second insulating block 212 abut against each other. At this time, the sealing ring 214 is disposed in the sealing groove and fits against the first insulating block 112, which can seal the gap between the first insulating block 112 and the second insulating block 212, prevent the protective gas introduced into the test chamber c from flowing out through the gap between the first insulating block 112 and the second insulating block 212, and can prevent external air from entering the test chamber c through this gap, ensuring the dryness and insulation of the test chamber c.

[0068] It should be understood that the sealing ring 214 can be an O-ring, a V-ring, a square ring, etc. In one embodiment, the cross-section of the sealing ring 214 is in a chevron shape.

[0069] By setting the cross-section of the sealing ring 214 to be in a chevron shape, when the first insulating block 112 abuts against the second insulating block 212, the first insulating block 112 squeezes the sealing ring 214, causing the sealing ring 214 to deform towards the first insulating block 112 and the insulating ring 213 respectively, so that the sealing ring 214 can seal the gap between the first insulating block 112, the second insulating block 212 and the insulating ring 213.

[0070] As Figure 2 and Figure 3 shown, in one embodiment, the air passage a includes an air inlet passage a1 and an air exhaust passage a2 formed in the first fixing base and the first insulating block, and the air inlet passage a1 and the air exhaust passage a2 are communicated through the test chamber.

[0071] The first fixing base 111 and the first insulating block 112 jointly form an air inlet passage a1 and an air exhaust passage a2, and the air inlet passage a1 and the air exhaust passage a2 are communicated through the test chamber c.

[0072] By providing separate intake channel a1 and exhaust channel a2, the protective gas enters through intake channel a1, flows into the test chamber c through intake channel a1, and pushes the air out through the outlet channel from the test chamber c, enabling the protective gas to flow along the set path.

[0073] It should be understood that the exhaust channel a2 penetrates through the first fixing base 111 and the first insulating block 112, and the intake channel a1 consists of two segments formed in the first fixing base 111 and the first insulating seat.

[0074] It should be understood that the first fixing member 11 and the second fixing member 21 can be detachably connected by means such as snap fasteners, bolts, and screws. As Figure 2 shown, in one of the embodiments, the second fixing member 21 further includes at least two claw members 215. The at least two claw members 215 are disposed on both sides of the second fixing base 211. One end of the claw member 215 is connected to the second fixing base 211, and the other end of the claw member 215 can be snap-connected to the first fixing base 111.

[0075] When the first insulating block 112 abuts against the second insulating block 212, the other end of the claw member 215 is snap-connected to the first fixing base 111. At this time, the first fixing base 111 and the second fixing base 211 are snap-connected through the claw member 215. When the chip needs to be disassembled, the snap connection between the claw member 215 and the second fixing base 211 is released. At this time, the first fixing base 111 can be separated from the second fixing base 211.

[0076] To achieve the snap connection between the other end of the claw member 215 and the first fixing base 111, for this purpose, as Figure 2 shown, in one of the embodiments, the other ends of the at least two claw members 215 can open in a direction away from each other, and can elastically reset under the action of their own elastic force and clamp the test portion 12 to be snap-connected to the first fixing base 111 through the test portion 12.

[0077] It should be understood that the material of the claw member 215 can be elastic plastics, resins, etc.

[0078] When the chip needs to be tested, the first fixing base 111 and the second fixing base 211 are moved closer to each other. During the approaching process, the first fixing base 111 presses the claw member 215, causing the at least two claw members 215 to bend in a direction away from each other until the triangular snap-connection portion of the claw member 215 slides past the test portion 12. At this time, the claw member 215 resets under the action of its own elastic force and snaps the test portion 12 through the triangular snap-connection portion of the claw member 215 to achieve snap connection with the first fixing base 111 through the snap connection with the test portion 12.

