Laser precise regulation and control substrate surface modification device

Abstract

The utility model relates to a laser precise regulation and control substrate surface modification device, which belongs to the technical field of substrate modification, and comprises an outer frame and two gas delivery pipes, two connecting plates are fixed on the inner side of the bottom of the outer frame, a connecting plate and a sliding seat are fixed between the two connecting plates, the front surface of each connecting plate is provided with a regulating mechanism, and the regulating mechanism is provided with a gas delivery pipe. A sliding block is movably connected to the front face of the sliding seat, a fixing ring is fixed to the outer side of the gas conveying pipe, a stabilizing assembly is arranged on the inner side of the bottom of the outer frame, a substrate body is movably connected to the stabilizing assembly, a heat dissipation plate is fixed to the stabilizing assembly, and a cooling box is fixed to the bottom of the outer frame. According to the laser precise regulation and control substrate surface modification device, the gas environment is adjusted through the arrangement of the adjusting mechanism, the stability of the substrate body is improved, the substrate body is prevented from being cracked and damaged through the arrangement of the heat dissipation plate and the cooling box, the stability of the substrate body is improved, and therefore the adaptability of the substrate body is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of substrate modification, in particular to a device for precisely regulating and controlling the surface modification of a substrate by laser. Background Technique

[0002] During the use of a semiconductor laser, heat is generated by the laser chip. If the heat generated by the laser chip cannot be dissipated in time, it will cause a decline in its optoelectronic performance. In severe cases, it may even cause the laser chip to burn out. Currently, by arranging a chip substrate in the semiconductor laser and mounting the laser chip on the chip substrate, the heat generated by the laser chip can be conducted out through the chip substrate to reduce the junction temperature of the laser chip, so that the laser chip can work normally.

[0003] For example, a chip substrate, a chip substrate assembly and a laser (publication number: CN220107186U) of a Chinese patent include: a substrate, a first metal layer and a second metal layer. Among them, the substrate is made of an insulating and heat-conducting material. The first metal layer includes a first conductive region and a second conductive region. The first conductive region and the second conductive region are arranged at intervals on the first side of the substrate. The second metal layer is arranged on the second side of the substrate opposite to the first side. The first metal layer and the second metal layer are made of the same metal material. The ratio of the sum of the thicknesses of the first metal layer and the second metal layer to the thickness of the substrate is 0.43 - 0.80. Through the above method, while the chip substrate has heat-conducting ability, the comprehensive thermal expansion coefficient of the chip substrate matches the thermal expansion coefficient of the chip. When the chip works, it can avoid serious deformation or even cracking of the chip, thereby improving the stability of the optoelectronic performance of the chip during operation.

[0004] This patent exports the heat on the substrate through the setting of the metal layer on the substrate, thereby preventing the substrate from cracking and improving the stability of the chip. However, during the processing process, different processing materials may cause a large degree of damage to the substrate. Therefore, a device for precisely regulating and controlling the surface modification of the substrate by laser is proposed to solve the above-mentioned problems. Content of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a device for precisely regulating and controlling the surface modification of a substrate by laser, which has the advantages of good substrate stability and solves the problem of high damage degree of the substrate.

[0006] To achieve the above object, the present utility model provides the following technical solutions: a laser precision control substrate surface modification device, including an outer frame and two air pipes. Inside the bottom of the outer frame, two connecting plates are fixed. Between the two connecting plates, a connecting plate and a sliding seat are fixed. On the front of the connecting plate, an adjusting mechanism is provided which is movably connected to the connecting plate. On the front of the sliding seat, a slider is movably connected which is movably connected to the adjusting mechanism. On the outer sides of both air pipes, fixing rings are fixed. Inside the bottom of the outer frame, a stabilizing component is provided. On the stabilizing component, a substrate body is movably connected. On the stabilizing component, a heat dissipation plate is fixed. At the bottom of the outer frame, a cooling box is fixed, and the cooling box extends to the inside of the outer frame;

[0007] The adjusting mechanism includes a fixing plate fixed to the front of the right connecting plate. On the back of the fixing plate, a servo motor is fixed. The output shaft of the servo motor is fixed with a driving gear. At the top of the driving gear, a driven gear rotatably connected to the connecting plate is engaged. On the front of the driven gear, a swinging rod is fixed. On the left side of the swinging rod, a movable rod movably connected to the slider is hinged. At the bottom of the movable rod, a baffle is fixed, and the baffle is movably connected to the fixing ring.

