Display device including reinforcement layer

Abstract

A display device including a reinforcement layer is provided. The display device includes: an array substrate including a display area, a peripheral area, and a pad area in order in a first direction, the display area including pixels; driving chips on the array substrate, in the pad region, the driving chips being arranged spaced apart from each other along a second direction crossing the first direction; an encapsulation layer on the array substrate and covering the pixels, the encapsulation layer including a base portion overlapping the display area and the peripheral area, and a convex portion protruding from one side of the base portion in the first direction, the convex portion overlapping the pad area; and a cover member covering the driving chip, the cover member contacting the convex portion of the encapsulation layer in the pad region. The display device may have improved durability and may reduce or prevent a tilting phenomenon of the cover member.

Description

Technical Field

[0001] Embodiments relate to a display device. More specifically, embodiments relate to a display device including a reinforcing layer. Background Art

[0002] A display device is an electronic device that displays an image for providing visual information to a user. Among display devices, organic light emitting diode displays have drawn attention.

[0003] In an electronic display device, a plurality of driving chips provide driving signals to a plurality of pixels for displaying an image. Accordingly, each of the plurality of pixels emits light, and the emitted light is used to generate and / or display an image. The plurality of pixels and driving chips may be disposed inside the display device. Summary of the Utility Model

[0004] An object of the present utility model is to provide a display device having improved durability.

[0005] A display device according to an embodiment may include: an array substrate including a display area in which a plurality of pixels are arranged, a peripheral area surrounding the display area, and a pad area adjacent to the peripheral area and spaced apart from one side of the display area in a first direction; a plurality of driving chips disposed on the array substrate in the pad area and arranged in rows along a second direction intersecting the first direction; a encapsulation layer disposed on the array substrate to cover the pixels, including a base portion overlapping the display area and the peripheral area and a convex portion protruding from the base portion toward the pad area and overlapping the pad area; and a covering member covering the driving chips in the pad area and contacting the convex portion of the encapsulation layer.

[0006] In an embodiment, in a plane, the driving chip and the convex portion may be spaced apart from each other.

[0007] In an embodiment, in a plane, the driving chips may all be disposed within a single recess defined by the base portion and the convex portion.

[0008] In an embodiment, in a plane, at least one of the convex portions may be positioned between the driving chips.

[0009] In an embodiment, in a plane, the convex portions and the driving chips may be alternately arranged along the second direction.

[0010] In an embodiment, the convex portion may extend to an end of the array substrate farthest from the display area in the first direction.

[0011] In an embodiment, the covering member may contact the driving chip.

[0012] In an embodiment, the covering member may be spaced apart from the uppermost surface of the array substrate closest to the covering member in the thickness direction of the array substrate.

[0013] In an embodiment, the display device may further include a reinforcing member disposed in a recess defined by a base portion and a convex portion in the pad region and contacting the covering member.

[0014] In an embodiment, on a plane, the reinforcing member may be spaced apart from the driving chip.

[0015] In an embodiment, the reinforcing member may include a first reinforcing member (e.g., a first reinforcing pattern) spaced apart from each other in a first direction, and at least one of the driving chips is disposed between the first reinforcing members (e.g., the first reinforcing pattern).

[0016] In an embodiment, the reinforcing member may include a second reinforcing member (e.g., a second reinforcing pattern) spaced apart from each other in a second direction, and at least one of the driving chips is disposed between the second reinforcing members (e.g., the second reinforcing pattern).

[0017] In an embodiment, the reinforcing member may include an adhesive material.

[0018] In an embodiment, the display device may further include: a flexible circuit film electrically connected to the array substrate at a pad electrode of the array substrate; a circuit board electrically connected to the array substrate through the flexible circuit film; a buffer layer disposed under the array substrate and including an insulating material; and a conductive layer disposed under the buffer layer and including a conductive material, wherein the covering member covers at least one of the flexible circuit film and the circuit board.

[0019] A display device according to an embodiment may include: an array substrate including a display region in which a plurality of pixels are arranged, a peripheral region surrounding the display region, and a pad region adjacent to the peripheral region and spaced apart from one side of the display region in a first direction; a plurality of driving chips disposed on the array substrate in the pad region and arranged in a row along a second direction intersecting the first direction; a packaging layer disposed on the array substrate and covering the pixels; a reinforcing member disposed on the array substrate in the pad region and spaced apart from the driving chips and the packaging layer; and a covering member covering the driving chips in the pad region and contacting the reinforcing member.

[0020] In an embodiment, on a plane, the reinforcing member may be spaced apart from the driving chip.

[0021] In an embodiment, the reinforcing member may include a first reinforcing member spaced apart from each other in a first direction, and at least one of the driving chips is disposed between the first reinforcing members.

[0022] In an embodiment, the reinforcement member may include second reinforcement members spaced apart from each other in the second direction, and at least one of the driving chips is interposed between the second reinforcement members.

[0023] In an embodiment, the reinforcement member may include an adhesive material.

[0024] In an embodiment, the display device may further include: a flexible circuit film electrically connected to the pad electrode of the array substrate; a circuit board electrically connected to the flexible circuit film; a buffer layer disposed under the array substrate and comprising an insulating material; and a conductive layer disposed under the buffer layer and comprising a conductive material, wherein the covering member covers at least one of the flexible circuit film and the circuit board.

[0025] The display device according to the embodiment may include an encapsulation layer on the array substrate. The encapsulation layer may include a base portion overlapping the display area and its surrounding area and a convex portion protruding from one side of the base portion toward the pad area. Therefore, since the thickness of the display device is increased in the pad area due to the stacking structure including the reinforcement layer (e.g., the convex portion and / or the reinforcement pattern of the encapsulation layer), cracks in the array substrate can be reduced or prevented. In addition, since the encapsulation layer includes a convex portion providing a surface area for contacting the covering member, the contact surface (area) of the covering member contacting the encapsulation layer in the pad area can be enlarged. Therefore, the warping phenomenon of the covering member relative to the stacking structure including the encapsulation layer can be reduced or prevented, and the durability of the display device can be improved.

[0026] In the display device according to the embodiment, the reinforcement pattern in the reinforcement layer, which is spaced apart from the driving chip and the encapsulation layer, can be provided in the pad region of the array substrate. Therefore, the covering member can contact the reinforcement pattern. Therefore, the contact surface (area) of the covering member contacting other components on the array substrate in the stacked structure can be enlarged. Therefore, the warping phenomenon of the covering member can be reduced or prevented, and the durability of the display device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0028] Figure 1 is a plan view showing a display device according to an embodiment of the present disclosure.

[0029] Figure 2 The cover member is omitted. Figure 1 A plan view of a display device.

[0030] Figure 3 yes Figure 1 An enlarged plan view of area A.

[0031] Figure 4 is a cross-sectional view taken along line I-I' of Figure 3 .

[0032] Figure 5 is a cross-sectional view taken along line II-II' of Figure 3 .

[0033] Figure 6 is a plan view showing an example of a display device of Figure 1 .

[0034] Figure 7 is a cross-sectional view taken along line III-III' of Figure 6 .

[0035] Figure 8 is a cross-sectional view taken along line IV-IV' of Figure 6 .

