Four-channel medium-power electrostatic protection chip packaging structure

Abstract

The utility model discloses a four-channel medium-power electrostatic protection chip packaging structure, and relates to the technical field of semiconductors. The silver paste solders placed on the first pin and the third pin of the metal lead frame are respectively provided with a four-channel ultra-low-capacitance one-way electrostatic protection chip, two chip windows on the left side of the chip on the first pin are electrically connected with the sixth pin of the metal lead frame through metal wires, and two chip windows on the right side of the chip on the first pin are electrically connected with the fifth pin of the metal lead frame through metal wires. Two chip windows at the upper part of the chip on the pin 3 are electrically connected with the pin 4 of the metal lead frame through metal wires, and two chip windows at the lower part of the chip on the pin 3 are electrically connected with the pin 2 of the metal lead frame through metal wires; the peripheries of the metal lead frame, the silver paste solder, the four-channel ultra-low-capacitance unidirectional electrostatic protection chip and the metal wire are half wrapped by epoxy resin. The utility model has a high-efficiency electrostatic protection function, is small in volume, reduces the area of a printed circuit board and the chip mounting frequency, and reduces the cost.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor technology, and particularly to a packaging structure of a four-channel medium-power electrostatic protection chip. Background Art

[0002] The integration degree of communication integrated circuits in electronic products is getting higher and higher, and electromagnetic or electrostatic interference is more sensitive to communication integrated circuits. Therefore, electrostatic protection chips have become common matching devices for communication integrated circuits. Considering that electronic products need to use medium-power electrostatic protection diodes to pass lightning strike test certification and the communication rate of communication integrated circuits is getting higher and higher, it is required that the parasitic capacitance on its communication line must be less than 1 pF, or even lower; moreover, current electronic products are thin, light, and small, and the volume requirements for their components are as small as possible. Based on this, it is particularly necessary to design a packaging structure of a four-channel medium-power electrostatic protection chip. Summary of the Utility Model

[0003] Aiming at the deficiencies in the prior art, the purpose of the utility model is to provide a packaging structure of a four-channel medium-power electrostatic protection chip, which has a simple structure, reasonable design, small volume, reduces the area of the printed circuit board and the number of chip mounting times, has an efficient electrostatic protection function, reduces costs, and is easy to promote and use.

[0004] To achieve the above purpose, the utility model is realized by the following technical solutions: A packaging structure of a four-channel medium-power electrostatic protection chip includes a metal lead frame, silver paste solder, a four-channel ultra-low-capacitance unidirectional electrostatic protection chip, metal wires, and epoxy resin. Silver paste solder is placed on the 1st pin and the 3rd pin of the metal lead frame respectively, and a four-channel ultra-low-capacitance unidirectional electrostatic protection chip is placed on each silver paste solder. Among them, the two chip openings on the left side of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the 1st pin of the metal lead frame are electrically connected to the 6th pin of the metal lead frame through metal wires respectively, the two chip openings on the right side of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the 1st pin of the metal lead frame are electrically connected to the 5th pin of the metal lead frame through metal wires respectively, the two chip openings on the upper part of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the 3rd pin of the metal lead frame are electrically connected to the 4th pin of the metal lead frame through metal wires respectively, and the two chip openings on the lower part of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the 3rd pin of the metal lead frame are electrically connected to the 2nd pin of the metal lead frame through metal wires respectively; the periphery of the metal lead frame, silver paste solder, four-channel ultra-low-capacitance unidirectional electrostatic protection chip, and metal wires is semi-wrapped with epoxy resin to form a packaging structure of a four-channel medium-power ultra-low-capacitance electrostatic protection chip.

[0005] Preferably, the metal wire is one of silver alloy wire or gold wire.

[0006] Advantages of the present utility model: This device has an efficient electrostatic protection function, meeting the electrostatic protection requirements of small volume, high power, high-speed data signals, and multiple channels in electronic products. It is small in size, reducing the area of the printed circuit board and the number of chip mounting times, and also reducing costs, with broad application prospects. Description of the Drawings

[0007] The present utility model will be described in detail below in conjunction with the drawings and specific embodiments;

[0008] Figure 1 It is a structural schematic diagram of the present utility model. Specific Embodiments

[0009] To make the technical means, creative features, achieved purposes, and functions of the present utility model easy to understand, the present utility model will be further elaborated below in conjunction with specific embodiments.

