Adhesive removing device for semiconductor packaging structure

Abstract

The utility model discloses a degumming device for a semiconductor packaging structure, which comprises a conveying channel with a U-shaped cross section, the left side and the right side in the conveying channel are respectively provided with a polishing plate which is obliquely arranged, one end of the conveying channel is provided with a reciprocating screw rod, the movable end of the reciprocating screw rod is provided with a clamping piece, and the clamping piece is provided with a clamping groove. A limiting piece is installed at the end, away from the reciprocating lead screw, of the clamping piece and slidably connected between the two grinding plates. The abutting plates are inserted into the two sides, close to the polishing plate, of the rectangular cylinder, the adjusting structure composed of the screw, the nut and the inclined block is installed on the lower surface of the rectangular cylinder, the positions of the abutting plates are adjusted through the adjusting structure, and therefore a semiconductor is clamped, and the semiconductor pin is slidably polished when making contact with the polishing plate. And the semiconductor pin is prevented from being damaged.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of semiconductor packaging, and particularly relates to a degumming device for a semiconductor packaging structure. Background Technique

[0002] Semiconductors are used in fields such as integrated circuits and communication systems. The core units of most electronic products are extremely closely related to semiconductors. After wire bonding the die and the frame during the semiconductor production process, plastic encapsulation is required. The plastic encapsulation wraps the die to prevent moisture from affecting its performance during use. However, if the operation is improper during plastic encapsulation, residual glue will remain outside the semiconductor pins, and the residual glue needs to be removed. Otherwise, it will affect subsequent processes such as lead frame trimming and forming, resulting in unqualified semiconductors produced.

[0003] Currently, the residual glue on semiconductor pins is usually removed by scraping with a blade. However, scraping with a blade is likely to accidentally damage the semiconductor pins, resulting in damage to the semiconductor pins. Therefore, a new degumming device for a semiconductor packaging structure is needed. Summary of the Utility Model

[0004] The technical solution of the utility model provides a solution significantly different from the prior art solution for the prior art solution. It mainly provides a degumming device for a semiconductor packaging structure to solve the technical problem that scraping the encapsulation glue on semiconductor pins with a blade is likely to damage the semiconductor pins as mentioned in the above background technique.

[0005] The technical solution adopted by the utility model to solve the above technical problem is as follows:

[0006] A degumming device for a semiconductor packaging structure includes a conveying channel with a U-shaped cross-section. On both the left and right sides inside the conveying channel, there are inclined grinding plates installed. The distance between the two grinding plates on the side facing the reciprocating screw rod is smaller than the distance between the two grinding plates on the side away from the reciprocating screw rod. One end of the conveying channel is provided with a reciprocating screw rod, and the movable end of the reciprocating screw rod is provided with a clamping member. One end of the clamping member away from the reciprocating screw rod is provided with a limiting member, and the limiting member is slidably connected between the two grinding plates.

[0007] Preferably, the clamping member includes a rectangular cylinder, the rectangular cylinder is connected to the movable end of the reciprocating screw rod, the limiting member is connected to the rectangular cylinder, on both sides of the rectangular cylinder facing the grinding plate, there are abutting plates inserted. One end of the abutting plate away from the rectangular cylinder is in contact with the inner side of the semiconductor pin. A circular hole is opened on the lower surface of the rectangular cylinder, and an adjusting member is inserted into the circular hole. The adjusting member is in contact with the abutting plate on both sides inside the circular hole.

[0008] Preferably, the adjusting member includes a screw rod, the screw rod is inserted into the round hole, an inclined block is installed at one end of the screw rod in the round hole, the inclined block contacts with the two abutting plates, a nut is threadedly connected to the end of the screw rod away from the inclined block, and the nut is arranged on the lower surface of the rectangular cylinder.

[0009] Preferably, anti-slip lines are provided at one end of the abutting plate away from the rectangular cylinder.

[0010] Preferably, the limiting member includes a connecting block, the connecting block is installed on the side of the rectangular cylinder away from the reciprocating lead screw, rectangular holes are provided on both the left and right sides of the connecting block, inclined plates are inserted into the rectangular holes, and a connecting rod is installed between the inclined plates and the abutting plates.

[0011] Preferably, a notch is provided on one side of the inclined plate away from the abutting plate, a brush is installed in the notch, and one end of the brush away from the inclined plate contacts with the grinding plate.