[0036] Figure 9 , Figure 10 , Figure 11 and Figure 12 are plan views respectively showing various examples of the display device of Figure 1 .

[0037] Figure 13 is a plan view showing a display device according to an embodiment of the present disclosure.

[0038] Figure 14 is Figure 13 an enlarged plan view of region B of

[0039] Figure 15 is a cross-sectional view taken along line V-V' of Figure 14 .

[0040] Figure 16 is a cross-sectional view taken along line V-V' of Figure 14 .

[0041] Figure 17 is a plan view showing a display device according to an embodiment of the present disclosure.

[0042] Figure 18 is Figure 17 an enlarged plan view of region C of

[0043] Figure 19 is a magnified cross-sectional view taken along line VI-VI' of Figure 18 .

[0044] Figure 20 is a magnified cross-sectional view showing an example of a cross-section taken along line VI-VI' of Figure 18 .

[0045] Figure 21 is a plan view showing a display device according to an embodiment of the present disclosure.

[0046] Figure 22 is a plan view showing a display device according to an embodiment of the present disclosure.

[0047] Figure 23 is a plan view showing a display device according to an embodiment of the present disclosure.

[0048] Figure 24 is a plan view showing a display device according to an embodiment of the present disclosure. Detailed Description

[0049] Hereinafter, a display device according to an embodiment will be described in more detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used for the same components, and repeated descriptions of the same components will be omitted.

[0050] It will be understood that when an element is referred to as being related to another element (such as "on" another element), it can be directly on the other element, or there may be an intervening element between them. In contrast, when an element is referred to as being related to another element (such as "directly on" another element), there is no intervening element.

[0051] It will be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, without departing from the teachings herein, the "first element", "first component", "first region", "first layer", or "first part" discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0052] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the articles "a", "an", "the", and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural. Thus, a reference to "an" element followed by a reference to "the" element includes one element and a plurality of elements. For example, unless the context clearly dictates otherwise, "an element" has the same meaning as "at least one element". "At least one" should not be construed as limiting "a" or "an". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. In the disclosed figures and text, reference numerals indicating a singular form of an element may also be used to refer to a plurality of individual elements.

[0053] It will also be understood that when the terms "comprises" and / or "comprising" and variations thereof are used in this specification, it is specified that there are the stated features, regions, wholes, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or groups thereof.

[0054] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another as shown in the figures. It will be understood that relative terms are intended to cover different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is flipped, an element described as on the "lower" side of another element will then be oriented on the "upper" side of the other element. Thus, depending on the particular orientation of the figure, the term "lower" can cover both the "lower" and "upper" orientations. Similarly, if the device in one of the figures is flipped, an element described as "beneath" or "under" another element will then be oriented "above" the other element. Thus, the terms "beneath" or "under" can cover both above and below orientations.

[0055] As used herein, "about" or "approximately" includes the stated value and means within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art in view of the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0056] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will also be understood that terms, such as those defined in a general dictionary, should be interpreted as having a meaning that is consistent with their meaning in the relevant art and the context of this disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0057] Embodiments are described herein with reference to cross-sectional views that are schematic illustrations of idealized embodiments. As such, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but include, for example, shape deviations resulting from manufacturing. For example, regions shown or described as flat may typically have rough and / or non-linear features. Additionally, sharp corners shown may be rounded. Thus, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the exact shape of the regions and are not intended to limit the scope of the claims.

[0058] Figure 1 is a plan view showing a display device DD according to an embodiment of the present disclosure. Figure 2 is a plan view showing the display device DD with the covering member 300 omitted. Figure 1 of the display device DD.

[0059] Referring to Figure 1 and Figure 2 , a display device DD according to an embodiment of the present disclosure may include an array substrate 100 as a first substrate, a packaging layer 200, a plurality of driving chips DDI, a circuit board PCB, a flexible circuit film FPC, and a covering member 300.

[0060] The array substrate 100 may include a display area DA, a peripheral area NDA, and a pad (also referred to as a "bond pad") area PA.

[0061] A plurality of pixels PX may be arranged in the display area DA. Each of the plurality of pixels PX may emit light (such as for displaying an image in the display area DA). The plurality of pixels PX may be arranged in a matrix form. For example, the plurality of pixels PX may be arranged in a first direction DR1 and may be arranged in a second direction DR2 that intersects the first direction DR1. In an embodiment, the second direction DR2 may be perpendicular to the first direction DR1.

[0062] In this specification, a plane can be defined by a first direction DR1 and a second direction DR2 that cross each other. For example, the second direction DR2 can be perpendicular to the first direction DR1. Additionally, a third direction DR3 can be perpendicular to the plane. The thickness of the display device DD and its various components or layers can be defined along the third direction DR3 (e.g., the thickness direction of the array substrate 100).

[0063] The peripheral region NDA is adjacent to the display region DA (such as surrounding the display region DA). The peripheral region NDA, which is a non-display region, can include the planar region of the array substrate 100 other than the planar region of the display region DA. That is to say, the non-display region can be the remaining planar region of the array substrate 100 other than the display region DA. The pad region PA can be considered as part of the non-display region, but is not limited thereto.

[0064] For example, a driving unit of a pixel circuit for driving a plurality of pixels PX can be provided in the peripheral region NDA. The driving unit can be electrically connected to the plurality of pixels PX and can provide a driving signal as an electrical signal to the plurality of pixels PX. The plurality of pixels PX can emit light with a brightness corresponding to the intensity of the driving signal. Therefore, an image can be displayed in the display region DA by the light emitted from each of the plurality of pixels PX.

[0065] In an embodiment, the driving unit can include a gate driving unit. In an embodiment, the driving unit can include a light emission control driving unit.

[0066] The pad region PA can be adjacent to the peripheral region NDA. The pad region PA can be spaced apart from one side of the display region DA in the first direction DR1. A pad electrode PDE (see Figure 4 ) can be provided in the pad region PA. The pad electrode PDE can be electrically connected to the plurality of pixels PX.

[0067] The encapsulation layer 200 can be provided on the array substrate 100 (such as facing the array substrate 100 along the thickness direction). For example, the encapsulation layer 200 can be stacked with the display region DA and at least a part of the peripheral region NDA adjacent to the display region DA. The encapsulation layer 200 can cover the plurality of pixels PX. The encapsulation layer 200 can protect the plurality of pixels PX from moisture and impurities.

[0068] A plurality of driving chips DDI can be provided on the array substrate 100. The plurality of driving chips DDI can be provided in the pad region PA. The plurality of driving chips DDI can be electrically connected to the plurality of pixels PX and the pad electrode PDE. The plurality of driving chips DDI can generate a driving signal as an electrical signal for driving the plurality of pixels PX.

[0069] In an embodiment, a plurality of driving chips DDI may be arranged in a row along the second direction DR2. Although two driving chips DDI are shown in Figure 1 and Figure 2 , the number of driving chips DDI is not limited thereto. That is, the display device DD may include two or more driving chips DDI.