[0008] Further, the circumferential radius of the driven gear is greater than that of the driving gear, and the swinging rod is fixed at the center of the front of the driven gear.

[0009] Further, a sliding through hole is formed on the front of the slider, and the movable rod is slidably connected to the slider through the sliding through hole. A sliding groove is formed on the front of the sliding seat, and the back of the slider is slidably connected to the sliding seat through the sliding groove.

[0010] Further, a ring-shaped clamping groove is fixed on the front of the fixing ring, the baffle is adapted to the ring-shaped clamping groove, and the baffle is clamped to the fixing ring through the ring-shaped clamping groove.

[0011] Further, the stabilizing component includes two receiving plates fixed to the inside of the bottom of the outer frame. On the opposite sides of the two receiving plates, movable holes are formed. On both receiving plates, clamping springs located inside the movable holes are fixed. On the opposite sides of the two clamping springs, acting plates extending outside the receiving plates are fixed. At the bottom of the acting plate, a placing plate is movably connected. On the left and right sides of the placing plate, limiting blocks are fixed. The substrate body is attached to the placing plate and the acting plate. The top of the heat dissipation plate is fixed to the placing plate, and the left and right sides of the heat dissipation plate are fixed to the receiving plates. The left and right sides of the cooling box are fixed to the receiving plates.

[0012] Further, a clamping groove is formed on the top of the placing plate, and the acting plate is slidably connected to the placing plate through the clamping groove.

[0013] Further, nitrogen is transported through the gas pipeline on the left side, and oxygen is transported through the gas pipeline on the right side. The inner side of the cooling box stores coolant, and both the left and right sides of the cooling box are connected with liquid passing pipes for exchanging coolant. The heat dissipation plate is made of heat-conducting metal.

[0014] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0015] The laser precision control substrate surface modification device adjusts and controls the gas environment on the outer surface of the substrate body through the adjustment mechanism, which is beneficial to reducing the damage to the outer surface of the substrate body, thereby improving the stability of the substrate body, and further contributing to improving the adaptability to different processing materials. Through the arrangement of the heat dissipation plate and the cooling box, the heat generated during the overall processing is absorbed, preventing the substrate body from cracking and being damaged, improving the stability of the substrate body, and thus improving the adaptability of the substrate body. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of the present utility model;

[0017] Figure 2 It is a three-dimensional view of the fixing ring of the present utility model;

[0018] Figure 3 It is a schematic structural diagram of the stable component of the present utility model.

[0019] In the figure: 1 outer frame, 2 connecting plate, 3 connecting plate, 4 fixing plate, 5 servo motor, 6 driving gear, 7 driven gear, 8 swinging rod, 9 movable rod, 10 baffle, 11 slider, 12 sliding seat, 13 fixing ring, 14 gas pipeline, 15 stable component, 1501 receiving plate, 1502 clamping spring, 1503 acting plate, 1504 placing plate, 1505 limiting block, 16 substrate body, 17 heat dissipation plate, 18 cooling box. Detailed Embodiment

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Please refer to Figures 1 to 2 , the laser precision control substrate surface modification device in this embodiment includes an outer frame 1 and two gas pipelines 14. Nitrogen is transported through the gas pipeline 14 on the left side, and oxygen is transported through the gas pipeline 14 on the right side.

[0022] It can be understood that by setting the gas composition, it is beneficial to control the gas environment outside the substrate, thereby facilitating the stability of the substrate during overall laser processing.

[0023] Two connecting plates 2 are fixed to the inner side of the bottom of the outer frame 1. An adapter plate 3 and a sliding seat 12 are fixed between the two connecting plates 2. An adjusting mechanism is provided on the front surface of the connecting plate 2 and is movably connected to the adapter plate 3. By setting the adjusting mechanism, it is beneficial to regulate the gas delivery pipe 14, thereby facilitating the stable use of the overall device. A slider 11 that is movably connected to the adjusting mechanism is movably connected to the front surface of the sliding seat 12. A sliding groove is formed on the front surface of the sliding seat 12. The back surface of the slider 11 is slidably connected to the sliding seat 12 through the sliding groove.

