Test fixture
By designing a test fixture that includes switching units, device interfaces and placement seats, the problem that the prior art cannot test different lines of the semiconductor packaging module is solved, and a more efficient testing process is achieved.
Patent Information
- Application Number
- CN202421399731.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-18
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-06-18
AI Technical Summary
The prior art test fixtures cannot test different test lines of semiconductor packaging modules in the same package, resulting in inefficient testing.
A test fixture is designed, including a switching unit, a device interface and a placement seat. The test pins are connected through multiple wiring pins of the switching unit to switch the test line through the preset operating part.
It realizes flexible switching of different test lines of semiconductor packaging modules in the same package, and improves the testing efficiency of semiconductor packaging modules.
Smart Images
Figure CN223038092U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor testing technologies, and more particularly, to a test fixture. Background Art
[0002] With the continuous development of the semiconductor industry, the demand for test fixtures for semiconductor packaging modules is also increasing.
[0003] In the prior art, semiconductor packaging modules of the same package are generally placed in a dedicated test fixture to implement the testing of the semiconductor packaging module.
[0004] However, the test fixture of the prior art can only test one test line of the semiconductor packaging module of the same package, and cannot test different lines of the semiconductor packaging module of the same package. Summary of the Utility Model
[0005] The purpose of this application is to provide a test fixture that can connect test pins through multiple connection pins of a switch unit, and switch the test line for the semiconductor packaging module to be tested through a preset operation unit, so as to realize the testing of different lines of the semiconductor packaging module of the same package, and thus improve the testing efficiency of the semiconductor packaging module.
[0006] To achieve the above purpose, the technical solutions adopted in the embodiments of this application are as follows:
[0007] In a first aspect, an embodiment of this application provides a test fixture, which includes: a fixture body, and a switch unit, a device interface, and a placement seat provided on the fixture body;
[0008] Among them, the device interface is used to connect an external device, the placement seat is used to place the semiconductor packaging module to be tested, the placement seat is integrally provided with test pins, and when the semiconductor packaging module to be tested is placed on the placement seat, the test points of the semiconductor packaging module to be tested are connected to some or all of the test pins;
[0009] The device interface is also connected to the test pins, the common pin of the switch unit is connected to a preset operation unit, and multiple connection pins of the switch unit are connected to the test pins, so as to switch the test line for the semiconductor packaging module to be tested through the preset operation unit.
[0010] Optionally, the device interface includes: a first device interface and a second device interface, the first device interface is used to connect an external power supply device, and the second device interface is used to connect an external sampling device;
[0011] The test pins include: a power supply test pin, a sampling test pin, and a control test pin;
[0012] The sampling test pin is connected to the second device interface, the first device interface is connected to the power supply test pin, and the control test pins are all connected to the first device interface.
[0013] Optionally, the power supply test pins include: a first test pin and a third test pin, the sampling test pins include: a second test pin, a fifth test pin, and a seventh test pin, and the control test pins include: a fourth test pin and a sixth test pin; wherein, the first test pin and the third test pin are both connected to the first device interface, the second test pin, the fifth test pin, and the seventh test pin are all connected to the second device interface, and the fourth test pin and the sixth test pin are both connected to the first device interface.
[0014] Optionally, the switch unit includes: a first switch unit and a second switch unit;
[0015] Wherein, the second pin of the first switch unit and the second pin of the second switch unit are respectively connected to a first operation part and a second operation part, the first pin of the first switch unit is connected to the fifth test pin, and the third connection pin of the first switch unit is connected to the second test pin;
[0016] The first pin of the second switch unit is connected to the seventh test pin, and the third pin of the second switch unit is connected to the first test pin.
[0017] Optionally, the semiconductor package module to be tested is a packaged series thyristor module. When the second pin of the first switch unit is connected to the first pin and the second pin of the second switch unit is connected to the first pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series thyristor module. The test circuit of the series thyristor module includes: the test circuit of the fifth test pin and the test circuit of the seventh test pin.
[0018] Optionally, the semiconductor package module to be tested is a packaged series diode module. When the second pin of the first switch unit is connected to the third pin and the second pin of the second switch unit is connected to the third pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series diode module. The test circuit of the series diode module includes: the test circuit of the first test pin and the test circuit of the second test pin.