[0070] The circuit board PCB may be adjacent to the pad region PA. For example, as shown in Figure 1 and Figure 2 , the circuit board PCB may be arranged to be spaced apart from the array substrate 100 in the first direction DR1. In the case where the array substrate 100 represents a planar region of the display panel, the circuit board PCB may be regarded as an external component with respect to the display panel within the entire display device DD. However, the present disclosure is not limited thereto, and the circuit board PCB may be placed under the array substrate 100 (such as being stacked with the array substrate 100 instead of being spaced apart from the array substrate 100).

[0071] The flexible circuit film FPC may be electrically connected to the array substrate 100 in the pad region PA of the array substrate 100 and electrically connected to the circuit board PCB. For example, the flexible circuit film FPC may be connected to the array substrate 100 on one side (e.g., the first side of the flexible circuit film FPC), and connected to the circuit board PCB on the other side opposite to the one side (e.g., the second side of the flexible circuit film FPC opposite to the first side). Specifically, the flexible circuit film FPC may be electrically connected to the array substrate 100 at the pad electrode PDE. Therefore, the flexible circuit film FPC may electrically connect the array substrate 100 and the circuit board PCB to each other.

[0072] The structure and position of the flexible circuit film FPC and the circuit board PCB will be described in more detail later with reference to Figure 4 , Figure 5 , Figure 6 and Figure 7 .

[0073] The covering member 300 may cover the upper surface of the display device DD facing the third direction DR3 and a part of the rear surface opposite to the upper surface. For example, the covering member 300 may cover a part of the peripheral region NDA between the display region DA and the pad region PA and the upper surfaces and rear surfaces of the components of the display device DD stacked with the pad region PA. The covering member 300 may be configured to be directly visible to the outside of the display device DD (such as to its user). The covering member 300 may provide the outer surface of the display device DD together with other outermost surfaces defined by layers or components of the display device DD other than the covering member 300, but is not limited thereto.

[0074] In an embodiment, the covering member 300 may contact the driving chip DDI. When contacting, the components may physically contact (such as forming an interface therebetween). Specifically, the covering member 300 may contact a part of the upper surface of the encapsulation layer 200 and the upper surface of the driving chip DDI, and may extend from the driving chip DDI to cover the flexible circuit film FPC and the circuit board PCB attached to the array substrate 100 of the display device DD. Accordingly, the covering member 300 may be fixed to the contact surface of the encapsulation layer 200, and may jointly protect the driving chip DDI, the flexible circuit film FPC, and the circuit board PCB from impact.

[0075] The structure of the encapsulation layer 200 in contact with the covering member 300 may be a part of the base portion 220 that overlaps with the peripheral region NDA (e.g., Figure 3 the main part or main region in Figure 3 ), and the convex portion 240 (e.g., a plurality of protruding portions are provided, and each of the plurality of protruding portions extends from the main part and in the first direction DR1, and the protruding portion protrudes from the base portion 220 toward the pad region PA). The explanations of the base portion 220 and the convex portion 240 will be described in more detail later in

[0076] In an embodiment, the covering member 300 may be spaced apart from the upper surface of the array substrate 100. Specifically, the covering member 300 may not contact the upper surface of the array substrate 100 adjacent to the driving chip DDI along a plane (e.g., a plane defined by the first direction DR1 and the second direction DR2 intersecting each other).

[0077] Figure 3 is Figure 1 an enlarged plan view of region A of

[0078] Referring to Figure 1 , Figure 2 and Figure 3 , the encapsulation layer 200 may include a base portion 220 and a convex portion 240 extending from the base portion 220. A boundary may be defined between the base portion 220 and the convex portion 240, and may extend along the second direction DR2. The base portion 220 may overlap with the display region DA, and extend from the display region DA to overlap with at least a part of the peripheral region NDA. That is, the base portion 220 may be an integral (or continuous) part of the encapsulation layer 200 that does not overlap with the pad region PA (e.g., except for the pad region PA). For example, except for the pad region PA, the base portion 220 may overlap with the entire display region DA and the entire peripheral region NDA.

[0079] Each of the convex portions 240 of the convex portion 240 can protrude from the base portion 220 in a direction toward the pad region PA. The convex portion 240 and the base portion 220 can be integrally formed by the same process (such as setting the encapsulation layer 200 as a single entity). That is, although the base portion 220 and the convex portion 240 effectively define a part of the encapsulation layer 200 that does not overlap with the pad region PA and another part that overlaps with the pad region PA, these two parts do not define a break in the structure.

[0080] In an embodiment, the thicknesses of the convex portion 240 and the base portion 220 can be substantially equal along the thickness direction (e.g., the third direction DR3). However, the present disclosure is not limited to this.

[0081] In an embodiment, the convex portion 240 can be spaced apart from the driving chip DDI in a plane. Specifically, the convex portion 240 can not contact the upper surface of the driving chip DDI.

[0082] In Figure 3 the number of the convex portions 240 is shown as two, but the present disclosure is not limited to this. The number of the convex portions 240 can be three or more. The base portion 220 (and the pad region PA) can have a first end and a second end that are opposite to each other along the second direction DR2. In addition, the convex portions 240 can be provided to protrude from the base portion 220 at two opposite ends of the pad region PA, respectively. The convex portions 240 can be spaced apart from each other along the second direction DR2 within the pad region PA. However, the present disclosure is not limited to this, and the positions of the convex portions 240 can be arranged at various positions in the pad region PA that do not overlap with the driving chip DDI.

[0083] The concave portion CP can be defined by the base portion 220 together with the convex portion 240 along the plane of the array substrate 100. Specifically, the concave portion CP can be a region (e.g., a planar region) surrounded by the base portion 220, the outer surfaces of the convex portions 240, and the end of the connection flexible circuit film FPC of the array substrate 100. That is, the concave portion CP can be a virtual planar region where the upper surface of the array substrate 100 is exposed to the outside of the encapsulation layer 200 within the pad region PA. The concave portion CP can be defined by a notch in the encapsulation layer 200 that opens in the first direction DR1 and exposes the upper surface of the array substrate 100 to the outside of the display device DD.

[0084] In an embodiment, the convex portion 240 can have a planar shape in which at least one part has a rounded edge. Corresponding to the shape of the convex portion 240, the concave portion CP can also have a planar shape in which at least a part is rounded. However, the present disclosure is not limited to this.

[0085] In an embodiment, the driving chip DDI can be entirely disposed within the concave portion CP. Although in Figure 3Only one recessed portion CP is shown, but the number of recessed portions CP is not limited thereto. One or more recessed portions CP may be respectively defined between adjacent convex portions 240. For example, as Figure 11 and Figure 12 shown, the number of recessed portions CP may be two or three.

[0086] In an embodiment, the convex portion 240 may extend to an end of the array substrate 100. For example, the convex portion 240 may cover an end of the array substrate 100 in the pad region PA. A distal end of the convex portion 240 may be aligned with a distal end of the array substrate 100 in the pad region PA. An end surface of the convex portion 240 and an end surface of the array substrate 100 may be coplanar, but not limited thereto. Accordingly, due to the multi-layer structure including the convex portion 240 overlapping with the pad region PA, the thickness of the display device DD may increase in the pad region PA. Accordingly, cracks generated in the array substrate 100 due to external impact may be reduced or prevented.