[0012] Preferably, a collection groove is provided in the conveying channel, and a collection frame is installed below the collection groove.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. By inserting abutting plates on both sides of the rectangular cylinder close to the grinding plate, and then installing an adjusting structure composed of a screw rod, a nut and an inclined block on the lower surface of the rectangular cylinder, the position of the abutting plate is adjusted by the adjusting structure to clamp the semiconductor, so that the semiconductor pins are slidably ground when contacting the grinding plate, avoiding damage to the semiconductor pins.

[0015] 2. At the same time, the length of the inclined block outside the rectangular groove is adjusted by the adjusting structure, so as to meet the removal of the surface sealant of semiconductors of different sizes.

[0016] 3. By installing an inclined plate on the side of the rectangular cylinder away from the reciprocating lead screw, using the abutting effect of the inclined plate and the grinding plate, it is avoided that the semiconductor pins are ground when the moving end of the reciprocating lead screw deviates during movement. At the same time, the brush installed on the inclined plate can remove the sealant adhered to the grinding plate.

[0017] The present utility model will be explained in detail below in combination with the drawings and specific embodiments. Description of the Drawings

[0018] Figure 1 is a three-dimensional schematic diagram of the present utility model;

[0019] Figure 2 is an assembly schematic diagram of the rectangular cylinder and the rectangular plate of the present utility model;

[0020] Figure 3 is an assembly schematic diagram of the abutting plate, the connecting rod and the inclined plate of the present utility model.

[0021] Markings in the figure:

[0022] 1. Conveyor channel; 2. Collection box; 3. Grinding plate; 4. Reciprocating lead screw; 5. Rectangular cylinder; 6. Brush; 7. Inclined plate; 8. Connecting block; 9. Anti-slip pattern; 10. Supporting plate; 11. Nut; 12. Screw; 13. Inclined block; 14. Connecting rod. Detailed implementation manners

[0023] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the disclosure of the present utility model more thorough and comprehensive.

[0024] It should be noted that when an element is referred to as being "fixedly provided on" another element, it can be directly on the other element or there can be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] Please refer specifically to the attached Figures 1-3 , A debonding device for a semiconductor packaging structure, including a conveyor channel 1 with a U-shaped cross-section. On both the left and right sides inside the conveyor channel 1, inclined grinding plates 3 are installed. The distance between the two grinding plates 3 on the side facing the reciprocating lead screw 4 is smaller than the distance between the two grinding plates 3 on the side away from the reciprocating lead screw 4. A rectangular cylinder 5 is installed at the movable end of the reciprocating lead screw 4, and supporting plates 10 are inserted at both ends of the rectangular cylinder 5 close to the grinding plates 3. The end of the supporting plate 10 away from the rectangular cylinder 5 is in contact with the inner side of the semiconductor pin, and an anti-slip pattern 9 is provided at the end of the supporting plate 10 away from the rectangular cylinder 5. Then, a round hole is opened on the lower surface of the rectangular cylinder 5, and a screw 12 is inserted into the round hole. An inclined block 13 is installed at one end of the screw 12 inside the round hole. The inclined block 13 is in contact with two adjusting plates. A nut 11 is threadedly connected to the end of the screw 12 away from the inclined block 13, and the nut 11 is arranged on the lower surface of the rectangular cylinder 5.

[0027] The position of the supporting plate 10 is adjusted by the adjustment structure to clamp the semiconductor position, so that the semiconductor pin is slid and polished when in contact with the polishing plate 3 to avoid damage to the semiconductor pin. At the same time, the length of the inclined block 13 outside the rectangular groove is adjusted by the adjustment structure to meet the requirements of removing the surface sealant of semiconductor pins of different sizes.

[0028] A connecting block is installed on the side of the rectangular tube 5 away from the reciprocating screw 4. Rectangular holes are provided on the left and right sides of the connecting block, and an inclined plate 7 is inserted into the rectangular hole. The inclined plate 7 is in contact with the polishing plate 3, and the inclined plate 7 is in contact with the edge of the semiconductor. A connecting rod 14 is installed between the inclined plate 7 and the supporting plate 10. The movement of the supporting plate 10 is utilized to drive the inclined plate 7 to adjust its position, so as to prevent the semiconductor pins from being polished when the movable end of the reciprocating screw 4 deviates in movement.

[0029] A notch is then formed on the side of the inclined plate 7 away from the supporting plate 10, and a brush 6 is installed in the notch. One end of the brush 6 away from the inclined plate 7 contacts the grinding plate 3, and the brush 6 is used to remove the sealant adhered to the grinding plate.