[0019] Optionally, the semiconductor package module to be tested is a packaged thyristor diode module. When the second pin of the first switch unit is connected to the first pin and the second pin of the second switch unit is connected to the third pin, the test circuit of the semiconductor package module to be tested is the test circuit of the thyristor diode module. The test circuit of the thyristor diode module includes: the test circuit of the first test pin and the test circuit of the fifth test pin.
[0020] Optionally, both the first switch unit and the second switch unit are knife switch units, and the first operating part and the second operating part are operating rods;
[0021] When the operating rod of the knife switch unit faces the preset second direction, the second pin of the knife switch unit is vacant; when the operating rod of the knife switch unit faces the preset first direction, the second pin of the knife switch unit is connected to the first pin; when the operating rod of the knife switch unit faces the preset third direction, the second pin of the knife switch unit is connected to the third pin.
[0022] Optionally, the first test pin, the second test pin, and the third test pin respectively extend out through the first interface area, the second interface area, and the third interface area on the placement seat;
[0023] The fourth test pin, the fifth test pin, the sixth test pin, and the seventh test pin extend out through the fourth interface area on the placement seat.
[0024] Optionally, both the first switch unit and the second switch unit are push-button switch units, and the first operating part and the second operating part are operating buttons.
[0025] The beneficial effects of the test fixture provided by this application are:
[0026] The present application provides a test fixture, which includes: a fixture body, a switch unit, a device interface, and a placement seat provided on the fixture body; wherein, the device interface is used to connect an external device, the placement seat is used to place a semiconductor package module to be tested, and test pins are integrally provided on the placement seat. When the semiconductor package module to be tested is placed on the placement seat, some or all of the test points of the semiconductor package module to be tested are connected to the test pins; the device interface is also connected to the test pins, the common pin of the switch unit is connected to a preset operation part, and multiple connection pins of the switch unit are connected to the test pins, so as to switch the test circuit for the semiconductor package module to be tested through the preset operation part. Thus, in the present application, since the common pin of the switch unit is connected to the preset operation part, the test circuit for the semiconductor package module to be tested can be flexibly switched through the preset operation part, thereby realizing the test of different circuits of the semiconductor package module with the same package, and further improving the test efficiency of the semiconductor package module and facilitating production operations. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.
[0028] Figure 1 FIG. is a schematic structural diagram of a test fixture provided by an embodiment of the present application;
[0029] Figure 2 FIG. is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 1 ;
[0030] Figure 3 FIG. is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 2 ;
[0031] Figure 4 FIG. is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 3 ;
[0032] Figure 5 FIG. is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 4 ;
[0033] Figure 6 FIG. is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 5 ;
[0034] Figure 7 FIG. is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 6;
[0035] Figure 8 The circuit schematic of a test fixture provided by an embodiment of the present application Figure 7 ;
[0036] Figure 9 The structural schematic diagram of a knife switch unit provided by an embodiment of the present application. Detailed implementation manners
[0037] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.
[0038] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.
[0039] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0040] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships when the utility model product is normally placed, or the orientation or positional relationships commonly understood by those skilled in the art. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.
[0041] In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.
[0042] In the description of this application, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "linked" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0043] To better understand the various solutions provided by the embodiments of this application, the following will successively combine the accompanying drawings to provide a detailed description of a test fixture provided by the embodiments of this application.
[0044] The following will first provide an example description of the test fixture provided by the embodiments of this application in combination with the accompanying drawings. Figure 1 It is a schematic structural diagram of a test fixture provided by an embodiment of this application. As Figure 1 shown, the test fixture 100 may include: a fixture body 110, and a switch unit 120, a device interface 130, and a placement seat 140 provided on the fixture body 110.
[0045] Among them, the device interface 130 is used to connect an external device, and the external device can be selected according to actual circumstances. The placement seat 140 is used to place the semiconductor package module to be tested. Among them, the way the semiconductor package module to be tested is placed in the placement seat 140 can be selected according to actual circumstances. For example, this placement method can be a snap connection method, that is, the semiconductor package module to be tested can be snap-connected in the placement seat 140 to facilitate the placement in the placement seat 140.
[0046] The placement seat 140 is integrally provided with test pins 141. When the semiconductor package module to be tested is placed on the placement seat 140, some or all of the test points of the semiconductor package module to be tested are connected to some or all of the test pins 141, so that some or all of the test points of the semiconductor package module to be tested are correspondingly connected to the test pins 141 in the placement seat 140; the device interface 130 is also connected to the test pins 141, and is used to collect the data of the test pins 141 or provide signals to the test pins 141.