[0087] However, in Figure 1 shown, the convex portion 240 is shown as being formed up to a boundary of the pad region PA at opposite ends along the second direction DR2, but the present disclosure is not necessarily limited thereto. For example, the convex portion 240 may terminate before the boundary of the pad region PA to be spaced apart from the boundary of the pad region PA along the second direction DR2.

[0088] The covering member 300 may contact an upper surface of the encapsulation layer 200 at each of its convex portions 240 and a portion of the encapsulation layer 200 that overlaps with the peripheral region NDA at the base portion 220. That is, since the encapsulation layer 200 includes the convex portion 240, the covering member 300 may contact the encapsulation layer 200 even in the pad region PA. Accordingly, a total contact surface of the covering member 300 contacting the encapsulation layer 200 is enlarged, so a lifting phenomenon of the covering member 300 in the display device DD may be reduced or prevented. Accordingly, durability of the display device DD may be improved.

[0089] Figure 4 is a cross-sectional view taken along line I-I' of Figure 3 . Figure 5 is a cross-sectional view taken along line II-II' of Figure 3 .

[0090] Specifically, Figure 4 and Figure 5A view showing an example in which the printed circuit board (PCB) is spaced apart from the array substrate 100 in the first direction DR1 because the flexible printed circuit (FPC) film is not bent and / or does not have flexibility. That is, the PCB can be coplanar with the display panel of the display device DD. The PCB can be coplanar with the encapsulation layer 200 and the driving chip DDI.

[0091] Referring Figure 4 and Figure 5 FIGS. and, the display device DD may further include a polarizing layer POL, a buffer layer BUF, a conductive layer ELL, and a pad electrode PDE. For ease of explanation, each layer above or below the array substrate 100 along the third direction DR3 may define the display panel. For the purpose of explanation, one end or boundary of the display area DA may correspond to the farthest end of the polarizing layer POL in the first direction DR1. The boundary of the pad area PA may correspond to the boundary between the base portion 220 and the convex portion 240 and the farthest end of the encapsulation layer 200 in the first direction DR1.

[0092] The polarizing layer POL may be disposed on the encapsulation layer 200. For example, the polarizing layer POL may cover at least a part of the upper surface of the encapsulation layer 200. In addition, the polarizing layer POL may be spaced apart from the covering member 300. In addition, the polarizing layer POL may prevent external light incident from the outside of the display device DD from being reflected inside the display device DD and being visible to the user. The polarizing layer POL may define the upper surface of the display device DD (or the display panel).

[0093] The buffer layer BUF may be disposed under the array substrate 100. The buffer layer BUF may include an insulating material. The buffer layer BUF may protect the array substrate 100 from impact. In addition, the buffer layer BUF may protect the array substrate 100 from moisture and impurities.

[0094] The conductive layer ELL may be disposed under the buffer layer BUF. The conductive layer ELL may include a conductive material to define the conductive layer. For example, the conductive layer ELL may include aluminum or copper. Each of the array substrate 100, the encapsulation layer 200, and the polarizing layer POL disposed on the conductive layer ELL may have flexibility. The array substrate 100, the encapsulation layer 200, and the polarizing layer POL may be bent together (such as being bendable, foldable, rollable, etc.).

[0095] Each of the array substrate 100, the encapsulation layer 200, the polarizing layer POL, and the conductive layer ELL may have rigidity. The conductive layer ELL may have relatively greater rigidity than each of the array substrate 100, the encapsulation layer 200, and the polarizing layer POL. In addition, the conductive layer ELL having higher rigidity may support the array substrate 100, the encapsulation layer 200, and the polarizing layer POL.

[0096] As described above, the pad electrode PDE can be disposed in the pad region PA of the array substrate 100. The pad electrode PDE can be within the cross-sectional and / or planar regions of the array substrate 100 and exposed to its exterior. In addition, the pad electrode PDE can be connected to the flexible circuit film FPC. That is, the array substrate 100 can be connected to the flexible circuit film FPC through the pad electrode PDE. In addition, the array substrate 100 and the circuit board PCB can be connected through the flexible circuit film FPC.

[0097] The driving chip DDI can be spaced apart from the flexible circuit film FPC in the first direction DR1. The driving chip DDI can be mounted on the array substrate 100 in the pad region PA in the form of chip on glass (COG) or chip on plastic (COP). However, the present disclosure is not limited thereto.

[0098] The circuit board PCB can be spaced apart from the end surfaces of each of the array substrate 100, the buffer layer BUF, and the conductive layer ELL in the planar direction. In this case, the covering member 300 can contact a part of the circuit board PCB. For example, the covering member 300 can contact a part of the upper surface of the circuit board PCB and / or a part of the side surface of the circuit board PCB disposed facing the first direction DR1.

[0099] In an embodiment, the covering member 300 can cover at least one of the flexible circuit film FPC connected to the array substrate 100 and the circuit board PCB. Specifically, the covering member 300 can extend along the upper surface of the flexible circuit film FPC, along the upper surface of the circuit board PCB, and along the side surface of the circuit board PCB facing the first direction DR1.

[0100] In an embodiment, the covering member 300 can contact the driving chip DDI. In this case, as Figure 4 shown, a part (e.g., the first part) of the covering member 300 that contacts a part of the encapsulation layer 200 and another part (e.g., the second part) of the covering member 300 that contacts the driving chip DDI can form a step in the cross-section. That is, a part of the covering member 300 and another part of the covering member 300 can be positioned at different levels (i.e., in different planes from each other) with respect to the array substrate 100. However, the present disclosure is not limited thereto. For example, the covering member 300 can only contact a part of the upper surface of the driving chip DDI, or can not contact the driving chip DDI.

[0101] As Figure 5As shown, the covering member 300 may contact a part of the base portion 220 and the convex portion 240. Specifically, the covering member 300 may contact only a part of the upper surface of the base portion 220 and may be spaced apart from the polarization layer POL in the first direction DR1. In addition, the covering member 300 may contact the entire upper surface of the convex portion 240.

[0102] The covering member 300 may contact the upper surface of the circuit board PCB. Accordingly, one part of the covering member 300 that contacts a part of the encapsulation layer 200 and another part of the covering member 300 that contacts the circuit board PCB may form a step in the cross-section. That is, one part of the covering member 300 and another part of the covering member 300 may be positioned at different levels from each other. However, the utility model is not limited thereto.

[0103] Figure 6 is a plan view showing Figure 1 an example in which the display device DD is bent to define an end portion of the display device DD. Figure 7 is a cross-sectional view taken along Figure 6 line III-III' of Figure 8 is a cross-sectional view taken along Figure 6 line IV-IV' of

[0104] Figure 9 , Figure 10 , Figure 11 and Figure 12 are plan views showing Figure 1 various examples of the display device DD.

[0105] Specifically, Figure 6 , Figure 7 and Figure 8 are views showing examples in which the circuit board PCB is placed under the array substrate 100 by bending a flexible circuit film FPC having flexibility.

[0106] Referring to Figure 6 and Figure 7 , the circuit board PCB may be disposed under the conductive layer ELL. Specifically, the circuit board PCB may be electrically connected to the array substrate 100 through a flexible circuit film FPC having a curved surface. That is, the display device DD may be bent at the flexible circuit film FPC, and a portion of the bent display device DD including the circuit board PCB may be disposed under the conductive layer ELL.