[0024] By setting the sliding groove, it is beneficial to the stable sliding of the slider 11 and the sliding seat 12, and further beneficial to the displacement of the movable rod 9, thereby improving the stability of gas control and further facilitating the stable use of the overall device.

[0025] It can also be understood that fixing rings 13 are fixed to the outer sides of both gas delivery pipes 14. By setting the fixing rings 13, it is beneficial to cooperate with the movable rod 9, and further beneficial to improving the reasonable use of the overall device. A stabilizing assembly 15 is provided on the inner side of the bottom of the outer frame 1. By setting the stabilizing assembly 15, it is beneficial to stabilize the substrate body 16, thereby facilitating the stable use of the substrate body 16 and improving its adaptability during processing of different materials. The substrate body 16 is movably connected to the stabilizing assembly 15. A heat dissipation plate 17 is fixed to the stabilizing assembly 15. A cooling box 18 is fixed to the bottom of the outer frame 1. A coolant is stored inside the cooling box 18. Liquid passing pipes for exchanging the coolant are communicated with both the left and right sides of the cooling box 18. The heat dissipation plate 17 is a heat-conducting metal, and the cooling box 18 extends to the inner side of the outer frame 1.

[0026] It should be noted that through the cooperative setting of the cooling box 18 and the heat dissipation plate 17, the heat transfer on the outer surface of the substrate body 16 is realized, thereby facilitating the reduction of the temperature of the substrate body 16, preventing the substrate body 16 from cracking, and improving the stability of overall use.

[0027] The adjusting mechanism includes a fixing plate 4 fixed to the front surface of the right connecting plate 2. A servo motor 5 is fixed to the back surface of the fixing plate 4. The output shaft of the servo motor 5 is fixed with a driving gear 6. A driven gear 7 that is rotatably connected to the adapter plate 3 is engaged with the top of the driving gear 6. A swing rod 8 is fixed to the front surface of the driven gear 7. The circumferential radius of the driven gear 7 is larger than the circumferential radius of the driving gear 6. The swing rod 8 is fixed to the center of the front surface of the driven gear 7.

[0028] It should also be noted that by setting the radii of the driving gear 6 and the driven gear 7, it is beneficial to adjust the rotation speed of the driven gear 7, which is beneficial to adjusting the baffle 10, helping to adjust the opening size of the air delivery pipe 14, and improving the flexibility of the device.

[0029] On the left side of the swing rod 8, there is a movable rod 9 hinged and movably connected to the slider 11. A sliding through hole is formed in the front surface of the slider 11, and the movable rod 9 is slidably connected to the slider 11 through the sliding through hole.

[0030] In addition, through the setting of the sliding through hole, it is beneficial for the up and down displacement of the movable rod 9, which is beneficial to adjusting the movable rod 9, and thus beneficial to the stable use of the overall device.

[0031] A baffle 10 is fixed to the bottom of the movable rod 9. The baffle 10 is movably connected to the fixed ring 13. A circular groove is fixed to the front surface of the fixed ring 13. The baffle 10 is adapted to the circular groove, and the baffle 10 is snap-fitted to the fixed ring 13 through the circular groove.

[0032] Moreover, in this embodiment, the substrate body 16 is stabilized by the stabilizing component 15, which is beneficial to the stability of the placement of the substrate body 16. Through the setting of the adjusting mechanism, the opening of the air delivery pipe 14 is controlled, which is beneficial to protecting the outer surface of the substrate body 16, thus improving the stability of the substrate body 16. Through the cooperation of the heat dissipation plate 17 and the cooling box 18, it is beneficial to the export of the heat of the substrate body 16, thus preventing the substrate body 16 from cracking and being damaged, and thus helping to achieve the stability of the substrate body 16 and improving its adaptability to different processing materials.

