MEMS microphone device

Abstract

The utility model discloses an MEMS microphone device, and relates to the technical field of microphones. Comprising a packaging substrate and a packaging cover, a bonding pad is arranged on the packaging substrate, an MEMS chip, an ASIC chip and an RF suppression circuit are arranged on the bonding pad, the MEMS chip is electrically connected with the ASIC chip through a gold wire, the ASIC chip is electrically connected with the RF suppression circuit through a gold wire, a frame is clamped on the packaging substrate, an annular convex edge is arranged in the middle of the frame, and the packaging cover is arranged on the packaging substrate. And the packaging cover is clamped on the frame through the annular convex edge. According to the MEMS microphone device, the sound hole is formed in the side surface to change the position of the sound hole of the microphone, and the eave edge is arranged at the position of the sound hole to play a role of enclosure, so that sound airflow can be prevented from being directly sprayed to the microphone chip, and the interference of dust on a sensor sound film in the microphone chip can be reduced; the method reduces the occurrence of sensor film damage caused by sound airflow or surface foreign matters in the use process, and is easy to operate and beneficial to use.

Description

Technical Field

[0001] The utility model relates to the technical field of microphones, and particularly to a MEMS microphone device. Background Technique

[0002] With the rapid development of consumer electronics, the microphone industry has also flourished. The ECM microphone generates a change in capacitance by the impact of the air flow generated by sound waves on a thin sheet, causing it to deform, thereby changing the output electrical signal, and thus reflecting the changes in the sound wave frequency and amplitude at the entrance. MEMS microphones are applied in multiple application fields such as consumer electronics, automobiles, security, and intelligent healthcare. Their application proportion in the consumer electronics field reaches 90%. The applications of MEMS microphones in the consumer electronics field are mainly mobile phones, tablets, and computers, among which mobile phones account for up to 85%. MEMS microphones can provide extremely high performance and rich acoustic experiences for almost all applications such as smart phones, wearable Internet of Things devices, and Internet cars.

[0003] Usually in consumer electronic products, MEMS microphones are mounted on the surface of the FPC through SMT technology. Since the sound inlet holes of MEMS microphones are in an open state, the sound air flow will directly spray onto the microphone chip. Under long-term action, the sensor film may rupture or foreign substances may appear on the surface, resulting in the failure of the MIC function. Content of the Utility Model

[0004] The utility model provides a MEMS microphone device to solve the problems in the background technique.

[0005] To achieve the above object, the utility model provides the following technical solution: A MEMS microphone device includes a packaging substrate and a packaging cover. The packaging substrate is provided with pads. The pads are respectively provided with a MEMS chip, an ASIC chip, and an RF suppression circuit. The MEMS chip is electrically connected to the ASIC chip through a gold wire. The ASIC chip is electrically connected to the RF suppression circuit through a gold wire. A frame is clamped on the packaging substrate, and a circular convex edge is provided in the middle of the frame. The packaging cover is clamped on the frame through the circular convex edge. Sound holes are opened on the side surface of the packaging cover. An eaves edge is provided on the side surface of the packaging cover, and the eaves edge is close to the position of the sound holes.

[0006] Further, pins are provided at the bottom of the packaging substrate, and the pins are located around it.

[0007] Further, the pins protrude from the bottom of the packaging substrate, and the bottom of the frame is flush with the bottom of the packaging substrate.

[0008] Further, heat-conducting silicone grease layers are coated on the inner walls of both sides of the frame, and the heat-conducting silicone grease layers are between the frame and the packaging substrate.

[0009] Further, the encapsulation cover is filled with sealant, and the sealant covers the ASIC chip and the RF suppression circuit.

[0010] Further, the sound hole is close to the position of the MEMS chip, and the eaves cover the sound hole.

[0011] Compared with the prior art, the present utility model provides a MEMS microphone device, which has the following beneficial effects:

[0012] For this MEMS microphone device, the sound hole is opened on the side surface to change the position of the sound hole of the microphone, and eaves are provided at the position of the sound hole to play a role in enclosing, which can prevent the sound airflow from directly spraying onto the microphone chip, and can also reduce the interference of dust on the sensor sound film in the microphone chip, and reduce the occurrence of damage to the sensor film caused by sound airflow or surface foreign objects during use. This method is easy to operate and is beneficial for use. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural view of the present utility model;

[0014] Figure 2 is a top view of the present utility model;

[0015] Figure 3 is a bottom view of the present utility model.

[0016] In the figure: 1. Encapsulation substrate; 2. Encapsulation cover; 3. Pad; 4. MEMS chip; 5. ASIC chip; 6. RF suppression circuit; 7. Frame; 8. Annular convex edge; 9. Sound hole; 10. Eaves; 11. Pin; 12. Thermal grease layer; 13. Sealant. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0018] Please refer to Figures 1 - 3, the present utility model discloses a MEMS microphone device, including a packaging substrate 1 and a packaging cover 2. A pad 3 is provided on the packaging substrate 1, and a MEMS chip 4, an ASIC chip 5 and an RF suppression circuit 6 are respectively provided on the pad 3. The MEMS chip 4 is electrically connected to the ASIC chip 5 through a gold wire, and the ASIC chip 5 is electrically connected to the RF suppression circuit 6 through a gold wire. A frame 7 is snap-fitted on the packaging substrate 1, and an annular convex edge 8 is provided in the middle of the frame 7. The packaging cover 2 is snap-fitted on the frame 7 through the annular convex edge 8. A sound hole 9 is opened on the side surface of the packaging cover 2. An eaves edge 10 is provided on the side surface of the packaging cover 2, and the eaves edge 10 is close to the position of the sound hole 9. The sound hole 9 is opened on the side surface to change the position of the sound hole 9 of the microphone, and the eaves edge 10 is provided at the position of the sound hole 9 to play a role of enclosure, which can prevent the sound air flow from directly spraying on the microphone chip, and can also reduce the interference of dust on the sensor sound film in the microphone chip, and reduce the occurrence of damage to the sensor film caused by sound air flow or surface foreign objects during use. This method is simple to operate and is beneficial to use.