[0107] Referring to Figure 7 and Figure 8, the bonding member AM can be disposed between the circuit board PCB and the conductive layer ELL. For example, the circuit board PCB can be fixed to the lower portion of the conductive layer ELL by the bonding member AM. The bonding member AM can include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), a photocurable resin, a thermosetting resin, etc. They can be used alone or can be used in combination with each other.

[0108] Referring to Figure 9 , in an embodiment, the convex portion 240 can have a rectangular planar shape. Corresponding to the shape of the convex portion 240, the concave portion CP can also have a rectangular planar shape. However, the present disclosure is not limited thereto, and the convex portion 240 and the concave portion CP can have various planar shapes. For example, as Figure 3 shown, at least a part of the convex portion 240 and the concave portion CP can have a rounded (circular) planar shape. That is, the encapsulation layer 200 can have a rounded edge at the convex portion 240.

[0109] Since the convex portion 240 has various shapes, it is possible to easily adjust the contact surfaces where the covering member 300 and the encapsulation layer 200 contact each other in the pad region PA. Therefore, the design simplicity can be improved, and the warping phenomenon of the covering member 300 can also be reduced or prevented.

[0110] Referring to Figure 10 , in an embodiment, the distal end (or distal edge) of the convex portion 240 can be disposed between the end surface of the array substrate 100 and the end surface of the base portion 220. Here, the end, edge or surface can be the farthest from the display region DA in the direction towards the pad region PA. In other words, the convex portion 240 can extend from the base portion 220 only to a specific point within the pad region PA, where the point is spaced apart from both the end surface of the base portion 220 and the end surface of the array substrate 100. That is, the convex portion 240 can not extend to the end of the array substrate 100, and a part of the upper surface of the array substrate 100 extends farther than the distal end of the convex portion 240 to be exposed outside the encapsulation layer 200 at the distal end of the convex portion 240.

[0111] However, although not shown in Figure 10 , the extent to which each of the plurality of convex portions 240 extends from the base portion 220 can be different. For example, one of the convex portions 240 (e.g., the first convex portion 240) can extend to the end of the array substrate 100, while another of the convex portions 240 (e.g., the second convex portion 240 different from the first convex portion 240) can extend only to a specific point within the pad region PA.

[0112] According to an embodiment, the degree to which the convex portion 240 extends from the base portion 220 can be adjusted in various ways, such that the contact surface where the covering member 300 and the encapsulation layer 200 contact each other in the pad region PA can be easily adjusted. Accordingly, the design simplicity of the display device DD can be improved, and the warping phenomenon of the covering member 300 can also be reduced or prevented.

[0113] Referring Figure 11 , in an embodiment, at least one of the convex portions 240 can be positioned between the driving chips DDI. Specifically, at least one of the convex portions 240 can be disposed between two adjacent driving chips DDI in a direction along the array substrate 100. In this case, at least one of the convex portions 240 disposed between the driving chips DDI can be spaced apart from each of the adjacent driving chips DDI.

[0114] The encapsulation layer 200 can be recessed at positions corresponding to the driving chips DDI to define recesses CP. Each of the recesses can open in a direction from the display region DA to the pad region PA.

[0115] When at least one of the convex portions 240 is positioned between the driving chips DDI, the area of the convex portion 240 positioned in the pad region PA can be further increased. That is, the contact surface where the covering member 300 and the encapsulation layer 200 contact each other in the pad region PA can be wider. Accordingly, the warping phenomenon of the covering member 300 can be further reduced or prevented.

[0116] Referring Figure 12 , in an embodiment, the driving chips DDI and the convex portions 240 can be alternately arranged with each other along a second direction DR2 on a plane of the array substrate 100. Specifically, one of the convex portions 240 can be positioned between two adjacent driving chips DDI. In addition, one of the driving chips DDI can be positioned between the convex portions 240 adjacent to each other. Accordingly, the contact surface where the covering member 300 and the encapsulation layer 200 contact each other in the pad region PA can be enlarged, and the warping phenomenon of the covering member 300 can be prevented or reduced.

[0117] However, the shape and arrangement of the convex portion 240 can be merely examples and can vary according to embodiments. For example, although not shown, in an embodiment including three or more driving chips DDI, one of the convex portions 240 can be disposed between a pair of adjacent driving chips DDI. In addition, the convex portion 240 can not be disposed between another pair of adjacent driving chips DDI. As another example, although not shown, at least two convex portions 240 can be disposed between a pair of adjacent driving chips DDI.

[0118] Figure 13 is a plan view showing a display device DD1 according to an embodiment of the present disclosure.Figure 14 Yes Figure 13 It is an enlarged view of region B of .

[0119] Except that the encapsulation layer 200' does not extend to the pad region PA and includes the first reinforcement member 420, referring to Figure 13 Figure 13 and Figure 14 the display device DD1 described can be substantially the same as the display device DD described with reference to Figure 1 Figure 1 , Figure 2 and Figure 3 In the following, the descriptions of the components of the display device DD that are repetitive with those described with reference to Figure 1 Figure 1 , Figure 2 and Figure 3 will be omitted or simplified.

[0120] Referring to Figure 13 Figure 13 and Figure 14 , the encapsulation layer 200' can be disposed in the display area DA and the peripheral area NDA of the array substrate 100. Except that the encapsulation layer 200' does not include the convex portion 240 extending from the base portion 220, the encapsulation layer 200' can be substantially the same as the encapsulation layer 200 described with reference to Figure 1 Figure 1 . That is, the encapsulation layer 200' may not extend to the pad region PA. For example, the encapsulation layer 200' may have a structure substantially corresponding to the base portion 220 of the encapsulation layer 200 of Figure 1 Figure 1 .

[0121] The reinforcement member 400 can be disposed in the pad region PA of the array substrate 100. The reinforcement member 400 can be provided in multiple in the pad region PA. In an embodiment, the multiple reinforcement members 400 provided can include the first reinforcement member 420 (e.g., the first reinforcement pattern) of the reinforcement pattern layer. For example, the first reinforcement member 420 can be arranged to be spaced apart from the encapsulation layer 200' in the first direction DR1 on the array substrate 100. The reinforcement member 400 can be separated from the encapsulation layer 200'.

[0122] In an embodiment, one of the driving chips DDI can correspond to at least two first reinforcement members 420. For example, as shown in Figure 13 Figure 13 , one of the driving chips DDI can correspond to a pair of first reinforcement members 420. The pair of first reinforcement members 420 corresponding to one of the driving chips DDI can be arranged to be spaced apart from each other in the first direction DR1, and the corresponding driving chip DDI is disposed between the pair of first reinforcement members 420. Specifically, one of the pair of first reinforcement members 420 can be disposed between the encapsulation layer 200' and the corresponding driving chip DDI, and the other can be disposed between the corresponding driving chip DDI and the flexible circuit film FPC.

[0123] In an embodiment, the first reinforcement member 420 may include an adhesive material. For example, the adhesive material may include a pressure sensitive adhesive (PSA), an optically clear adhesive (OCA), a photocurable resin, a thermosetting resin, etc. They may be used alone or in combination with each other.