[0033] Please refer to Figure 3 , to improve the stability of the device, the stabilizing component 15 in this embodiment includes two receiving plates 1501 fixed to the inner side of the bottom of the outer frame 1. Activity holes are formed on the opposite sides of the two receiving plates 1501, and clamping springs 1502 located in the activity holes are fixed on both receiving plates 1501.

[0034] It is not difficult to see that through the setting of the activity holes and the clamping springs 1502, it is beneficial to clamp and stabilize the substrate body 16, beneficial to improving the stability of the substrate body 16, and thus helpful for the stable use of the overall device.

[0035] On the opposite sides of the two clamping springs 1502, there are action plates 1503 extending to the outside of the receiving plates 1501. The bottom of the action plate 1503 is movably connected to a placement plate 1504. A clamping groove is formed on the top of the placement plate 1504, and the action plate 1503 is slidably connected to the placement plate 1504 through the clamping groove.

[0036] Through the arrangement of the clamping groove, it is beneficial to the sliding of the acting plate 1503, and further beneficial to the stable clamping of the substrate body 16 by the acting plate 1503, which is beneficial to improving the stability of the device.

[0037] It should be elaborated that limiting blocks 1505 are fixed on both the left and right sides of the placing plate 1504. Through the arrangement of the limiting blocks 1505, it is beneficial to limit the acting plate 1503 and prevent the acting plate 1503 from falling off, thereby improving the stability of the device during use. The substrate body 16 is in contact with the placing plate 1504 and the acting plate 1503. The top of the heat dissipation plate 17 is fixed to the placing plate 1504, and both the left and right sides of the heat dissipation plate 17 are fixed to the receiving plate 1501. Both the left and right sides of the cooling box 18 are fixed to the receiving plate 1501.

[0038] In this embodiment, through the elastic force of the clamping spring 1502 on the acting plate 1503, the acting plate 1503 is clamped towards the middle, thereby improving the stability of the substrate body 16, which is beneficial to improving the adaptability of the substrate body 16 to different materials.

[0039] The electrical components mentioned in the text are all electrically connected to the controller and the power supply. The control mode of the present utility model is controlled by the controller. The control circuit of the controller can be realized by simple programming of those skilled in the art. The provision of the power supply also belongs to the common knowledge in the art. And the present utility model is mainly used to protect mechanical devices, so the control mode and circuit connection of the present utility model will not be explained in detail.

[0040] The working principle of the above embodiment is as follows:

[0041] Place the substrate body 16 above the placement plate 1504. Under the action of the clamping spring 1502, push the action plate 1503 to clamp towards the middle to stabilize the substrate body 16. Then place the workpiece to be processed above the substrate body 16 and process the workpiece through an externally provided laser. During this process, the servo motor 5 can be started to drive the driving gear 6 to rotate. Under the meshing action, drive the driven gear 7 to rotate. Through the fixing action, adjust the swing rod 8 so that the swing rod 8 rotates to the right. When rotating, through the sliding action of the movable rod 9 and the slider 11, the movable rod 9 moves upward, and at the same time the slider 11 moves to the right through the sliding seat 12, causing the baffle 10 to perform an arc-shaped movement. Finally, the baffle 10 is clamped with the fixing ring 13 outside the right gas pipeline 14, thereby opening the left nitrogen gas pipeline 14. Then, nitrogen gas is transported from the gas pipeline 14 to the substrate body 16. Thus, through the non-oxidizing effect of nitrogen gas, the stability of the workpiece processing on the top of the substrate body 16 is achieved, which is beneficial to reducing the influence of processing on the substrate body 16, and thus beneficial to the service durability of the substrate body 16. Then, reverse-start the servo motor 5 so that the baffle 10 blocks the left nitrogen gas pipeline 14, and oxygen is blown to the substrate body 16 through the right gas pipeline 14. The gas oxidation effect of oxygen is beneficial to eliminating the debris and droplets of the substrate material, thereby preventing the formation and residue of debris and droplets on the surface of the substrate body 16, and further improving the stability of the substrate body 16, and thus being beneficial to meeting the adaptability to different processing materials. At the same time, the coolant flowing through the cooling box 18 absorbs heat above it, and under the conduction action of the heat dissipation plate 17, the heat is dissipated, which is beneficial to preventing the possible heating phenomenon during material processing, and thus beneficial to further improving the overall use stability and improving the adaptability of the substrate to different processing materials.