[0019] Specifically, pins 11 are provided at the bottom of the packaging substrate 1, and the pins 11 are located around it.

[0020] In this embodiment, the microphone is welded to a circuit board or a flexible circuit through the pins 11.

[0021] Specifically, the pins 11 protrude from the bottom of the packaging substrate 1, and the bottom of the frame 7 is flush with the bottom of the packaging substrate 1.

[0022] In this embodiment, the packaging substrate 1 is assembled in the frame 7, which can play a role of protection and heat dissipation for the packaging substrate 1.

[0023] Specifically, heat-conducting silicone grease layers 12 are coated on the inner walls of both sides of the frame 7, and the heat-conducting silicone grease layers 12 are located between the frame 7 and the packaging substrate 1.

[0024] In this embodiment, the heat-conducting silicone grease layer 12 is a paste made mainly of organosilicon and mixed with various additives through a specific process. It can efficiently conduct the heat of the heat source to the radiator, and can effectively improve the heat dissipation ability and use stability of electronic components.

[0025] Specifically, a sealant 13 is filled in the packaging cover 2, and the sealant 13 covers the ASIC chip 5 and the RF suppression circuit 6.

[0026] In this embodiment, the sealant 13 is an adhesive that can form an elastic seal, which can prevent electronic products from being affected by external factors such as water, dust, and vibration, and protect the circuits and components inside the electronic products.

[0027] Specifically, the sound hole 9 is close to the MEMS chip 4, and the eaves 10 cover the sound hole 9.

[0028] In this embodiment, the sound hole 9 is opened on the side surface to change the position of the sound hole 9 of the microphone, and the eaves 10 are provided at the position of the sound hole 9 to play a role of enclosure, which can prevent the sound airflow from directly spraying onto the microphone chip.

[0029] During use, the sound hole 9 is opened on the side surface to change the position of the sound hole 9 of the microphone, and the eaves 10 are provided at the position of the sound hole 9 to play a role of enclosure, which can prevent the sound airflow from directly spraying onto the microphone chip, and can also reduce the interference of dust on the sensor sound film in the microphone chip, and reduce the occurrence of damage to the sensor film caused by sound airflow or surface foreign objects during use. This method is easy to operate and is beneficial to use.

[0030] In summary, for this MEMS microphone device, the sound hole 9 is opened on the side surface to change the position of the sound hole 9 of the microphone, and the eaves 10 are provided at the position of the sound hole 9 to play a role of enclosure, which can prevent the sound airflow from directly spraying onto the microphone chip, and can also reduce the interference of dust on the sensor sound film in the microphone chip, and reduce the occurrence of damage to the sensor film caused by sound airflow or surface foreign objects during use. This method is easy to operate and is beneficial to use.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A MEMS microphone device, comprising a packaging substrate (1) and a packaging cover (2), characterized in that: The packaging substrate (1) is provided with a pad (3), and a MEMS chip (4), an ASIC chip (5) and an RF suppression circuit (6) are respectively provided on the pad (3); the MEMS chip (4) is electrically connected to the ASIC chip (5) via a gold wire, and the ASIC chip (5) is electrically connected to the RF suppression circuit (6) via a gold wire; a frame (7) is clamped on the packaging substrate (1), and a ring-shaped convex edge (8) is provided in the middle of the frame (7); the packaging cover (2) is clamped on the frame (7) via the ring-shaped convex edge (8); a sound hole (9) is opened on the side of the packaging cover (2); an eave (10) is provided on the side of the packaging cover (2), and the eave (10) is close to the position of the sound hole (9).

2. A MEMS microphone device according to claim 1, characterized in that: The bottom of the packaging substrate (1) is provided with pins (11), and the pins (11) are located around it.

3. A MEMS microphone device according to claim 2, characterized in that: The pins (11) protrude from the bottom of the packaging substrate (1), and the bottom of the frame (7) is flush with the bottom of the packaging substrate (1).

4. The MEMS microphone device according to claim 1, characterized in that: The inner walls on both sides of the frame (7) are coated with a thermally conductive silicone grease layer (12), and the thermally conductive silicone grease layer (12) is located between the frame (7) and the packaging substrate (1).

5. The MEMS microphone device according to claim 1, characterized in that: The packaging cover (2) is filled with a sealant (13), and the sealant (13) covers the ASIC chip (5) and the RF suppression circuit (6).

6. The MEMS microphone device according to claim 1, characterized in that: The sound hole (9) is located close to the MEMS chip (4), and the eaves (10) cover the sound hole (9).

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