[0030] In order to collect the sealing glue dropped during the polishing of the semiconductor, a collecting groove is opened in the conveying channel 1, and a collecting frame 2 is installed under the collecting groove, and the collecting frame 2 is used to collect the dropped sealing glue.

[0031] The specific operation process of the utility model is as follows: the semiconductor is placed on the rectangular tube 5, and the semiconductor is restricted by two inclined blocks 13, and then the movable end of the reciprocating screw rod 4 drives the rectangular tube 5 to move in a rectangular shape, so that the sealing glue adhered to the semiconductor pin contacts with the inclined grinding block, and grinds the sealing glue on the semiconductor pin to remove the sealing glue.

[0032] As the rectangular tube 5 moves between the two grinding plates 3, the inclined plate 7 installed on the connecting plate 8 gets closer and closer to the inclined plate 7. When the direct grinding plate 3 is about to grind the semiconductor pin, the inclined plate 7 contacts the grinding plate 3, thereby limiting the movable end of the reciprocating screw 4 from continuing to move, thereby preventing the semiconductor pin from being polished when the movable end of the reciprocating screw 4 deviates in movement.

[0033] At the same time, when the inclined plate 7 is not in contact with the polishing plate 3, the brush 6 installed on the inclined plate 7 is in contact with the polishing plate 3 to remove the sealant adhered to the polishing plate 3 when the sealant is polished.

[0034] The above description of the utility model in combination with the accompanying drawings is an exemplary description. Obviously, the specific implementation of the utility model is not limited to the above-mentioned method. As long as the non-substantial improvements are made by adopting the method concept and technical solution of the utility model, or the concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A debonding device for a semiconductor packaging structure, comprising a delivery channel (1) having a U-shaped cross section, characterized in that: Inclined grinding plates (3) are installed on both sides of the conveying channel (1), and the spacing between the two grinding plates (3) facing the reciprocating screw rod (4) is smaller than the spacing between the two grinding plates (3) away from the reciprocating screw rod (4). A reciprocating screw rod (4) is installed at one end of the conveying channel (1), and a clamping member is installed at the movable end of the reciprocating screw rod (4). A limiting member is installed at the end of the clamping member away from the reciprocating screw rod (4), and the limiting member is slidably connected between the two grinding plates (3).

2. The debonding device for semiconductor packaging structure according to claim 1, characterized in that: The clamping member comprises a rectangular tube (5), the rectangular tube (5) being connected to the movable end of the reciprocating screw rod (4), the limiting member being connected to the rectangular tube (5), both sides of the rectangular tube (5) facing the grinding plate (3) being plugged with abutment plates (10), one end of the abutment plate (10) away from the rectangular tube (5) being in contact with the inner side of the semiconductor pin, a circular hole being provided on the lower surface of the rectangular tube (5), an adjusting member being plugged into the circular hole, and both sides of the adjusting member being in contact with the abutment plates (10) in the circular hole.

3. The debonding device for semiconductor packaging structure according to claim 2, characterized in that: The adjusting member comprises a screw rod (12), the screw rod (12) being inserted into the circular hole, an inclined block (13) being installed at one end of the screw rod (12) in the circular hole, the inclined block (13) being in contact with two abutting plates (10), and a nut (11) being threadedly connected at one end of the screw rod (12) away from the inclined block (13), the nut (11) being arranged on the lower surface of the rectangular cylinder (5).

4. The debonding device for semiconductor packaging structure according to claim 2, characterized in that: An end of the supporting plate (10) away from the rectangular tube (5) is provided with an anti-slip pattern (9).

5. The debonding device for semiconductor packaging structure according to claim 2, characterized in that: The limiting member comprises a connecting block (8), the connecting block (8) being mounted on a side of the rectangular cylinder (5) away from the reciprocating screw rod (4), the connecting block (8) being provided with rectangular holes on both left and right sides, the inclined plates (7) being inserted into the rectangular holes, the inclined plates (7) being in contact with the grinding plate (3), and a connecting rod (14) being mounted between the inclined plates (7) and the abutting plate (10).

6. The debonding device for semiconductor packaging structure according to claim 5, characterized in that: A notch is provided on one side of the inclined plate (7) away from the supporting plate (10), a brush (6) is installed in the notch, and an end of the brush (6) away from the inclined plate (7) is in contact with the grinding plate (3).

7. The debonding device for semiconductor packaging structure according to claim 6, characterized in that: A collecting trough is provided in the conveying channel (1), and a collecting frame (2) is installed below the collecting trough.

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