[0124] However, in Figure 13 and Figure 14 , the planar shape of the first reinforcement members 420 is shown as a straight line shape, but the planar shape of each of the first reinforcement members 420 may vary according to the embodiment. The first reinforcement members 420 may be discrete patterns having discrete planar shapes in a plan view.

[0125] In an embodiment, the cover member 300 may contact a portion of the encapsulation layer 200' in the peripheral area NDA, and may contact the upper surface of each of the first reinforcement members 420 in the pad area PA. That is, since the display device DD1 includes the first reinforcement member 420 disposed in the pad area PA, the cover member 300 may contact other components even in the pad area PA. Therefore, the contact surface of the cover member 300 contacting other components on the array substrate 100 is expanded, so that the warping phenomenon of the cover member 300 can be reduced or prevented. Therefore, the durability of the display device DD1 can be improved.

[0126] However, the arrangement and number of the first reinforcing members 420 are only examples and may vary according to the embodiment. For example, although not shown, any one of the driving chips DDI may correspond to three or more first reinforcing members 420. Specifically, two or more first reinforcing members 420 corresponding to one driving chip DDI may be disposed between the encapsulation layer 200' and the corresponding driving chip DDI. In addition, two or more first reinforcing members 420 corresponding to one driving chip DDI may be disposed between the flexible circuit film FPC and the corresponding driving chip DDI.

[0127] Figure 15 It is along Figure 14 A cross-sectional view taken along line V-V'. Figure 16 It is along Figure 14 Cross-sectional view along line V-V'.

[0128] Reference Figure 15 and Figure 16 The display device DD1 described includes a first reinforcement member 420, and in addition to the cover member 300 also contacting the first reinforcement member 420, it can be with reference to Figure 4 The display devices DD described are essentially the same.

[0129] In the following, the references will be omitted or simplified. Figure 4Repeated description of components of the described display device DD.

[0130] Referring to Figure 15 , in an embodiment, the thickness of the first reinforcing member 420 in the third direction DR3 may be smaller than the thickness of the driving chip DDI in the third direction DR3. In this case, the covering member 300 may have a protruding surface (e.g., a protrusion) to contact the first reinforcing member 420 respectively. That is, the thickness of the covering member 300 in the third direction DR3 at the portion where the covering member 300 contacts the driving chip DDI and the thickness of the covering member 300 in the third direction DR3 at the portion where the covering member 300 contacts the first reinforcing member 420 may be different from each other. In addition, the covering member 300 may be spaced apart from the upper surface of the array substrate 100 at a position where the first reinforcing member 420 is not provided and the array substrate 100 is exposed to the outside of the first reinforcing member 420. In other words, the covering member 300 may not contact the upper surface of the array substrate 100 at the portion where the first reinforcing member 420 is not provided.

[0131] Referring to Figure 16 , in an embodiment, the thickness of the first reinforcing member 420 in the third direction DR3 may be substantially equal to the thickness of the driving chip DDI in the third direction DR3. In this case, the surface of the covering member 300 that contacts the first reinforcing member 420 and the surface that contacts the driving chip DDI may be positioned at substantially the same level (i.e., coplanar with each other). In this case, the covering member 300 may not include a separate protruding surface (or protrusion) for contacting the first reinforcing member 420. However, the present disclosure is not necessarily limited thereto, and when the thickness of the first reinforcing member 420 in the third direction DR3 is equal to the thickness of the driving chip DDI in the third direction DR3, the covering member 300 may have a separate protruding surface.

[0132] However, in Figure 13 , Figure 14 , Figure 15 and Figure 16 , the description focuses on examples in which the flexible circuit film FPC is not flexible, the flexible circuit film FPC extends flatly (e.g., does not bend), and the circuit board PCB is spaced apart from the array substrate 100 in the first direction DR1, but the present disclosure is not necessarily limited thereto. For example, even in the display device DD1 including the first reinforcing member 420, the flexible circuit film FPC may have the flexibility as described with reference to Figure 6 , Figure 7 and Figure 8 , and the flexible circuit film FPC is bent. Therefore, the circuit board PCB can be placed under the array substrate 100 by the bending of the display device DD1 at the flexible circuit film FPC.

[0133] Figure 17 is a plan view showing a display device DD2 according to an embodiment of the present disclosure. Figure 18 is Figure 17 an enlarged view of region C of

[0134] Except that the display device DD2 includes a second reinforcing member 440 instead of the first reinforcing member 420, the display device DD2 described with reference to Figure 17 and Figure 18 can be substantially the same as the display device DD1 described with reference to Figure 13 and Figure 14 described.

[0135] Hereinafter, descriptions of components that are repetitive of those of the display device DD1 described with reference to Figure 13 and Figure 14 will be omitted or simplified.

[0136] Referring to Figure 17 and Figure 18 , a plurality of reinforcing members 400 may be provided in the pad region PA of the array substrate 100. In an embodiment, the reinforcing member 400 including a reinforcing pattern layer (e.g., a second reinforcing pattern) may be provided as a plurality. For example, the second reinforcing members 440 may be arranged on the array substrate 100 spaced apart from each other in the second direction DR2.

[0137] In an embodiment, one of the driving chips DDI may correspond to at least two second reinforcing members 440. For example, as shown in Figure 17 , one of the driving chips DDI may correspond to a pair of second reinforcing members 440. The pair of second reinforcing members 440 corresponding to one of the driving chips DDI may be spaced apart from each other in the second direction DR2, and the corresponding driving chip DDI is disposed between the pair of second reinforcing members 440. Specifically, one of the pair of second reinforcing members 440 may be arranged to be spaced apart from the corresponding driving chip DDI in the second direction DR2, and the other of the pair of second reinforcing members 440 may be arranged to be spaced apart from the corresponding driving chip DDI in a direction opposite to the second direction DR2.

[0138] In an embodiment, the second reinforcing member 440 may include an adhesive material. For example, the adhesive material may include a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), a photocurable resin, a thermosetting resin, etc. They may be used alone or in combination with each other.

[0139] However, in Figure 17 and Figure 18 , the planar shape of the second reinforcing member 440 is shown as a quadrilateral, but the planar shape of each of the second reinforcing members 440 may vary according to the embodiment.

[0140] In an embodiment, the cover member 300 may contact a portion of the encapsulation layer 200' in the peripheral area NDA, and may contact the upper surface of each of the second reinforcement members 440 in the pad area PA. That is, since the display device DD2 includes the second reinforcement member 440 disposed in the pad area PA, the cover member 300 may contact other components of the display device DD2 on the array substrate 100 even in the pad area PA. Therefore, the contact surface of the cover member 300 contacting other components on the array substrate 100 is enlarged, so that the warping phenomenon of the cover member 300 can be reduced or prevented.

[0141] However, the arrangement and number of the second reinforcement members 440 are merely examples and may vary according to embodiments.

[0142] Figure 19 It is along Figure 18 A cross-sectional view taken along line VI-VI'. Figure 20 It is along Figure 18 A cross-sectional view taken along line VI-VI'.