[0047] The common pin 2 of the switch unit 120 is connected to a preset operation part, which can be understood as a part that can be directly operated by the user. The form of this preset operation part can be selected according to actual circumstances. For example, the form of this preset operation part can be a toggle form or a button form. Multiple wiring pins of the switch unit 120 are connected to the test pins 141 to switch the test circuit for the semiconductor package module to be tested through the preset operation part.
[0048] Exemplarily, for a clear understanding of the circuit wiring in the test fixture, Figure 2Circuit schematic of a test fixture provided by an embodiment of the present application Figure 1 As Figure 2 shown, the device interface 130 is connected to the test pin 141; the test pin 141 is connected to multiple wiring pins of the switch unit 120.
[0049] The present application provides a test fixture, including: a fixture body, and a switch unit, a device interface, and a placement seat provided on the fixture body; wherein, the device interface is used to connect an external device, the placement seat is used to place a semiconductor package module to be tested, and test pins are integrally provided on the placement seat. When the semiconductor package module to be tested is placed on the placement seat, the test points of the semiconductor package module to be tested are connected to some or all of the test pins; the device interface is also connected to the test pins, the common pin of the switch unit is connected to a preset operation part, and multiple wiring pins of the switch unit are connected to the test pins to switch the test circuit for the semiconductor package module to be tested through the preset operation part. Thus, in the present application, since the common pin of the switch unit is connected to the preset operation part, the test circuit for the semiconductor package module to be tested can be flexibly switched through the preset operation part, and then the tests of different circuits of the semiconductor package module with the same package can be realized, thereby improving the test efficiency of the semiconductor package module and facilitating production operations.
[0050] Continuing to refer to Figure 1 As Figure 1 shown, the device interface 130 may include: a first device interface 131 and a second device interface 132.
[0051] Among them, the first device interface 131 is used to connect an external power supply device to provide an electrical signal for the semiconductor package module to be tested placed on the placement seat in the test fixture 100; the second device interface 132 is used to connect an external sampling device to perform sampling analysis on the semiconductor package module to be tested in the test fixture 100.
[0052] Furthermore, the test fixture 100 is further illustrated by continuing to combine examples. Figure 3 Circuit schematic of a test fixture provided by an embodiment of the present application Figure 2 As Figure 3 shown, the test pin 141 may include: a power supply test pin, a sampling test pin, and a control test pin.
[0053] Among them, the sampling test pin is connected to the second device interface 132 to transmit sampling data to the second device interface 132 for the second device interface 132 to analyze the sampling data; the first device interface 131 is connected to the power supply test pin to provide an electrical signal for the power supply test pin, and the control test pins are all connected to the first device interface 131.
[0054] It should be noted that the first device interface 131 provides not only electrical signals but also control signals for the test fixture 100, which should not be construed as a limitation to this application.
[0055] The test fixture provided by this application, wherein the device interface includes: a first device interface and a second device interface. The first device interface is used to connect an external power supply device, and the second device interface is used to connect an external sampling device; the test pins include: a power supply test pin, a sampling test pin, and a control test pin; the sampling test pin is connected to the second device interface, the first device interface is connected to the power supply test pin, and the control test pins are all connected to the first device interface. Thus, this application can be used to implement the test of the semiconductor package module to be tested.
[0056] The test fixture 100 will be further illustrated by examples as follows. Figure 4 The circuit schematic of a test fixture provided by an embodiment of this application Figure 3 As Figure 4 shown, the power supply test pins may include: a first test pin (1) and a third test pin (3), the sampling test pins may include: a second test pin (2), a fifth test pin (5), and a seventh test pin (7), and the control test pins may include: a fourth test pin (4) and a sixth test pin (6).
[0057] Among them, the first test pin (1) and the third test pin (3) are both connected to the first device interface 131, and are used to provide power supply signals for the test pins of the test fixture 100;
[0058] The second test pin (2), the fifth test pin (5), and the seventh test pin (7) are all connected to the second device interface 132, and are used to transmit the sampling signals of the test fixture 100 to the second device interface 132, so as to facilitate the subsequent analysis of the sampling signals by the second device interface 132; the fourth test pin (4) and the sixth test pin (6) are both connected to the first device interface 131, and are used for the first device interface 131 to provide control signals for the test fixture 100.