[0010] Referring to Figure 1 , the following technical solution is adopted in this specific embodiment: A four-channel medium-power electrostatic protection chip packaging structure includes a metal lead frame A, silver paste solder B, a four-channel ultra-low-capacitance unidirectional electrostatic protection chip C, a metal wire D, and an epoxy resin E. Silver paste solders B are respectively placed on pins 1 and 3 of the metal lead frame A, and a four-channel ultra-low-capacitance unidirectional electrostatic protection chip C is placed on each silver paste solder B. Among them, the two chip openings on the left side of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C on pin 1 of the metal lead frame A are respectively electrically connected to pin 6 of the metal lead frame A through the metal wire D, and the two chip openings on the right side of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C on pin 1 of the metal lead frame A are respectively electrically connected to pin 5 of the metal lead frame A through the metal wire D. The two chip openings on the upper part of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C on pin 3 of the metal lead frame A are respectively electrically connected to pin 4 of the metal lead frame A through the metal wire D, and the two chip openings on the lower part of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C on pin 3 of the metal lead frame A are respectively electrically connected to pin 2 of the metal lead frame A through the metal wire D; the periphery of the metal lead frame A, silver paste solder B, four-channel ultra-low-capacitance unidirectional electrostatic protection chip C, and metal wire D is semi-wrapped by the epoxy resin E to form a four-channel medium-power ultra-low-capacitance electrostatic protection chip packaging structure.

[0011] In this specific embodiment, two four-channel ultra-low-capacitance unidirectional electrostatic protection chips C are connected through the metal lead frame A, silver paste solder B, and metal wire D in a specified circuit. The metal wire D is one of silver alloy wire or gold wire, and then semi-wrapped by the epoxy resin E to form an electrostatic protection chip containing four medium-power ultra-low-capacitance electrostatic protection channels.

[0012] This device is small in size, which can reduce the area of the printed circuit board and the number of chip mounting times, thereby reducing costs. It has an efficient electrostatic protection function, meeting the current requirements for thin, light, and compact electronic products and protecting their communication integrated circuits from electromagnetic / static interference. Moreover, it can pass the lightning strike test certification, satisfying the electrostatic protection needs of high-power, high-speed data signal multi-channels, and having broad market application prospects.

[0013] The above shows and describes the basic principles, main features, and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and all these changes and improvements fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A four-channel medium-power electrostatic protection chip packaging structure, characterized in that: The invention comprises a metal lead frame (A), silver paste solder (B), a four-channel ultra-low capacitance unidirectional electrostatic protection chip (C), a metal wire (D) and an epoxy resin (E), wherein silver paste solder (B) is placed on pins 1 and 3 of the metal lead frame (A), and a four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) is placed on each silver paste solder (B), wherein two chip opening windows on the left side of the four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) on pin 1 of the metal lead frame (A) are electrically connected to pin 6 of the metal lead frame (A) through metal wires (D), and two chip opening windows on the right side of the four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) on pin 1 of the metal lead frame (A) are electrically connected to pins 6 of the metal lead frame (A) through metal wires (D). ) is electrically connected to pin 5 of the metal lead frame (A), the two chip opening windows on the upper part of the four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) on pin 3 of the metal lead frame (A) are electrically connected to pin 4 of the metal lead frame (A) through metal wires (D), and the two chip opening windows on the lower part of the four-channel ultra-low capacitance unidirectional electrostatic protection chip (C) on pin 3 of the metal lead frame (A) are electrically connected to pin 2 of the metal lead frame (A) through metal wires (D); the metal lead frame (A), silver paste solder (B), four-channel ultra-low capacitance unidirectional electrostatic protection chip (C), and metal wire (D) are semi-wrapped with epoxy resin (E) to form a four-channel medium-power ultra-low capacitance electrostatic protection chip packaging structure.

2. A four-channel medium-power electrostatic protection chip packaging structure according to claim 1, characterized in that: The metal wire (D) is a silver alloy wire or a gold wire.

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