[0143] Reference Figure 19 In an embodiment, the thickness of the second reinforcing member 440 in the third direction DR3 may be smaller than the thickness of the driving chip DDI in the third direction DR3. In this case, the covering member 300 may have a protrusion to contact the second reinforcing member 440. That is, the thickness of the portion of the covering member 300 where the covering member 300 contacts the driving chip DDI in the third direction DR3 and the thickness of the portion of the covering member 300 where the covering member 300 contacts the second reinforcing member 440 in the third direction DR3 may be different. In addition, the covering member 300 may be spaced apart from the upper surface of the array substrate 100 that is closest to the covering member 300 along the third direction DR3 and at which the second reinforcing member 440 is not disposed. In other words, the covering member 300 may not contact the upper surface of the array substrate 100 where the second reinforcing member 440 is not disposed and exposed at the exposed upper surface of the covering member 300 along the third direction DR3.

[0144] Reference Figure 20, in an embodiment, the thickness of the second reinforcing member 440 in the third direction DR3 may be substantially equal to the thickness of the driving chip DDI in the third direction DR3. In this case, the contact surface of the covering member 300 where the covering member 300 contacts the second reinforcing member 440 and the contact surface of the covering member 300 where the covering member 300 contacts the driving chip DDI may be positioned at substantially the same level (e.g., coplanar with each other) with respect to a reference surface such as the upper surface of the array substrate 100. In this case, the covering member 300 may not include a protruding surface for contacting the second reinforcing member 440. However, the present disclosure is not limited thereto, and even when the thickness of the second reinforcing member 440 in the third direction DR3 is equal to the thickness of the driving chip DDI in the third direction DR3, the covering member 300 may have a separate protruding surface defined by a protrusion of the covering member 300.

[0145] However, in Figure 17 , Figure 18 , Figure 19 and Figure 20 , the description focuses on examples where the flexible circuit film FPC is not flexible and the circuit board PCB is spaced apart from the array substrate 100 in the first direction DR1, but the present disclosure may not necessarily be limited thereto. For example, even in the display device DD2 including the second reinforcing member 440, the flexible circuit film FPC may be flexible as described with reference to Figure 6 , Figure 7 and Figure 8 , and the flexible circuit film FPC is bent. Therefore, within the display device DD2 that is bent or folded by the bending of the flexible circuit film FPC, the circuit board PCB may be placed below the array substrate 100 within the display device DD2.

[0146] Figure 21 is a plan view showing a display device DD3 according to an embodiment of the present disclosure.

[0147] Except that the display device DD3 further includes a second reinforcing member 440, the display device DD3 described with reference to Figure 21 may be substantially the same as the display device DD1 described with reference to Figure 13 and Figure 14 . Hereinafter, the description of components that are repetitive with those of the display device DD1 described with reference to Figure 13 and Figure 14 will be omitted or simplified.

[0148] Here, the second reinforcing member 440 may be substantially the same as the second reinforcing member 440 described with reference to Figure 17 , Figure 18 , Figure 19 and Figure 20 . Hereinafter, the description of components that are repetitive with those of the second reinforcing member 440 described with reference toFigure 17 , Figure 18 , Figure 19 and Figure 20 a description that repeats the components described.

[0149] Referring to Figure 21 , the display device DD3 may include reinforcing members 400 that are provided in a plurality. The reinforcing members 400 provided in a plurality may include a first reinforcing member 420 and a second reinforcing member 440 in a reinforcing layer. That is, the display device DD3 may simultaneously include the first reinforcing member 420 described with reference to Figure 13 and Figure 14 and the second reinforcing member 440 described with reference to Figure 17 and Figure 18 . Since the display device DD3 includes both the first reinforcing member 420 and the second reinforcing member 440, the warping phenomenon of the covering member 300 can be further reduced or prevented.

[0150] The first reinforcing member 420 may be aligned or corresponding to the driving chip DDI along the first direction DR1. The first reinforcing members 420 may be aligned with each other in the first direction DR1, but are not limited thereto. Along the first direction DR1, the second reinforcing member 440 may correspond to the gap between the driving chips DDI that are spaced apart from each other in the second direction DR2. Along the second direction DR2, within the pad region PA, the first reinforcing member 420 and the second reinforcing member 440 may alternate.

[0151] In an embodiment in which the display device DD3 includes both the first reinforcing member 420 and the second reinforcing member 440, the first reinforcing member 420 and the second reinforcing member 440 may include the same material as each other. The thickness of the first reinforcing member 420 in the third direction DR3 may be equal to the thickness of the second reinforcing member 440 in the third direction DR3. For example, the first reinforcing member 420 and the second reinforcing member 440 may be formed by the same process. The planar shape of each of the first reinforcing members 420 may be substantially equal to the planar shape of each of the second reinforcing members 440. For example, as shown in Figure 21 , the planar shape of each of the first reinforcing members 420 and the planar shape of each of the second reinforcing members 440 may both have a rectangular planar shape. The first reinforcing member 420 and the second reinforcing member 440 may be in the same layer of the display device DD3. Since they are in the same layer, the components may be formed in the same process and / or include the same material as each other, the components may be respective parts of the same material layer, and the components may be in the same layer by forming an interface with the same underlying layer or overlying layer, etc., but are not limited thereto.

[0152] However, in the present disclosure, the materials, thicknesses, and shapes of the first reinforcing member 420 and the second reinforcing member 440 may not be limited thereto. For example, the materials, thicknesses, and shapes of the first reinforcing member 420 and the second reinforcing member 440 of the display device DD3 may be different from each other.

[0153] Figure 22 is a plan view showing a display device DD4 according to an embodiment of the present disclosure.

[0154] Except that the display device DD4 further includes a first reinforcing member 420, the display device DD4 described with reference to Figure 22 may be substantially the same as the display device DD described with reference to Figure 1 In the following, descriptions of components that are repeated with those of the display device DD described with reference to Figure 1 will be omitted or simplified.

[0155] Here, the first reinforcing member 420 may be substantially the same as the explanation described with reference to Figure 13 In the following, descriptions of components that are repeated with those described with reference to Figure 13 will be omitted or simplified.

[0156] Referring to Figure 22 , the display device DD4 may include both the convex portion 240 and the first reinforcing member 420. In an embodiment, the first reinforcing member 420 may be disposed together with the driving chip DDI in the recess CP defined on the plane of the array substrate 100.

[0157] The first reinforcing member 420 may be arranged to be spaced apart from the convex portion 240. In other words, each of the first reinforcing members 420 may not contact the convex portion 240 on the array substrate 100. Due to the non-contact, the elements may be spaced apart from each other or adjacent to each other in one direction. For example, the first reinforcing member 420 that does not contact the convex portion 240 may be spaced apart from and / or adjacent to the convex portion 240 in one or more directions (e.g., the planar direction) along the array substrate 100.

[0158] The covering member 300 may contact the portion of the base portion 220 of the encapsulation layer 200 that overlaps with the peripheral region NDA, the convex portion 240 of the encapsulation layer 200, and the upper surface of each of the first reinforcing members 420. Since the display device DD4 includes both the convex portion 240 and the first reinforcing member 420, the warping phenomenon of the covering member 300 may be further reduced or prevented.

[0159] Figure 23 is a plan view showing a display device DD5 according to an embodiment of the present disclosure.