[0059] It should be noted that among the test pins, the power supply test pin is a positive electrode pin; the sampling test pin is a negative electrode pin; the control test pin is a control electrode pin.
[0060] The test fixture provided by this application, wherein the power supply test pins include: a first test pin and a third test pin, the sampling test pins include: a second test pin, a fifth test pin, and a seventh test pin, and the control test pins include: a fourth test pin and a sixth test pin; wherein, the first test pin and the third test pin are both connected to a first device interface, the second test pin, the fifth test pin, and the seventh test pin are all connected to a second device interface, and the fourth test pin and the sixth test pin are both connected to the first device interface. Thus, this application can realize the testing of different circuits of the semiconductor packaging module through the wiring of different test pins, improving the testing efficiency of the semiconductor packaging module.
[0061] The test fixture 100 will be further illustrated by examples as follows. Figure 5 A circuit schematic of a test fixture provided by an embodiment of this application Figure 4 . As Figure 5 shown, the switch unit 120 may include: a first switch unit 121 and a second switch unit 122.
[0062] Among them, the second pin 2 of the first switch unit 121 and the second pin 2 of the second switch unit 122 are respectively connected to a first operation part and a second operation part, that is, the second pins of the first switch unit 121 and the second switch unit 122 are both common pins; the first pin 1 of the first switch unit 121 is connected to the fifth test pin (5), and the third wiring 3 pin of the first switch unit 121 is connected to the second test pin (2); the first pin 1 of the second switch unit 122 is connected to the seventh test pin (7), and the third pin 3 of the second switch unit 122 is connected to the first test pin (1).
[0063] The test fixture provided by this application, wherein the switch unit includes: a first switch unit and a second switch unit; wherein, the second pins of the first switch unit and the second switch unit are respectively connected to a first operation part and a second operation part, the first pin of the first switch unit is connected to the fifth test pin, and the third wiring pin of the first switch unit is connected to the second test pin; the first pin of the second switch unit is connected to the seventh test pin, and the third pin of the second switch unit is connected to the first test pin. Thus, this application can realize the testing of different circuits of the semiconductor packaging module through the wiring of different test pins, improving the testing efficiency of the semiconductor packaging module.
[0064] The test fixture 100 will be further illustrated by examples as follows. Figure 6 A circuit schematic of a test fixture provided by an embodiment of this application Figure 5 . As Figure 6As shown, if the semiconductor package module to be tested is a packaged series thyristor module, when the second pin 2 of the first switch unit 121 is connected to the first pin 1 and the second pin 2 of the second switch unit 122 is connected to the first pin 1, the test circuit of the semiconductor package module to be tested is the test circuit of the series thyristor module. The test circuit of the series thyristor module may include: the test circuit of the fifth test pin and the test circuit of the seventh test pin.
[0065] It should be noted that Figure 6 in which A is the positive electrode, K is the negative electrode, and G is the control electrode, that is, the first test pin (1) can be either the anode (such as A1) of the first thyristor D1 or the negative electrode K2 of the second thyristor D2.
[0066] The test fixture provided by the present application, wherein, if the semiconductor package module to be tested is a packaged series thyristor module, when the second pin of the first switch unit is connected to the first pin and the second pin of the second switch unit is connected to the first pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series thyristor module. The test circuit of the series thyristor module includes: the test circuit of the fifth test pin and the test circuit of the seventh test pin. Thus, the present application can connect the two ends of the circuit to the test fixture of the semiconductor package module to be tested flexibly by connecting the second pin of the switch unit to the first pin, so as to realize the test of the packaged series thyristor module.
[0067] The test fixture 100 will be further illustrated by examples as follows. Figure 7 is a circuit schematic diagram of a test fixture provided by an embodiment of the present application Figure 6 . As Figure 7 shown, if the semiconductor package module to be tested is a packaged series diode module, when the second pin 2 of the first switch unit 121 is connected to the third pin 3 and the second pin 2 of the second switch unit 122 is connected to the third pin 3, the test circuit of the semiconductor package module to be tested is the test circuit of the series diode module. The test circuit of the series diode module may include: the test circuit of the first test pin and the test circuit of the second test pin.
[0068] It should be noted that Figure 7 the first test pin (1) in which can be either the anode (such as A1) of the first diode D3 or the negative electrode K2 of the second diode D4.