[0042] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0043] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model.

Claims

1. A laser precise control substrate surface modification device, comprising an outer frame (1) and two gas delivery pipes (14), characterized in that: Two connecting plates (2) are fixed on the inner side of the bottom of the outer frame (1), a connecting plate (3) and a slide seat (12) are fixed between the two connecting plates (2), an adjustment mechanism movably connected to the connecting plate (3) is provided on the front side of the connecting plate (2), a slider (11) movably connected to the adjustment mechanism is movably connected to the front side of the slide seat (12), a fixing ring (13) is fixed on the outer side of the two gas pipes (14), a stabilizing component (15) is provided on the inner side of the bottom of the outer frame (1), a substrate body (16) is movably connected to the stabilizing component (15), a heat sink (17) is fixed to the stabilizing component (15), a cooling box (18) is fixed to the bottom of the outer frame (1), and the cooling box (18) extends to the inner side of the outer frame (1); The adjustment mechanism comprises a fixing plate (4) fixed to the front of the right connecting plate (2); a servo motor (5) is fixed to the back of the fixing plate (4); a driving gear (6) is fixed to the output shaft of the servo motor (5); a driven gear (7) is meshed with the top of the driving gear (6) and is rotatably connected to the connecting plate (3); a swing rod (8) is fixed to the front of the driven gear (7); a movable rod (9) movably connected to a slider (11) is hinged on the left side of the swing rod (8); a baffle (10) is fixed to the bottom of the movable rod (9); and the baffle (10) is movably connected to a fixing ring (13).

2. The laser precise control substrate surface modification device according to claim 1, characterized in that: The circumferential radius of the driven gear (7) is greater than the circumferential radius of the driving gear (6), and the swing rod (8) is fixed to the axis center of the front side of the driven gear (7).

3. The laser precise control substrate surface modification device according to claim 1 is characterized in that: The front side of the slider (11) is provided with a sliding through hole, and the movable rod (9) is slidably connected to the slider (11) via the sliding through hole; the front side of the slide seat (12) is provided with a sliding groove, and the back side of the slider (11) is slidably connected to the slide seat (12) via the sliding groove.

4. The laser precise control substrate surface modification device according to claim 1 is characterized in that: An annular clamping groove is fixed on the front side of the fixing ring (13), the baffle plate (10) is matched with the annular clamping groove, and the baffle plate (10) is clamped with the fixing ring (13) via the annular clamping groove.

5. The laser precise control substrate surface modification device according to claim 1 is characterized in that: The stabilizing assembly (15) comprises two receiving plates (1501) fixed to the inner side of the bottom of the outer frame (1), the two receiving plates (1501) are provided with movable holes on opposite sides, the two receiving plates (1501) are fixed with clamping springs (1502) located in the movable holes, the two receiving plates (1501) are fixed with action plates (1503) extending to the outside of the receiving plates (1501) on opposite sides, and the bottom of the action plates (1503) is provided with a plurality of movable holes. The part is movably connected with a placement plate (1504), and the left and right sides of the placement plate (1504) are fixed with limit blocks (1505), the substrate body (16) is fitted with the placement plate (1504) and the action plate (1503), the top of the heat dissipation plate (17) is fixed to the placement plate (1504), the left and right sides of the heat dissipation plate (17) are fixed to the receiving plate (1501), and the left and right sides of the cooling box (18) are fixed to the receiving plate (1501).

6. The laser precise control substrate surface modification device according to claim 5, characterized in that: A clamping groove is provided on the top of the placement plate (1504), and the action plate (1503) is slidably connected to the placement plate (1504) via the clamping groove.

7. The laser precise control substrate surface modification device according to claim 1 is characterized by: The gas delivery pipe (14) on the left side transmits nitrogen, and the gas delivery pipe (14) on the right side transmits oxygen. The inner side of the cooling box (18) stores coolant. The left and right sides of the cooling box (18) are connected with liquid pipes for exchanging coolant. The heat sink (17) is a heat-conducting metal.

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