[0079] It should be understood that the test portion 12 can be various test devices for testing the chip, such asFigure 2 As shown, in one of the embodiments, the test unit 12 includes a PCB board 121 and spring probes 122. The PCB board 121 is disposed on a side of the first fixing base 111 away from the second fixing base 211. The PCB board 121 is connected to the first fixing base 111 and can be engaged with a triangular engaging portion of the clamping jaw 215. The spring probes 122 are connected to the PCB board 121. The spring probes 122 pass through the first fixing base 111, the second fixing base 211 and extend into the test chamber c to abut against the chip when testing the chip, for testing the chip.

[0080] By providing the spring probes 122, when the first fixing base 111 and the second fixing base 211 approach each other, the first fixing base 111 drives the spring probes 122 to approach the chip through the PCB board 121. When the spring probes 122 abut against the chip, they can be compressed and contracted. At this time, the spring probes 122 have an elastic force to abut against the chip, so as to achieve a tight fit between the spring probes 122 and the chip, to achieve electrical connection between the PCB board 121 and the chip, and to perform a high-voltage test on the chip through the PCB board 121.

[0081] The specific embodiments of the present invention described above do not constitute a limitation to the protection scope of the present invention. Any other corresponding changes and deformations made according to the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A chip testing jig, characterized in that: include: A first testing assembly includes a first fixing member and a testing portion for testing a chip, wherein the first fixing member is provided with an air passage, and the testing portion is connected to the first fixing member; and The second test component includes a second fixing part and an electrode, wherein the second fixing part is detachably connected to the first fixing part, the electrode is connected to the second fixing part, and an adsorption surface and a flow channel passing through the adsorption surface are provided, the adsorption surface, the second fixing part and the first fixing part together form a test cavity for accommodating the chip, and the test cavity is connected to the air channel and the flow channel.

2. The chip testing jig according to claim 1, characterized in that: The contact surfaces of the first fixing member and the second fixing member are sealed and connected.

3. The chip testing jig according to claim 2, characterized in that: The first fixing member includes a first fixing seat and a first insulating block, the first insulating block is connected to the first fixing seat, and the testing part is connected to the first fixing seat; The second fixing member includes a second fixing seat and a second insulating block, the second fixing seat and the second insulating block are sleeved on the electrode, the second insulating block has a through hole on the adsorption surface relative to the electrode, and the adsorption surface, the second insulating block and the first insulating block together form the test cavity.

4. The chip testing jig according to claim 3, characterized in that: The first insulating block and the first fixing seat are provided with two positioning holes; The second test assembly further includes two positioning parts, which are connected to the second fixing seat and are respectively arranged opposite to two positioning holes, and the positioning parts can be inserted into the opposite positioning holes.

5. The chip testing jig according to claim 4, characterized in that: The second fixing member further includes an insulating ring, which is arranged on a side of the second fixing seat facing the first insulating block, and the insulating ring is sleeved on the two positioning portions.

6. The chip testing jig according to claim 5, characterized in that: An annular sealing groove is formed between the insulating ring and the second insulating block, and the sealing groove is arranged around the test cavity; The second fixing member further includes a sealing ring, which is embedded in the sealing groove, and when the second insulating block abuts against the first insulating block, the sealing ring fits the first insulating block.

7. The chip testing jig according to claim 6, characterized in that: The cross section of the sealing ring is in a herringbone shape.

8. The chip testing jig according to claim 3, characterized in that: The air channel includes an air inlet channel and an air exhaust channel opened in the first fixing seat and the first insulating block, and the air inlet channel and the air exhaust channel are connected through the test cavity.

9. The chip testing jig according to claim 3, characterized in that: The second fixing member further includes at least two claws, which are arranged on both sides of the second fixing seat, one end of the claw is connected to the second fixing seat, and the other end of the claw can be clamped with the first fixing seat.

10. The chip testing jig according to claim 9, characterized in that: The other ends of at least two of the claws can be opened in directions away from each other, and can be elastically reset and clamp the test part under the action of their own elastic force, so as to be clamped with the first fixing seat through the test part.

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