[0069] The test fixture provided by the present application, wherein the semiconductor package module to be tested is a packaged series double diode module. When the second pin of the first switch unit is connected to the third pin, and the second pin of the second switch unit is connected to the third pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series double diode module. The test circuit of the series double diode module includes: the test circuit of the first test pin and the test circuit of the second test pin. Thus, the present application can connect the two ends of the circuit to the test fixture of the semiconductor package module to be tested flexibly by connecting the second pin of the switch unit to the third pin, so as to realize the test of the packaged series double diode module.
[0070] The test fixture 100 will be further illustrated by examples as follows. Figure 8 Schematic diagram of the circuit of a test fixture provided by an embodiment of the present application Figure 7 . As Figure 8 shown, if the semiconductor package module to be tested is a packaged series thyristor diode module, when the second pin 2 of the first switch unit 121 is connected to the first pin 1, and the second pin 2 of the second switch unit 122 is connected to the third pin 3, the test circuit of the semiconductor package module to be tested is the test circuit of the series thyristor diode module. The test circuit of the series thyristor diode module may include: the test circuit of the first test pin and the test circuit of the fifth test pin.
[0071] It should be noted that Figure 8 the first test pin (1) in
[0072] can be either the anode (such as A1) of the third thyristor D5 or the cathode K2 of the third diode D6.
[0073] Optionally, in a possible implementation embodiment, both the first switch unit 121 and the second switch unit 122 are knife switch units, and the first operation part and the second operation part are operating rods; that is, the first operation part and the second operation part are the preset operation parts of the first switch unit 121 and the second switch unit 122.
[0074] When the operating lever of the toggle switch unit 120 faces the preset second direction, the second pin 2 of the toggle switch unit 120 is vacant; when the operating lever of the toggle switch unit 120 faces the preset first direction, the second pin 2 of the toggle switch unit 120 is connected to the first pin 1; when the operating lever of the toggle switch unit 120 faces the preset third direction, the second pin 2 of the toggle switch unit 120 is connected to the third pin 3. Among them, the preset second direction, the preset first direction, and the preset third direction can be selected according to the actual situation.
[0075] Exemplarily, Figure 9 is a schematic structural diagram of a toggle switch unit provided by an embodiment of the present application. As Figure 9 shown, when the second pin 2 of the toggle switch unit 120 is connected to the first pin 1, the preset first direction is a left turn; as Figure 9 shown, when the second pin 2 of the toggle switch unit 120 is connected to the third pin 3, the preset third direction is a right turn.
[0076] For the test fixture provided by the present application, wherein both the first switch unit and the second switch unit are toggle switch units, and the first operating part and the second operating part are operating levers; when the operating lever of the toggle switch unit faces the preset second direction, the second pin of the toggle switch unit is vacant; when the operating lever of the toggle switch unit faces the preset first direction, the second pin of the toggle switch unit is connected to the first pin; when the operating lever of the toggle switch unit faces the preset third direction, the second pin of the toggle switch unit is connected to the third pin. Thus, according to the operating lever on the toggle switch unit, the present application realizes flexible switching of the test circuit for the semiconductor package module to be tested, and further realizes the test of different circuits of the semiconductor package module with the same package, thereby improving the test efficiency of the semiconductor package module and facilitating production operations.
[0077] Optionally, in a possible implementation embodiment, continue to refer to Figure 1 , the first test pin (1), the second test pin (2), and the third test pin (3) respectively extend out through the first interface area, the second interface area, and the third interface area on the placement seat; the fourth test pin (4), the fifth test pin (5), the sixth test pin (6), and the seventh test pin (7) extend out through the fourth interface area on the placement seat; to realize the connection of some or all of the test points of the semiconductor package module to be tested with the test pins, thereby realizing the test of the semiconductor package module to be tested.
[0078] Optionally, in a possible implementation embodiment, both the first switch unit 121 and the second switch unit 122 are push-button switch units, and the first operating part and the second operating part are operating buttons, that is, the first operating part and the second operating part are the preset operating parts of the first switch unit 121 and the second switch unit 122.
[0079] When the operating rod of the push-button switch unit 120 faces the preset second direction, the second pin 2 of the push-button switch unit 120 is vacant; when the operating rod of the push-button switch unit 120 faces the preset first direction, the second pin 2 of the push-button switch unit 120 is connected to the first pin 1; when the operating rod of the push-button switch unit 120 faces the preset third direction, the second pin 2 of the push-button switch unit 120 is connected to the third pin 3.