[0160] Except that the display device DD5 includes a second reinforcing member 440 instead of the first reinforcing member 420, referring to Figure 23The described display device DD5 may be substantially the same as the display device DD4 described with reference to Figure 22 In the following, descriptions of components that are the same as those of the display device DD4 described with reference to Figure 22 will be omitted or simplified.

[0161] Here, the second reinforcing member 440 may be substantially the same as the description of the second reinforcing member 440 described with reference to Figure 17 In the following, descriptions of components that are the same as those described with reference to Figure 17 will be omitted or simplified.

[0162] With reference to Figure 23 , the display device DD5 may include both the convex portion 240 and the second reinforcing member 440. In an embodiment, the second reinforcing member 440 may be disposed within the recess CP defined in the plane of the array substrate 100.

[0163] The second reinforcing member 440 may be arranged to be spaced apart from the convex portion 240. In other words, each of the second reinforcing members 440 may not contact the convex portion 240 on the array substrate 100.

[0164] The covering member 300 may contact the portion of the base portion 220 that overlaps with the peripheral region NDA, the upper surfaces of each of the convex portion 240 and the second reinforcing member 440. Since the display device DD5 includes both the convex portion 240 and the second reinforcing member 440, the warping phenomenon of the covering member 300 can be further reduced or prevented.

[0165] Figure 24 is a plan view showing a display device DD6 according to an embodiment of the present disclosure.

[0166] Except that the display device DD6 further includes the second reinforcing member 440, the display device DD6 described with reference to Figure 24 may be substantially the same as the display device DD4 described with reference to Figure 22 In the following, descriptions of components that are the same as those of the display device DD4 described with reference to Figure 22 will be omitted or simplified.

[0167] Here, the second reinforcing member 440 may be substantially the same as the explanation of the second reinforcing member 440 described with reference to Figure 17 In the following, descriptions of components that are the same as those described with reference to Figure 17 will be omitted or simplified.

[0168] With reference to Figure 24 , the display device DD6 may include the convex portion 240, the first reinforcing member 420, and the second reinforcing member 440. In an embodiment, the first reinforcing member 420 and the second reinforcing member 440 may be disposed within the recess CP defined in the plane of the array substrate 100.

[0169] The first reinforcing member 420 and the second reinforcing member 440 may be arranged to be spaced apart from the convex portion 240. In other words, each of the first reinforcing member 420 and the second reinforcing member 440 may not contact the convex portion 240 on the array substrate 100.

[0170] The covering member 300 may contact the portion of the base portion 220 that overlaps with the peripheral region NDA, the convex portion 240, and the upper surfaces of each of the first reinforcing member 420 and the second reinforcing member 440. Since the display device DD6 includes all of the convex portion 240, the first reinforcing member 420, and the second reinforcing member 440, the warping phenomenon of the covering member 300 can be further reduced or prevented.

[0171] However, in Figure 22 , Figure 23 and Figure 24 , the description focuses on examples in which the flexible circuit film FPC is not flexible and the circuit board PCB is spaced apart from the array substrate 100 in the first direction DR1, but the utility model is not necessarily limited thereto. For example, in the display devices DD4, DD5, and DD6 according to various embodiments described with reference to Figure 22 , Figure 23 and Figure 24 , as described with reference to Figure 6 , Figure 7 and Figure 8 , the flexible circuit film FPC may be flexible. Therefore, the circuit board PCB can be placed under the array substrate 100 by bending the flexible circuit film FPC.

[0172] The display device DD according to various embodiments of the utility model may include, in the pad region PA, the convex portion 240 and / or the reinforcing member 400 of the encapsulation layer 200 extending from the peripheral region NDA to the pad region PA. Therefore, since the thickness of the display device DD increases in the pad region PA, cracks in the array substrate 100 can be reduced or prevented. In addition, the covering member 300 covering the planar region of the pad region PA may contact the convex portion 240 and / or the reinforcing member 400 of the encapsulation layer 200 within the pad region PA. In addition, the contact surface of the covering member 300 with other components on the array substrate 100 can be enlarged. Therefore, the phenomenon that the covering member 300 warps from the lower stacked structure including the array substrate 100 can be reduced or prevented. Therefore, the durability of the display device DD can be improved.

[0173] The display device DD according to an embodiment may be applied to a display device DD included in a computer, a notebook, a mobile phone, a smartphone, a smart tablet, a PMP, a PDA, an MP3 player, or the like.

[0174] Although the display device DD according to the embodiments has been described with reference to the accompanying drawings, the illustrated embodiments are examples, and those skilled in the art can modify and change them without departing from the technical spirit described in the appended claims.

Claims

1. A display device, characterized in that: The display device comprises: An array substrate, comprising a display area, a peripheral area and a pad area in sequence in a first direction, wherein the display area comprises pixels; driving chips, on the array substrate, in the pad region, the driving chips being arranged spaced apart from each other along a second direction intersecting the first direction; an encapsulation layer on the array substrate and covering the pixels, the encapsulation layer comprising: a base portion overlapping the display area and the peripheral area; and a convex portion protruding from one side of the base portion in the first direction, the convex portion overlapping the pad area; and A covering member covers the driving chip, wherein the covering member contacts the protrusion of the encapsulation layer in the pad region.

2. The display device according to claim 1, characterized in that The base portion and the convex portion together define a single concave portion of the encapsulation layer, and The driving chip is entirely within the single recess of the packaging layer.

3. The display device according to claim 1, characterized in that One of the protrusions is between the driving chips.

4. The display device according to claim 1, characterized in that The convex portion extends to an end portion of the array substrate farthest from the display area in the first direction.

5. The display device according to claim 1, characterized in that The display device further includes: a reinforcing member, on the array substrate, in the pad region, in: The base portion and the convex portion together define a concave portion of the encapsulation layer, The reinforcing member is within the recessed portion of the encapsulation layer, and The covering member also contacts the reinforcing member in the pad region.

6. The display device according to claim 5, characterized in that: The reinforcing member includes first reinforcing patterns that are spaced apart from each other along the first direction, and one of the driving chips is between the first reinforcing patterns.

7. The display device according to claim 5, characterized in that: The reinforcing member includes second reinforcing patterns that are spaced apart from each other in the second direction, and one of the driving chips is between the second reinforcing patterns.

8. A display device, characterized in that: The display device comprises: An array substrate, comprising a display area, a peripheral area and a pad area in sequence in a first direction, wherein the display area comprises pixels; driving chips, on the array substrate, in the pad region, the driving chips being arranged spaced apart from each other along a second direction intersecting the first direction; An encapsulation layer, on the array substrate and covering the pixels; a reinforcing member, on the array substrate, in the pad region, the reinforcing member being spaced apart from each of the encapsulation layer and the driving chip; and A covering member covers the driving chip, wherein the covering member contacts the reinforcing member in the pad region.

9. The display device according to claim 8, characterized in that: The reinforcing member includes first reinforcing patterns that are spaced apart from each other along the first direction, and one of the driving chips is between the first reinforcing patterns.

10. The display device according to claim 8, characterized in that The reinforcing member includes second reinforcing patterns that are spaced apart from each other along the second direction, and one of the driving chips is between the second reinforcing patterns.

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