[0080] In the test fixture provided by the present application, the first switch unit and the second switch unit are both push-button switch units, and the first operating part and the second operating part are operating buttons. Thus, according to the operating rod on the push-button switch unit, the present application realizes flexible switching of the test circuit for the semiconductor package module to be tested, and further realizes the test of different circuits of the semiconductor package module of the same package, thereby improving the test efficiency of the semiconductor package module and facilitating production operations.
[0081] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A test fixture, characterized in that: The test fixture comprises: a fixture body, and a switch unit, a device interface and a placement seat arranged on the fixture body; Wherein, the device interface is used to connect an external device, the placement seat is used to place the semiconductor package module to be tested, and the placement seat is integrated with test pins. When the semiconductor package module to be tested is placed on the placement seat, the test points of the semiconductor package module to be tested are connected to part or all of the test pins; The device interface is also connected to the test pin, the common pin of the switch unit is connected to the preset operation unit, and the multiple connection pins of the switch unit are connected to the test pin, so as to switch the test circuit for the semiconductor package module to be tested through the preset operation unit.
2. The test fixture according to claim 1, characterized in that: The device interface comprises: a first device interface and a second device interface, the first device interface is used to connect to an external power supply device, and the second device interface is used to connect to an external sampling device; The test pins include: a power supply test pin, a sampling test pin, and a control test pin; The sampling test pin is connected to the second device interface, the first device interface is connected to the power supply test pin, and the control test pins are connected to the first device interface.
3. The test fixture according to claim 2, characterized in that: The power supply test pin includes: a first test pin and a third test pin, the sampling test pin includes: a second test pin, a fifth test pin and a seventh test pin, and the control test pin includes: a fourth test pin and a sixth test pin; wherein, the first test pin and the third test pin are both connected to the first device interface, the second test pin, the fifth test pin and the seventh test pin are both connected to the second device interface, and the fourth test pin and the sixth test pin are both connected to the first device interface.
4. The test fixture according to claim 3, characterized in that: The switch unit comprises: a first switch unit and a second switch unit; The second pin of the first switch unit and the second pin of the second switch unit are connected to the first operating part and the second operating part respectively, the first pin of the first switch unit is connected to the fifth test pin, and the third connection pin of the first switch unit is connected to the second test pin; The first pin of the second switch unit is connected to the seventh test pin, and the third pin of the second switch unit is connected to the first test pin.
5. The test fixture according to claim 4, characterized in that: The semiconductor package module to be tested is a packaged series dual thyristor module, the second pin of the first switch unit is connected to the first pin, and when the second pin of the second switch unit is connected to the first pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series dual thyristor module, and the test circuit of the series dual thyristor module includes: the test circuit of the fifth test pin and the test circuit of the seventh test pin.
6. The test fixture according to claim 4, characterized in that: The semiconductor package module to be tested is a packaged series dual diode module. The second pin of the first switch unit is connected to the third pin. When the second pin of the second switch unit is connected to the third pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series dual diode module. The test circuit of the series dual diode module includes: a test circuit of the first test pin and a test circuit of the second test pin.
7. The test fixture according to claim 4, characterized in that: The semiconductor package module to be tested is a packaged series thyristor diode module. When the second pin of the first switch unit is connected to the first pin and the second pin of the second switch unit is connected to the third pin, the test circuit of the semiconductor package module to be tested is the test circuit of the series thyristor diode module, and the test circuit of the series thyristor diode module includes: a test circuit of the first test pin and a test circuit of the fifth test pin.
8. The test fixture according to claim 4, characterized in that: The first switch unit and the second switch unit are both toggle switch units, and the first operating part and the second operating part are operating rods; When the operating lever of the button switch unit is directed toward a preset second direction, the second pin of the button switch unit is vacant; when the operating lever of the button switch unit is directed toward a preset first direction, the second pin of the button switch unit is connected to the first pin; when the operating lever of the button switch unit is directed toward a preset third direction, the second pin of the button switch unit is connected to the third pin.
9. The test fixture according to claim 3, characterized in that: The first test pin, the second test pin and the third test pin extend through the first interface area, the second interface area and the third interface area on the placement seat respectively; The fourth test pin, the fifth test pin, the sixth test pin and the seventh test pin extend through a fourth interface area on the placement seat.
10. The test fixture according to claim 4, characterized in that: The first switch unit and the second switch unit are both button switch units, and the first operating portion and the second operating portion are operating buttons.